CN103348199A - Grapheme fiber and preparing method thereof - Google Patents
Grapheme fiber and preparing method thereof Download PDFInfo
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- CN103348199A CN103348199A CN2012800034670A CN201280003467A CN103348199A CN 103348199 A CN103348199 A CN 103348199A CN 2012800034670 A CN2012800034670 A CN 2012800034670A CN 201280003467 A CN201280003467 A CN 201280003467A CN 103348199 A CN103348199 A CN 103348199A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/04—Refrigeration circuit bypassing means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention relates to a liquid cooling system (2) for cooling at least one heat generating component (10), where the liquid cooling system (2) comprises a liquid loop (4) in which liquid (6) is arranged to be circulated, where the liquid (6) is arranged to be cooled by a first stage cooling unit (14), where the cold side (26) of at least one Thermo Electric Cooling unit (24) is arranged at a position situated downstream of the first stage cooling unit (14) and upstream of the at least one heat generating component (10) to be cooled by liquid (6), where the at least one Thermo Electric Cooling unit (24) is arranged in its operative state to cool the liquid (6) in order to provide for further cooling power when the cooling power of the first stage cooling unit (14) is not sufficient, where the liquid (6) is further arranged to cool down the hot side (32); of the at least one Thermo Electric Cooling unit (24) and to transfer heat generated by the at least one Thermo Electric Cooling unit (24) to the first stage cooling unit (14) arranged to transfer away heat from the liquid (6). The invention also relates to a method for cooling at least one heat generating component (10) using a liquid cooling system (2) comprising a liquid loop (4) in which liquid (6) is arranged to be circulated.
Description
Technical field
The present invention relates to a kind of liquid-cooling system.The invention still further relates to the method at least one heat generating component of cooling.
Background technology
Cooling system is used for the cooling purposes in different application, for example to the PCB(printed circuit board (PCB) on the telecomm base station system equipment) or assemblies such as chip or memory cell or power amplifier cool off.
Assembly to be cooled, for example PCB can use radiator to cool off, and places assembly to be cooled by nestling up foot of radiator, thereby the heat of assembly can be delivered to radiator.
More if desired cooling capacity, can arrange the pressure cooling of radiator so, namely, arrange fan, described fan forces air-flow to pass the surface that radiator cools off fin, thereby uses the surrounding air replacement cooling fin air that has been heated by the heat from the cooling fin on every side from the cold of radiator outside.
Because the bottom area of the assembly such as for example PCB or chip etc. in telecommunication technology field is limited usually, and need settle more and more functionally at the bottom area of the restriction of assembly, therefore develop more powerful assembly.For example, can be by making the capacity that the higher assembly of integrated level improves assembly.The power of supplying with to assembly on this increase unit of the making assembly bottom area of assembly capacity may be than many in the past, can cause so again when using to greatest extent---for example, during the peak traffic in reaching the telecomm base station system---the heat that assembly radiates at the unit bottom area is than many in the past, namely, the maximum heating load of assembly increases, because the power of presenting to assembly by every square centimeter of power (W/cm2) bottom area may be bigger.
When the pressure cooling of the use air of the radiator of placing near assembly to be cooled when base is not enough to cooling package, for example must use other methods such as liquid cools.
Usually, liquid-cooling system comprises a loop, is the one-level circuit system,, only comprises first order loop that is.Liquid in the loop circulates in the loop by pump, wherein further described liquid is forced cooling: the liquid in the loop is flowed through and is had the radiator that cools off fin, described cooling fin is by the surrounding air cooling of forcing on the cooling fin outside to flow through, and wherein the liquid in the loop is further by the heat heating from least one heat generating component.
In the one-level circuit cools system of the above-mentioned type, can not be with liquid cools to below the temperature of surrounding air.For needing to use refrigeration cooler with liquid cools to below the temperature of surrounding air.
By replacing pump can realize refrigeration cooler with compressor, wherein said compressor is arranged in the downstream of radiator and the upstream of assembly to be cooled, can before liquid arrives assembly to be cooled, arrive liquid cools below the temperature of surrounding air thus, thereby strengthen the cooling for the treatment of cooling package, use the shortcoming of compressor to be: compare with pump, the Mean Time Between Failures of compressor is shorter.
Also can realize refrigeration cooler by pump being stayed in the above-mentioned one-level circuit system, and in the downstream of radiator and the interpolation thermoelectric-cooled unit (TEC), upstream of assembly to be cooled, can before liquid arrives assembly to be cooled, arrive liquid cools below the temperature of surrounding air thus, thereby strengthen the cooling for the treatment of cooling package, even being the extra cooling capacity that does not need to use TEC to provide, shortcoming cools off assembly to be cooled, TEC is necessary continuous firing also, another shortcoming is, each assembly to be cooled needs a TEC, namely, if two assemblies to be cooled are arranged, so just need two TEC, wherein two TEC must continuous firing.
U.S. 2003/088538A1 patent has been showed the two-stage cooling system that comprises electrothermal module of another kind of type.
Stronger if desired cooling is arrived liquid cools below the temperature of surrounding air to arrive assembly to be cooled at liquid before, also can use the two-stage circuit system, rather than the one-level circuit system,, uses the system of the fluid loop with two separation that is.There is certain methods can realize the two-stage circuit system.The two-stage circuit system comprises through arranging with the first order fluid loop through assembly to be cooled, and through arranging with the second level fluid loop through radiator.Liquid in the loop, the second level circulates in the loop by pump, wherein second level liquid further cools off by pressure: second level liquid flows in having the radiator that cools off fin, described cooling fin is cooled off by the surrounding air of forcing to flow through on the cooling fin outside, and wherein second level liquid is further by from the heating of the heat of the liquid in the first order fluid loop, the thermoelectric-cooled unit (TEC) of all flowing through of the liquid in two loops.TEC is through arranging with cooling first order liquid: the hot side of TEC is connected to second level fluid loop, and the cold side of TEC is connected to first order fluid loop.Therefore, first order liquid is cooled off when flowing through described TEC, wherein, first order liquid is further through arranging the cold drawing to flow through and to arrange near assembly to be cooled, heat thereby transfer to cold drawing and first order liquid from assembly to be cooled, assembly is therefore by first order liquid cools, and therefore first order liquid heated by assembly, thereby can be with the first order liquid cools in the above-mentioned cooling system below the temperature of surrounding air, and then have strengthened the cooling for the treatment of cooling package.This solution does not need compressor, and shortcoming is even do not need sometimes the first order liquid cools in the above-mentioned cooling system below the temperature of surrounding air, also must connect TEC, thereby cause unnecessary power consumption.
Summary of the invention
Target of the present invention provides improved liquid-cooling system and improved method at least one heat generating component of cooling.
Realize this goal by arranging the liquid-cooling system that is used at least one heat generating component of cooling, wherein liquid-cooling system comprises fluid loop, liquid is through arranging to circulate in the loop, wherein liquid is through arranging with the first order cooling unit cooling by liquid-cooling system, wherein the downstream of the cold side of at least one thermoelectric-cooled unit through being arranged in first order cooling unit and at least one will be by the positions of the upstream of the heat generating component of liquid cools, wherein at least one thermoelectric-cooled unit is through arranging with cooling liquid under its mode of operation, thereby when the cooling capacity deficiency of first order cooling unit, provide other cooling capacity, wherein liquid is further through arranging to cool off the hot side of at least one thermoelectric-cooled unit, and the transfer of heat that at least one thermoelectric-cooled unit is produced is to first order cooling unit, and described first order cooling unit is through arranging from liquid transfer of heat is gone out.
Further realize this goal by the method for using liquid-cooling system to cool off at least one heat generating component, described liquid-cooling system comprises fluid loop, liquid said method comprising the steps of through arranging to circulate in the loop: the first order cooling unit that liquid is arranged as by liquid-cooling system cools off; At least the cold side of a thermoelectric-cooled unit is arranged in the downstream of first order cooling unit and at least one will be by the position of the upstream of the heat generating component of liquid cools; At least one thermoelectric-cooled unit is arranged as cooling liquid under its mode of operation, thereby when the cooling capacity deficiency of first order cooling unit, provides other cooling capacity; Further comprise and arrange that liquid is to cool off the hot side of at least one thermoelectric-cooled unit, and the transfer of heat that at least one thermoelectric-cooled unit is produced is to the step of first order cooling unit, described first order cooling unit through layout from liquid transfer of heat is gone out.
The liquid-cooling system that has fluid loop by layout, wherein liquid is through arranging to circulate in the loop, wherein liquid is through arranging that the transfer of heat that produces with the hot side of cooling off at least one thermoelectric-cooled unit and with at least one thermoelectric-cooled unit is to first order cooling unit, described first order cooling unit is through arranging from liquid transfer of heat is gone out, through arranging that the liquid to be used at least one heat generating component of cooling can be further in order to cool off the hot side of at least one thermoelectric-cooled unit, and the heat that at least one thermoelectric-cooled unit produces is migrated out space on every side, thermoelectric-cooled unit at first order cooling unit place, and migrate out liquid-cooling system.This is very favourable, because therefore the thermoelectric-cooled unit can be arranged in crossing in the heat sensitive narrow space, and first order cooling unit can be arranged in and has greater room and to the insensitive position of heat emission, and then placing second level cooling unit, namely in the design of thermoelectric cooling unit more freedom is arranged.Another advantage is to arrange extra fluid loop for the hot side of cooling off thermoelectric cooling unit.
In having the liquid-cooling system of fluid loop, wherein liquid is through arranging to circulate in the loop, being arranged in the downstream of first order cooling unit and at least one by the cold side with the thermoelectric-cooled unit will can be reduced to the temperature of liquid in the fluid loop below the temperature of the liquid that leaves first cooling unit by the position of the upstream of the heat generating component of liquid cools.
In having the liquid-cooling system of fluid loop, wherein liquid is through arranging to circulate in the loop, being arranged in the downstream of first order cooling unit and at least one by the cold side with the thermoelectric-cooled unit will be by the position of the upstream of the heat generating component of liquid cools, can be under the situation that need in the loop, not add compressor with fluid loop in the temperature of liquid be reduced to below the environment temperature, owing to needn't add moving-member, so this has guaranteed longer MTBF when being integrated with refrigerating function in liquid-cooling system.In addition, the shape of thermoelectric-cooled unit also can be changeable, therefore can be arranged in the narrow space.
In having the liquid-cooling system of fluid loop, wherein liquid is through arranging to circulate in the loop, being arranged in the downstream of first order cooling unit and at least one by the cold side with the thermoelectric-cooled unit will can only just must be operated the thermoelectric-cooled unit when needs additionally cool off by the position of the upstream of the heat generating component of liquid cools.
According to one embodiment of present invention, liquid-cooling system comprises a pump, and described pump is through arranging so that liquid circulates in fluid loop.
According to one embodiment of present invention, liquid-cooling system comprises a cold drawing, and described cold drawing is through arranging to become thermo-contact with at least one heat generating component to be cooled and liquid.
According to one embodiment of present invention, the cold side of at least one thermoelectric-cooled unit becomes thermo-contact through being arranged as in the described position of the upstream of the downstream of first order cooling unit and at least one heat generating component to be cooled with liquid.
According to one embodiment of present invention, liquid-cooling system comprises a cold drawing, and described cold drawing becomes thermo-contact with cold side and the liquid of at least one thermoelectric-cooled unit.
According to one embodiment of present invention, the hot side of at least one thermoelectric-cooled unit becomes thermo-contact through being arranged as with liquid.
According to one embodiment of present invention, liquid-cooling system comprises a cold drawing, and described cold drawing becomes thermo-contact with hot side and the liquid of at least one thermoelectric-cooled unit.
According to one embodiment of present invention, the location downstream of the hot side of at least one thermoelectric-cooled unit through being arranged as last assembly in described at least one heat generating component to be cooled becomes thermo-contact with described liquid.
According to one embodiment of present invention, at least one heat generating component to be cooled is chip.
According to one embodiment of present invention, liquid-cooling system comprises at least one liquid bypass that is arranged in the fluid loop, wherein said at least one liquid bypass is arranged in parallel with at least one thermoelectric-cooled unit (TEC) in the loop, so that at least a portion that flows to the liquid of at least one heat generating component to be cooled from first order cooling unit is walked around at least one thermoelectric-cooled unit, and can not produce thermo-contact with the cold side of at least one thermoelectric-cooled unit.
According to one embodiment of present invention, liquid-cooling system comprises at least one volume control device that is arranged at least one bypass, thereby has guaranteed that opposing connection crosses the amount of the liquid of thermoelectric cooling unit and control.
According to one embodiment of present invention, liquid-cooling system comprises control module, described control module is through arranging to control at least one volume control device at least one liquid bypass, and/or control voltage at least one thermoelectric-cooled unit, thereby control is through arranging the temperature with the liquid that cools off at least one heat generating component to be cooled.
According to one embodiment of present invention, comprise at least one liquid bypass that is arranged in the fluid loop, wherein said at least one liquid bypass is arranged in parallel with at least one thermoelectric-cooled unit (TEC) in the loop, so that at least a portion that flows to the liquid of at least one first order cooling unit from least one heat generating component to be cooled is walked around at least one thermoelectric-cooled unit, and can not produce thermo-contact with the hot side of at least one thermoelectric-cooled unit.
Other advantage of the present invention is apparent from following specifying.
Description of drawings
Accompanying drawing is intended to illustrate and explain different embodiments of the invention, wherein:
Figure 1 shows that the schematic diagram of the two-stage liquid design of Cooling System of prior art;
Figure 2 shows that the schematic diagram according to the liquid-cooling system of the first embodiment of the present invention, and
Figure 3 shows that the schematic diagram of liquid-cooling system according to a second embodiment of the present invention.
The specific embodiment
In conjunction with this explanation, vocabulary " liquid " refers to is fluid such as water, ethylene glycol for example, and the mixture of fluid, for example comprises the mixture of water and ethylene glycol etc.
Figure 1 shows that the schematic diagram of the two-stage liquid design of Cooling System of prior art, two-stage liquid cooling system 1 comprises: first order fluid loop 3, through arranging with the assembly 5 to be cooled of flowing through; With second level fluid loop 7, through arranging with the radiator 9 of flowing through.Liquid 11 in the loop, the second level 7 circulates in the loop by pump 13, wherein second level liquid 11 further cools off through pressure: second level liquid 11 is having in the radiator 9 that cools off fin 15 mobile, described cooling fin 15 is cooled off by the cooling fin 15 outside surrounding airs 17 of forcing to flow through that go up, and wherein second level liquid 11 is further by from the heating of the heat of the liquid 19 in the first order fluid loop 3, the thermoelectric-cooled unit (TEC) 21 of flowing through of the liquid 11,19 in two loops 3,7.TEC21 is connected to second level fluid loop 7 through arranging the hot side 23 with cooling first order liquid 19:TEC21, and the cold side 25 of TEC21 is connected to first order fluid loop 3.Therefore, first order liquid 19 is cooled when flowing through described TEC21, wherein first order liquid 19 is further through arranging the cold drawing 27 that abuts against assembly 5 layouts to be cooled to flow through, thereby heat is transferred to cold drawing 27 and first order liquid 19 from assembly 5, assembly 5 thereby by first order liquid 19 cooling, and first order liquid 19 thereby by assembly 5 heating.By adopting TEC21, the first order liquid 19 in the above-mentioned cooling system 1 can be cooled to below the temperature of surrounding air 17, thereby strengthen the cooling for the treatment of cooling package 5.Shortcoming is even do not need sometimes the first order liquid 19 in the above-mentioned cooling system 1 is cooled to below the temperature of surrounding air 17, also must connect TEC21, thereby cause unnecessary power consumption, because the efficient of TEC is relatively low.
Figure 2 shows that the schematic diagram according to the liquid-cooling system 2 of first embodiment of the invention, wherein, liquid-cooling system 2 comprises fluid loop 4, and liquid 6 is through arranging to circulate in the loop by pump 8.Liquid 6 will be by the heat generating component 10 of liquid 6 coolings to cool off at least one through arranging: liquid 6 is through arranging so that cold drawing 12 is cooled off, described cold drawing 12 through arrange with described at least one heat generating component to be cooled 10 and 6 one-tenths thermo-contacts of liquid, wherein liquid 6 preferably through layout with the cold drawing 12 of flowing through.Therefore, described at least one heat generating component to be cooled 10 is by liquid 6 cooling: heat is transferred to cold drawing 12 and liquid 6 from heat generating component 10, liquid 6 thereby by heat generating component 10 heating.
For cooling liquid 6, described liquid is through arranging with first order cooling unit 14 coolings by liquid-cooling system 2, wherein liquid 6 preferably through arrange with for example by use air 16 be cooled to environment temperature or more than, wherein liquid 6 is further preferably cooled off by the forced draft of the air 16 that is preferably surrounding air, and wherein forced draft is preferably produced by at least one fan 18.First order cooling unit 14 preferably includes radiator 20, and wherein liquid 6 is preferably through arranging with the radiator 20 of flowing through, and wherein radiator 20 further preferably includes cooling fin 22.Air 16 is preferably through the outer surface of layout with some cooling fins 22 of flowing through, thereby heat is transferred to the air-flow of described air 16 from cooling fin 22.Can replace radiator 20 with heat exchanger.
When the cooling capacity of first order cooling unit 14 is not enough to cool off at least one heat generating component 10 to be cooled, for other cooling capacity is provided in this case, under mode of operation, arrange at least one thermoelectric-cooled unit (TEC) 24 of liquid-cooling system 2, namely, when being switched on, TEC24 is cooling liquid 6 on a position between the upstream of the downstream of first order cooling unit 14 and the heat generating component 10 that at least one will be cooled off by liquid 6, in described position, liquid 6 through arrange with 26 one-tenth thermo-contacts of cold side of described at least one TEC24, wherein liquid 6 is preferably through arranging the cold side with described at least one TEC24 that flows through, or flow through and the cold side 26 of described at least one TEC24 and the cold drawing 28 of 6 one-tenth thermo-contacts of liquid, wherein liquid 6 is preferably through arranging with at least one passage disposed therein 30 of flowing through.By using TEC24, liquid 6 can be cooled to below the environment temperature, namely, be lower than through arranging with the temperature at the air 16 of first order cooling unit 14 place's cooling liquids 6, therefore, by the liquid 6 of first order cooling unit 14 cooling arrive described at least one will the heat generating component 10 by liquid 6 coolings before, further cooled off by TEC24.
Thermoelectric-cooled unit (TEC) is also referred to as amber and obedient cooler is active heat pump, and when having applied voltage on the TEC and have direct current to pass through TEC, described TEC is through arranging heat to be transferred to the hot side of device from the cold side of device.Thereby use electric energy that heat is pumped into hot side from cold side, thus, cold side is cooled off, and hot side is heated.
Thereby use electric power between the both sides of device, to produce temperature difference.By changing the cooling capacity of the voltage controlled TEC24 processed on the TEC24, TEC24 is therefore through arranging the thermic load with processing variation.
Because TEC24 efficient is relatively low, therefore when work, produce a lot of heats on the hot side 32 of device.As shown in the figure, thereby loop 4 is comparatively favourable when being arranged in such a way: preferably flow through at least one will be by last assembly in heat generating component 10 of liquid 6 coolings after, namely, will be by the downstream of last assembly in the heat generating component 10 of liquid 6 coolings at least one, liquid 6 through arrange with 32 one-tenth thermo-contacts of hot side of at least one TEC24, namely, through arrange with its thermal coupling, wherein liquid 6 is preferably through arranging with the hot side of at least one TEC24 that flows through or flowing through and the hot side 32 of at least one TEC24 and the cold drawing 34 of 6 one-tenths thermo-contacts of liquid, and wherein preferably at least one is arranged in wherein passage 36 to liquid 6 to flow through through layout.Therefore, liquid 6 can be further in order to cool off the hot side 32 of at least one TEC24, and the transfer of heat that at least one TEC24 produces is left TEC24 space on every side, thereby 14 places go out liquid-cooling system 2 with described transfer of heat at first order cooling unit, and therefore liquid 6 heated by the hot side 32 of at least one TEC24.This is very favourable, because therefore TEC24 can be arranged in crossing in the heat sensitive narrow space, and first order cooling unit 14 can be arranged in and has greater room and to the insensitive position of heat emission, and then is placing second level cooling unit, namely in the design of TEC24 more freedom is arranged.Another advantage is to arrange extra fluid loop for cooling TEC24.
Therefore, liquid-cooling system 2 according to the present invention is through arranging to be used at least one heat generating component 10 of cooling, wherein liquid-cooling system 2 comprises fluid loop 4, liquid 6 is through arranging to circulate in this loop, wherein liquid 6 is through arranging to be cooled off by first order cooling unit 14, wherein the cold side 26 of at least one thermoelectric-cooled unit 24 is arranged in the downstream that is positioned at first order cooling unit 14 and will be by the position of the upstream of at least one heat generating component 10 of liquid 6 coolings, wherein said at least one thermoelectric-cooled unit 24 is through arranging with cooling liquid 6 under its mode of operation, thereby when the cooling capacity deficiency of first order cooling unit 14, provide other cooling capacity, wherein liquid 6 is further through arranging to cool off the hot side 32 of described at least one thermoelectric-cooled unit 24, and the transfer of heat that at least one thermoelectric-cooled unit 24 is produced is to first order cooling unit 14, and described first order cooling unit 14 is through arranging so that heat is shifted away from liquid 6.Therefore, the major part in the thermic load that produces of TEC24 is through arranging to migrate out liquid-cooling system 2 by first order cooling unit 14.
With respect to the liquid-cooling system of the prior art described in Fig. 1 above, can only have a fluid loop 4 through being arranged as according to liquid-cooling system 2 of the present invention, thereby save the needs of arranging two independent fluid loops.
By using the foregoing invention layout, wherein at least one thermoelectric-cooled unit (TEC) 24 is through arranging with will be by the position cooling liquid 6 of the upstream of the heat generating component 10 of liquid 6 coolings in the downstream of first order cooling unit 14 and at least one, there no matter will what be arranged by the position that the heat generating component 10 of liquid 6 coolings is arranged along the loop to be individual, all only need a TEC24, prerequisite is that described TEC24 discharges enough cooling capacities to the liquid 6 in the loop 4.Therefore, only arrange in above-mentioned position that preferably a thermoelectric-cooled unit (TEC) 24 comes cooling liquid 6.
For example, described at least one heat generating component 10 that will be cooled off by liquid 6 can be the chip that for example can be arranged on the PCB, for example IC chip.For example, will can be some chips that for example can be arranged in the diverse location on the PCB by the heat generating component 10 of liquid 6 cooling, wherein some chips share a cold drawing or wherein at least one chip through being furnished with the cold drawing of himself special use.
In the above-described embodiments, the cold side of TEC24 and loop 4 are connected in series.
According to this embodiment, only when cooling off liquid 6 in the above-mentioned cooling system 2, needs just must connect TEC24, be not enough to cool off at least one with the cooling capacity of convenient first order cooling unit 14 other cooling capacity is provided will be by the heat generating component 10 of liquid 6 coolings the time, for example, liquid 6 is cooled to below the temperature of surrounding air 16.On the other hand, if wherein liquid 6 provides enough cooling capacities through arranging with the first order cooling unit 14 by for example air 16 coolings to the liquid 6 in the loop 4, namely, when the extra cooling capacity that for example do not need to use TEC24 to provide because load is lower, if for example the heat that will have only part to discharge in use by the heat generating component 10 of liquid 6 coolings is less than maximum heat, for example when the portfolio of telecomm base station system is hanged down, disconnect TEC24 under the situation of liquid 6 that can be in not hindering first order cooling unit 14 cooling circuits 4, therefore, guarantee necessary cooling, avoided unnecessary power consumption simultaneously.
Figure 3 shows that the schematic diagram according to the liquid-cooling system of second embodiment of the invention, wherein, liquid-cooling system 2 comprises fluid loop 4, and liquid 6 is through arranging to circulate in the loop by pump 8.Liquid 6 will be by the heat generating component 10 of liquid 6 coolings to cool off at least one through arranging: liquid 6 is through arranging so that cold drawing 12 is cooled off, described cold drawing 12 through arrange with at least one heat generating component to be cooled 10 and 6 one-tenths thermo-contacts of liquid, wherein liquid 6 preferably through layout with the cold drawing 12 of flowing through.Therefore, at least one heat generating component to be cooled 10 is by liquid 6 cooling: heat is transferred to cold drawing 12 and liquid 6 from heat generating component 10, liquid 6 thereby by heat generating component 10 heating.
For cooling liquid 6, described liquid is through arranging with first order cooling unit 14 coolings by liquid-cooling system 2, wherein liquid 6 preferably through arrange with for example by use air 16 be cooled to environment temperature or more than, wherein liquid 6 is further preferably cooled off by the forced draft of the air 16 that is preferably surrounding air, and wherein forced draft is preferably produced by at least one fan 18.First order cooling unit 14 preferably includes radiator 20, and wherein liquid 6 is preferably through arranging with the radiator 20 of flowing through, and wherein radiator 20 further preferably includes cooling fin 22.Air 16 is preferably through the outer surface of layout with some cooling fins 22 of flowing through, thereby heat is transferred to the air-flow of described air 16 from cooling fin 22.Can replace radiator 20 with heat exchanger.
When the cooling capacity of first order cooling unit 14 is not enough to cool off at least one will be by the heat generating component 10 of liquid 6 coolings the time, for other cooling capacity is provided in this case, under mode of operation, arrange at least one thermoelectric-cooled unit (TEC) 24 of liquid-cooling system 2, namely, when being switched on, the position cooling liquid 6 of TEC24 between the upstream of the downstream of first order cooling unit 14 and the heat generating component 10 that at least one will be cooled off by liquid 6, in described position, liquid 6 is through being arranged as the 26 one-tenth thermo-contacts of cold side with at least one TEC24, wherein liquid 6 is preferably through arranging the cold side with at least one TEC24 that flows through, or flow through and the cold side 26 of at least one TEC24 and the cold drawing 28 of 6 one-tenth thermo-contacts of liquid, wherein liquid 6 is preferably through arranging with at least one passage disposed therein 30 of flowing through.By using TEC24, liquid 6 can be cooled to below the environment temperature, namely, be lower than through arranging with the temperature at the air 16 of first order cooling unit 14 place's cooling liquids 6, therefore, the liquid 6 that has been cooled off by first order cooling unit 14 further be cooled off by TEC24 before arriving at least one heat generating component 10 that will be cooled off by liquid 6.
Thermoelectric-cooled unit (TEC) is also referred to as amber and obedient cooler is active heat pump, and when having applied voltage on the TEC and have direct current to pass through TEC, described TEC is through arranging heat to be transferred to the hot side of device from the cold side of device.Thereby use electric energy that heat is pumped into hot side from cold side, thus, cold side is cooled off, and hot side is heated.
Thereby use electric power between the both sides of device, to produce temperature difference.By changing the cooling capacity of the voltage controlled TEC24 processed on the TEC24, TEC24 is therefore through arranging the thermic load with processing variation.
According to this embodiment, at least one liquid bypass 38 is in being arranged in fluid loop 4, wherein said at least one liquid bypass 38 will be walked around at least one thermoelectric-cooled unit (TEC) 24 of the upstream of the downstream that is arranged in first order cooling unit 14 and at least one assembly 10 to be cooled through arranging by at least a portion 40 of the liquid 6 of the heat generating component 10 of liquid 6 coolings so that flow at least one from first order cooling unit 14, and can not produce thermo-contacts with the cold side 26 of at least one TEC24.Therefore, in the loop, at least one liquid bypass 38 is arranged in parallel with at least one thermoelectric-cooled unit (TEC) 24.
Situation is preferably, in at least one bypass 38, arrange at least one volume control device 42, valve is for example guaranteed the amount of the liquid of walking around TEC24 is controlled thus, thus further to controlling through arranging with the temperature T of the liquid that cools off heat generating component 10 to be cooled.
Because the efficient of TEC is relatively low, therefore when work, produce a lot of heats on the hot side 32 of device.As shown in the figure, thereby loop 4 is comparatively favourable when being arranged in such a way: preferably flow through at least one will be by last assembly in heat generating component 10 of liquid 6 coolings after, namely, will be by the downstream of last assembly in the heat generating component 10 of liquid 6 coolings at least one, liquid 6 is arranged into the 32 one-tenth thermo-contacts of hot side with at least one TEC24, namely, be arranged into and its thermal coupling, wherein liquid 6 is preferably through arranging with the hot side of at least one TEC24 that flows through or flowing through and the hot side 32 of at least one TEC24 and the cold drawing 34 of 6 one-tenths thermo-contacts of liquid, and wherein preferably at least one is arranged in wherein passage 36 to liquid 6 to flow through through layout.Therefore, liquid 6 can be further in order to cool off the hot side 32 of at least one TEC24, and the transfer of heat that at least one TEC24 produces is gone out TEC24 space on every side, thereby 14 places go out liquid-cooling system 2 with described transfer of heat at first order cooling unit, and therefore liquid 6 heated by the hot side 32 of at least one TEC24.This is very favourable, because therefore TEC24 can be arranged in crossing in the heat sensitive narrow space, and first order cooling unit 14 can be arranged in and has greater room and to the insensitive position of heat emission, and then is placing second level cooling unit, namely in the design of TEC24 more freedom is arranged.Another advantage is to arrange extra fluid loop for cooling TEC24.Therefore, liquid-cooling system 2 according to the present invention is through arranging to be used at least one heat generating component 10 of cooling, wherein liquid-cooling system 2 comprises fluid loop 4, liquid 6 is through arranging to circulate in this loop, wherein liquid 6 is through arranging to be cooled off by first order cooling unit 14, wherein at least one thermoelectric-cooled unit 24 is arranged in the downstream that is positioned at first order cooling unit 14 and will be by the position of the upstream of at least one heat generating component 10 of liquid 6 coolings, wherein at least one thermoelectric-cooled unit 24 under its mode of operation through arranging with cooling liquid 6, thereby when the cooling capacity deficiency of first order cooling unit 14, provide other cooling capacity, wherein liquid 6 is further through arranging to cool off the hot side 32 of at least one thermoelectric-cooled unit 24, and the transfer of heat that at least one thermoelectric-cooled unit 24 is produced is to first order cooling unit 14, and described first order cooling unit 14 is through arranging transfer of heat to be gone out from liquid 6.Therefore, the major part in the thermic load that produces of TEC24 is through arranging to migrate out liquid-cooling system 2 by first order cooling unit 14.
With respect to the liquid-cooling system of the prior art described in Fig. 1 above, can only have a fluid loop 4 through being arranged as according to liquid-cooling system 2 of the present invention, thereby save the demand of two independent fluid loops.
Similar with above-mentioned at least one liquid bypass 38, according to this embodiment, at least one another liquid bypass 44 further is arranged in the fluid loop 4, at least a portion 46 that wherein said at least one liquid bypass 44 flows to the liquid 6 of at least one first order cooling unit 14 through arranging so that from least one heat generating component 10 to be cooled is walked around the thermoelectric-cooled unit (TEC) 24 in the downstream of the upstream that is arranged in first order cooling unit 14 and at least one heat generating component 10 to be cooled, and can not produce thermo-contacts with the hot side 26 of at least one TEC24.Therefore, in loop 4, at least one another liquid bypass 44 is arranged in parallel with at least one thermoelectric-cooled unit (TEC) 24.
Situation is preferably, in at least one another bypass 44, arrange at least one volume control device 48, valve for example, guarantee thus the amount of the liquid 48 of walking around TEC24 is controlled, thereby whether hot side 32 and this thermo-contact between the liquid 6 in the loop 4 according at least one TEC24 be favourable, optimizes the volume with the liquid of 32 one-tenth thermo-contacts of hot side of at least one TEC24.If the liquid 6 at position A place is colder than the hot side 32 of at least one TEC24, wherein do not need the liquid 6 at A place, position to cool off the hot side 32 of at least one TEC24, liquid 6 thereby carried out unnecessary heating by the hot side 32 of at least one TEC24 before entering first order cooling unit 14, so this thermo-contact will be disadvantageous.
By layout mentioned above, wherein at least one thermoelectric-cooled unit (TEC) 24 is through arranging with will be by the position cooling liquid 6 of the upstream of the heat generating component 10 of liquid 6 coolings in the downstream of first order cooling unit 14 and at least one, there no matter will what be arranged by the position that the heat generating component 10 of liquid 6 coolings is arranged along the loop to be individual, all only need a TEC24, prerequisite is that described TEC24 discharges enough cooling capacities to the liquid 6 in the loop 4.Therefore, only arrange in above-mentioned position that preferably a thermoelectric-cooled unit (TEC) 24 comes cooling liquid 6.
For example, described at least one heat generating component 10 that will be cooled off by liquid 6 can be the chip that for example can be arranged on the PCB.For example, will can be some chips that for example can be arranged in the diverse location of PCB by the heat generating component 10 of liquid 6 cooling, wherein some chips share a cold drawing or wherein at least one chip through being furnished with the cold drawing of himself special use.
According to this embodiment, only when cooling off liquid 6 in the above-mentioned cooling system 2, needs just must connect TEC24, be not enough to cool off at least one with the cooling capacity of convenient first order cooling unit 14 other cooling capacity is provided will be by the heat generating component 10 of liquid 6 coolings the time, for example, liquid 6 is cooled to temperature below the temperature of surrounding air 16.On the other hand, if wherein liquid 6 provides enough cooling capacities through arranging with the first order cooling unit 14 by for example air 16 coolings to the liquid 6 in the loop 4, namely, when the extra cooling capacity that for example do not need to use TEC24 to provide because load is lower, if for example the heat that will have only part to discharge in use by the heat generating component 10 of liquid 6 coolings is less than maximum heat, for example when the portfolio of telecomm base station system is hanged down, disconnect TEC24 under the situation of liquid 6 that can be in not hindering first order cooling unit 14 cooling circuits 4, therefore, guarantee necessary cooling, avoided unnecessary power consumption simultaneously.
The invention still further relates to the method for using liquid-cooling system 2 at least one heat generating component 10 of cooling, described system comprises fluid loop 4, liquid 6 is through arranging to circulate in the loop, and wherein, the first order cooling unit 14 that liquid 6 is arranged as by liquid-cooling system 2 cools off; The cold side 26 of at least one thermoelectric-cooled unit 24 is arranged in the downstream of first order cooling unit 14 and at least one will be by the position of the upstream of the heat generating component 10 of liquid 6 coolings; At least one thermoelectric-cooled unit 24 is arranged as cooling liquid 6 under its mode of operation, thereby when the cooling capacity deficiency of first order cooling unit 14, provides other cooling capacity; Arrange that further liquid 6 is to cool off the hot side 32 of at least one thermoelectric-cooled unit 24, and the transfer of heat that at least one thermoelectric-cooled unit 24 is produced is to first order cooling unit 14, described first order cooling unit 14 through layout from liquid 6 transfer of heat is gone out.
Use the step of liquid-cooling system 2 at least one heat generating component 10 of cooling to comprise cold drawing 12 is arranged as that both become the step of thermo-contact with at least one heat generating component 10 to be cooled and liquid 6, described liquid-cooling system 2 comprises fluid loop 4, and liquid 6 is through arranging to circulate in the loop.
The step that at least one thermoelectric-cooled unit 24 is arranged as cooling liquid 6 under its mode of operation can comprise and cold drawing 28 is arranged as both become the step of thermo-contact with the cold side 26 of at least one thermoelectric-cooled unit 24 and liquid 6.
Arranging that liquid 6 can comprise with the step of the hot side 32 of cooling off at least one thermoelectric-cooled unit 24 is arranged as cold drawing 34 that both become the step of thermo-contact with the hot side 32 of at least one thermoelectric-cooled unit 24 and liquid 6.
The present invention is not limited to above-described embodiment, and relates to and comprise all interior embodiment of scope of appended independent claims.Therefore, might make up each feature in above-described embodiment, as long as these combinations are possible.
Claims (22)
1. liquid-cooling system (2) that is used at least one heat generating component of cooling (10), wherein said liquid-cooling system (2) comprises fluid loop (4), liquid (6) is through arranging with circulation in described fluid loop (4), wherein said liquid (6) is through arranging with first order cooling unit (14) cooling by described liquid-cooling system (2), wherein the cold side (26) of at least one thermoelectric-cooled unit (24) through being arranged in described first order cooling unit (14) the downstream and described at least one will be by the position of the upstream of the heat generating component (10) of liquid (6) cooling, wherein said at least one thermoelectric-cooled unit (24) is through arranging with cooling described liquid (6) under its mode of operation, thereby when the cooling capacity deficiency of described first order cooling unit (14), provide other cooling capacity, described liquid-cooling system (2) is characterised in that, described liquid (6) is further through arranging to cool off the hot side (32) of described at least one thermoelectric-cooled unit (24), and the transfer of heat that described at least one thermoelectric-cooled unit (24) produces is arrived described first order cooling unit (14), and described first order cooling unit (14) is through arranging from described liquid (6) transfer of heat is gone out.
2. liquid-cooling system according to claim 1 (2), it comprises pump (8), described pump (8) is through arranging so that described liquid (6) circulates in described fluid loop (4).
3. liquid-cooling system according to claim 1 (2), it comprises cold drawing (12), both become thermo-contact to described cold drawing (12) with described liquid (6) with described at least one heat generating component to be cooled (10) through being arranged as.
4. liquid-cooling system according to claim 1 (2), wherein said first order cooling unit (14) is through arranging to be cooled off by air (16).
5. liquid-cooling system according to claim 4 (2), wherein said first order cooling unit (14) is through arranging with by surrounding air (16) cooling of forcing to flow through.
6. liquid-cooling system according to claim 1 (2), the described cold side (26) of wherein said at least one thermoelectric-cooled unit (24) becomes thermo-contact through being arranged as in the downstream of described first order cooling unit (14) and the described position of the upstream of described at least one heat generating component to be cooled (10) with described liquid (6).
7. liquid-cooling system according to claim 6 (2), it comprises cold drawing (28), both become thermo-contact the described cold side (26) and described liquid (6) of described cold drawing (28) and described at least one thermoelectric-cooled unit (24).
8. liquid-cooling system according to claim 1 (2), the described hot side (32) of wherein said at least one thermoelectric-cooled unit (24) becomes thermo-contact through being arranged as with described liquid (6).
9. liquid-cooling system according to claim 8 (2), it comprises cold drawing (34), both become thermo-contact the described hot side (32) and described liquid (6) of described cold drawing (34) and described at least one thermoelectric-cooled unit (24).
10. liquid-cooling system according to claim 8 (2), the location downstream of the described hot side (32) of wherein said at least one thermoelectric-cooled unit (24) through being arranged as last assembly in described at least one heat generating component to be cooled (10) becomes thermo-contact with described liquid (6).
11. liquid-cooling system according to claim 10 (2), it comprises cold drawing (34), and both become thermo-contact the described hot side (32) and described liquid (6) of described cold drawing (34) and described at least one thermoelectric-cooled unit (24).
12. liquid-cooling system according to claim 1 (2), wherein said at least one heat generating component to be cooled (10) is chip.
13. liquid-cooling system according to claim 1 (2), it comprises at least one liquid bypass (38) that is arranged in the described fluid loop (4), wherein said at least one liquid bypass (38) is arranged in parallel with described at least one thermoelectric-cooled unit (24) in described loop (4), so that at least a portion (40) that flows to the described liquid (6) of described at least one heat generating component to be cooled (10) from described first order cooling unit (14) is walked around described at least one thermoelectric-cooled unit (24), and can not produce thermo-contact with the described cold side (26) of described at least one thermoelectric-cooled unit (24).
14. liquid-cooling system according to claim 13 (2), it comprises at least one volume control device (42) that is arranged in described at least one bypass (38), thereby guarantees the amount of the liquid of walking around described thermoelectric-cooled unit (24) is controlled.
15. liquid-cooling system according to claim 14 (2), it comprises control module (50), described control module (50) is through arranging to control at least one volume control device (42) at least one liquid bypass (38), and/or control voltage (V) at least one thermoelectric-cooled unit (24), thereby control is through arranging the temperature (T) with the described liquid (10) that cools off described at least one heat generating component to be cooled (10).
16. liquid-cooling system according to claim 1 (2), it comprises at least one liquid bypass (44) that is arranged in the described fluid loop (4), wherein said at least one liquid bypass (44) is arranged in parallel with described at least one thermoelectric-cooled unit (24) in described loop (4), so that at least a portion (46) that flows to the described liquid (6) of described at least one first order cooling unit (14) from described at least one heat generating component to be cooled (10) is walked around described at least one thermoelectric-cooled unit (24), and can not produce thermo-contact with the described hot side (32) of described at least one thermoelectric-cooled unit (24).
17. liquid-cooling system according to claim 16 (2), it comprises at least one volume control device (48) that is arranged in described at least one bypass (44), thereby guarantees the amount of the liquid of walking around described thermoelectric-cooled unit (24) is controlled.
18. liquid-cooling system according to claim 17 (2), it comprises control module (50), described control module (50) is through arranging to control at least one volume control device (48) at least one liquid bypass (44), and/or control voltage (V) at least one thermoelectric-cooled unit (24), thereby control is through arranging the temperature (T) with the described liquid (6) that cools off described at least one heat generating component to be cooled (10).
19. one kind is used for using liquid-cooling system (2) to cool off the method for at least one heat generating component (10), described liquid-cooling system (2) comprises fluid loop (4), liquid (6) said method comprising the steps of through arranging with circulation in described fluid loop (4): the first order cooling unit (14) that described liquid (6) is arranged as by described liquid-cooling system (2) cools off; With the cold side (26) of at least one thermoelectric-cooled unit (24) be arranged in described first order cooling unit (14) the downstream and described at least one will be by the position of the upstream of the heat generating component (10) of liquid (6) cooling; Described at least one thermoelectric-cooled unit (24) is arranged as cooling described liquid (6) under its mode of operation, thereby when the cooling capacity deficiency of described first order cooling unit (14), provides other cooling capacity; Described method is further characterized in that following steps: arrange that described liquid (6) is to cool off the hot side (32) of described at least one thermoelectric-cooled unit (24), and the transfer of heat that described at least one thermoelectric-cooled unit (24) is produced is to described first order cooling unit (14), and described first order cooling unit (14) is through arranging from described liquid (6) transfer of heat is gone out.
20. the method at least one heat generating component of cooling (10) according to claim 19, the step that wherein said use liquid-cooling system (2) cools off at least one heat generating component (10) comprises and cold drawing (12) is arranged as both become the step of thermo-contact with described liquid (6) with described at least one heat generating component to be cooled (10), described liquid-cooling system (2) comprises fluid loop (4), and liquid (6) is through arranging with circulation in described fluid loop (4).
21. the method at least one heat generating component of cooling (10) according to claim 19, the wherein said step of cooling off described liquid (6) under its mode of operation that will described at least one thermoelectric-cooled unit (24) be arranged as comprises and cold drawing (28) is arranged as both become the step of thermo-contact with the described cold side (26) and described liquid (6) of described at least one thermoelectric-cooled unit (24).
22. comprising with the step of the described hot side (32) of cooling off described at least one thermoelectric-cooled unit (24), the method at least one heat generating component of cooling (10) according to claim 19, the described liquid of wherein said layout (6) cold drawing (34) is arranged as both become the step of thermo-contact with the described hot side (32) and described liquid (6) of described at least one thermoelectric-cooled unit (24).
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2012/051938 WO2013117212A1 (en) | 2012-02-06 | 2012-02-06 | Liquid cooling system and method for cooling at least one heat generating component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103348199A true CN103348199A (en) | 2013-10-09 |
| CN103348199B CN103348199B (en) | 2016-01-13 |
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| CN201280003467.0A Expired - Fee Related CN103348199B (en) | 2012-02-06 | 2012-02-06 | Liquid-cooling system and the method for cooling at least one heat generating component |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20130199208A1 (en) |
| EP (1) | EP2641035A1 (en) |
| CN (1) | CN103348199B (en) |
| WO (1) | WO2013117212A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20160161998A1 (en) * | 2014-12-05 | 2016-06-09 | Corsair Memory, Inc. | Actively Cooled Liquid Cooling System |
| US9983641B2 (en) * | 2016-04-27 | 2018-05-29 | Intel Corporation | Tunable two phase liquid cooling thermal management method and apparatus |
| US11249522B2 (en) | 2016-06-30 | 2022-02-15 | Intel Corporation | Heat transfer apparatus for a computer environment |
| US20180066663A1 (en) * | 2016-09-08 | 2018-03-08 | Intel Corporation | Cooling using coolant-driven fans |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6295819B1 (en) * | 2000-01-18 | 2001-10-02 | Midwest Research Institute | Thermoelectric heat pump fluid circuit |
| JP2003176962A (en) * | 2001-12-11 | 2003-06-27 | Espec Corp | Temperature control device and environmental testing machine |
| CN1711449A (en) * | 2002-12-02 | 2005-12-21 | 派尔技术有限公司 | Integrated thermoelectric module |
| CN1714261A (en) * | 2002-08-23 | 2005-12-28 | Bsst有限责任公司 | High power density thermoelectric systems |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030088538A1 (en) | 2001-11-07 | 2003-05-08 | Ballard Curtis C. | System for and method of automated device data collection |
| TWI338390B (en) * | 2007-07-12 | 2011-03-01 | Ind Tech Res Inst | Flexible thermoelectric device and manufacturing method thereof |
-
2012
- 2012-02-06 CN CN201280003467.0A patent/CN103348199B/en not_active Expired - Fee Related
- 2012-02-06 EP EP12702541.9A patent/EP2641035A1/en not_active Withdrawn
- 2012-02-06 WO PCT/EP2012/051938 patent/WO2013117212A1/en active Application Filing
- 2012-12-05 US US13/705,967 patent/US20130199208A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6295819B1 (en) * | 2000-01-18 | 2001-10-02 | Midwest Research Institute | Thermoelectric heat pump fluid circuit |
| JP2003176962A (en) * | 2001-12-11 | 2003-06-27 | Espec Corp | Temperature control device and environmental testing machine |
| CN1714261A (en) * | 2002-08-23 | 2005-12-28 | Bsst有限责任公司 | High power density thermoelectric systems |
| CN1711449A (en) * | 2002-12-02 | 2005-12-21 | 派尔技术有限公司 | Integrated thermoelectric module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103348199B (en) | 2016-01-13 |
| US20130199208A1 (en) | 2013-08-08 |
| EP2641035A1 (en) | 2013-09-25 |
| WO2013117212A1 (en) | 2013-08-15 |
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