CN103336542B - A kind of hot melt adhesive heated for controlling temperature method and heated for controlling temperature system thereof - Google Patents
A kind of hot melt adhesive heated for controlling temperature method and heated for controlling temperature system thereof Download PDFInfo
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- CN103336542B CN103336542B CN201310162080.6A CN201310162080A CN103336542B CN 103336542 B CN103336542 B CN 103336542B CN 201310162080 A CN201310162080 A CN 201310162080A CN 103336542 B CN103336542 B CN 103336542B
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Abstract
The present invention relates to hot melt adhesive heating and technical field of temperature control, more specifically, relate to a kind of hot melt adhesive heated for controlling temperature method and heated for controlling temperature system thereof, this hot melt adhesive heated for controlling temperature method, setting interim temperature value T1, finishing temperature value T2 and efficiency of heating surface value P0, energising automatic heating, temperature carries out Fast Heating before not reaching T1, when temperature reaches T1, the P0 according to setting carries out slow heat temperature raising, effectively prevents the too fast T2 exceeding final setting of temperature in heating process.When temperature reaches T2, temperature is controlled in the scope of T2 ± 0.5 DEG C, until complete heating process.Increase setting interim temperature value and efficiency of heating surface value, effectively can control the precision of finishing temperature value, prevent heating-up temperature from exceeding the permissible variation scope of finishing temperature value, effectively prevent the problems such as the aging of hot melt adhesive and carbonization.This hot melt adhesive heated for controlling temperature method can realize heated for controlling temperature uniformly and stably easily, avoid hot melt adhesive easily aging, heat uneven.
Description
Technical field
The present invention relates to hot melt adhesive heating and technical field of temperature control, more specifically, relate to a kind of hot melt adhesive heated for controlling temperature method and heated for controlling temperature system thereof.
Background technology
In the market, a lot of commercial unit in use, all needs to control well temperature, prevents from heating slow, too fast, if temperature controls bad, crosses and then affects efficiency slowly, too fastly may cause overheated etc., burns out equipment and heatable substance.In photograph album production equipment, particularly use the field of hot melt adhesive, its heating means are adopt general hot melt adhesive heated for controlling temperature method substantially, and general hot melt adhesive heated for controlling temperature method, only be provided with finishing temperature value, interim temperature value not in heated for controlling temperature process and the efficiency of heating surface control, the precision simultaneously controlled is bad, substantially at about ± 5 DEG C, due to the problem of above-mentioned heated for controlling temperature aspect, cause hot melt adhesive easily aging or carbonization, heat uneven, thus add the maintenance cost of hot melt adhesive.
Summary of the invention
The present invention is intended to solve the problems of the technologies described above at least to a certain extent.
Primary and foremost purpose of the present invention is to provide a kind of hot melt adhesive heated for controlling temperature method, increase setting interim temperature value and efficiency of heating surface value, effectively can control the precision of finishing temperature value, prevent heating-up temperature from exceeding the permissible variation scope of finishing temperature value, effectively prevent the problems such as the aging of hot melt adhesive and carbonization.
A further object of the present invention is to provide a kind of heated for controlling temperature system adopting above-mentioned hot melt adhesive heated for controlling temperature method, and this system is stablized the homogeneous heating of hot melt adhesive, is convenient to realize heated for controlling temperature, effectively prevent the problems such as the aging of hot melt adhesive and carbonization.
For solving the problems of the technologies described above, the technical solution used in the present invention is:
A kind of hot melt adhesive heated for controlling temperature method is provided, comprises the following steps:
S1. interim temperature value T1, finishing temperature value T2, efficiency of heating surface value P0 is set;
S2. heated for controlling temperature pattern is entered:
S21., as temperature T < T1, efficiency of heating surface value P=100% is now Fast Heating pattern;
S22., as temperature T1≤T < T2, efficiency of heating surface value P=P0 is now slow heating mode;
S23., as temperature T=T2, stop heating and making temperature remain on T2-0.5 DEG C of < T < T2+0.5 DEG C.
Hot melt adhesive heated for controlling temperature method of the present invention, setting interim temperature value T1, finishing temperature value T2 and efficiency of heating surface value P0, energising automatic heating, temperature carries out Fast Heating before not reaching T1, when temperature reaches T1, P0 according to setting carries out slow heat temperature raising, effectively prevents the too fast T2 exceeding final setting of temperature in heating process.When temperature reaches T2, temperature is controlled in the scope of T2 ± 0.5 DEG C, until complete heating process.Increase setting interim temperature value and efficiency of heating surface value, effectively can control the precision of finishing temperature value, prevent heating-up temperature from exceeding the permissible variation scope of finishing temperature value, effectively prevent the problems such as the aging of hot melt adhesive and carbonization.
In such scheme, when heated for controlling temperature pattern is out of control, T > T2+10 DEG C, stops heating automatically.If heat temperature raising is out of control, during more than T2 setting value 10 DEG C, stop heating, now can send alerting signal simultaneously.
Wherein, temperature value 100 DEG C≤T1≤150 DEG C set in described step S1.Preferably, the temperature value T1 set in described step S1 is 130 DEG C.
Wherein, temperature value 150 DEG C≤T2≤190 DEG C set in described step S2.Preferably, the temperature value T2 set in described step S2 is 170 DEG C.
Wherein, efficiency of heating surface value P0≤100% set in described step S2.Preferably, the efficiency of heating surface value P0 set in described step S2 is 50%.
Present invention also offers the heated for controlling temperature system of a kind of employing hot melt adhesive heated for controlling temperature method as described in any one of claim 1 to 8, it is characterized in that, comprise temperature detection element, heated for controlling temperature module, processing module and heating element, described temperature detection element is provided with thermistor, heated for controlling temperature module is provided with ADC conversion chip, through ADC conversion chip access processing module after the voltage of described thermistor sampling heated for controlling temperature system, processing module controls heating element work.
Alternatively, described temperature detection element adopt digital sample directly by signal transmission to heated for controlling temperature module.Heated for controlling temperature module can have the mode of separate analogue sampling and digital signal samples, utilizes temperature detection element to carry out corresponding signal sampling.Adopt two-way analog sampling and two-way relay to export under normal circumstances, when wherein path loss bad time emits choice for use the 3rd tunnel to replace by jumping, each road is independent of each other mutually.Wherein, analog sampling scope is 20 ~ 170 DEG C, to meet the heat temperature raising demand of glue box.
Wherein, heated for controlling temperature module has temperature automatically controlled pattern and manual temperature controlling mode.Under temperature automatically controlled pattern, circuit board under the mating reaction of temperature detection element, after powering on by automatic heating, control to before the set temperature value preserved.
In such scheme, heated for controlling temperature module is connected with processing module by CAN communication, and communication speed is fast, distance, and reliability is high, and the adjustment of corresponding setting value by realizing on the output devices such as processing module operating system display screen.
Compared with prior art, the invention has the beneficial effects as follows:
Hot melt adhesive heated for controlling temperature method of the present invention, setting interim temperature value T1, finishing temperature value T2 and efficiency of heating surface value P0, energising automatic heating, temperature carries out Fast Heating before not reaching T1, when temperature reaches T1, P0 according to setting carries out slow heat temperature raising, effectively prevents the too fast T2 exceeding final setting of temperature in heating process.When temperature reaches T2, temperature is controlled in the scope of T2 ± 0.5 DEG C, until complete heating process.Increase setting interim temperature value and efficiency of heating surface value, effectively can control the precision of finishing temperature value, prevent heating-up temperature from exceeding the permissible variation scope of finishing temperature value, effectively prevent the problems such as the aging of hot melt adhesive and carbonization.This hot melt adhesive heated for controlling temperature method can realize heated for controlling temperature uniformly and stably easily, simple to operate, thus controls the heating up process of hot melt adhesive glue box, avoid hot melt adhesive easily aging, heat uneven problem.
Adopt the heated for controlling temperature system of this hot melt adhesive heated for controlling temperature method, adopt integrated heated for controlling temperature module, by accessing processing module through ADC conversion chip after the voltage of thermistor sampling heated for controlling temperature system, processing module controls heating element work, just heated for controlling temperature can be realized easily, thus the heating up process of hot melt adhesive glue box is controlled, avoid hot melt adhesive easily aging, heat uneven problem.
Embodiment
Below in conjunction with embodiment, the present invention is further illustrated.
In the present invention, unless otherwise prescribed or limit, it should be noted that, if there is the term such as " connection ", " being connected " to be interpreted broadly, such as, can be mechanically connected or be electrically connected or gas circuit connection, also can be the connection of two element internals, can be direct connection, also can be indirectly be connected by intermediary, for the ordinary skill in the art, the concrete meaning of above-mentioned term can be understood as the case may be.
Embodiment 1
The present embodiment hot melt adhesive heated for controlling temperature method, comprises the following steps:
Step one: setting interim temperature value T1=130 DEG C;
Step 2: set final setting value T2=170 DEG C, and set efficiency of heating surface value P0=50%;
Step 3: start enters heated for controlling temperature pattern, Automatic-heating heats up, and is fast heating pattern, namely heats with the efficiency of heating surface of 100% when temperature does not reach interim temperature value 130 DEG C;
Step 4: slowly heat according to the efficiency of heating surface of arrange 50% when temperature reaches 130 DEG C, effectively preventing from heating, process temperature is too fast exceeds final setting value 170 DEG C;
Step 5: when temperature reaches final setting value 170 DEG C, temperature will control in the scope of 170 DEG C ± 0.5 DEG C.
Out of control if heat, when exceeding 10 DEG C of final setting value 170 DEG C, system sends red alarm signal, and stops heating.
Embodiment 2
The present embodiment hot melt adhesive heated for controlling temperature method, comprises the following steps:
Step one: setting interim temperature value T1=100 DEG C;
Step 2: set final setting value T2=150 DEG C, and set efficiency of heating surface value P0=40%;
Step 3: start enters heated for controlling temperature pattern, Automatic-heating heats up, and is fast heating pattern, namely heats with the efficiency of heating surface of 100% when temperature does not reach interim temperature value 100 DEG C;
Step 4: slowly heat according to the efficiency of heating surface of arrange 40% when temperature reaches 100 DEG C, effectively preventing from heating, process temperature is too fast exceeds final setting value 150 DEG C;
Step 5: when temperature reaches final setting value 150 DEG C, temperature will control in the scope of 150 DEG C ± 0.5 DEG C.
Out of control if heat, when exceeding 10 DEG C of final setting value 150 DEG C, system sends red alarm signal, and stops heating.
Embodiment 3
The present embodiment hot melt adhesive heated for controlling temperature method, comprises the following steps:
Step one: setting interim temperature value T1=150 DEG C;
Step 2: set final setting value T2=190 DEG C, and set efficiency of heating surface value P0=60%;
Step 3: start enters heated for controlling temperature pattern, Automatic-heating heats up, and is fast heating pattern, namely heats with the efficiency of heating surface of 100% when temperature does not reach interim temperature value 150 DEG C;
Step 4: slowly heat according to the efficiency of heating surface of arrange 60% when temperature reaches 150 DEG C, effectively preventing from heating, process temperature is too fast exceeds final setting value 190 DEG C;
Step 5: when temperature reaches final setting value 190 DEG C, temperature will control in the scope of 190 DEG C ± 0.5 DEG C.
Out of control if heat, when exceeding 10 DEG C of final setting value 190 DEG C, system sends red alarm signal, and stops heating.
Embodiment 4
The present embodiment hot melt adhesive heated for controlling temperature method, comprises the following steps:
Step one: setting interim temperature value T1=110 DEG C;
Step 2: set final setting value T2=170 DEG C, and set efficiency of heating surface value P0=60%;
Step 3: start enters heated for controlling temperature pattern, Automatic-heating heats up, and is fast heating pattern, namely heats with the efficiency of heating surface of 100% when temperature does not reach interim temperature value 110 DEG C;
Step 4: slowly heat according to the efficiency of heating surface of arrange 60% when temperature reaches 110 DEG C, effectively preventing from heating, process temperature is too fast exceeds final setting value 170 DEG C;
Step 5: when temperature reaches final setting value 170 DEG C, temperature will control in the scope of 170 DEG C ± 0.5 DEG C.
Out of control if heat, when exceeding 10 DEG C of final setting value 170 DEG C, system sends red alarm signal, and stops heating.
Embodiment of the present invention hot melt adhesive heated for controlling temperature method, setting interim temperature value T1, finishing temperature value T2 and efficiency of heating surface value P0, energising automatic heating, temperature carries out Fast Heating before not reaching T1, when temperature reaches T1, P0 according to setting carries out slow heat temperature raising, effectively prevents the too fast T2 exceeding final setting of temperature in heating process.When temperature reaches T2, temperature is controlled in the scope of T2 ± 0.5 DEG C, until complete heating process.Increase setting interim temperature value and efficiency of heating surface value, effectively can control the precision of finishing temperature value, prevent heating-up temperature from exceeding the permissible variation scope of finishing temperature value, effectively prevent the problems such as the aging of hot melt adhesive and carbonization.
Embodiment 5
The present embodiment adopts the heated for controlling temperature system of above-described embodiment 1 ~ 4 arbitrary hot melt adhesive heated for controlling temperature method, comprise temperature detection element, heated for controlling temperature module, processing module and heating element, described temperature detection element is provided with thermistor, heated for controlling temperature module is provided with ADC conversion chip, through ADC conversion chip access processing module after the voltage of described thermistor sampling heated for controlling temperature system, processing module controls heating element work.
In the present embodiment, processing module chip is STC series 89C54RD+, ADC conversion chip is ADS7841.
The present embodiment heated for controlling temperature module has temperature automatically controlled pattern and manual temperature controlling mode.Under temperature automatically controlled pattern, circuit board under the mating reaction of temperature detection element, after powering on by automatic heating, control to before the set temperature value preserved.Heated for controlling temperature module is connected with processing module by CAN communication, and adopt 220V Alternating Current Power Supply, output power is 220V/8A.
Embodiment 6
The present embodiment heated for controlling temperature system, as the improvement to embodiment 5, as different from Example 5, temperature detection element adopt digital sample directly by signal transmission to heated for controlling temperature module.Heated for controlling temperature module can have the mode of separate analogue sampling and digital signal samples, utilizes temperature detection element to carry out corresponding signal sampling.Two-way analog sampling and two-way relay is adopted to export under normal circumstances, when wherein path loss bad time emits choice for use the 3rd tunnel to replace by jumping.Wherein, analog sampling scope is 20 ~ 170 DEG C, to meet the heat temperature raising demand of glue box.
In the present embodiment, digital sample chip is DS18B20.
Obviously, the above embodiment of the present invention is only for example of the present invention is clearly described, and is not the restriction to embodiments of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all embodiments.All any amendments done within the spirit and principles in the present invention, equivalent to replace and improvement etc., within the protection domain that all should be included in the claims in the present invention.
Claims (8)
1. a hot melt adhesive heated for controlling temperature method, is characterized in that, comprises the following steps:
S1. interim temperature value T1, finishing temperature value T2, efficiency of heating surface value P0 is set;
S2. heated for controlling temperature pattern is entered:
S21., as temperature T < T1, efficiency of heating surface value P=100% is now Fast Heating pattern;
S22., as temperature T1≤T < T2, efficiency of heating surface value P=efficiency of heating surface value P0 is now slow heating mode;
S23., as temperature T=T2, stop heating and making temperature remain on T2-0.5 DEG C of < T < T2+0.5 DEG C;
Temperature value 100 DEG C≤T1≤150 DEG C set in described step S1; Temperature value 150 DEG C≤T2≤190 DEG C set in described step S1.
2. hot melt adhesive heated for controlling temperature method according to claim 1, is characterized in that, when heated for controlling temperature pattern is out of control, T > T2+10 DEG C, stops heating automatically.
3. hot melt adhesive heated for controlling temperature method according to claim 1, is characterized in that, the temperature value T1 set in described step S1 is 130 DEG C.
4. hot melt adhesive heated for controlling temperature method according to claim 1, is characterized in that, the temperature value T2 set in described step S1 is 170 DEG C.
5. hot melt adhesive heated for controlling temperature method according to claim 1, is characterized in that, efficiency of heating surface value P0≤100% set in described step S1.
6. hot melt adhesive heated for controlling temperature method according to claim 5, is characterized in that, the efficiency of heating surface value P0 set in described step S1 is 50%.
7. one kind adopts the heated for controlling temperature system of hot melt adhesive heated for controlling temperature method as described in any one of claim 1 to 6, it is characterized in that, comprise temperature detection element, heated for controlling temperature module, processing module and heating element, described temperature detection element is provided with thermistor, heated for controlling temperature module is provided with ADC conversion chip, through ADC conversion chip access processing module after the voltage of described thermistor sampling heated for controlling temperature system, processing module controls heating element work.
8. heated for controlling temperature system according to claim 7, is characterized in that, described temperature detection element adopt digital sample directly by signal transmission to heated for controlling temperature module.
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| CN201310162080.6A CN103336542B (en) | 2013-05-06 | 2013-05-06 | A kind of hot melt adhesive heated for controlling temperature method and heated for controlling temperature system thereof |
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| CN201310162080.6A CN103336542B (en) | 2013-05-06 | 2013-05-06 | A kind of hot melt adhesive heated for controlling temperature method and heated for controlling temperature system thereof |
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| CN103336542B true CN103336542B (en) | 2015-10-21 |
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| CN113236702A (en) * | 2021-05-11 | 2021-08-10 | 中国第一汽车股份有限公司 | Low-temperature compensation method and assembly of magnetorheological damper, vehicle and storage medium |
| CN115181514A (en) * | 2022-07-25 | 2022-10-14 | 广州市嘉雁粘合剂有限公司 | Environment-friendly hot melt adhesive for spring mattress and preparation method thereof |
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| CN1309589A (en) * | 1998-08-26 | 2001-08-22 | 罗卡菲克斯公司 | Hotmelt applicator and adhesive stick for supplying same |
| CN2558466Y (en) * | 2002-07-23 | 2003-07-02 | 甲宇兴业有限公司 | Coating device of upper hot-melt adhesive machine |
| CN1696858A (en) * | 2005-06-15 | 2005-11-16 | 中国海洋大学 | Intelligent temperature control equipment |
| CN201444263U (en) * | 2009-07-07 | 2010-04-28 | 山东荣泰电炉制造有限公司 | Temperature closed loop control device of medium-frequency heat processing equipment |
| CN101930241A (en) * | 2010-08-27 | 2010-12-29 | 九阳股份有限公司 | Safety relief temperature controlled electric pressure cooker and precious voltage controlling method thereof |
-
2013
- 2013-05-06 CN CN201310162080.6A patent/CN103336542B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1309589A (en) * | 1998-08-26 | 2001-08-22 | 罗卡菲克斯公司 | Hotmelt applicator and adhesive stick for supplying same |
| CN2558466Y (en) * | 2002-07-23 | 2003-07-02 | 甲宇兴业有限公司 | Coating device of upper hot-melt adhesive machine |
| CN1696858A (en) * | 2005-06-15 | 2005-11-16 | 中国海洋大学 | Intelligent temperature control equipment |
| CN201444263U (en) * | 2009-07-07 | 2010-04-28 | 山东荣泰电炉制造有限公司 | Temperature closed loop control device of medium-frequency heat processing equipment |
| CN101930241A (en) * | 2010-08-27 | 2010-12-29 | 九阳股份有限公司 | Safety relief temperature controlled electric pressure cooker and precious voltage controlling method thereof |
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