CN101337419A - Manufacture method of electronic apparatus housing - Google Patents
Manufacture method of electronic apparatus housing Download PDFInfo
- Publication number
- CN101337419A CN101337419A CNA2007100763741A CN200710076374A CN101337419A CN 101337419 A CN101337419 A CN 101337419A CN A2007100763741 A CNA2007100763741 A CN A2007100763741A CN 200710076374 A CN200710076374 A CN 200710076374A CN 101337419 A CN101337419 A CN 101337419A
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- Prior art keywords
- casing
- electronic apparatus
- die cavity
- mold
- thin layer
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- Injection Moulding Of Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention provides a method for producing a casing of an electronic device. The method comprises the following steps: an injection mold is provided, which comprises a female mold and a male mold matched with the female mold, a mold cavity is arranged on either the female mold or the male mold, and a movable mold core is arranged on the other mold; a film layer is provided; the film layer is positioned into the mold cavity; the female mold and the male mold are closed, the mold cavity and the mold core form a mold chamber, and the shape and the size of the mold chamber are corresponding to the shape and the size of the casing of the electronic device. Fused thermoplastics is injected in the mold chamber to mold a substrate layer, and meanwhile, the film layer and the substrate layer are integrally molded into the casing of the electronic device; the mold core is pushed to carry out in-mold compression to the casing of the electronic device.
Description
Technical field
The present invention relates to a kind of manufacture method of casing of electronic apparatus.
Background technology
Along with the development of mobile communication technology, electronic installation miscellaneous such as mobile phone etc. competitively emerge in large numbers, and make the consumer can enjoy all facilities that mobile technology is brought whenever and wherever possible to the full, and portable electron device is more and more favored by consumers in general thus.
Casing is one of main spare part of electronic installation, and it is widely used on the electronic installations such as phone, calculator, computer.But, all be printed with pattern on the general casing of electronic apparatus in order to promote the ornamental of electronic installation.
Existing, be that direct method by mimeograph is printed in pattern on the shell of electronic installation forming method of patterning on the casing of electronic apparatus.Because pattern is exposed to the appearance of casing of electronic apparatus, this pattern weares and teares easily.
At above-mentioned situation, generally adopt the in-mold decoration processing procedure that pattern is formed on the casing of electronic apparatus.In-mold decoration is meant that product is in mould during ejection formation, its product surface forms the technology with decorative pattern simultaneously, it generally is to be pre-formed a thin layer with decorative pattern, then this thin layer that is formed with decorative pattern is carried out hot-forming to form predetermined shape, place again in the die cavity of ejection shaping die after this thin layer cut, at last melted material is injected in the die cavity, thin layer combines with melted material and forms the product with decorative pattern.
Though, adopted the casing of electronic apparatus of in-mold decoration processing procedure, because pattern coated by a thin layer, can avoid pattern to wear and tear because of factors such as uses.But, for the casing of electronic apparatus that display window is arranged, because the thin layer that the in-mold decoration processing procedure is used and the shrinkage factor of injection material are inconsistent, when this casing of electronic apparatus of injection moulding, to produce stress between this thin layer and this injection material, and then produce birefringent phenomenon, influence the translucent effect of this casing of electronic apparatus.
Summary of the invention
In view of this, be necessary to provide a kind of manufacture method of avoiding the pattern wearing and tearing and promoting the casing of electronic apparatus of translucent effect.
A kind of manufacture method of casing of electronic apparatus may further comprise the steps:
One injection molding is provided, and this injection molding comprises a master mold and a male model that cooperates with this master mold, and a side of this master mold or male model offers a die cavity, and the opposing party is provided with a mobilizable die;
One thin layer is provided;
This thin layer is placed in the described die cavity;
With this master mold and this male model matched moulds, this die cavity and this die form a die cavity, and this die cavity is corresponding with the shape and size of this casing of electronic apparatus;
The thermoplastic of injection fusion in above-mentioned die cavity, this base layer of moulding, above-mentioned thin layer and this base layer are one-body molded simultaneously is this casing of electronic apparatus;
Promote this die, this casing of electronic apparatus is carried out compression processing in the mould.
Cool off die sinking behind the described injection molding, this casing of electronic apparatus is taken out.Compared with prior art, the manufacture method of described casing of electronic apparatus, owing to adopt the method for in-mold decoration that this thin layer and this base layer is one-body molded, because pattern is formed on the first surface of this thin layer, this first surface is towards this base layer, so, can avoid pattern to wear and tear because of factors such as uses.Simultaneously, owing to behind this thin layer and one-body molded this casing of electronic apparatus of this base layer, also this casing of electronic apparatus is carried out compression processing in the mould, so, can eliminate the stress between this thin layer and this base layer, thereby strengthen the translucent effect of casing of electronic apparatus.
Description of drawings
Fig. 1 makes the mould of casing of electronic apparatus of the present invention and the schematic diagram of thin layer;
Fig. 2 is the schematic diagram that the thin layer of manufacturing casing of electronic apparatus of the present invention is put master mold into;
Fig. 3 is the thin layer of casing of electronic apparatus of the present invention when putting into master mold, the schematic diagram when male model and master mold matched moulds;
Fig. 4 is after Fig. 3 injects the thermoplastic of fusion, the schematic diagram of this casing of electronic apparatus of moulding;
After Fig. 5 is this casing of electronic apparatus of moulding, the schematic diagram during die sinking.
The specific embodiment
The manufacture method of the casing of electronic apparatus 20 of preferred embodiment of the present invention comprises the steps:
One injection molding is provided, sees also shown in Figure 1ly, this injection molding comprises a master mold 32 and a male model 34 that cooperates with this master mold 32, and this master mold 32 offers a die cavity 322, and this male model 34 is provided with a mobilizable die 342;
One thin layer 22 is provided, and this thin layer 22 can be polycarbonate family macromolecule polymer, and this thin layer 22 comprises that a first surface (figure does not show) reaches and this first surface opposing second surface (figure does not show), is formed with pattern on this first surface;
See also Fig. 2, the mode that this thin layer 22 is fitted with this second surface and this die cavity 322 places in the die cavity 322 of described master mold 32;
See also Fig. 3, with this master mold 32 and these male model 34 matched moulds, the die cavity 322 of this master mold 32 forms a die cavity 36 with the die of this male model 34 342, and this die cavity 36 is corresponding with the shape and size of this casing of electronic apparatus 20;
See also Fig. 4, the thermoplastic of injection fusion in above-mentioned die cavity 36, this thermoplastic can be polyvinyl chloride, the described die cavity 36 of this molten thermoplastic plastics filling, and being molded into described base layer 24, simultaneously described thin layer 22 and this base layer 24 are one-body molded to be this casing of electronic apparatus 20;
See also Fig. 4, promote this die 342, this casing of electronic apparatus 20 is carried out compression processing in the mould, the stroke L of this die 342 in die cavity 36 is 0.3 millimeter.
See also Fig. 5, cool off die sinking behind the described injection molding, this casing of electronic apparatus 20 that forms is taken out.
Be appreciated that this mould can be provided with a mobilizable die (figure does not show) on this master mold 32, and on this male model 34, offer a die cavity (figure does not show).
Being appreciated that in the die cavity 322 of this master mold 32 also to have vaccum suction pipe 324 (as shown in Figure 1), this thin layer 22 is fixed in the die cavity 322 of this master mold 32.
In addition, the stroke L of this die 342 in die cavity 36 is not defined as 0.3 millimeter, can be generally 0.1 millimeter～0.5 millimeter for eliminating any distance of stress between this rete 22 and this base layer 24.
In addition, this thermoplastic optional from polyvinyl chloride, PETG, acrylonitrile-styrene-butadiene co-polymer, Merlon, polyimide, polyethers vinegar imines, polyphenylene sulfide, poly-ly sough, in polystyrene, glycol-modified polyester and the polyacrylic polymer one or more.
Described casing of electronic apparatus 20 adopts the method for in-mold decoration that this thin layer 22 is one-body molded with this base layer 24, because pattern between this thin layer 22 and this base layer 24, so, can avoid pattern to wear and tear because of factors such as uses.Simultaneously, owing to behind this thin layer 22 and these base layer 24 one-body molded these casing of electronic apparatus 20, also this casing of electronic apparatus 20 is carried out compression processing in the mould, so, can eliminate the stress between this thin layer 22 and this base layer 24, thereby strengthen the translucent effect of this casing of electronic apparatus 20.
Claims (8)
1. the manufacture method of a casing of electronic apparatus may further comprise the steps:
One injection molding is provided, and this injection molding comprises a master mold and a male model that cooperates with this master mold, and a side of this master mold or male model offers a die cavity, and the opposing party is provided with a mobilizable die;
One thin layer is provided;
This thin layer is placed in the described die cavity;
With this master mold and this male model matched moulds, this die cavity and this die form a die cavity, and this die cavity is corresponding with the shape and size of this casing of electronic apparatus;
The thermoplastic of injection fusion in above-mentioned die cavity, this base layer of moulding, above-mentioned thin layer and this base layer are one-body molded simultaneously is this casing of electronic apparatus;
Promote this die, this casing of electronic apparatus is carried out compression processing in the mould;
Cool off die sinking behind the described injection molding, this casing of electronic apparatus is taken out.
2. the manufacture method of casing of electronic apparatus as claimed in claim 1 is characterized in that: in this die cavity vaccum suction pipe is arranged, in order to this thin layer is fixed in the described die cavity.
3. the manufacture method of casing of electronic apparatus as claimed in claim 1 is characterized in that: this thermoplastic be selected from polyvinyl chloride, PETG, acrylonitrile-styrene-butadiene co-polymer, Merlon, polyimide, polyethers vinegar imines, polyphenylene sulfide, poly-ly sough, in polystyrene, glycol-modified polyester and the polyacrylic polymer one or more.
4. the manufacture method of casing of electronic apparatus as claimed in claim 1, it is characterized in that: the material of this thin layer is a polycarbonate family macromolecule polymer.
5. the manufacture method of casing of electronic apparatus as claimed in claim 1, it is characterized in that: the compression travel of this die in this die cavity is 0.3 millimeter.
6. the manufacture method of casing of electronic apparatus as claimed in claim 1, it is characterized in that: the compression travel of this die in this die cavity is 0.1 millimeter～0.5 millimeter.
7. the manufacture method of casing of electronic apparatus as claimed in claim 1, it is characterized in that: this thin layer comprises a first surface, is formed with pattern on this first surface.
8. the manufacture method of casing of electronic apparatus as claimed in claim 7 is characterized in that: this thin layer also comprise one with this first surface opposing second surface, this thin layer places in the described die cavity in the mode of this second surface with the applying of described die cavity.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710076374A CN101337419B (en) | 2007-07-04 | 2007-07-04 | Manufacture method of electronic apparatus housing |
| US11/959,164 US7684178B2 (en) | 2007-07-04 | 2007-12-18 | Housing for electronic devices, electronic device using the housing and method for making the housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710076374A CN101337419B (en) | 2007-07-04 | 2007-07-04 | Manufacture method of electronic apparatus housing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101337419A true CN101337419A (en) | 2009-01-07 |
| CN101337419B CN101337419B (en) | 2012-09-19 |
Family
ID=40211656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710076374A Expired - Fee Related CN101337419B (en) | 2007-07-04 | 2007-07-04 | Manufacture method of electronic apparatus housing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101337419B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102664313A (en) * | 2012-04-13 | 2012-09-12 | 深圳光启创新技术有限公司 | Shell structure with flexible film and preparation method of shell structure |
| CN102815066A (en) * | 2011-06-08 | 2012-12-12 | 联想(北京)有限公司 | Preparation method for workpieces and electronic device |
| WO2014139093A1 (en) * | 2013-03-12 | 2014-09-18 | Sabic Innovative Plastics Ip B.V. | Thin wall application with injection compression molding and in-mold roller |
| CN104416915A (en) * | 2013-09-05 | 2015-03-18 | 比亚迪股份有限公司 | Device and method for making shell |
| CN108472848A (en) * | 2015-08-31 | 2018-08-31 | 统实业有限公司 | Injection forming equipment and method |
| CN112512250A (en) * | 2015-08-11 | 2021-03-16 | 三星电子株式会社 | Method for manufacturing a housing and electronic device comprising a housing |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1137811C (en) * | 2001-02-27 | 2004-02-11 | 绿点高新科技股份有限公司 | Method for preapring decorative running gate in mould from being flushed |
| KR200339231Y1 (en) * | 2003-10-17 | 2004-01-16 | 피닉스코리아 주식회사 | Apparatus for in-mold injection molding |
-
2007
- 2007-07-04 CN CN200710076374A patent/CN101337419B/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102815066B (en) * | 2011-06-08 | 2016-03-02 | 联想(北京)有限公司 | The preparation method of workpiece and electronic equipment |
| CN102815066A (en) * | 2011-06-08 | 2012-12-12 | 联想(北京)有限公司 | Preparation method for workpieces and electronic device |
| CN102664313B (en) * | 2012-04-13 | 2015-03-11 | 深圳光启创新技术有限公司 | Shell structure with flexible film and preparation method of shell structure |
| CN102664313A (en) * | 2012-04-13 | 2012-09-12 | 深圳光启创新技术有限公司 | Shell structure with flexible film and preparation method of shell structure |
| CN105142871A (en) * | 2013-03-12 | 2015-12-09 | 沙特基础全球技术有限公司 | Thin wall application with injection compression molding and in-mold roller |
| WO2014139093A1 (en) * | 2013-03-12 | 2014-09-18 | Sabic Innovative Plastics Ip B.V. | Thin wall application with injection compression molding and in-mold roller |
| CN104416915A (en) * | 2013-09-05 | 2015-03-18 | 比亚迪股份有限公司 | Device and method for making shell |
| CN104416915B (en) * | 2013-09-05 | 2017-07-04 | 比亚迪股份有限公司 | Make the device and method of housing |
| CN112512250A (en) * | 2015-08-11 | 2021-03-16 | 三星电子株式会社 | Method for manufacturing a housing and electronic device comprising a housing |
| CN112512250B (en) * | 2015-08-11 | 2022-03-25 | 三星电子株式会社 | Method for manufacturing a housing and electronic device comprising a housing |
| US11516930B2 (en) | 2015-08-11 | 2022-11-29 | Samsung Electronics Co., Ltd. | Method for manufacturing exterior housing and electronic device comprising same |
| US11805611B2 (en) | 2015-08-11 | 2023-10-31 | Samsung Electronics Co., Ltd. | Method for manufacturing exterior housing and electronic device comprising same |
| CN108472848A (en) * | 2015-08-31 | 2018-08-31 | 统实业有限公司 | Injection forming equipment and method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101337419B (en) | 2012-09-19 |
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