CN103358215A - Polishing machining device - Google Patents
Polishing machining device Download PDFInfo
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- CN103358215A CN103358215A CN 201210100798 CN201210100798A CN103358215A CN 103358215 A CN103358215 A CN 103358215A CN 201210100798 CN201210100798 CN 201210100798 CN 201210100798 A CN201210100798 A CN 201210100798A CN 103358215 A CN103358215 A CN 103358215A
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- China
- Prior art keywords
- polishing
- interference fringe
- processing device
- coherent
- beam splitter
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- Length Measuring Devices By Optical Means (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a polishing machining device which is used for performing polishing machining on a workpiece to be polished. The polishing machining device comprises a movable base body and a polishing cutter, wherein the polishing cutter is fixed on the movable base body. The movable base body is used for driving the polishing cutter to perform polishing machining. The polishing machining device further comprises a flatness detecting unit which is fixedly arranged on the movable base body and located behind the proceeding direction in which polishing machining is performed by the polishing cutter, and the flatness detecting unit is used for detecting the surface flatness of the polishing cutter along the polishing machining track of the polishing cutter after the polishing cutter performs polishing machining.
Description
Technical field
The present invention relates to a kind of polishing processing device.
Background technology
Along with the development of science and technology, very the requirement of product effects on surface flatness day by day improved, reach requirement for making the product surface flatness, prior art adopts the polishing processing device that product surface or formed product die surface are carried out polishing usually.
Existing polishing processing device generally comprises a polishing tool and a base of tool that drives described polishing tool moving linearly.The described base of tool drives by precision and guiding device can drive described polishing tool and treats polishing workpiece and polish.So, owing to unavoidably can produce chip in the polishing process, bad if described chip is discharged, will have a strong impact on the precision of polishing.In addition, in polishing process, if polishing tool weares and teares because of processing, then polishing also can descend.In the prior art, owing to can't learn in time that chip is discharged the wear condition of situation and processing stage property in the polishing process, so can not learn in real time whether the polished workpiece of institute's polishing meets the requirements.
Summary of the invention
In view of this, be necessary to provide a kind of polishing processing device that can Real Time Monitoring polishing situation.
A kind of polishing processing device is used for treating polished part and carries out polishing.Described polishing processing device comprises a movable pedestal and a polishing tool.Described polishing tool is fixed on the described movable pedestal.Described movable pedestal is used for driving described polishing tool and carries out polishing.Described polishing processing device comprises a flatness detecting unit, described flatness detecting unit is fixedly installed on the described movable pedestal and is positioned at the direct of travel rear that described polishing tool carries out polishing, for the surface planarity of described polishing tool behind the polishing track detection polishing that follows described polishing tool.
With respect to prior art, polishing processing device of the present invention adopts the flatness detecting unit that is arranged at described polishing tool direct of travel rear to carry out flatness to polished behind described polishing tool polishing and detects, can learn in real time the surface planarity situation of polishing, therefore can in time adjust polishing tool according to described flatness situation, improve the precision of polishing.In addition, owing to can learn in real time whether the flatness on the plane that processes meets the requirements, if flatness is undesirable, then only need previous sub-fraction burnishing surface is processed again, therefore can prevent described polished whole again processing, the efficient of polishing is provided.
Description of drawings
Fig. 1 is the schematic diagram of the polishing processing device of first embodiment of the invention.
Fig. 2 is that the polishing processing device of Fig. 1 carries out the schematic diagram that flatness detects.
Fig. 3 is the schematic diagram of the polishing processing device of second embodiment of the invention.
Fig. 4 is that the polishing processing device of Fig. 3 carries out the schematic diagram that flatness detects.
The main element symbol description
| |
100，100’ |
| |
10，10’ |
| |
20，20’ |
| The cutter |
21 |
| The |
30，30’ |
| |
31，31’ |
| |
32，32’ |
| |
33，33’ |
| The interference |
34，34’ |
| The interference |
35，35’ |
| |
351 |
| |
352 |
| Polished | 200 |
The following specific embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
The specific embodiment
Below in conjunction with accompanying drawing the present invention being done one specifically introduces.
See also Fig. 1 and Fig. 2, be the schematic diagram of the polishing processing device 100 of first embodiment of the invention, described polishing processing device 100 is used for treating polished part 200 surfaces and carries out polishing.Described polishing processing device 100 comprises a movable pedestal 10, a polishing tool 20 and a flatness detecting unit 30.
Described movable pedestal 10 is used for fixing described polishing tool 20 and described flatness detecting unit 30.Described movable pedestal 10 can be adjusted the fixed position of described polishing tool 20 and can drive the motion of described polishing tool 20 and described flatness detecting unit 30 under the effect of CD-ROM drive motor (not shown) and guiding device (not shown).
Described polishing tool 20 is used for polishing described polished surface.Described polishing tool 20 has a cutter front end 21, when polishing, described cutter front end 21 contacts with described polished 200, so that described polished 200 rats are pruned, according to the difference of polished 200 materials, the material of described polishing tool 20 can be different.In the present embodiment, described polished 200 is the die of the ejection shaping die of the metals such as copper coating or nickel, and described cutter front end 21 is diamond.
Described polished 200 surface planarity after described flatness detecting unit 30 polishes for the described polishing tool 20 of polishing track detection that follows described polishing tool 20 judges according to testing result whether described surface planarity meets the requirements.Described flatness detecting unit 30 comprises a coherent source 31, a beam splitter 32, a speculum 33, an interference fringe receiving element 34 and an interference fringe analysis unit 35.
Described coherent source 31 is for generation of coherent ray and with the described beam splitter 32 of described coherent ray directive.In the present embodiment, the direct of travel of the coherent ray L1 that described coherent source 31 produces is parallel with the direct of travel that described polishing tool 20 carries out polishing.Described coherent source 31 is laser generator.
Described beam splitter 32 is arranged on the light path of the coherent ray L1 that described coherent source 31 produces, be used for described coherent ray L1 is divided into two bundle coherent ray L2, L3, wherein, light L2 is described polished 200 surfaces of directive after described beam splitter 32 reflections, and light L3 throws the described speculum 33 of described beam splitter 32 rear directives.In the present embodiment, described beam splitter 32 is the Transflective optical thin film, and namely the transmissivity of described beam splitter 32 and reflectivity roughly respectively are 50%.
Described speculum 33 is arranged on the light path of light L3, is used for described light L3 is reflected back described beam splitter 32.On described polished 200 light path that is positioned at light L2, described light L2 can be reflected back described beam splitter 32.Wherein, the light L4 that crosses described beam splitter 32 through described polished 200 reflection and transmission with through described speculum 33 reflections and identical through the direct of travel of the light L5 of described beam splitter reflection, so described light L4 and light L5 are coherent ray.In addition, described speculum 33 can along near or move away from the direction of described beam splitter, to adjust the optical path difference between described light L4 and the light L5.
Described interference fringe receiving element 34 is arranged on the light path of described light L4 and described light L5, is used for receiving described light L4 and the formed interference fringe of light L5.Described interference fringe receiving element 34 can be CCD(charge-coupled device) or CMOS(complementary metal oxide semiconductor).
Described interference fringe analysis unit 35 is used for analyzing the received interference fringe of described interference fringe receiving element 34, draws described polished 200 surface planarity situation.Described interference fringe analysis unit 35 comprises a memory 351 and a processor 352.Prestore the corresponding flatness situation of interference fringe of different patterns in the described memory 351, described processor 352 is according to the feature of the received described interference fringe of interference fringe analysis of described interference fringe receiving element 34, and according to the interference fringe pattern that prestores in the described memory 351 of characteristic matching of described interference fringe, further obtain described polished 200 surface planarity.Described interference fringe analysis unit 35 can obtain described polished 200 surface planarity and exports to display unit (not shown) and show described, perhaps, described interference fringe analysis unit 35 further calculates described polishing tool 20 according to resulting described polished 200 surface planarity needs the position quantity adjusted, and described position quantity is fed back to described movable pedestal 10 carries out the position adjustment of described polishing tool 20.
When carrying out polishing, at first carry out the contraposition between described polishing tool 20 and described polished 200, set polishing position and the polishing degree of depth of described polishing tool 20; To described polished 200 polishing that carries out a segment distance; Open described flatness detecting unit 30, described coherent source 31 emission coherent ray L1 are to described beam splitter 32, described beam splitter 32 is divided into reflection ray L2 and transmitted ray L3 with described light L1, the surface of described light L2 vertical incidence to described polished 200 polishings, described light L3 vertical incidence is to described speculum 33; Described polished 200 and described speculum 33 are reflected back described beam splitter 32 with described light L2 and light L3 respectively, and described light L2 is incident to described interference fringe receiving element through described polished 200 reflection and the part light L2 and the described light L3 that see through described beam splitter 32 through speculum 33 reflections and through the part light L3 of described beam splitter 32 reflections; Adjust described speculum 33 along described light L3, so that form predetermined optical path difference between described light L5 and the light L4, namely light L4 and light L5 form the interference fringe of predetermined pattern on described interference fringe receiving element 34 surfaces; Fixing described speculum 33.After finishing, above-mentioned adjustment then can continue to carry out polishing to described polished 200.
In the polishing processing, if the surface planarity error that described polishing tool 20 processes is in allowed band, then the optical path difference between described light L4 and the light L5 changes less, the variation that is the interference fringe that receives of described interference fringe receiving element 34 is less, and then described interference fringe analysis unit 35 judges that the surface planarity that institute's polishings go out meets the requirements; If the surface planarity error that described polishing tool 20 processes has exceeded allowed band, then the optical path difference between described light L4 and the light L5 changes greatly, the variation that is the interference fringe that receives of described interference fringe receiving element 34 is larger, this moment, the flatness situation of institute's finished surface was judged in described interference fringe analysis unit 35 according to the variation of described interference fringe, and calculate the relevant position compensation rate of described polishing tool according to described flatness situation, then described movable pedestal 10 can be according to the position of the described polishing tool 20 of the corresponding adjustment of position compensation amount of described polishing tool 20, with timely minimizing or eliminate the flatness error of the burnishing surface on described polished 200.
See also Fig. 3 and Fig. 4, be the schematic diagram of the polishing processing device 100 ' of second embodiment of the invention, described polishing processing device 100 ' comprises 10 ', one polishing tool 20 ' of a movable pedestal and a flatness detecting unit 30 '.Described movable pedestal and described polishing tool are similar with movable pedestal 10 and the polishing tool 20 of the first embodiment respectively.
Described flatness detecting unit 30 ' comprises coherent source 31 ', a beam splitter 32 ', a speculum 33 ', an interference fringe receiving element 34 ' and an interference fringe analysis unit 35 '.Described coherent source 31 ', beam splitter 32 ', speculum 33 ', interference fringe receiving element 34 ' and interference fringe analysis unit 35 ' respectively with the first embodiment in coherent source 31, beam splitter 32, speculum 33, interference fringe receiving element 34 and interference fringe analysis unit 35 have similar function.Different persons be: the direct of travel of the coherent ray L1 ' that described coherent source 31 ' is launched is vertical with the direct of travel that described polishing tool 20 ' carries out polishing, described beam splitter 32 is divided into reflecting part light L2 ' and transmissive portion light L3 ' with described coherent ray L1 ', described polished of described light L3 ' directive, the described speculum 33 ' of described light L2 ' directive, described speculum 33 ' is arranged on the light path of described light L2 '.Through the 33 ' reflection of described speculum and through the light L4 ' of described beam splitter reflection with through described polished 200 reflect and transmission to cross the direct of travel of light L5 ' of described beam splitter 32 ' identical, described interference fringe receiving element 34 ' is positioned on the light path of described light L4 ' and light L5 '.Described flatness detecting unit 30 ' can be realized the function identical with the flatness detecting unit 30 of the first embodiment.
Should illustrate, described coherent source 31(31 '), described beam splitter 32(32 '), described speculum 33(33 ') and described interference fringe receiving element 34(34 ') set-up mode and setting position be not limited to description in the first embodiment and the second embodiment, as long as described beam splitter 32(32 ') can be with the two-beam line that the separates described speculum 33(33 ' of directive respectively) and described polished 200, and described interference fringe receiving element 34(34 ') can receive through described speculum 33(33 ') and the light of the light of described polished 200 reflection get final product.
Polishing processing device of the present invention adopts the flatness detecting unit that is arranged at described polishing tool direct of travel rear to carry out flatness to polished behind described polishing tool polishing and detects, can learn in real time the surface planarity situation of polishing, therefore can in time adjust polishing tool according to described flatness situation, improve the precision of polishing.In addition, owing to can learn in real time whether the flatness on the plane that processes meets the requirements, if flatness is undesirable, then only need previous sub-fraction burnishing surface is processed again, therefore can prevent described polished whole again processing, the efficient of polishing is provided.
In addition, those skilled in the art also can do other variation in spirit of the present invention, and certainly, the variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.
Claims (10)
1. polishing processing device, be used for treating polished part and carry out polishing, described polishing processing device comprises a movable pedestal and a polishing tool, described polishing tool is fixed on the described movable pedestal, described movable pedestal is used for driving described polishing tool and carries out polishing, it is characterized in that: described polishing processing device also comprises a flatness detecting unit, described flatness detecting unit is fixedly installed on the described movable pedestal and is positioned at the direct of travel rear that described polishing tool carries out polishing, for described polished surface planarity behind the polishing track detection polishing that follows described polishing tool.
2. polishing processing device as claimed in claim 1, it is characterized in that: described flatness detecting unit comprises a coherent source, a beam splitter, a speculum, an interference fringe receiving element and an interference fringe analysis unit, described coherent source is for generation of coherent ray and with the described beam splitter of described coherent ray directive, described beam splitter is used for described coherent ray is divided into two surfaces of restrainting after coherent rays also are projected to described two wherein a branch of coherent rays of restrainting coherent rays described polished polishing, described speculum be arranged at described two the bundle coherent rays another the bundle coherent ray light path on, be used for described another bundle coherent ray is reflected back described beam splitter, described interference fringe receiving element is arranged at the light of the light of described polished reflection and described mirror reflects through on the common light path behind the described beam splitter, and described interference fringe analysis unit links to each other with described interference fringe receiving element for the surface planarity situation after analyzing the received interference fringe of described interference fringe receiving element and drawing described polished polishing.
3. polishing processing device as claimed in claim 2, it is characterized in that: the direct of travel of the coherent ray that described coherent source produces is parallel with the direct of travel that described polishing tool carries out polishing.
4. polishing processing device as claimed in claim 2, it is characterized in that: the direct of travel of the coherent ray that described coherent source produces is vertical with the direct of travel that described polishing tool carries out polishing.
5. polishing processing device as claimed in claim 2, it is characterized in that: described beam splitter is the Transflective optical thin film.
6. polishing processing device as claimed in claim 2 is characterized in that: described speculum can along described away from or move near the direction of described beam splitter.
7. polishing processing device as claimed in claim 2, it is characterized in that: described interference fringe receiving element is CCD or CMOS.
8. polishing processing device as claimed in claim 2, it is characterized in that: described interference fringe analysis unit comprises a memory and a processor, prestore the corresponding flatness situation of interference fringe of different patterns in the described memory, described processor is according to the feature of the received described interference fringe of interference fringe analysis of described interference fringe receiving element, and according to the interference fringe pattern that prestores in the described memory of characteristic matching of described interference fringe, further obtain described polished surface planarity situation.
9. polishing processing device as claimed in claim 8, it is characterized in that: described interference fringe analysis unit also further calculates the position quantity that described polishing tool need to be adjusted according to resulting described polished surface planarity situation, and described position quantity is fed back to the position adjustment that described movable pedestal carries out described polishing tool.
10. polishing processing device as claimed in claim 2, it is characterized in that: described coherent source is laser generator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210100798 CN103358215A (en) | 2012-04-09 | 2012-04-09 | Polishing machining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201210100798 CN103358215A (en) | 2012-04-09 | 2012-04-09 | Polishing machining device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103358215A true CN103358215A (en) | 2013-10-23 |
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ID=49360928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201210100798 Pending CN103358215A (en) | 2012-04-09 | 2012-04-09 | Polishing machining device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103358215A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104290017A (en) * | 2014-10-30 | 2015-01-21 | 浙江久德不锈钢型材有限公司 | Comparison type sectional material section polishing device |
| CN108088388A (en) * | 2018-01-15 | 2018-05-29 | 中国工程物理研究院机械制造工艺研究所 | A kind of workpiece polishes detection device |
| CN109551367A (en) * | 2018-11-20 | 2019-04-02 | 无锡继平锻造有限公司 | A kind of tube sheet production measurement and bearing calibration of tube sheet surface evenness |
-
2012
- 2012-04-09 CN CN 201210100798 patent/CN103358215A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104290017A (en) * | 2014-10-30 | 2015-01-21 | 浙江久德不锈钢型材有限公司 | Comparison type sectional material section polishing device |
| CN108088388A (en) * | 2018-01-15 | 2018-05-29 | 中国工程物理研究院机械制造工艺研究所 | A kind of workpiece polishes detection device |
| CN109551367A (en) * | 2018-11-20 | 2019-04-02 | 无锡继平锻造有限公司 | A kind of tube sheet production measurement and bearing calibration of tube sheet surface evenness |
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Application publication date: 20131023 |