CN103348199B - Liquid-cooling system and the method for cooling at least one heat generating component - Google Patents
Liquid-cooling system and the method for cooling at least one heat generating component Download PDFInfo
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- CN103348199B CN103348199B CN201280003467.0A CN201280003467A CN103348199B CN 103348199 B CN103348199 B CN 103348199B CN 201280003467 A CN201280003467 A CN 201280003467A CN 103348199 B CN103348199 B CN 103348199B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/04—Refrigeration circuit bypassing means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The present invention relates to a kind of for cooling the liquid-cooling system (2) of at least one heat generating component (10), wherein said liquid-cooling system (2) comprises fluid loop (4), liquid (6) is through arranging with circulation in described fluid loop (4), wherein said liquid (6) is through arranging to be cooled by first order cooling unit (14), the wherein position of the upstream in the downstream and described at least one heat generating component (10) that will by liquid (6) be cooled of cold side (26) through being arranged in described first order cooling unit (14) of at least one thermoelectric-cooled unit (24), at least one thermoelectric-cooled unit (24) wherein said is through arranging to cool described liquid (6) under its mode of operation, thus provide other cooling capacity when the cooling capacity of described first order cooling unit (14) is not enough, wherein said liquid (6) is further through arranging the hot side (32) to cool at least one thermoelectric-cooled unit (24) described, and the transfer of heat produced by least one thermoelectric-cooled unit (24) described is to described first order cooling unit (14), described first order cooling unit (14) is through arranging transfer of heat to be gone out from described liquid (6).The invention still further relates to a kind of method for using liquid-cooling system (2) to cool at least one heat generating component (10), described liquid-cooling system (2) comprises fluid loop (4), and liquid (6) is through arranging with circulation in described fluid loop (4).
Description
Technical field
The present invention relates to a kind of liquid-cooling system.The invention still further relates to the method for cooling at least one heat generating component.
Background technology
Cooling system in different applications for cooling purposes, such as, cools the PCB (printed circuit board (PCB)) on telecomm base station system equipment or chip or the assembly such as memory cell or power amplifier.
Assembly to be cooled, such as PCB, can use radiator to cool, and places assembly to be cooled, thus the heat of assembly can be delivered to radiator by nestling up foot of radiator.
If need more cooling capacity, so can arrange the pressure cooling of radiator, namely, arrange fan, described fan forces air-flow to pass the surface of radiator cooling fins, thus with the cooler surrounding air from radiator outside replace around cooling fins by air that the heat from cooling fins heats.
Because the bottom area of the assembly such as such as PCB or chip etc. in telecommunication technology field is usually limited, and needs are settled more and more functional on the bottom area of the restriction of assembly, therefore develop more powerful assembly.Such as, the capacity of assembly is improved by manufacturing the higher assembly of integrated level.This increase of assembly capacity makes may be more than in the past to the power of assembly supply on unit component bottom area, can cause when using to greatest extent so again---such as, during reaching the peak traffic in telecomm base station system---the heat that assembly radiates on unit bottom area is more than in the past, namely, the maximum heating load of assembly increases, may be larger because be fed to the power of assembly by power every square centimeter (W/cm2) bottom area.
When the pressure cooling of the use air of the radiator that base is placed near assembly to be cooled is not enough to cooling package, other methods such as such as liquid cools must be used.
Usually, liquid-cooling system comprises a loop, is primary circuit system, that is, only comprise first order loop.Liquid in loop is circulated in the loop by pump, wherein carry out forcing cooling to described liquid further: the liquid stream in loop is through the radiator with cooling fins, described cooling fins is cooled by the surrounding air that cooling fins outside is forced to flow through, and the liquid wherein in loop is heated by the heat from least one heat generating component further.
In the primary circuit cooling system of the above-mentioned type, can not by below liquid cools to the temperature of surrounding air.For can, by below liquid cools to the temperature of surrounding air, need to use refrigeration cooler.
By replacing pump to realize refrigeration cooler with compressor, wherein said compressor is arranged in the downstream of radiator and the upstream of assembly to be cooled, thus can by below liquid cools to the temperature of surrounding air before liquid arrives assembly to be cooled, thus strengthen the cooling treating cooling package, the shortcoming of use compressor is: compared with pump, the mean free error time (MTBF) of compressor is shorter.
Also refrigeration cooler can be realized by being stayed by pump in above-mentioned primary circuit system, and add thermoelectric-cooled unit (TEC) in the upstream of the downstream of radiator and assembly to be cooled, thus can by below liquid cools to the temperature of surrounding air before liquid arrives assembly to be cooled, thus strengthen the cooling treating cooling package, even if shortcoming does not need the extra cooling capacity using TEC to provide to cool assembly to be cooled, TEC is necessary continuous firing also, another shortcoming is, each assembly to be cooled needs a TEC, namely, if there are two assemblies to be cooled, so just need two TEC, wherein two TEC must continuous firing.
No. 2003/088538A1st, the U.S. patent shows the two-stage cooling system comprising electrothermal module of another kind of type.
If need stronger cooling to arrive below liquid cools to the temperature of surrounding air before assembly to be cooled at liquid, also two-stage circuit system can be used, instead of primary circuit system, that is, use the system with the fluid loop that two are separated.There is certain methods can realize two-stage circuit system.Two-stage circuit system comprises through arranging with the first order fluid loop through assembly to be cooled, and through arranging with the second level fluid loop through radiator.Liquid in loop, the second level is circulated in the loop by pump, wherein second level liquid cools further by pressure cooling: second level liquid is flowing with in the radiator of cooling fins, described cooling fins is cooled by the surrounding air that cooling fins outside is forced to flow through, and wherein second level liquid is heated by the heat from the liquid in first order fluid loop further, and the liquid in two loops all flows through thermoelectric-cooled unit (TEC).TEC is through arranging to cool first order liquid: the hot side of TEC is connected to second level fluid loop, and the cold side of TEC is connected to first order fluid loop.Therefore, first order liquid is cooled when flowing through described TEC, wherein, first order liquid is further through arranging to flow through the cold drawing arranged near assembly to be cooled, thus heat transfers to cold drawing and first order liquid from assembly to be cooled, and assembly is therefore by first order liquid cools, and first order liquid is therefore by device heats, thus by below the first order liquid cools in above-mentioned cooling system to the temperature of surrounding air, and then the cooling treating cooling package can be enhanced.This solution does not need compressor, and shortcoming is, even if sometimes do not need, by below the first order liquid cools in above-mentioned cooling system to the temperature of surrounding air, also must connect TEC, thus cause unnecessary power consumption.
Summary of the invention
Target of the present invention is to provide the liquid-cooling system of improvement and the method for cooling at least one heat generating component of improvement.
Realize this goal for the liquid-cooling system cooling at least one heat generating component by arranging, wherein liquid-cooling system comprises fluid loop, liquid is through arranging to circulate in the loop, wherein liquid is through arranging to be cooled by the first order cooling unit of liquid-cooling system, wherein the cold side of at least one thermoelectric-cooled unit is through being arranged in the downstream of first order cooling unit and at least one is by the position of the upstream of the heat generating component by liquid cools, wherein at least one thermoelectric-cooled unit is through arranging with cooling liquid under its mode of operation, thus provide other cooling capacity when the cooling capacity of first order cooling unit is not enough, wherein liquid is further through arranging with the hot side cooling at least one thermoelectric-cooled unit, and the transfer of heat produced by least one thermoelectric-cooled unit is to first order cooling unit, described first order cooling unit is through arranging transfer of heat to be gone out from liquid.
Realized this goal further by the method using liquid-cooling system to cool at least one heat generating component, described liquid-cooling system comprises fluid loop, liquid, through arranging to circulate in the loop, said method comprising the steps of: be arranged as by liquid and cooled by the first order cooling unit of liquid-cooling system; At least cold side of a thermoelectric-cooled unit is arranged in the downstream of first order cooling unit and at least one is by the position of the upstream of the heat generating component by liquid cools; Be cooling liquid under its mode of operation by least one thermoelectric-cooled cell layout, thus provide other cooling capacity when the cooling capacity of first order cooling unit is not enough; Comprise further and arrange that liquid is to cool the hot side of at least one thermoelectric-cooled unit, and by the step of the transfer of heat of at least one thermoelectric-cooled unit generation to first order cooling unit, described first order cooling unit is through arranging transfer of heat to be gone out from liquid.
By arranging the liquid-cooling system with fluid loop, wherein liquid is through arranging to circulate in the loop, wherein liquid through arrange with cool at least one thermoelectric-cooled unit hot side and by least one thermoelectric-cooled unit produce transfer of heat to first order cooling unit, described first order cooling unit is through arranging transfer of heat to be gone out from liquid, through arranging that the liquid at least one heat generating component of cooling can further in order to cool the hot side of at least one thermoelectric-cooled unit, and the heat produced by least one thermoelectric-cooled unit migrates out the space around thermoelectric-cooled unit at first order cooling unit place, and migrate out liquid-cooling system.This is very favourable, because therefore thermoelectric-cooled unit can be arranged in crossing in heat sensitive narrow space, and first order cooling unit can be arranged in and has greater room and to the insensitive position of heat emission, and then at placement second level cooling unit, i.e. in the design of thermoelectricity cooling unit, have more freedom.Another advantage need not be the hot side of cooling thermoelectricity cooling unit and arrange extra fluid loop.
With in the liquid-cooling system of fluid loop, wherein liquid is through arranging to circulate in the loop, by the cold side of thermoelectric-cooled unit being arranged in the downstream of first order cooling unit and at least one is by the position of the upstream of the heat generating component by liquid cools, the temperature of liquid in fluid loop can be reduced to below the temperature of the liquid leaving the first cooling unit.
With in the liquid-cooling system of fluid loop, wherein liquid is through arranging to circulate in the loop, by the cold side of thermoelectric-cooled unit being arranged in the downstream of first order cooling unit and at least one is by the position of the upstream of the heat generating component by liquid cools, when not needing to add compressor in the loop, the temperature of liquid in fluid loop can be reduced to below environment temperature, due to moving-member need not be added, when therefore this is integrated with refrigerating function in liquid-cooling system, ensure that longer MTBF.In addition, the shape of thermoelectric-cooled unit also can be changeable, therefore can be arranged in narrow space.
With in the liquid-cooling system of fluid loop, wherein liquid is through arranging to circulate in the loop, by the cold side of thermoelectric-cooled unit being arranged in the downstream of first order cooling unit and at least one is by the position of the upstream of the heat generating component by liquid cools, can only just must operate thermoelectric-cooled unit when needs additionally cool.
According to one embodiment of present invention, liquid-cooling system comprises a pump, and described pump is through arranging to make liquid circulate in fluid loop.
According to one embodiment of present invention, liquid-cooling system comprises a cold drawing, and described cold drawing is through arranging to become thermo-contact with at least one heat generating component to be cooled and liquid.
According to one embodiment of present invention, the described position of cold side through being arranged as the upstream of the heat generating component to be cooled with at least one in the downstream of first order cooling unit of at least one thermoelectric-cooled unit becomes thermo-contact with liquid.
According to one embodiment of present invention, liquid-cooling system comprises a cold drawing, and cold side and the liquid of described cold drawing and at least one thermoelectric-cooled unit become thermo-contact.
According to one embodiment of present invention, the hot side of at least one thermoelectric-cooled unit becomes thermo-contact through being arranged as with liquid.
According to one embodiment of present invention, liquid-cooling system comprises a cold drawing, and hot side and the liquid of described cold drawing and at least one thermoelectric-cooled unit become thermo-contact.
According to one embodiment of present invention, the position in the downstream of hot side through being arranged as last assembly at least one heat generating component to be cooled described of at least one thermoelectric-cooled unit becomes thermo-contact with described liquid.
According to one embodiment of present invention, at least one heat generating component to be cooled is chip.
According to one embodiment of present invention, liquid-cooling system comprises at least one liquid bypass be arranged in fluid loop, at least one liquid bypass wherein said is arranged in parallel with at least one thermoelectric-cooled unit (TEC) in the loop, walk around at least one thermoelectric-cooled unit at least partially with what make to flow to the liquid of at least one heat generating component to be cooled from first order cooling unit, and thermo-contact can not be produced with the cold side of at least one thermoelectric-cooled unit.
According to one embodiment of present invention, liquid-cooling system comprises at least one volume control device be arranged at least one bypass, thus ensure that the amount that opposing connection crosses the liquid of thermoelectricity cooling unit controls.
According to one embodiment of present invention, liquid-cooling system comprises control unit, described control unit is through arranging to control at least one volume control device at least one liquid bypass, and/or the voltage controlled at least one thermoelectric-cooled unit, thus control the temperature through arranging the liquid to cool at least one heat generating component to be cooled.
According to one embodiment of present invention, comprise at least one liquid bypass be arranged in fluid loop, at least one liquid bypass wherein said is arranged in parallel with at least one thermoelectric-cooled unit (TEC) in the loop, walk around at least one thermoelectric-cooled unit at least partially with what make to flow to the liquid of at least one first order cooling unit from least one heat generating component to be cooled, and thermo-contact can not be produced with the hot side of at least one thermoelectric-cooled unit.
Other advantage of the present invention is apparent from following illustrating.
Accompanying drawing explanation
Accompanying drawing is intended to illustrate and explain different embodiments of the invention, wherein:
Figure 1 shows that the schematic diagram of the two-stage liquid design of Cooling System of prior art;
Figure 2 shows that the schematic diagram of the liquid-cooling system according to the first embodiment of the present invention, and
Figure 3 shows that the schematic diagram of liquid-cooling system according to a second embodiment of the present invention.
Detailed description of the invention
Illustrate in conjunction with this, what vocabulary " liquid " referred to is the such as fluid such as water, ethylene glycol, and the mixture of fluid, such as, comprise the mixture etc. of water and ethylene glycol.
Figure 1 shows that the schematic diagram of the two-stage liquid design of Cooling System of prior art, two-stage liquid cooling system 1 comprises: first order fluid loop 3, through arranging to flow through assembly 5 to be cooled; With second level fluid loop 7, through arranging to flow through radiator 9.Liquid 11 in loop, the second level 7 passes through pump 13 at loop Inner eycle, wherein second level liquid 11 further through force cooling cool: second level liquid 11 with the radiator 9 of cooling fins 15 in flowing, described cooling fins 15 is cooled by the surrounding air 17 that cooling fins 15 outside is forced to flow through, and wherein second level liquid 11 is heated by the heat from the liquid 19 in first order fluid loop 3 further, and the liquid 11,19 in two loops 3,7 flows through thermoelectric-cooled unit (TEC) 21.TEC21 is connected to second level fluid loop 7 through arranging with the hot side 23 cooling first order liquid 19:TEC21, and the cold side 25 of TEC21 is connected to first order fluid loop 3.Therefore, first order liquid 19 is cooled when flowing through described TEC21, wherein first order liquid 19 is further through arranging to flow through the cold drawing 27 abutting against assembly 5 to be cooled and arrange, heat thus transfer to cold drawing 27 and first order liquid 19 from assembly 5, thus assembly 5 is cooled by first order liquid 19, and thus first order liquid 19 heated by assembly 5.By adopting TEC21, the first order liquid 19 in above-mentioned cooling system 1 can be cooled to below the temperature of surrounding air 17, thus enhance the cooling treating cooling package 5.Shortcoming is, even if sometimes do not need the first order liquid 19 in above-mentioned cooling system 1 to be cooled to below the temperature of surrounding air 17, also must connect TEC21, thus cause unnecessary power consumption, because the efficiency of TEC is relatively low.
Figure 2 shows that the schematic diagram of liquid-cooling system 2 according to a first embodiment of the present invention, wherein, liquid-cooling system 2 comprises fluid loop 4, and liquid 6 is through arranging to pass through pump 8 at loop Inner eycle.Liquid 6 is through arranging to cool the heat generating component 10 that at least one will be cooled by liquid 6: liquid 6 is through arranging to cool cold drawing 12, described cold drawing 12 through arrange with described at least one heat generating component 10 to be cooled and liquid 6 one-tenth thermo-contact, wherein liquid 6 is preferably through arranging to flow through cold drawing 12.Therefore, at least one heat generating component 10 to be cooled described is cooled by liquid 6: heat transfers to cold drawing 12 and liquid 6 from heat generating component 10, and thus liquid 6 heated by heat generating component 10.
Fluid loop 4 comprises liquid delivery path, and such as, conduit in cold drawing, flexible pipe, passage etc., liquid 6 is carried in the path for which.
In order to cooling liquid 6, described liquid is through arranging to be cooled by the first order cooling unit 14 of liquid-cooling system 2, wherein liquid 6 is preferably through arranging such as be cooled to environment temperature or more by using air 16, wherein liquid 6 is further preferably cooled by the forced draft of the air 16 being preferably surrounding air, and wherein forced draft is preferably produced by least one fan 18.First order cooling unit 14 preferably includes radiator 20, and wherein liquid 6 is preferably through arranging to flow through radiator 20, and wherein radiator 20 preferably includes cooling fins 22 further.Air 16 preferably through arranging with the outer surface flowing through some cooling fins 22, heat thus transfer to the air-flow of described air 16 from cooling fins 22.Radiator 20 can be replaced with heat exchanger.
When the cooling capacity of first order cooling unit 14 is not enough to cool at least one heat generating component 10 to be cooled, in order to provide other cooling capacity in this case, arrange at least one thermoelectric-cooled unit (TEC) 24 of liquid-cooling system 2 in operational conditions, namely, when turned on, TEC24 is in the downstream of first order cooling unit 14 and at least one is by cooling liquid 6 on a position between the upstream of heat generating component 10 that cooled by liquid 6, in described position, liquid 6 is through arranging with the cold side 26 one-tenth thermo-contact with at least one TEC24 described, wherein liquid 6 is preferably through arranging the cold side to flow through at least one TEC24 described, or the cold drawing 28 of the cold side 26 flowed through with at least one TEC24 described and liquid 6 one-tenth thermo-contact, wherein liquid 6 is preferably through arranging to flow through at least one passage disposed therein 30.By using TEC24, liquid 6 can be cooled to below environment temperature, namely, lower than through arrange with the temperature of the air 16 at first order cooling unit 14 place cooling liquid 6, therefore, the liquid 6 cooled by first order cooling unit 14 arrive described at least one by before the heat generating component 10 that cooled by liquid 6, cooled further by TEC24.
Thermoelectric-cooled unit (TEC), the note cooler also referred to as amber is active heat pump, and when TEC being applied with voltage and have direct current by TEC, described TEC is through arranging with hot side heat being transferred to device from the cold side of device.Thus use electric energy that heat is pumped into hot side from cold side, thus, cold side is cooled, and hot side is heated.
Thus electric power is used to produce temperature difference between the both sides of device.Can the cooling capacity of control TEC24 by changing voltage on TEC24, TEC24 is therefore through arranging with the thermic load of processing variation.
Because TEC24 efficiency is relatively low, therefore operationally, the hot side 32 of device produces a lot of heat.As shown in the figure, thus when loop 4 is arranged in such a way advantageously: preferably flow through at least one by last assembly in the heat generating component 10 that cooled by liquid 6 after, namely, in at least one downstream by last assembly in the heat generating component 10 that cooled by liquid 6, liquid 6 is through arranging with hot 32 one-tenth, the side thermo-contact with at least one TEC24, namely, through arrange with its thermal coupling, wherein liquid 6 is preferably through arranging with the cold drawing 34 of the hot side or the hot side 32 flowed through with at least one TEC24 and liquid 6 one-tenth thermo-contact that flow through at least one TEC24, wherein liquid 6 is preferably arranged in passage 36 wherein through arranging to flow through at least one.Therefore, liquid 6 can further in order to cool the hot side 32 of at least one TEC24, and the transfer of heat that at least one TEC24 produces is left the space around TEC24, thus at first order cooling unit 14 place, described transfer of heat being gone out liquid-cooling system 2, therefore liquid 6 heated by the hot side 32 of at least one TEC24.This is very favourable, because therefore TEC24 can be arranged in crossing in heat sensitive narrow space, and first order cooling unit 14 can be arranged in and has greater room and to the insensitive position of heat emission, and then at placement second level cooling unit, i.e. in the design of TEC24, there is more freedom.Another advantage need not arrange extra fluid loop for cooling TEC24.
Therefore, liquid-cooling system 2 according to the present invention is through arranging at least one heat generating component 10 of cooling, wherein liquid-cooling system 2 comprises fluid loop 4, liquid 6 is through arranging to circulate in this loop, wherein liquid 6 is through arranging to be cooled by first order cooling unit 14, the wherein cold side 26 of at least one thermoelectric-cooled unit 24 position of the upstream of at least one heat generating component 10 that is arranged in the downstream that is positioned at first order cooling unit 14 and will be cooled by liquid 6, at least one thermoelectric-cooled unit 24 wherein said is through arranging with cooling liquid 6 under its mode of operation, thus provide other cooling capacity when the cooling capacity of first order cooling unit 14 is not enough, wherein liquid 6 is further through arranging the hot side 32 to cool at least one thermoelectric-cooled unit 24 described, and the transfer of heat produced by least one thermoelectric-cooled unit 24 is to first order cooling unit 14, described first order cooling unit 14 is through arranging to be shifted away from liquid 6 by heat.Therefore, the major part in the thermic load that produces of TEC24 is through arranging to migrate out liquid-cooling system 2 by first order cooling unit 14.
Relative to the liquid-cooling system of the prior art above described in Fig. 1, can only have a fluid loop 4 through being arranged as according to liquid-cooling system 2 of the present invention, thus eliminate the needs of the independent fluid loop of layout two.
Arrange by using foregoing invention, wherein at least one thermoelectric-cooled unit (TEC) 24 is through arranging with at the downstream of first order cooling unit 14 and the position cooling liquid 6 of the upstream of heat generating component 10 that at least one will be cooled by liquid 6, no matter the position that the heat generating component 10 cooled by liquid 6 is arranged there are how many along loop, all only need a TEC24, prerequisite is that described TEC24 discharges enough cooling capacities to the liquid 6 in loop 4.Therefore, preferably only arrange in above-mentioned position that a thermoelectric-cooled unit (TEC) 24 carrys out cooling liquid 6.
Such as, described at least one can be the chip that such as can be arranged on PCB by the heat generating component 10 cooled by liquid 6, such as IC chip.Such as, can be some chips of the diverse location that such as can be arranged on PCB by the heat generating component 10 cooled by liquid 6, wherein some chips share a cold drawing or wherein at least one chip through being furnished with himself special cold drawing.
In the above-described embodiments, the cold side of TEC24 and loop 4 are connected in series.
According to this embodiment, only needing just must connect TEC24 when cooling the liquid 6 in above-mentioned cooling system 2, be not enough to cool at least one with the cooling capacity of convenient first order cooling unit 14 and provide other cooling capacity by during the heat generating component 10 cooled by liquid 6, such as, below temperature liquid 6 being cooled to surrounding air 16.On the other hand, if wherein liquid 6 provides enough cooling capacity with the first order cooling unit 14 cooled by such as air 16 to the liquid 6 in loop 4 through arranging, namely, when such as not needing the extra cooling capacity using TEC24 to provide because load is lower, if the heat such as being only had by the heat generating component 10 cooled by liquid 6 part to discharge in use is less than maximum heat, such as when the portfolio of telecomm base station system is lower, TEC24 can be disconnected when not hindering in first order cooling unit 14 cooling circuit 4 liquid 6, therefore, ensure that necessary cooling, avoid unnecessary power consumption simultaneously.
Figure 3 shows that the schematic diagram of liquid-cooling system according to a second embodiment of the present invention, wherein, liquid-cooling system 2 comprises fluid loop 4, and liquid 6 is through arranging to pass through pump 8 at loop Inner eycle.Liquid 6 is through arranging to cool the heat generating component 10 that at least one will be cooled by liquid 6: liquid 6 is through arranging to cool cold drawing 12, described cold drawing 12 through arrange with at least one heat generating component 10 to be cooled and liquid 6 one-tenth thermo-contact, wherein liquid 6 is preferably through arranging to flow through cold drawing 12.Therefore, at least one heat generating component 10 to be cooled is cooled by liquid 6: heat transfers to cold drawing 12 and liquid 6 from heat generating component 10, and thus liquid 6 heated by heat generating component 10.
In order to cooling liquid 6, described liquid is through arranging to be cooled by the first order cooling unit 14 of liquid-cooling system 2, wherein liquid 6 is preferably through arranging such as be cooled to environment temperature or more by using air 16, wherein liquid 6 is further preferably cooled by the forced draft of the air 16 being preferably surrounding air, and wherein forced draft is preferably produced by least one fan 18.First order cooling unit 14 preferably includes radiator 20, and wherein liquid 6 is preferably through arranging to flow through radiator 20, and wherein radiator 20 preferably includes cooling fins 22 further.Air 16 preferably through arranging with the outer surface flowing through some cooling fins 22, heat thus transfer to the air-flow of described air 16 from cooling fins 22.Radiator 20 can be replaced with heat exchanger.
When the cooling capacity of first order cooling unit 14 be not enough to cool at least one by cooled by liquid 6 heat generating component 10 time, in order to provide other cooling capacity in this case, arrange at least one thermoelectric-cooled unit (TEC) 24 of liquid-cooling system 2 in operational conditions, namely, when turned on, TEC24 is in the downstream of first order cooling unit 14 and at least one is by a position cooling liquid 6 between the upstream of heat generating component 10 that cooled by liquid 6, in described position, liquid 6 is through being arranged as the cold side 26 one-tenth thermo-contact with at least one TEC24, wherein liquid 6 is preferably through arranging with the cold side flowing through at least one TEC24, or the cold drawing 28 of the cold side 26 flowed through with at least one TEC24 and liquid 6 one-tenth thermo-contact, wherein liquid 6 is preferably through arranging to flow through at least one passage disposed therein 30.By using TEC24, liquid 6 can be cooled to below environment temperature, namely, lower than through arrange with the temperature of the air 16 at first order cooling unit 14 place cooling liquid 6, therefore, the liquid 6 cooled by first order cooling unit 14 arrival at least one by the heat generating component 10 cooled by liquid 6 before cooled further by TEC24.
Thermoelectric-cooled unit (TEC), the note cooler also referred to as amber is active heat pump, and when TEC being applied with voltage and have direct current by TEC, described TEC is through arranging with hot side heat being transferred to device from the cold side of device.Thus use electric energy that heat is pumped into hot side from cold side, thus, cold side is cooled, and hot side is heated.
Thus electric power is used to produce temperature difference between the both sides of device.Can the cooling capacity of control TEC24 by changing voltage on TEC24, TEC24 is therefore through arranging with the thermic load of processing variation.
According to this embodiment, at least one liquid bypass 38 is through being arranged in fluid loop 4, at least one liquid bypass 38 wherein said through arranging to make to flow at least one by 40 at least one thermoelectric-cooled unit (TEC) 24 walking around the upstream of downstream and at least one assembly 10 to be cooled being arranged in first order cooling unit 14 at least partially of the liquid 6 of the heat generating component 10 cooled by liquid 6 from first order cooling unit 14, and can not produce thermo-contact with the cold side 26 of at least one TEC24.Therefore, in the loop, at least one liquid bypass 38 is arranged in parallel with at least one thermoelectric-cooled unit (TEC) 24.
Good situation is, at least one volume control device 42 is arranged at least one bypass 38, such as valve, guarantees to control the amount of the liquid walking around TEC24 thus, controls further thus to through arranging with the temperature T of the liquid cooling heat generating component 10 to be cooled.
Because the efficiency of TEC is relatively low, therefore operationally, the hot side 32 of device produces a lot of heat.As shown in the figure, thus when loop 4 is arranged in such a way advantageously: preferably flow through at least one by last assembly in the heat generating component 10 that cooled by liquid 6 after, namely, in at least one downstream by last assembly in the heat generating component 10 that cooled by liquid 6, liquid 6 is arranged into hot 32 one-tenth, the side thermo-contact with at least one TEC24, namely, be arranged into and its thermal coupling, wherein liquid 6 is preferably through arranging with the cold drawing 34 of the hot side or the hot side 32 flowed through with at least one TEC24 and liquid 6 one-tenth thermo-contact that flow through at least one TEC24, wherein liquid 6 is preferably arranged in passage 36 wherein through arranging to flow through at least one.Therefore, liquid 6 can further in order to cool the hot side 32 of at least one TEC24, and the transfer of heat that at least one TEC24 produces is gone out the space around TEC24, thus at first order cooling unit 14 place, described transfer of heat being gone out liquid-cooling system 2, therefore liquid 6 heated by the hot side 32 of at least one TEC24.This is very favourable, because therefore TEC24 can be arranged in crossing in heat sensitive narrow space, and first order cooling unit 14 can be arranged in and has greater room and to the insensitive position of heat emission, and then at placement second level cooling unit, i.e. in the design of TEC24, there is more freedom.Another advantage need not arrange extra fluid loop for cooling TEC24.Therefore, liquid-cooling system 2 according to the present invention is through arranging at least one heat generating component 10 of cooling, wherein liquid-cooling system 2 comprises fluid loop 4, liquid 6 is through arranging to circulate in this loop, wherein liquid 6 is through arranging to be cooled by first order cooling unit 14, wherein at least one thermoelectric-cooled unit 24 position of the upstream of at least one heat generating component 10 of being arranged in the downstream that is positioned at first order cooling unit 14 and will being cooled by liquid 6, wherein at least one thermoelectric-cooled unit 24 under its mode of operation through arranging with cooling liquid 6, thus provide other cooling capacity when the cooling capacity of first order cooling unit 14 is not enough, wherein liquid 6 is further through arranging with the hot side 32 cooling at least one thermoelectric-cooled unit 24, and the transfer of heat produced by least one thermoelectric-cooled unit 24 is to first order cooling unit 14, described first order cooling unit 14 is through arranging transfer of heat to be gone out from liquid 6.Therefore, the major part in the thermic load that produces of TEC24 is through arranging to migrate out liquid-cooling system 2 by first order cooling unit 14.
Relative to the liquid-cooling system of the prior art above described in Fig. 1, can only have a fluid loop 4 through being arranged as according to liquid-cooling system 2 of the present invention, thus eliminate the demand of two independent fluid loops.
Similar with at least one liquid bypass 38 above-mentioned, according to this embodiment, at least one another liquid bypass 44 is arranged in fluid loop 4 further, at least one liquid bypass 44 wherein said through arranging the 46 thermoelectric-cooled unit (TEC) 24 walking around the downstream of upstream and at least one heat generating component 10 to be cooled being arranged in first order cooling unit 14 at least partially to make to flow to from least one heat generating component 10 to be cooled the liquid 6 of at least one first order cooling unit 14, and can not produce thermo-contact with the hot side 26 of at least one TEC24.Therefore, in loop 4, at least one another liquid bypass 44 is arranged in parallel with at least one thermoelectric-cooled unit (TEC) 24.
Good situation is, at least one volume control device 48 is arranged at least one another bypass 44, such as valve, guarantee thus to control the amount of the liquid 48 walking around TEC24, thus whether favourable according to this thermo-contact between the liquid 6 in the hot side 32 of at least one TEC24 and loop 4, optimize the volume with the liquid of hot 32 one-tenth, the side thermo-contact of at least one TEC24.If the liquid 6 at A place, position is colder than the hot side 32 of at least one TEC24, wherein do not need the liquid 6 at A place, position to cool the hot side 32 of at least one TEC24, thus liquid 6 carried out unnecessary heating by the hot side 32 of at least one TEC24 before entering first order cooling unit 14, and so this thermo-contact will be disadvantageous.
By layout mentioned above, wherein at least one thermoelectric-cooled unit (TEC) 24 is through arranging with at the downstream of first order cooling unit 14 and the position cooling liquid 6 of the upstream of heat generating component 10 that at least one will be cooled by liquid 6, no matter the position that the heat generating component 10 cooled by liquid 6 is arranged there are how many along loop, all only need a TEC24, prerequisite is that described TEC24 discharges enough cooling capacities to the liquid 6 in loop 4.Therefore, preferably only arrange in above-mentioned position that a thermoelectric-cooled unit (TEC) 24 carrys out cooling liquid 6.
Such as, described at least one can be the chip that such as can be arranged on PCB by the heat generating component 10 cooled by liquid 6.Such as, can be some chips of the diverse location that such as can be arranged in PCB by the heat generating component 10 cooled by liquid 6, wherein some chips share a cold drawing or wherein at least one chip through being furnished with himself special cold drawing.
According to this embodiment, only needing just must connect TEC24 when cooling the liquid 6 in above-mentioned cooling system 2, be not enough to cool at least one with the cooling capacity of convenient first order cooling unit 14 and provide other cooling capacity by during the heat generating component 10 cooled by liquid 6, such as, the temperature below temperature liquid 6 being cooled to surrounding air 16.On the other hand, if wherein liquid 6 provides enough cooling capacity with the first order cooling unit 14 cooled by such as air 16 to the liquid 6 in loop 4 through arranging, namely, when such as not needing the extra cooling capacity using TEC24 to provide because load is lower, if the heat such as being only had by the heat generating component 10 cooled by liquid 6 part to discharge in use is less than maximum heat, such as when the portfolio of telecomm base station system is lower, TEC24 can be disconnected when not hindering in first order cooling unit 14 cooling circuit 4 liquid 6, therefore, ensure that necessary cooling, avoid unnecessary power consumption simultaneously.
Control unit 50 can through arranging to control at least one volume control device 42,48 at least one liquid bypass 38,44, and/or the voltage V controlled at least one TEC24, thus control the temperature T through arranging the liquid 6 to cool at least one heat generating component 10 to be cooled.
The invention still further relates to the method using liquid-cooling system 2 to cool at least one heat generating component 10, described system comprises fluid loop 4, liquid 6, through arranging to circulate in the loop, wherein, is arranged as and is cooled by the first order cooling unit 14 of liquid-cooling system 2 by liquid 6; The cold side 26 of at least one thermoelectric-cooled unit 24 is arranged in the downstream of first order cooling unit 14 and the position of the upstream of heat generating component 10 that at least one will be cooled by liquid 6; At least one thermoelectric-cooled unit 24 is arranged as cooling liquid 6 under its mode of operation, thus provides other cooling capacity when the cooling capacity of first order cooling unit 14 is not enough; Further layout liquid 6 is to cool the hot side 32 of at least one thermoelectric-cooled unit 24, and the transfer of heat produced by least one thermoelectric-cooled unit 24 is to first order cooling unit 14, described first order cooling unit 14 is through arranging transfer of heat to be gone out from liquid 6.
The step using liquid-cooling system 2 to cool at least one heat generating component 10 can comprise cold drawing 12 is arranged as the step that both heat generating component 10 to be cooled with at least one and liquid 6 become thermo-contact, described liquid-cooling system 2 comprises fluid loop 4, and liquid 6 is through arranging to circulate in the loop.
The step at least one thermoelectric-cooled unit 24 being arranged as cooling liquid 6 under its mode of operation can comprise the step being arranged as by cold drawing 28 and becoming thermo-contact with the cold side 26 of at least one thermoelectric-cooled unit 24 with both liquid 6.
Arrange that liquid 6 can comprise the step being arranged as by cold drawing 34 and becoming thermo-contact with the hot side 32 of at least one thermoelectric-cooled unit 24 with both liquid 6 with the step of the hot side 32 cooling at least one thermoelectric-cooled unit 24.
The present invention is not limited to above-described embodiment, and relates to and comprise all embodiments in the scope of accompanying independent claim.Therefore, each feature in above-described embodiment is likely combined, as long as these combinations are possible.
Claims (20)
1. one kind for cooling the liquid-cooling system (2) of at least one heat generating component (10), wherein said liquid-cooling system (2) comprises fluid loop (4), liquid (6) is through arranging with circulation in described fluid loop (4), wherein said liquid (6) is through arranging to be cooled by the first order cooling unit (14) of described liquid-cooling system (2), the wherein position of the upstream in the downstream and described at least one heat generating component (10) of cold side (26) through being arranged in described first order cooling unit (14) of at least one thermoelectric-cooled unit (24), at least one thermoelectric-cooled unit (24) wherein said is through arranging to cool described liquid (6) under its mode of operation, thus provide other cooling capacity when the cooling capacity of described first order cooling unit (14) is not enough, described liquid-cooling system (2) is characterised in that, described liquid (6) is further through arranging the hot side (32) to cool at least one thermoelectric-cooled unit (24) described, and the transfer of heat produced by least one thermoelectric-cooled unit (24) described is to described first order cooling unit (14), described first order cooling unit (14) is through arranging transfer of heat to be gone out from described liquid (6),
Described liquid-cooling system (2) also comprises at least one liquid bypass (38) be arranged in described fluid loop (4), wherein said at least one liquid bypass (38) is arranged in parallel with at least one thermoelectric-cooled unit (24) described in described fluid loop (4), at least one thermoelectric-cooled unit (24) described is walked around to make (40) at least partially flowing to the described liquid (6) of described at least one heat generating component (10) from described first order cooling unit (14), and thermo-contact can not be produced with the described cold side (26) of at least one thermoelectric-cooled unit (24) described,
Described liquid-cooling system (2) also comprises at least one liquid bypass (44) be arranged in described fluid loop (4), wherein said at least one liquid bypass (44) is arranged in parallel with at least one thermoelectric-cooled unit (24) described in described fluid loop (4), at least one thermoelectric-cooled unit (24) described is walked around to make (46) at least partially flowing to the described liquid (6) of first order cooling unit (14) described at least one from described at least one heat generating component (10), and thermo-contact can not be produced with the described hot side (32) of at least one thermoelectric-cooled unit (24) described.
2. liquid-cooling system according to claim 1 (2), it comprises pump (8), and described pump (8) is through arranging to make described liquid (6) circulation in described fluid loop (4).
3. liquid-cooling system according to claim 1 (2), it comprises cold drawing (12), and through being arranged as with described at least one heat generating component (10) and described liquid (6), both become thermo-contact to described cold drawing (12).
4. liquid-cooling system according to claim 1 (2), wherein said first order cooling unit (14) is through arranging to be cooled by air (16).
5. liquid-cooling system according to claim 4 (2), wherein said first order cooling unit (14) is through arranging to be cooled by the surrounding air be forced to flow through (16).
6. liquid-cooling system according to claim 1 (2), the described cold side (26) of at least one thermoelectric-cooled unit (24) wherein said becomes thermo-contact with the described position of the upstream of described at least one heat generating component (10) with described liquid (6) in the downstream of described first order cooling unit (14) through being arranged as.
7. liquid-cooling system according to claim 6 (2), it comprises cold drawing (28), the described cold side (26) of described cold drawing (28) and at least one thermoelectric-cooled unit (24) described and described liquid (6) both become thermo-contact.
8. liquid-cooling system according to claim 1 (2), the described hot side (32) of at least one thermoelectric-cooled unit (24) wherein said becomes thermo-contact through being arranged as with described liquid (6).
9. liquid-cooling system according to claim 8 (2), it comprises cold drawing (34), the described hot side (32) of described cold drawing (34) and at least one thermoelectric-cooled unit (24) described and described liquid (6) both become thermo-contact.
10. liquid-cooling system according to claim 8 (2), the position in the downstream of described hot side (32) through being arranged as last assembly in described at least one heat generating component (10) of at least one thermoelectric-cooled unit (24) wherein said becomes thermo-contact with described liquid (6).
11. liquid-cooling systems according to claim 10 (2), it comprises cold drawing (34), the described hot side (32) of described cold drawing (34) and at least one thermoelectric-cooled unit (24) described and described liquid (6) both become thermo-contact.
12. liquid-cooling systems according to claim 1 (2), wherein said at least one heat generating component (10) is chip.
13. liquid-cooling systems according to claim 1 (2), it comprises at least one volume control device (42) be arranged in described at least one liquid bypass (38), thus guarantees to control the amount of the liquid walking around described thermoelectric-cooled unit (24).
14. liquid-cooling systems according to claim 13 (2), it comprises control unit (50), described control unit (50) is through arranging to control at least one volume control device (42) at least one liquid bypass (38), and/or the voltage (V) controlled at least one thermoelectric-cooled unit (24), thus control the temperature (T) through arranging the described liquid (6) to cool described at least one heat generating component (10).
15. liquid-cooling systems according to claim 1 (2), it comprises at least one volume control device (48) be arranged in described at least one liquid bypass (44), thus guarantees to control the amount of the liquid walking around described thermoelectric-cooled unit (24).
16. liquid-cooling systems according to claim 15 (2), it comprises control unit (50), described control unit (50) is through arranging to control at least one volume control device (48) at least one liquid bypass (44), and/or the voltage (V) controlled at least one thermoelectric-cooled unit (24), thus control the temperature (T) through arranging the described liquid (6) to cool described at least one heat generating component (10).
17. 1 kinds of methods for using liquid-cooling system (2) to cool at least one heat generating component (10), described liquid-cooling system (2) comprises fluid loop (4), liquid (6), through arranging with circulation in described fluid loop (4), said method comprising the steps of: be arranged as by described liquid (6) and cooled by the first order cooling unit (14) of described liquid-cooling system (2); The cold side (26) of at least one thermoelectric-cooled unit (24) is arranged in the position of the downstream of described first order cooling unit (14) and the upstream of at least one heat generating component described (10); At least one thermoelectric-cooled unit (24) described is arranged as under its mode of operation, cools described liquid (6), thus provide other cooling capacity when the cooling capacity of described first order cooling unit (14) is not enough; Described method is further characterized in that following steps: arrange that described liquid (6) is to cool the hot side (32) of at least one thermoelectric-cooled unit (24) described, and the transfer of heat to be produced by least one thermoelectric-cooled unit (24) described is to described first order cooling unit (14), described first order cooling unit (14) is through arranging transfer of heat to be gone out from described liquid (6);
Described liquid-cooling system (2) also comprises at least one liquid bypass (38) be arranged in described fluid loop (4), wherein said at least one liquid bypass (38) is arranged in parallel with at least one thermoelectric-cooled unit (24) described in described fluid loop (4), at least one thermoelectric-cooled unit (24) described is walked around to make (40) at least partially flowing to the described liquid (6) of described at least one heat generating component (10) from described first order cooling unit (14), and thermo-contact can not be produced with the described cold side (26) of at least one thermoelectric-cooled unit (24) described,
Described liquid-cooling system (2) also comprises at least one liquid bypass (44) be arranged in described fluid loop (4), wherein said at least one liquid bypass (44) is arranged in parallel with at least one thermoelectric-cooled unit (24) described in described fluid loop (4), at least one thermoelectric-cooled unit (24) described is walked around to make (46) at least partially flowing to the described liquid (6) of first order cooling unit (14) described at least one from described at least one heat generating component (10), and thermo-contact can not be produced with the described hot side (32) of at least one thermoelectric-cooled unit (24) described.
18. methods according to claim 17, the step that wherein said use liquid-cooling system (2) cools at least one heat generating component (10) comprises the step being arranged as by cold drawing (12) and becoming thermo-contact with both described at least one heat generating component (10) and described liquid (6), described liquid-cooling system (2) comprises fluid loop (4), and liquid (6) is through arranging with circulation in described fluid loop (4).
19. methods according to claim 17, the wherein said step cooling described liquid (6) under its mode of operation that is arranged as by least one thermoelectric-cooled unit (24) described comprises the step being arranged as by cold drawing (28) and becoming thermo-contact with both the described cold side (26) of at least one thermoelectric-cooled unit (24) described and described liquid (6).
20. methods according to claim 17, the described liquid of wherein said layout (6) comprises the step being arranged as by cold drawing (34) and becoming thermo-contact with both the described hot side (32) of at least one thermoelectric-cooled unit (24) described and described liquid (6) with the step of the described hot side (32) cooling at least one thermoelectric-cooled unit (24) described.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2012/051938 WO2013117212A1 (en) | 2012-02-06 | 2012-02-06 | Liquid cooling system and method for cooling at least one heat generating component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103348199A CN103348199A (en) | 2013-10-09 |
| CN103348199B true CN103348199B (en) | 2016-01-13 |
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| CN201280003467.0A Expired - Fee Related CN103348199B (en) | 2012-02-06 | 2012-02-06 | Liquid-cooling system and the method for cooling at least one heat generating component |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20130199208A1 (en) |
| EP (1) | EP2641035A1 (en) |
| CN (1) | CN103348199B (en) |
| WO (1) | WO2013117212A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20160161998A1 (en) * | 2014-12-05 | 2016-06-09 | Corsair Memory, Inc. | Actively Cooled Liquid Cooling System |
| US9983641B2 (en) * | 2016-04-27 | 2018-05-29 | Intel Corporation | Tunable two phase liquid cooling thermal management method and apparatus |
| US11249522B2 (en) | 2016-06-30 | 2022-02-15 | Intel Corporation | Heat transfer apparatus for a computer environment |
| US20180066663A1 (en) * | 2016-09-08 | 2018-03-08 | Intel Corporation | Cooling using coolant-driven fans |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6295819B1 (en) * | 2000-01-18 | 2001-10-02 | Midwest Research Institute | Thermoelectric heat pump fluid circuit |
| CN1711449A (en) * | 2002-12-02 | 2005-12-21 | 派尔技术有限公司 | Integrated thermoelectric module |
| CN1714261A (en) * | 2002-08-23 | 2005-12-28 | Bsst有限责任公司 | High power density thermoelectric systems |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030088538A1 (en) | 2001-11-07 | 2003-05-08 | Ballard Curtis C. | System for and method of automated device data collection |
| JP2003176962A (en) * | 2001-12-11 | 2003-06-27 | Espec Corp | Temperature control device and environmental testing machine |
| TWI338390B (en) * | 2007-07-12 | 2011-03-01 | Ind Tech Res Inst | Flexible thermoelectric device and manufacturing method thereof |
-
2012
- 2012-02-06 CN CN201280003467.0A patent/CN103348199B/en not_active Expired - Fee Related
- 2012-02-06 EP EP12702541.9A patent/EP2641035A1/en not_active Withdrawn
- 2012-02-06 WO PCT/EP2012/051938 patent/WO2013117212A1/en active Application Filing
- 2012-12-05 US US13/705,967 patent/US20130199208A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6295819B1 (en) * | 2000-01-18 | 2001-10-02 | Midwest Research Institute | Thermoelectric heat pump fluid circuit |
| CN1714261A (en) * | 2002-08-23 | 2005-12-28 | Bsst有限责任公司 | High power density thermoelectric systems |
| CN1711449A (en) * | 2002-12-02 | 2005-12-21 | 派尔技术有限公司 | Integrated thermoelectric module |
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| Publication number | Publication date |
|---|---|
| US20130199208A1 (en) | 2013-08-08 |
| CN103348199A (en) | 2013-10-09 |
| EP2641035A1 (en) | 2013-09-25 |
| WO2013117212A1 (en) | 2013-08-15 |
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