CN103358459A - Positioning structure of tone cavity sealing bracket and die for manufacturing tone cavity sealing bracket - Google Patents
Positioning structure of tone cavity sealing bracket and die for manufacturing tone cavity sealing bracket Download PDFInfo
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- CN103358459A CN103358459A CN2012100909439A CN201210090943A CN103358459A CN 103358459 A CN103358459 A CN 103358459A CN 2012100909439 A CN2012100909439 A CN 2012100909439A CN 201210090943 A CN201210090943 A CN 201210090943A CN 103358459 A CN103358459 A CN 103358459A
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Abstract
The invention discloses a positioning structure of a tone cavity sealing bracket. The bracket comprises a first shell and a second shell, wherein the first shell and the second shell are sealed to form a cavity serving as a tone cavity; the first shell comprises a shell body and a conductive layer which is positioned in the shell body and is attached to a part of the surface of the shell body; the conductive layer is communicated with the cavity; a first positioning through hole is formed in a part, which is positioned outside the shell body, of the conductive layer; a second positioning through hole is formed in a part, which is positioned at the end part of the shell body, of the conductive layer. The invention also provides a die for manufacturing the tone cavity sealing bracket. According to the positioning structure of the tone cavity sealing bracket, the first positioning through hole is formed in a part, which is positioned outside the shell body, of the conductive layer, so that the positioning can be executed through the first positioning through hole without arranging a positioning component on the first shell; the height of the tone cavity component can be reduced; the volume of the tone cavity component is guaranteed; and therefore, the size of a mobile terminal is small.
Description
Technical field
The present invention relates to technical field of electronic equipment, be specifically related to the location structure of a kind of sound chamber sealed support and the mould of making sound chamber sealed support.
Background technology
Because mechanics of communication is flourish, so that communication terminal product, such as: mobile phone etc., become the now indispensable essential tool of people, this mobile phone not only can be used as the conversation instrument and uses, and also carries out the important medium of the multimedia recreations such as handheld game, the audiovisual of video display song for people now, and mobile phone is at the complete machine thin thickness, the sealing of sound chamber is intact, and the importance that reaches the good design of audio performance just highlights.
It below is the Position Design scheme of the mold insert injection moulding of known a kind of sound chamber sealed support, design schematic diagram in this communication terminal product, see also Fig. 1 to Fig. 3, this communication terminal product is take a mobile phone as example, and its first housing 11 and the second housing 12 fit tightly the cavity 13 that together forms a sealing.The first housing 11 is injection molded by metal material 111 and plastic material 112 mold inserts.When metal material 111 is put into injection mold, position by hole 111A and 2 of hole 111B, need to guarantee the accuracy of metal material 111 positions.For the ease of the location of metal material 111 in injection mold, injection mold is provided with locating dowel in the position of hole 111B, and locating dowel need to be passed hole 111B and be exceeded 3mm or above height.Simultaneously, in order to ensure the sealing of cavity, reaching end face around the 111B of hole needs surround with plastic material 112A.
Learnt by above-mentioned, around the 111B of hole and after end face surrounds with plastic material 112A, this plastic material will take 3mm or above height, can't reach client and consumer's desirable desired level down to the thickness of complete machine.One of known solution is done the height of cavity littlely as far as possible, reduces the sound cavity volume, and reaching the purpose that reduces complete machine thickness, but the audio performance will obviously reduce, and the user is experienced affect greatly.Therefore, how to design a kind of sound chamber support location structure that improves aforesaid drawbacks, the problem that must solve for present technical staff.
Summary of the invention
Technical problem to be solved by this invention is to overcome the deficiencies in the prior art, provide a kind of can be to the metal material effective location of mold insert injection moulding, can guarantee again the location structure of sound chamber sealed support of sound chamber height, volume and sealing effectiveness and the mould of making sound chamber sealed support.
For solving the problems of the technologies described above, the invention provides following technical scheme:
The location structure of a kind of sound chamber sealed support, described support comprises: the first housing and the second housing, described the first housing and the second housing seal form cavity as the sound chamber; The conductive layer that described the first housing comprises the shell body and is arranged in the shell body and fits with described shell body part surface, described conductive layer is communicated with described cavity, described conductive layer is provided with the first positioning through hole in the part that is positioned at outside the described shell body regions, and described conductive layer is provided with the second positioning through hole at the end regions that is positioned at described shell body.
The present invention also provides a kind of mould of making sound chamber sealed support, this mould is used for making the first above-mentioned housing, comprise: the core system, this core system comprises the first pilot pin on the first locating hole on front mould core, the front mould core, rear mold core, the rear mold core, the second locating hole on the front mould core, the second pilot pin on the rear mold core; Described front mould core and rear mold core complement each other to form an airtight die cavity, this airtight die cavity and described the first housing coupling; The first pilot pin on the described rear mold core can pass the first positioning through hole and with the first locating hole interlock; The second pilot pin on the described rear mold core can pass the second positioning through hole and with the second locating hole interlock.
Compared with prior art, the present invention has following beneficial effect: the location structure of sound provided by the invention chamber sealed support, the part that conductive layer is positioned at outside the described shell body regions is provided with the first positioning through hole, can position by this first locating hole, and need to positioning element be set at the first housing upper zone, therefore can be at the height that reduces sound chamber assembly, guarantee to make the portable terminal size less in the situation of volume of sound chamber assembly.
Description of drawings
Fig. 1 is the first housing separate structure schematic diagram of prior art sound chamber sealed support.
Fig. 2 is prior art sound chamber sealed support A-A generalized section in Fig. 1.
Fig. 3 is the schematic diagram after prior art sound chamber sealed support is finished.
Fig. 4 is the first housing separate structure schematic diagram of embodiment of the invention sound chamber sealed support.
Fig. 5 is embodiment of the invention sound chamber sealed support A-A generalized section in Fig. 4.
Fig. 6 is the structural representation of embodiment of the invention sound chamber sealed support.
Fig. 7 is embodiment of the invention sound chamber sealed support B-B generalized section in Fig. 6.
Fig. 8 is the schematic diagram after embodiment of the invention sound chamber sealed support is sheared.
Fig. 9 is the generalized section of embodiment of the invention Mold Making Fig. 7.
Figure 10 is a-quadrant enlarged drawing among embodiment of the invention Fig. 9.
The specific embodiment
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
The invention provides the location structure of a kind of sound chamber sealed support, to Fig. 7, described support comprises with reference to figure 4: the first housing 21 and the second housing 22, and described the first housing 21 and 22 sealings of the second housing form cavity as the sound chamber; The conductive layer 211 that described the first housing 21 comprises shell body 212 and is arranged in shell body 212 and fits with described shell body 212 part surfaces, described conductive layer 211 is communicated with described cavity, described conductive layer 211 is provided with the first positioning through hole 211B in the part that is positioned at outside shell body 212 zones, and described conductive layer 211 is provided with the second positioning through hole 211A at the end regions that is positioned at shell body 212.Because the part that conductive layer 211 is positioned at outside shell body 212 zones is provided with the first positioning through hole 211B, can position by this first locating hole 211B, and positioning element need to be set on the first housing top, can reduce the height of sound chamber assembly, guarantee the volume of sound chamber assembly, thereby make the portable terminal size less.In the time of in the prior art locating hole is arranged on the upper surface of the first housing, the such effect in order to seal, need with the shell body this locating hole sealing, reaching end face around this locating hole needs surround with the shell body, can be with reference to figure 3, this shell body be positioned at height above the conductive layer will take 3mm or more than, like this can be so that the volume of seal chamber reduces, the audio performance will obviously reduce.And the relative prior art of the embodiment of the invention has enlarged conductive layer 211 extensions, this conductive layer 211 is extended to the perimeter 211C that has exceeded shell body 212, simultaneously the first positioning through hole 211B is made in the zone of perimeter 211C, such the first positioning through hole 211B does not affect the sealing of cavity 23, can reach easily complete cavity sealing effectiveness.Such Position Design can not take because of the reason of product processing procedure (such as the location of mold insert injection moulding) height in sound chamber so that sound chamber sealed support is higher in the utilization rate of short transverse, causes the audio performance not good.Because short transverse does not have occupied, the height in sound chamber can be enough, little to the thickness requirement that is contained in loudspeaker in its sound chamber or other devices, need not select unconventional loudspeaker or other devices for the height of doing little cavity, can find easily suitable loudspeaker or other devices.
Described conductive layer 211 of the present invention is positioned at upper surface or the lower surface of described shell body 212, be that conductive layer is used to be electrically connected the inside and outside of described cavity 23, during final assembly, a loudspeaker (not shown) can be put in the inside of seal chamber 13, and the conductive contact that loudspeaker carries carries out conducting by the mainboard of this conductive layer 211 and seal chamber 23 outsides.The conductive layer 211 of the embodiment of the invention is at least one, conductive layer in the present embodiment is two, what of conductive layer number can be determined according to the number that the loudspeaker needs are drawn conductive pin, and all be provided with at least the first positioning through hole 211B and the second positioning through hole 211A on each conductive layer 211, certainly, if the positioning through hole that is provided with more than two also is fine, corresponding, mould also will arrange pilot pin and the locating hole of corresponding number, and pilot pin and locating hole have description in following description mould.In implementation, general two positioning through hole of through hole that are used for the location can meet the demands.Parts in the present embodiment in the cavity can not selected loudspeaker according to actual conditions, if for other devices and need to draw conductive pin when being three, the conductive layer number is three so.Described shell body and described conductive layer in the embodiment of the invention are one-body molded, can it be injection-moulded in together by mould, and integrated structure is more sturdy and durable.Conductive layer 211 is selected metal material in the embodiment of the invention, and this metal material is the materials such as stainless steel, copper, aluminium alloy; Shell body 212 is plastic material, and this plastic material is the mixture of PC, ABS or PC and ABS etc.
In the present embodiment, if the perimeter 211C of past extension interferes the assembling existence of complete machine or to the influential words of performance, its 211D place, profile edge along shell body 212 can be cut off.Before the shearing as shown in Figure 6, after the shearing as shown in Figure 8.
The present invention also provides a kind of mould of making sound chamber sealed support, is used for making the first above-mentioned housing 211, and Fig. 9 is the schematic diagram of embodiment of the invention Mold Making Fig. 7; This mould comprises: the core system, this core system comprises the first pilot pin 318 on the first locating hole 316 on front mould core 309, the front mould core, rear mold core 310, the rear mold core, the second locating hole (not shown) on the front mould core, the second pilot pin (not shown) on the rear mold core; Described front mould core 309 and rear mold core 310 complement each other to form an airtight die cavity 317, this airtight die cavity 317 and described the first housing 211 couplings; The first pilot pin 318 on the described rear mold core can pass the first positioning through hole 211B and with 316 interlocks of the first locating hole; The second pilot pin on the described rear mold core can pass the second positioning through hole and with the second locating hole interlock.The first locating hole 316 and the first pilot pin 318 on the rear mold core on the front mould core are concentric, and make its relatively smoothly interlock and deviate from by certain matched in clearance, and the Z value of both length of action indications when interlock is more than or equal to 3mm and less than or equal to 20mm; This interlock position is in detail referring to Figure 10, and Figure 10 is a-quadrant enlarged drawing among embodiment of the invention Fig. 9.
Injection mold also comprises form frame system and running gate system in the present embodiment, this form frame system comprises upper mounted plate 301, switch-plate 302, front template 303, rear pattern plate 304, upper ejector plate 305, lower liftout plate 306, mould pin 307, bottom plate 308, front template 303 is arranged at above the front mould core 309, switch-plate 302 is arranged on the front template 303, and upper mounted plate 301 is arranged on the switch-plate 302; Mould pin 307 is fixedly installed on bottom plate 308 peripheries, upper ejector plate 305 is arranged on the lower liftout plate 306 and with lower liftout plate and forms an integral body, this is wholy set on the bottom plate 308, and be arranged on mould pin 307 inside, rear pattern plate 304 is arranged at above the mould pin 307, and the upper surface of rear pattern plate 304 and rear mold core 310 closely cooperate.
Running gate system forms the passage of circulation material, and this running gate system comprises adaptor 311, runner 313, cast gate 314, and adaptor 311 forms a funnel shaped, can make things convenient for material to inject; Front mould core 309 and rear mold core 310 can form die cavity, runner 313 passes upper mounted plate 301, switch-plate 302 and front mould core 309, with the interface formation cast gate 314 of front mould core 309 die cavities, material can pass through runner 313, flow to through cast gate 314 in the die cavity of front mould core 309 and 310 formation of rear mold core, in order to form the first housing.
Ejection system comprises thimble 319, and the bottom of thimble 319 is anchored on the integral body of upper ejector plate 305 and 306 both formation of lower liftout plate.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the location structure of a sound chamber sealed support, described support comprises: the first housing and the second housing, described the first housing and the second housing seal form cavity as the sound chamber; It is characterized in that, the conductive layer that described the first housing comprises the shell body and is arranged in the shell body and fits with described shell body part surface, described conductive layer is communicated with described cavity, described conductive layer is provided with the first positioning through hole in the part that is positioned at outside the described shell body regions, and described conductive layer is provided with the second positioning through hole at the end regions that is positioned at described shell body.
2. the location structure of sound according to claim 1 chamber sealed support is characterized in that, described conductive layer is positioned at upper surface or the lower surface of described shell body.
3. the location structure of sound according to claim 1 chamber sealed support is characterized in that, described shell body and described conductive layer are one-body molded.
4. the location structure of sound according to claim 1 chamber sealed support is characterized in that, described conductive layer is at least one.
5. the location structure of sound according to claim 1 chamber sealed support is characterized in that, described conductive layer is selected metal material.
6. the location structure of sound according to claim 5 chamber sealed support is characterized in that, described metal material is stainless steel, copper or aluminum alloy materials.
7. the location structure of sound according to claim 1 chamber sealed support is characterized in that, the material of described shell body is plastic material.
8. the location structure of sound according to claim 7 chamber sealed support is characterized in that, described plastic material is the mixture of PC, ABS or PC and ABS.
9. mould of making sound chamber sealed support, be used for making such as each described first housing of claim 1-8, it is characterized in that, comprise: the core system, this core system comprises the first pilot pin on the first locating hole on front mould core, the front mould core, rear mold core, the rear mold core, the second locating hole on the front mould core, the second pilot pin on the rear mold core; Described front mould core and rear mold core complement each other to form an airtight die cavity, this airtight die cavity and described the first housing coupling; The first pilot pin on the described rear mold core can pass the first positioning through hole and with the first locating hole interlock; The second pilot pin on the described rear mold core can pass the second positioning through hole and with the second locating hole interlock.
10. the mould of described making sound chamber sealed support according to claim 9 is characterized in that, the length of action of described the second pilot pin and the second locating hole is more than or equal to 3mm and less than or equal to 20mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210090943.9A CN103358459B (en) | 2012-03-31 | 2012-03-31 | Positioning structure of tone cavity sealing bracket and die for manufacturing tone cavity sealing bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210090943.9A CN103358459B (en) | 2012-03-31 | 2012-03-31 | Positioning structure of tone cavity sealing bracket and die for manufacturing tone cavity sealing bracket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103358459A true CN103358459A (en) | 2013-10-23 |
| CN103358459B CN103358459B (en) | 2015-07-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210090943.9A Active CN103358459B (en) | 2012-03-31 | 2012-03-31 | Positioning structure of tone cavity sealing bracket and die for manufacturing tone cavity sealing bracket |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080006440A1 (en) * | 2006-06-21 | 2008-01-10 | Hans-Georg Huonker | Process for manufacturing an injection molded part with integrated flexible printed circuit board |
| CN201114237Y (en) * | 2007-09-24 | 2008-09-10 | 中兴通讯股份有限公司 | Mobile telephone sonic cavity structure |
| CN101997157A (en) * | 2009-08-10 | 2011-03-30 | 三星电机株式会社 | Antenna pattern frame, electronic device case, method and mold for manufacturing the same |
| CN102170040A (en) * | 2010-02-25 | 2011-08-31 | 三星电机株式会社 | Antenna pattern frame and mold for manufacturing electronic device case including the same |
-
2012
- 2012-03-31 CN CN201210090943.9A patent/CN103358459B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080006440A1 (en) * | 2006-06-21 | 2008-01-10 | Hans-Georg Huonker | Process for manufacturing an injection molded part with integrated flexible printed circuit board |
| CN201114237Y (en) * | 2007-09-24 | 2008-09-10 | 中兴通讯股份有限公司 | Mobile telephone sonic cavity structure |
| CN101997157A (en) * | 2009-08-10 | 2011-03-30 | 三星电机株式会社 | Antenna pattern frame, electronic device case, method and mold for manufacturing the same |
| CN102170040A (en) * | 2010-02-25 | 2011-08-31 | 三星电机株式会社 | Antenna pattern frame and mold for manufacturing electronic device case including the same |
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| CN103358459B (en) | 2015-07-22 |
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