CN103351806A - Organic silicon resin heat dissipating coating and preparation method thereof - Google Patents
Organic silicon resin heat dissipating coating and preparation method thereof Download PDFInfo
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- CN103351806A CN103351806A CN2013102100620A CN201310210062A CN103351806A CN 103351806 A CN103351806 A CN 103351806A CN 2013102100620 A CN2013102100620 A CN 2013102100620A CN 201310210062 A CN201310210062 A CN 201310210062A CN 103351806 A CN103351806 A CN 103351806A
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Abstract
The invention discloses an organic silicon resin heat dissipating coating and a preparation method thereof. The raw materials of the coating comprise 60-70 parts of an organic silicon resin, 2.5-3.0 parts of butadiene, 75-85 parts of methyl ethyl ketone, 5.5-6.5 parts of alum powder, 2.8-3.2 parts of titanium dioxide, 7.0-8.0 parts of polyethylene wax, 6.0-6.5 parts of diaminodipenylsulfone, 0.6-0.8 parts of methylethyl ketone peroxide, 3.3-3.5 parts of meerschaum powder, 1.7-1.9 parts of dimethyl succinate, 3.0-5.0 parts of anilinomethyltriethoxysilane and 15-20 parts of aluminum nitride. The film of the coating has the advantages of good durability, good water resistance, good moisture resistance, good corrosion resistance and extremely good adhesiveness.
Description
Technical field
The present invention relates to technical field of coatings, be specifically related to a kind of silicone resin heat radiation coating and preparation method thereof.
Background technology
Along with the rapid expansion of light fixture use range, prolong light fixture and also become urgent problem work-ing life; Adopt at present heat-conducting glue to solve the light fixture heat dissipation problem, but there is heatproof and ageing-resistant poor in its employed material, the technical problem little to the base material cohesive force, that radiating effect is not good and construction is inconvenient is difficult to satisfy people to the requirement of light fixture heat radiation.
Summary of the invention
The object of the present invention is to provide a kind of silicone resin heat radiation coating and preparation method thereof.
The present invention adopts following technical scheme:
A kind of silicone resin heat radiation coating is characterized in that the weight part of its constitutive material is: silicone resin 60-70, divinyl 2.5-3.0, methylethylketone 75-85, alum powder 5.5-6.5, titanium dioxide 2.8-3.2, polyethylene wax powder 7.0-8.0, diamino diphenyl sulfone 6.0-6.5, methylethyl ketone peroxide 0.6-0.8, sepiolite powder 3.3-3.5, dimethyl succinate 1.7-1.9, anilinomethyl triethoxysilane 3.0-5.0 and aluminium nitride 15-20.
Described silicone resin heat radiation coating is characterized in that the weight part of its constitutive material is: silicone resin 65, divinyl 2.8, methylethylketone 80, alum powder 6.0, titanium dioxide 3.0, polyethylene wax powder 7.5, diamino diphenyl sulfone 6.2, methylethyl ketone peroxide 0.7, sepiolite powder 3.4, dimethyl succinate 1.8, anilinomethyl triethoxysilane 4.0 and aluminium nitride 18.
The preparation method of described silicone resin heat radiation coating is characterized in that may further comprise the steps:
(1) divinyl, alum powder, dimethyl succinate are mixed, be heated to 75-85 ℃, stir, add methylethyl ketone peroxide, reacted 30-40 minute, add again anilinomethyl triethoxysilane, reacted 1-2 hour;
(2) take by weighing other residue constitutive materials such as silicone resin by the weight part of constitutive material, in step when joining (1) material, then mix and stir, when being ground to 10-15 μ m; Stop to grind packing.
Beneficial effect of the present invention:
The present invention adopts divinyl, alum powder, dimethyl succinate and crosslinked with silicane, has increased the film forming characteristics of heat radiation coating, the persistence of filming, water-fast, moisture-proof, good corrosion resistance, and adhesion property is splendid.
During construction, the heat radiation coating spraying application 60 ℃ of lower oven dry 1 hour, gets final product film forming, makes 30-50 μ m heat radiation coating.
Embodiment
Embodiment 1: the silicone resin heat radiation coating, the weight part of its constitutive material (kg) is: silicone resin 65, divinyl 2.8, methylethylketone 80, alum powder 6.0, titanium dioxide 3.0, polyethylene wax powder 7.5, diamino diphenyl sulfone 6.2, methylethyl ketone peroxide 0.7, sepiolite powder 3.4, dimethyl succinate 1.8, anilinomethyl triethoxysilane 4.0 and aluminium nitride 18.
The preparation method of described silicone resin heat radiation coating is characterized in that may further comprise the steps:
(1) divinyl, alum powder, dimethyl succinate are mixed, be heated to 75-85 ℃, stir, add methylethyl ketone peroxide, reacted 30-40 minute, add again anilinomethyl triethoxysilane, reacted 1-2 hour;
(2) take by weighing other residue constitutive materials such as silicone resin by the weight part of constitutive material, in step when joining (1) material, then mix and stir, when being ground to 10-15 μ m; Stop to grind packing.
The heat radiation coating direct spraying that above-described embodiment 1 makes is in through on the glass lamp that cleans up, the heatproof test: behind the 190 ℃/3h of baking oven baking, the baking oven baking after 135 ℃/15 days glass lamp coat color and luster without considerable change; Uviolizing 3h, not shedding of coating is non-yellowing, artificial accelerated aging test under 120 ℃ and 300W ultraviolet light irradiation condition, 5250 hours ageing-resistant time, 250 ℃ of heatproof high temperature, bonding shearing force 21.8MPa., thermal conductivity 285W/(mK).
Claims (3)
1. a silicone resin heat radiation coating is characterized in that the weight part of its constitutive material is: silicone resin 60-70, divinyl 2.5-3.0, methylethylketone 75-85, alum powder 5.5-6.5, titanium dioxide 2.8-3.2, polyethylene wax powder 7.0-8.0, diamino diphenyl sulfone 6.0-6.5, methylethyl ketone peroxide 0.6-0.8, sepiolite powder 3.3-3.5, dimethyl succinate 1.7-1.9, anilinomethyl triethoxysilane 3.0-5.0 and aluminium nitride 15-20.
2. silicone resin heat radiation coating according to claim 1 is characterized in that the weight part of its constitutive material is: silicone resin 65, divinyl 2.8, methylethylketone 80, alum powder 6.0, titanium dioxide 3.0, polyethylene wax powder 7.5, diamino diphenyl sulfone 6.2, methylethyl ketone peroxide 0.7, sepiolite powder 3.4, dimethyl succinate 1.8, anilinomethyl triethoxysilane 4.0 and aluminium nitride 18.
3. the preparation method of a silicone resin heat radiation coating as claimed in claim 1 is characterized in that may further comprise the steps:
(1) divinyl, alum powder, dimethyl succinate are mixed, be heated to 75-85 ℃, stir, add methylethyl ketone peroxide, reacted 30-40 minute, add again anilinomethyl triethoxysilane, reacted 1-2 hour;
(2) take by weighing other residue constitutive materials such as silicone resin by the weight part of constitutive material, in step when joining (1) material, then mix and stir, when being ground to 10-15 μ m; Stop to grind packing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102100620A CN103351806A (en) | 2013-05-30 | 2013-05-30 | Organic silicon resin heat dissipating coating and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102100620A CN103351806A (en) | 2013-05-30 | 2013-05-30 | Organic silicon resin heat dissipating coating and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
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| CN103351806A true CN103351806A (en) | 2013-10-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013102100620A Pending CN103351806A (en) | 2013-05-30 | 2013-05-30 | Organic silicon resin heat dissipating coating and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109539191A (en) * | 2018-11-19 | 2019-03-29 | 安徽蓝锐电子科技有限公司 | A kind of LED lamp that heat dissipation performance is outstanding |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101353553A (en) * | 2008-09-02 | 2009-01-28 | 飞力固有限公司 | Heat radiation coating and preparation thereof |
| CN102627912A (en) * | 2012-03-20 | 2012-08-08 | 江苏同辉照明科技有限公司 | Preparation method of lighting tube heat dissipation paint |
| CN102775908A (en) * | 2012-08-21 | 2012-11-14 | 华塑（青岛）科技有限公司 | Preparation method of heat-dissipation coating for LED (Light Emitting Diode) lamps |
| CN102838922A (en) * | 2012-08-10 | 2012-12-26 | 青岛太阳能电力研究院有限公司 | Method for preparing radiation cooling coating |
-
2013
- 2013-05-30 CN CN2013102100620A patent/CN103351806A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101353553A (en) * | 2008-09-02 | 2009-01-28 | 飞力固有限公司 | Heat radiation coating and preparation thereof |
| CN102627912A (en) * | 2012-03-20 | 2012-08-08 | 江苏同辉照明科技有限公司 | Preparation method of lighting tube heat dissipation paint |
| CN102838922A (en) * | 2012-08-10 | 2012-12-26 | 青岛太阳能电力研究院有限公司 | Method for preparing radiation cooling coating |
| CN102775908A (en) * | 2012-08-21 | 2012-11-14 | 华塑（青岛）科技有限公司 | Preparation method of heat-dissipation coating for LED (Light Emitting Diode) lamps |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109539191A (en) * | 2018-11-19 | 2019-03-29 | 安徽蓝锐电子科技有限公司 | A kind of LED lamp that heat dissipation performance is outstanding |
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Application publication date: 20131016 |
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