CN103333480A - Low CLTE (coefficient of linear thermal expansion) electroplating PC/ABS (Polycarbonate/Acrylonitrile Butadiene Styrene) alloy material and preparation method thereof - Google Patents
Low CLTE (coefficient of linear thermal expansion) electroplating PC/ABS (Polycarbonate/Acrylonitrile Butadiene Styrene) alloy material and preparation method thereof Download PDFInfo
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Abstract
The invention relates to a low CLTE electroplating PC/ABS (Polycarbonate/Acrylonitrile Butadiene Styrene) alloy material and a preparation method thereof. The low CLTE electroplating PC/ABS alloy material is prepared from the following raw materials in parts by weight: 30-80 parts of PC resin, 15-65 parts of ABS resin, 1-5 parts of talcum powder, 0.1-1 part of antioxygen and 0.1-1 part of lubricating agent. The preparation method comprises the following steps: adding all raw materials in a mixing agitator for mixing; then passing the obtained mixture through a double-screw extruder for blend granulation. According to the invention, the talcum powder is added into the materials, so that the CLTE of the PC/ABS alloy material is lowered; when the PC/ABS alloy material is machined after electroplating, the difference between the CLTE of the PC/ABS alloy material and the CLTE of an electroplating metal layer is reduced; therefore, the crack of the electroplating metal layer caused by deformation of the material due to cold and thermal impact is reduced, the high electroplating binding power is ensured, the surface of a product is smooth, the electroplating surface effect is good, and the preparation method is simple and practicable.
Description
Technical field
The invention belongs to polymer blended, polymer shaping manufacture field, specifically, relate to plating PC/ABS alloy material of a kind of low coefficient of linear expansion and preparation method thereof.
Background technology
The PC/ABS alloy material is owing to its excellent thermotolerance, toughness and fatigue resistance and electroplate performance, is widely used on the interior exterior part of automobile, as inside and outside door handle, vehicle nameplate, wheel clamshell, grid, ornamental strip etc.
Along with the widespread use of electroplating the PC/ABS alloy material, automobile industry requires also more and more stricter to it.Generally increased the thermal shock experiment to electroplating the PC/ABS alloy material in the GWM14668-2010 that released in 2010, requiring plated item not to have cracking in the standard behind thermal shock does not have foaming.And common plating PC/ABS alloy material all can't be tested by thermal shock.When thermal shock, PC/ABS plastic component and electrolytic coating all have been subjected to expanding with heat and contract with cold, but because the coefficient of linear expansion difference of PC/ABS alloy material and electroplated metal layer is big, the shrinkage strain of PC/ABS alloy material is bigger, finally causes craze of coating.Therefore need a kind of plating PC/ABS alloy material of low coefficient of linear expansion badly, when crossing thermal shock, do not have cracking, no bubble to guarantee it, still keep superperformance, to satisfy the high request of automobile industry, widen the range of application of PC/ABS alloy material.
Chinese patent literature CN201110242354.3, applying date 2011.08.23, polypropene composition of a kind of low coefficient of linear expansion and preparation method thereof is disclosed, described component percentage ratio by weight comprises: acrylic resin is 40 ~ 70%, elastomerics is 10 ~ 30%, the high length-diameter ratio filler is 5 ~ 30%, other mineral fillers are 0 ~ 20%, compatilizer 0.5 ~ 10%, other additives 0.05 ~ 5%.The polypropene composition of this invention adopts high length-diameter ratio (HAR) Inorganic Fillers Filled to strengthen or adopts the high length-diameter ratio mineral filler and the composite filling enhancing of common mineral filler, it is composite modified to add compatilizer again, the gained polypropene composition has low coefficient of linear expansion through injection molded plastic components, show good dimensional stability in high cold cycle, product has the approaching coefficient of linear expansion that equates along injection moulding flow direction (FD or MD) and vertical injection moulding flow direction (TD).Preparation method of the present invention is simple, practical, has enlarged the use range of modified polypropylene material in fields such as automobile, household electrical appliances and mechanical industries.
Summary of the invention
The objective of the invention is at deficiency of the prior art, a kind of plating PC/ABS alloy material of low coefficient of linear expansion is provided.
One purpose more of the present invention is that the preparation method of the plating PC/ABS alloy material of above-mentioned low coefficient of linear expansion is provided.
For achieving the above object, the technical scheme taked of the present invention is:
A kind of plating PC/ABS alloy material of low coefficient of linear expansion, it is to be made by the raw material of following weight part:
30～80 parts of PC resins,
15～65 parts of ABS resin,
1～5 part of talcum powder,
0.1～1 part in oxidation inhibitor,
0.1～1 part of lubricant.
Preferably, described plating PC/ABS alloy material is to be made by the raw material of following weight part:
30 parts of PC resins,
65 parts of ABS resin,
5 parts of talcum powder,
0.4 part in oxidation inhibitor,
0.3 part of lubricant.
Preferably, described plating PC/ABS alloy material is to be made by the raw material of following weight part:
50 parts of PC resins,
45 parts of ABS resin,
5 parts of talcum powder,
0.4 part in oxidation inhibitor,
0.3 part of lubricant.
Preferably, the relative molecular weight of described PC resin is 17000～30000g/mol, and second-order transition temperature is 140～150 ℃.
Preferably, the relative molecular weight of described ABS resin is 100000～180000g/mol, and wherein the divinyl weight percent content is 10～55%, and the vinyl cyanide weight percent content is 15～32%, and the vinylbenzene weight percent content is 30～70%.
Preferably, described talcum powder particle diameter≤5 μ m.
Preferably, described oxidation inhibitor is selected from Triethylene glycol two [β (3 tertiary butyls, 4 hydroxyls, 5 aminomethyl phenyls) propionic esters], four [β (3,5 di-t-butyls, 4 hydroxy phenyls) propionic acid] in pentaerythritol ester, three (2,4 di-tert-butyl-phenyl) phosphorous acid ester and the two stearyl alcohol pentaerythritol diphosphites one or more.
Preferably, described lubricant is selected from silane polymer, solid paraffin, whiteruss, soap, calcium stearate fatty acid amide, calcium stearate, Zinic stearas, tetramethylolmethane stearic acid, stearic amide, methylene bis stearic amide and N, one or more in the N ethylene bis stearic acid amide.
For realizing above-mentioned second purpose, the technical scheme that the present invention takes is:
The preparation method of the plating PC/ABS alloy material of aforesaid low coefficient of linear expansion may further comprise the steps:
A) by weight, will mix in 30～80 parts of PC resins, 15～65 parts of ABS resin, 1～5 part of talcum powder, 0.1～1 part in oxidation inhibitor and 0.1～1 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, obtain the plating PC/ABS alloy material particle of low coefficient of linear expansion.
Described twin screw extruder barrel zone temperature is 200～260 ℃, and screw speed is 200～600rpm.
The invention has the advantages that:
1, the present invention has added talcum powder in material, make PC/ABS alloy material coefficient of linear expansion reduce, be used for electroplating post-treatment, reduced the coefficient of linear expansion difference of PC/ABS material and electroplated metal layer, the cracking of the coating that distortion of materials causes when having dwindled owing to thermal shock;
2, select the talcum powder of particle diameter≤5 μ m for use, can guarantee the plating bonding force that material is higher, guarantee that product surface is smooth, plate surface is effective;
3, preparation method of the present invention is simple, is convenient to implement.
Embodiment
Below embodiment provided by the invention is elaborated.
Among following examples 1-4 and the Comparative Examples 1-2, described PC resin is selected the PC201-22 of Korea S LG-DOW for use; ABS resin is selected the ABS8434 of Shanghai Gaoqiao petrochemical industry for use; The YK-T that talcum powder I selects for use woods to change into, particle diameter are 2 μ m; Talcum powder II selects the R7 that makes every effort to open up for use, and particle diameter is 8 μ m; Oxidation inhibitor is Irganox 1076 and the Irganox 168 of Ciba company, and its weight ratio is 1: 1; Lubricant is commercially available tetramethylolmethane stearic acid.
Embodiment 1 plating PC/ABS alloy material preparation of the present invention ()
A) by weight, will mix in 80 parts of PC resins, 15 parts of ABS resin, 1 part of talcum powder I, 0.1 part in oxidation inhibitor and 0.1 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion.
Embodiment 2 plating PC/ABS alloy material preparations of the present invention (two)
A) by weight, will mix in 30 parts of PC resins, 65 parts of ABS resin, 5 parts of talcum powder I, 0.4 part in oxidation inhibitor and 0.3 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion.
Embodiment 3 plating PC/ABS alloy material preparations of the present invention (three)
A) by weight, will mix in 50 parts of PC resins, 45 parts of ABS resin, 5 parts of talcum powder I, 0.4 part in oxidation inhibitor and 0.3 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion.
Embodiment 4 plating PC/ABS alloy material preparations of the present invention (four)
A) by weight, will mix in 50 parts of PC resins, 47 parts of ABS resin, 3 parts of talcum powder I, 1 part in oxidation inhibitor and 1 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion.
Embodiment 5 plating PC/ABS alloy material preparations of the present invention (five)
A) by weight, will mix in 80 parts of PC resins, 15 parts of ABS resin, 5 parts of talcum powder, 0.5 part in oxidation inhibitor and 0.5 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion,
Wherein, described PC resin relative molecular weight is 17000g/mol, 140 ℃ of second-order transition temperatures;
Described ABS resin relative molecular weight is 100000g/mol, and wherein the divinyl weight percent content is 55%, and the vinyl cyanide weight percent content is 15%, and the vinylbenzene weight percent content is 30%;
Described talcum powder particle diameter is 1 μ m;
Described oxidation inhibitor is Triethylene glycol two [β (3 tertiary butyls, 4 hydroxyls, 5 aminomethyl phenyls) propionic ester];
Described lubricant is N, the N ethylene bis stearic acid amide.
Embodiment 6 plating PC/ABS alloy material preparations of the present invention (six)
A) by weight, will mix in 30 parts of PC resins, 65 parts of ABS resin, 5 parts of talcum powder, 0.1 part in oxidation inhibitor and 0.1 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion,
Wherein, the relative molecular weight 30000g/mol of described PC resin, 150 ℃ of second-order transition temperatures;
Described ABS resin relative molecular weight is 180000g/mol, and wherein the divinyl weight percent content is 10%, and the vinyl cyanide weight percent content is 20%, and the vinylbenzene weight percent content is 70%;
Described talcous particle diameter is 5 μ m;
Described oxidation inhibitor is four [β (3,5 di-t-butyls, 4 hydroxy phenyls) propionic acid] pentaerythritol ester and three (2,4 di-tert-butyl-phenyl) phosphorous acid ester, the two weight ratio 1: 2;
Described lubricant is methylene bis stearic amide and N, the mixing of N ethylene bis stearic acid amide, the two weight ratio 1: 1.
Embodiment 7 plating PC/ABS alloy material preparations of the present invention (seven)
A) by weight, will mix in 30 parts of PC resins, 65 parts of ABS resin, 5 parts of talcum powder, 0.4 part in oxidation inhibitor and 0.3 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion,
Wherein, the relative molecular weight 24000g/mol of described PC resin, 150 ℃ of second-order transition temperatures;
Described ABS resin relative molecular weight is 150000g/mol;
Described talcous particle diameter is 5 μ m;
Described oxidation inhibitor is two stearyl alcohol pentaerythritol diphosphites;
Described lubricant is calcium stearate, Zinic stearas and N, the mixing of N ethylene bis stearic acid amide, three's weight ratio 1: 1: 1.
Embodiment 8 plating PC/ABS alloy material preparations of the present invention (eight)
A) by weight, will mix in 50 parts of PC resins, 45 parts of ABS resin, 5 parts of talcum powder, 0.4 part in oxidation inhibitor and 0.3 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion,
Wherein, the relative molecular weight 17000g/mol of described PC resin, 140 ℃ of second-order transition temperatures;
Described ABS resin relative molecular weight is 100000g/mol, and wherein the divinyl weight percent content is 55%, and the vinyl cyanide weight percent content is 15%, and the vinylbenzene weight percent content is 30%;
Described talcous particle diameter is 4 μ m;
Described oxidation inhibitor is the mixing of four [β (3,5 di-t-butyls, 4 hydroxy phenyls) propionic acid] pentaerythritol ester, three (2,4 di-tert-butyl-phenyl) phosphorous acid ester and two stearyl alcohol pentaerythritol diphosphites, and three's weight ratio is 2: 2: 1;
Described lubricant is the mixing of calcium stearate fatty acid amide and stearic amide, the two weight ratio 1: 2.
Embodiment 9 plating PC/ABS alloy material preparations of the present invention (nine)
A) by weight, will mix in 30 parts of PC resins, 65 parts of ABS resin, 5 parts of talcum powder, 0.4 part in oxidation inhibitor and 0.3 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion,
Wherein, the relative molecular weight 24000g/mol of described PC resin, 150 ℃ of second-order transition temperatures;
Described ABS resin relative molecular weight is 150000g/mol;
Described talcous particle diameter is 5 μ m;
Described oxidation inhibitor is two stearyl alcohol pentaerythritol diphosphites;
Described lubricant is the mixing of siloxanes and solid paraffin, the two weight ratio 2: 1.
Embodiment 10 plating PC/ABS alloy material preparations of the present invention (ten)
A) by weight, will mix in 80 parts of PC resins, 15 parts of ABS resin, 1 part of talcum powder I, 0.1 part in oxidation inhibitor and 0.1 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion,
Wherein, the relative molecular weight 30000g/mol of described PC resin, 150 ℃ of second-order transition temperatures;
Described ABS resin relative molecular weight is 180000g/mol, and wherein the divinyl weight percent content is 10%, and the vinyl cyanide weight percent content is 20%, and the vinylbenzene weight percent content is 70%;
Described talcous particle diameter is 5 μ m;
Described oxidation inhibitor is four [β (3,5 di-t-butyls, 4 hydroxy phenyls) propionic acid] pentaerythritol ester;
Described lubricant is the mixing of methylene bis stearic amide and whiteruss, the two weight ratio 2: 1.
Comparative Examples 1
A) by weight, will mix in 50 parts of PC resins, 50 parts of ABS resin, 0.4 part in oxidation inhibitor and 0.3 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion.
Comparative Examples 2
A) by weight, will mix in 50 parts of PC resins, 50 parts of ABS resin, 5 parts of talcum powder II, 0.4 part in oxidation inhibitor and 0.3 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion.
Comparative Examples 3
A) by weight, will mix in 30 parts of PC resins, 65 parts of ABS resin, 5 parts of talcum powder, 0.4 part in oxidation inhibitor and 0.3 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion,
Wherein, the relative molecular weight 24000g/mol of described PC resin, 150 ℃ of second-order transition temperatures;
Described ABS resin relative molecular weight is 150000g/mol;
Described talcous particle diameter is 6 μ m;
Described oxidation inhibitor is two stearyl alcohol pentaerythritol diphosphites;
Described lubricant is calcium stearate, Zinic stearas and N, the mixing of N ethylene bis stearic acid amide, three's weight ratio 1: 1: 1.
Comparative Examples 4
A) by weight, will mix in 30 parts of PC resins, 65 parts of ABS resin, 5 parts of ground silicas, 0.4 part in oxidation inhibitor and 0.3 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion,
Wherein, the relative molecular weight 24000g/mol of described PC resin, 150 ℃ of second-order transition temperatures;
Described ABS resin relative molecular weight is 150000g/mol;
The particle diameter of described ground silica is 5 μ m;
Described oxidation inhibitor is two stearyl alcohol pentaerythritol diphosphites;
Described lubricant is calcium stearate, Zinic stearas and N, the mixing of N ethylene bis stearic acid amide, three's weight ratio 1: 1: 1.
Comparative Examples 5
A) by weight, will mix in 30 parts of PC resins, 65 parts of ABS resin, 5.5 parts of talcum powder, 0.4 part in oxidation inhibitor and 0.3 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, wherein the barrel zone temperature of twin screw extruder is 200～260 ℃, and screw speed is 200～600rpm, obtains the plating PC/ABS alloy particle of low coefficient of linear expansion.
Wherein, the relative molecular weight 24000g/mol of described PC resin, 150 ℃ of second-order transition temperatures;
Described ABS resin relative molecular weight is 150000g/mol;
Described talcous particle diameter is 5 μ m;
Described oxidation inhibitor is two stearyl alcohol pentaerythritol diphosphites;
Described lubricant is calcium stearate, Zinic stearas and N, the mixing of N ethylene bis stearic acid amide, three's weight ratio 1: 1: 1.
The test of embodiment 11 product performance
The plating PC/ABS alloy material of the low coefficient of linear expansion of above embodiment 1～10 and Comparative Examples 1～5 preparation is used for door handle product in the automobile, and its performance is as shown in table 1.The CLTE(coefficient of linear expansion) carries out according to ISO 11359-2-1999 standard, at N
2Under the environment, be warmed up to 40 ℃ with the speed of 5 ℃/min from-40 ℃; Electroplate bonding force and carry out according to the GMW14668-2010 standard, draw speed is 100 mm/min, and angle is 90 °; The thermal shock experiment is carried out according to GMW 14668-2010 standard; Plating leakage and plating pit situation are all carried out the sense organ evaluation and test, and each Oranoleptic indicator is divided into a star, two stars, Samsung, 4 grades of four stars, and ★ more multilist presentation surface performance is more good, and sense organ group comprises 10 members.
Table 1 product performance test result
As shown in Table 1, add talcum powder, make the PC/ABS coefficient of linear expansion reduce; Select for use particle diameter less than the talcum powder of 5 μ m, when reducing CLTE, do not cause and electroplate back pit and plating leakage, improved the electroplating effect of thermal shock qualification rate and PC/ABS alloy material.
The above only is preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the inventive method; can also make some improvement and replenish, these improvement and replenish and also should be considered as protection scope of the present invention.
Claims (10)
1. the plating PC/ABS alloy material of a low coefficient of linear expansion is characterized in that, it is to be made by the raw material of following weight part:
30～80 parts of PC resins,
15～65 parts of ABS resin,
1～5 part of talcum powder,
0.1～1 part in oxidation inhibitor,
0.1～1 part of lubricant.
2. the plating PC/ABS alloy material of low coefficient of linear expansion according to claim 1 is characterized in that, it is to be made by the raw material of following weight part:
30 parts of PC resins,
65 parts of ABS resin,
5 parts of talcum powder,
0.4 part in oxidation inhibitor,
0.3 part of lubricant.
3. the plating PC/ABS alloy material of low coefficient of linear expansion according to claim 1 is characterized in that, it is to be made by the raw material of following weight part:
50 parts of PC resins,
45 parts of ABS resin,
5 parts of talcum powder,
0.4 part in oxidation inhibitor,
0.3 part of lubricant.
4. the plating PC/ABS alloy material of low coefficient of linear expansion according to claim 1 is characterized in that, the relative molecular weight of described PC resin is 17000～30000g/mol, and second-order transition temperature is 140～150 ℃.
5. the plating PC/ABS alloy material of low coefficient of linear expansion according to claim 1, it is characterized in that, the relative molecular weight of described ABS resin is 100000～180000g/mol, wherein the divinyl weight percent content is 10～55%, the vinyl cyanide weight percent content is 15～32%, and the vinylbenzene weight percent content is 30～70%.
6. the plating PC/ABS alloy material of low coefficient of linear expansion according to claim 1 is characterized in that, described talcum powder particle diameter≤5 μ m.
7. the plating PC/ABS alloy material of low coefficient of linear expansion according to claim 1, it is characterized in that, described oxidation inhibitor is selected from Triethylene glycol two [β (3 tertiary butyls, 4 hydroxyls, 5 aminomethyl phenyls) propionic esters], four [β (3,5 di-t-butyls, 4 hydroxy phenyls) propionic acid] in pentaerythritol ester, three (2,4 di-tert-butyl-phenyl) phosphorous acid ester and the two stearyl alcohol pentaerythritol diphosphites one or more.
8. the plating PC/ABS alloy material of low coefficient of linear expansion according to claim 1, it is characterized in that, described lubricant is selected from silane polymer, solid paraffin, whiteruss, soap, calcium stearate fatty acid amide, calcium stearate, Zinic stearas, tetramethylolmethane stearic acid, stearic amide, methylene bis stearic amide and N, one or more in the N ethylene bis stearic acid amide.
9. the preparation method of the plating PC/ABS alloy material of the described low coefficient of linear expansion of claim 1 is characterized in that, may further comprise the steps:
A) by weight, will mix in 30～80 parts of PC resins, 15～65 parts of ABS resin, 1～5 part of talcum powder, 0.1～1 part in oxidation inhibitor and 0.1～1 part of adding of the lubricant mixing and blending machine;
B) step a) gained mixture is passed through twin screw extruder blend granulation, obtain the plating PC/ABS alloy material particle of low coefficient of linear expansion.
10. preparation method according to claim 9 is characterized in that, described twin screw extruder barrel zone temperature is 200～260 ℃, and screw speed is 200～600rpm.
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