The application requires in the U.S. Provisional Application the 61/614th of submission on March 23rd, 2012, No. 685, the U.S. Provisional Application the 61/731st submitted on November 30th, 2012, No. 949 and the U.S. utility patent application the 13/720th submitted on December 19th, 2012, No. 565 priority is incorporated into its integral body that this is for reference and as the application's a part.
Summary of the invention
The invention provides a kind of three-dimensional spiral antenna, comprising: substrate has 3D shape district (three-dimensional shaped region); Helical antenna element is complementary by the support of described 3D shape district and with described 3D shape district, makes described helical antenna element have the global shape near 3D shape; And distributing point (feed point), be coupled to the tie point of described helical antenna element.
In the above-mentioned three-dimensional spiral antenna, described helical antenna element comprises in following: the spiral of Archimedes shape; And the equiangular spiral shape, wherein, the gain of described three-dimensional spiral antenna has spiral gain component and three-dimensional gain component.
In the above-mentioned three-dimensional spiral antenna, described helical antenna element comprises in following: symmetrical spiral pattern; And eccentric spiral pattern.
In the above-mentioned three-dimensional spiral antenna, described substrate comprises in following: one or more printed circuit board (PCB)s; One or more integrated circuit (IC) substrate package; And non-conductive assembled antenna backing structure (non-conductive fabricated antenna backing structure).
In the above-mentioned three-dimensional spiral antenna, described helical antenna element comprises: have the solid substantially electric conducting material of multiturn spiral fluted, wherein, the low side of the frequency band of described three-dimensional spiral antenna is based on the radius of described helical antenna element, and wherein, high-end at least one based in following of described frequency band: the radius of the inner coil of described helical antenna element and the radius of described distributing point.
In the above-mentioned three-dimensional spiral antenna, described helical antenna element comprises: lead, it is spiral-shaped to be formed multiturn, wherein, the low side of the frequency band of described three-dimensional spiral antenna is based on the radius of described helical antenna element, and wherein, high-end at least one based in following of described frequency band: the radius of the inner coil of described helical antenna element and the radius of described distributing point.
In the above-mentioned three-dimensional spiral antenna, described 3D shape district comprises in following: cup-shaped; Conical; Cylindrical; Pyramid; Box-like; Spherical; Parabola shaped; And hyperbola.
The present invention also provides a kind of three-dimensional spiral antenna, comprising: substrate has the 3D shape district; First helical antenna element is complementary by the support of described 3D shape district and with described 3D shape district; Second helical antenna element, interweave mutually with described first helical antenna element, wherein, described second helical antenna element is supported by the three-dimensional cup district and is complementary with described three-dimensional cup district that feasible described first helical antenna element that interweaves mutually and described second helical antenna element have the global shape near 3D shape; And distributing point, be coupled at least one the tie point in described first helical antenna element and described second helical antenna element.
In the above-mentioned three-dimensional spiral antenna, each in described first helical antenna element and described second helical antenna element comprises in following: the spiral of Archimedes shape; And the equiangular spiral shape, wherein, the gain of described three-dimensional spiral antenna has spiral gain component and three-dimensional gain component.
In the above-mentioned three-dimensional spiral antenna, each in described first helical antenna element and described second helical antenna element comprises in following: symmetrical spiral pattern; And eccentric spiral pattern.
In the above-mentioned three-dimensional spiral antenna, described substrate comprises in following: one or more printed circuit board (PCB)s; One or more integrated circuit (IC) substrate package; And non-conductive assembled antenna backing structure.
In the above-mentioned three-dimensional spiral antenna, in described first helical antenna element and described second helical antenna element each comprises: solid substantially electric conducting material, wherein, the multiturn helicla flute is separated described first helical antenna element and described second helical antenna element, wherein, the low side of the frequency band of described three-dimensional spiral antenna is based on described first helical antenna element that interweaves mutually and the radius of described second helical antenna element, and wherein, high-end at least one based in following of described frequency band: described first helical antenna element that interweaves mutually and the radius of the inner coil of described second helical antenna element and the radius of described distributing point.
In the above-mentioned three-dimensional spiral antenna, in described first helical antenna element and described second helical antenna element each comprises: lead, it is spiral-shaped to be formed multiturn, wherein, the low side of the frequency band of described three-dimensional spiral antenna is based on described first helical antenna element that interweaves mutually and the radius of described second helical antenna element, and wherein, high-end at least one based in following of described frequency band: described first helical antenna element that interweaves mutually and the radius of the inner coil of described second helical antenna element and the radius of described distributing point.
In the above-mentioned three-dimensional spiral antenna, described 3D shape district comprises in following: cup-shaped; Conical; Cylindrical; Pyramid; Box-like; Spherical; Parabola shaped; And hyperbola.
The invention provides a kind of radio frequency (RF) front-end module, comprising: operationally receive and dispatch the three-dimensional spiral antenna of inbound radiofrequency signal and departures radiofrequency signal, described three-dimensional spiral antenna comprises: substrate has the 3D shape district; Helical antenna element is complementary by the support of described 3D shape district and with described 3D shape district, makes described helical antenna element have the global shape near 3D shape; And distributing point, be coupled to the tie point of described helical antenna element; Receive-send isolation module, operationally be coupled to described three-dimensional spiral antenna, wherein, described reception-transmission isolation module is operationally isolated described inbound radiofrequency signal and described departures radiofrequency signal; And the tuner module of tuning described reception-transmission isolation module operationally.
Above-mentioned RF front-end module also comprises at least one in following: power amplifier, operationally be coupled to described reception-transmission isolation module, and wherein, described power amplifier amplifies the up-conversion exit signal to produce described departures radiofrequency signal; And low noise amplifier, operationally be coupled to described reception-transmission isolation module, wherein, described low noise amplifier amplifies described inbound radiofrequency signal.
Above-mentioned RF front-end module also comprises: integrated circuit (IC) chip comprises described tuner module; And integrated circuit (IC) substrate package, support described integrated circuit (IC) chip, and be the described substrate that comprises the three-dimensional cup district that wherein, described reception-transmission isolation module is positioned on described integrated circuit (IC) chip or the described integrated circuit (IC) substrate package.
In the above-mentioned RF front-end module, described helical antenna element comprises in following: Archimedes's symmetry is spiral-shaped; Archimedes's off-centre is spiral-shaped; The isogonism symmetry is spiral-shaped; And isogonism off-centre is spiral-shaped.
In the above-mentioned RF front-end module, described helical antenna element comprises in following: have the solid substantially electric conducting material of multiturn spiral fluted; And lead, it is spiral-shaped to be formed multiturn, wherein, the low side of the frequency band of described three-dimensional spiral antenna is based on the radius of described helical antenna element, and wherein, high-end at least one based in following of described frequency band: the radius of the inner coil of described helical antenna element and the radius of described distributing point.
In the above-mentioned RF front-end module, described three-dimensional spiral antenna comprises: second helical antenna element, interweave mutually with first helical antenna element, wherein, described second helical antenna element is supported by the three-dimensional cup district and is complementary with described three-dimensional cup district that feasible described first helical antenna element that interweaves mutually and described second helical antenna element have the global shape near described 3D shape; And distributing point, be coupled to the tie point of described second helical antenna element.
Embodiment
Fig. 1 is the schematic block diagram of a kind of execution mode of radio communication device 5, and this radio communication device comprises radio frequency (RF) front-end module 10, power amplifier 18, low noise amplifier 20, up-conversion module 22, down conversion module 24 and baseband processing module 26.RF front-end module 10 comprises three-dimensional (3D) helical antenna 12, receives-send (RX-TX) isolation module 14 and tuner module 16.
Communicator 5 can be any device that can be carried by the people, can be at least part of battery-powered, and comprise radio transceiver (for example, radio frequency (RF) and/or millimeter wave (MMW)), and carry out one or more software application.For example, communicator 5 can be cell phone, laptop computer, personal digital assistant, electronic game controller, electronic game machine, personal entertainment device, panel computer etc.
In an example that sends departures RF signal, baseband processing module 26 is converted to one or more departures symbol streams according to communication standard or agreement with outbound data (for example, voice, text, video, figure, video file, audio file etc.).Can be the up-conversion module 22 of direct modular converter or super-heterodyne conversion module, one or more departures symbol circulations are changed to one or more up-conversion signals.Power amplifier 18 amplifies these one or more up-conversion signals, to produce one or more departures RF signals.To set off RF signal and inbound RF signal of RX-TX isolation module 14 isolated, and the RF signal that will set off offers 3D helical antenna 12 to be used for transmission.Notice that 16 pairs of RX-TX isolation modules of tuner module 14 carry out tuning.
In the example that receives one or more inbound RF signals, 3D antenna 12 reception of inbound RF signals, and provide it to RX-TX isolation module 14.RX-TX isolation module 14 is isolated inbound RF signal and departures RF signal, and inbound RF signal is offered low noise amplifier 20.Low noise amplifier 20 amplifies inbound RF signal, and can be the down conversion module 24 of direct down conversion module or super-heterodyne conversion module, and the inbound RF signal that amplifies is converted to one or more inbound symbol streams.Baseband processing module 26 is changed to inbound data with one or more inbound symbol circulations.
RF front-end module 10 can be implemented as the integrated circuit (IC) that comprises one or more IC chips and IC base plate for packaging.Tuner module 16 is embodied on one or more IC chips.The IC base plate for packaging is supported the IC chip, and also can comprise 3D helical antenna 12.RX-TX isolation module 14 can be embodied on one or more IC chips and/or the IC base plate for packaging.One or more being embodied on one or more IC chips in power amplifier 18, low noise amplifier 20, up-conversion module 22, down conversion module 24 and the baseband processing module 26.
Fig. 2 is the schematic block diagram of a kind of execution mode of RF front-end module 10, and this RF front-end module comprises 3D helical antenna 12, as the duplexer 14-1 of RX-TX isolation module 14 and balancing network 14-2 and as resitstance voltage divider (R1 and R2), detector 34 and the tuning engine 36 of tuner module 16.Duplexer 14-1 is used for secondary winding is added the voltage of being responded at two elementary windings by inbound RF signal 32 ideally, and deduct the voltage of being responded at two elementary windings by departures RF signal 30, make on secondary winding, not have departures RF signal, and inbound RF signal occurs twice at secondary winding.Based on the feedback from tuner module 16, balancing network 14-2 adjusts the impedance that the 3D helical antenna is mated in its impedance substantially, makes duplexer more come work near perfect condition.
Fig. 3 is the axonometric drawing of a kind of execution mode of dimensional antenna 12, and this dimensional antenna comprises substrate 40, helical antenna element 46 and is coupled to the distributing point 48 of the tie point of helical antenna element 46.Can be the substrate 40 of one or more printed circuit board (PCB)s, one or more integrated circuit (IC) substrate package and/or non-conductive assembled antenna backing structure, for example comprise exterior three dimensional shape district 42(, extend to surface or periphery above substrate 40).Helical antenna element 46 is supported by 3D shape district 42 and is complementary with this 3D shape district, makes helical antenna element 46 have the global shape near 3D shape.
For example, when 3D shape district 42 had hyperbolic shape, helical antenna element had the hyperbolic shape with 3D shape district 42 about same sizes.As another example, substrate 40 can be centered on (encompass) so that the non-conductive antenna backing structure (for example, plastics, glass, glass fibre etc.) of hyperbola antenna to be provided by 3D shape district 42.The diameter range of hyperbolic shape can be from being used for several microns tens meters of arriving for low frequency and/or higher-power applications that high frequency (for example, tens GHzs) and/or lower-wattage are used.
As another example, 3D shape district 42 has cone shape, makes helical antenna element 46 also have cone shape, and roughly the same with the size in 3D shape district 42.3D shape district 42 can have other shapes, such as cup-shaped, cylindrical, pyramid, box-like (as shown in Figure 3), spherical or parabola shaped.
Fig. 4 is the axonometric drawing of another execution mode of dimensional antenna 12, and this dimensional antenna comprises substrate 40, helical antenna element 46 and is coupled to the distributing point 48 of the tie point of helical antenna element 46.Can be the substrate 40 of one or more printed circuit board (PCB)s, one or more integrated circuit (IC) substrate package and/or non-conductive assembled antenna backing structure, for example comprise interior three-dimensional shape district 44(, extend internally with respect to surface or the outer rim of substrate 40).Helical antenna element 46 is supported by 3D shape district 44 and is complementary with this 3D shape district 44, makes helical antenna element 46 have the global shape near 3D shape.That 3D shape district 44 can have is cup-shaped, parabola shaped, conical, box-like (as shown in Figure 4), cylindrical, pyramid or sphere.
Fig. 5 to Fig. 8 is the schematic diagram of execution mode of the helical antenna element 46 of 3D antenna 12, and this 3D antenna has the spiral-shaped of a circle or multiturn.This is spiral-shaped can be spiral of Archimedes shape and/or equiangular spiral shape (for example, Sai Erte spiral).Because the spinning behaviour of helical antenna element 46, antenna has the gain (for example, the spiral gain component) of about 3dB, because opposite radiation lobe is inverted, therefore forward radiation pattern energy is doubled.Because the 3D shape of antenna element, antenna gain has for example further increased about 2dB(again, three-dimensional gain component).Therefore, 3D helical antenna 12 has the gain of about 5dB.
At least part of physical attribute based on antenna 12 of the working band of 3D helical antenna 12.For example, (that is, distributing point and/or interior circle radius) size has been set up the last cut-off region of bandwidth, and the periphery of helical antenna 12 has been set up the following cut-off region of bandwidth in the lasing region of antenna 12.Spiral pattern has been created circular polarization.Distance between track width, the trace, the length of each spiral part, can influence quality factor, radiation mode, impedance (quite constant on bandwidth), gain and/or other characteristics of antenna 12 to the use on the distance of ground level and/or artificial magnetic conductor plane.
As shown in Figure 5, helical antenna element 46 comprises and is formed the spiral lead of multiturn.Distance between length, width and the circle depends on the desirable characteristics (for example, bandwidth, centre frequency, quality factor, impedance, polarization etc.) of antenna.Fig. 6 shows and comprises having the helical antenna element 46 that the multiturn spiral fluted is solid electric conducting material substantially.Fig. 7 shows and comprises the lead with symmetrical spiral pattern 52 or the helical antenna element of realizing for solid conductor substantially 46, and this symmetry spiral pattern has been created the radiation mode that is basically perpendicular to distributing point.Fig. 8 shows and comprises the lead with eccentric spiral pattern 54 or the helical antenna element of realizing for solid conductor substantially 46, and this off-centre spiral pattern has been created the radiation mode that is not orthogonal to distributing point.
Fig. 9 is the axonometric drawing of dimensional antenna 12, and this dimensional antenna comprises and is the nemaline helical antenna element 46 of three dimensional parabolic.In this exemplary execution mode, substrate 40 only comprises 3D shape district 42 or 44.Therefore, 3D antenna 12 is the parabolic helical aerials with above-mentioned characteristic.Notice that helical antenna element 46 can be according to one or more enforcement the among Fig. 5 to Fig. 8.
Figure 10 is the sectional view that only comprises the nemaline dimensional antenna 12 of three dimensional parabolic, and this dimensional antenna comprises helical antenna element 46 and substrate 40.Figure 11 is the sectional view that only comprises the dimensional antenna 12 of three-dimensional hyperbolic shape, and this dimensional antenna comprises helical antenna element 46 and substrate 40.Therefore, 3D antenna 12 is the hyperbolic spiral antennas with above-mentioned characteristic.Notice that helical antenna element 46 can be according to one or more enforcement the among Fig. 5 to Fig. 8.
Figure 12 is the axonometric drawing of another execution mode of dimensional antenna 12, and this dimensional antenna comprises substrate 40, helical antenna element 60 and be coupled to the distributing point 62 of the tie point of the helical antenna element 60 that interweaves interweaves.Can be the substrate 40 of one or more printed circuit board (PCB)s, one or more integrated circuit (IC) substrate package and/or non-conductive assembled antenna backing structure, comprise that exterior three dimensional shape district 42(extends to surface or the periphery above substrate 40).The helical antenna element 60 that interweaves comprises first helical antenna element and second helical antenna element, and matches by 42 supports of 3D shape district and with this 3D shape district, and the feasible helical antenna element 60 that interweaves has the global shape near 3D shape.
For example, when 3D shape district 42 had hyperbolic shape, the helical antenna element 60 that interweaves had the hyperbolic shape with 3D shape district 42 approximate same size.As another example, substrate 40 can be centered on so that the non-conductive antenna backing structure (for example, plastics, glass, glass fibre etc.) of hyperbola antenna to be provided by 3D shape district 42.Hyp diameter range can be from being used for several microns tens meters of arriving for low frequency and/or higher-power applications of high frequency (for example, tens GHzs) and/or low power applications.
As another example, 3D shape district 42 has cone shape, and the feasible helical antenna element 60 that interweaves also has cone shape and roughly the same with the size in 3D shape district 42.3D shape district 42 can have other shapes, such as cup-shaped, cylindrical, pyramid, box-like (as shown in figure 12), spherical or parabola shaped.
Figure 13 is the axonometric drawing of another execution mode of dimensional antenna 12, and this dimensional antenna comprises substrate 40, helical antenna element 60 and be coupled to the distributing point 62 of the tie point of the helical antenna element that interweaves interweaves.Can be the substrate 40 of one or more printed circuit board (PCB)s, one or more integrated circuit (IC) substrate package and/or non-conductive assembled antenna backing structure, for example comprise interior three-dimensional shape district 44(, extend internally with respect to surface or the outer rim of substrate 40).The helical antenna element 60 that interweaves is supported by 3D shape district 44 and is complementary with this 3D shape district that the feasible helical antenna element 60 that interweaves has the global shape near 3D shape.That 3D shape district 44 can have is cup-shaped, parabola shaped, conical, box-like (as shown in Figure 4), cylindrical, pyramid or sphere.
Figure 14 is the schematic diagram of another execution mode of helical antenna element 60 of interweaving, and this helical antenna element that interweaves comprises the first helical antenna element 60-1 and the second helical antenna element 60-2.Among the first and second helical antenna element 60-1 and the 60-2 each all can have spiral of Archimedes shape or equiangular spiral shape.In addition, each in first and second helical antenna elements all can have symmetrical spiral pattern or eccentric spiral pattern.Further, each in first and second helical antenna elements all can comprise and is formed the spiral-shaped lead of multiturn.
The spinning behaviour of helical antenna element 60 owing to interweave, antenna 12 has the gain (for example, the spiral gain component) of about 3dB, because opposite radiation lobe is inverted, therefore forward radiation pattern energy is doubled.Because the 3D shape of antenna element, antenna gain has for example further increased about 2dB(again, three-dimensional gain component).Therefore, 3D helical antenna 12 has the gain of about 5dB.
At least part of physical attribute based on antenna 12 of the working band of 3D helical antenna 12.For example, (that is, distributing point and/or interior circle radius) size has been set up the last cut-off region of bandwidth, and the girth of helical antenna 12 has been set up the following cut-off region of bandwidth in the lasing region of antenna 12.The spiral pattern that interweaves has been created circular polarization.Distance between track width, the trace, the length of each spiral part, to the use on the distance of ground level and/or artificial magnetic conductor plane can influence antenna 12 quality factor, radiation mode, impedance (more constant in bandwidth), gain and/or other characteristics.
In instantiation, 20mm radius (for example, 2 * π * 20=125.66mm girth) provides the low cut-off frequency of about 2GHz, and the higher cutoff frequency of about 8GHz has been set up in the lasing region with about 5mm radius.Therefore, the antenna of this particular instance has the bandwidth of the 2-8GHz centered by 5GHz.
Figure 15 is the schematic diagram of another execution mode of helical antenna element 60 of interweaving, and this helical antenna element that interweaves comprises the first helical antenna element 60-1 and the second helical antenna element 60-2.Among the first and second helical antenna element 60-1 and the 60-2 each all can have spiral of Archimedes shape or equiangular spiral shape.In addition, each in first and second helical antenna elements all can have symmetrical spiral pattern or eccentric spiral pattern.Further, the helical antenna element 60 that interweaves can be the basic solid electric conducting material that is, wherein, the multiturn helicla flute is separated first and second helical antenna element 60-1 and the 60-2.
Figure 16 is the sectional view that only comprises a kind of execution mode of the nemaline dimensional antenna 12 of three dimensional parabolic, and this dimensional antenna comprises interweave helical antenna element 60 and substrate 40.Therefore, 3D antenna 12 is the parabolic helical aerials with above-mentioned characteristic.Notice that this helical antenna element 46 can be according to one or more enforcement the among Figure 13 and Figure 14.
Figure 17 is the sectional view that only comprises the dimensional antenna 12 of three-dimensional hyperbolic shape, and this dimensional antenna comprises interweave helical antenna element 60 and substrate 40.Therefore, 3D antenna 12 is the hyperbolic spiral antennas with above-mentioned characteristic.Notice that this helical antenna element 46 can be according to one or more enforcement the among Figure 13 and Figure 14.
As used herein, term " substantially " and " pact " provide acceptable tolerance in the industry for the correlation between its corresponding entry and/or the item.This can be accepted tolerance in the industry and comprises from less than 1% to 50% scope, and corresponding to but be not limited to components values, integrated circuit technology variation, variations in temperature, lifting number of times and/or thermal noise.This correlation between comprises the scope from the difference of a few percent to a large amount of differences.Also as used herein, term " operationally is coupled to ", " being coupled to " and/or " coupling " comprise between the item directly couple and/or between via middle entry (for example, item includes but not limited to assembly, element, circuit and/or module) couple indirectly, wherein, for coupling indirectly, middle entry is not revised signal message, but can adjust its levels of current, voltage levvl and/or power level.Also can use as this paper, infer that coupling (that is, one of them element is coupled to another element by deduction) comprises directly and indirectly coupling in the mode identical with " being coupled to " between two items.Also can use as this paper, term " operationally " or " operationally being coupled to " are indicated a certain comprise an above power supply connection, input, output etc., in order to when being activated, carry out its corresponding function more than, and also can comprise and infer and be coupled to more than one other.Also can use as this paper, term " with ... be associated " comprise independent directly and/or indirectly couple and/or an item embeds in another.As used herein, relatively provide desired relationship between the plural item of term " relatively preferred " expression, the signal etc.For example, when expectation relation has than the bigger amplitude of signal 2 for signal 1, when the amplitude of signal 1 during greater than the amplitude of signal 2 or when the amplitude of signal 2 during less than the amplitude of signal 1, can realize preferred comparison.
Also as used herein, term " processing module ", " treatment circuit " and/or " processing unit " can be single processing unit or a plurality of processing unit.This processing unit can be microprocessor, microcontroller, digital signal processor, microcomputer, CPU, field programmable gate array, programmable logic device, state machine, logical circuit, analog circuit, digital circuit and/or any device that comes control signal (simulation and/or numeral) based on circuit hard coded and/or operational order.Processing module, module, treatment circuit and/or processing unit can be or comprise that also memory and/or integrated memory element, this memory and/or integrated memory element can be the flush type circuits of single memory device, a plurality of storage arrangement and/or another processing module, module, treatment circuit and/or processing unit.This storage arrangement can be any device of read-only memory, random access memory, volatile memory, nonvolatile memory, static memory, dynamic memory, flash memory, buffer memory and/or storing digital information.Note, if processing module, module, treatment circuit and/or processing unit comprise the processing unit more than, then this processing unit can be by centralized location (for example, directly be coupled in together via wired and/or wireless bus structure), perhaps can be distributed formula location (for example, the cloud computing that couples indirectly via local area network (LAN) and/or wide area network).Note also, if processing module, module, treatment circuit and/or processing unit are implemented an one above function via state machine, analog circuit, digital circuit and/or logical circuit, memory and/or the memory element of then storing the corresponding operating instruction can embed in the circuit that comprises state machine, analog circuit, digital circuit and/or logical circuit or in this circuit outside.Note also, memory element can storage and processing module, module, treatment circuit and/or processing unit can carry out corresponding at least some hard coded and/or the operational order in step shown in the drawings and/or the function more than.This storage device or memory element can be included in the product.
Above utilized the method step of the performance that its appointed function and relation are shown to describe the present invention.For ease of describing, defined border and the order of these functional modules and method step herein arbitrarily.The substituting border of definable and order are as long as can suitably carry out appointed function and relation.Therefore, any this substituting border or order are all in the scope of the present invention and thought of opinion right.In addition, for ease of describing, defined the border that these functions are touched piece arbitrarily.The substituting border of definable is as long as can suitably carry out specific critical function.Similarly, this paper has also defined flow chart block arbitrarily so that specific critical function to be described.For reaching employed degree, the border of flow chart block and order can otherwise define and still carry out specific critical function.Therefore, this substituting definition of functional block and flow chart block and order is all in the scope of the present invention and thought of opinion right.Those of ordinary skills also will recognize, the functional block of this paper and other illustrated blocks, module and assembly can according to shown in implement, perhaps processor by discrete assembly, application-specific integrated circuit (ASIC), the suitable software of execution etc. or their any combination are implemented.
The present invention also is described at least in part with the form of more than one execution modes.Embodiments of the present invention are used to illustrate the present invention, aspect of the present invention, feature of the present invention, concept of the present invention and/or example of the present invention in this article.The physical embodiments that embodies device of the present invention, product, machine and/or processing can comprise the more than one aspect described with reference to more than one execution mode discussed in this article, feature, concept, example etc.In addition, from figure to figure, these execution modes can be in conjunction with the function of the identical or similar name that can use identical or different Reference numeral, step, module etc., and therefore, these functions, step, module etc. can be identical or similar function, step, module etc. or different function, step, module etc.
Unless otherwise indicated, the element in any accompanying drawing that go to element in any accompanying drawing that this paper provides, provides from this paper and/or the signal between the element in any accompanying drawing that this paper provides can be analog or digital, the time is continuous or time-discrete and single-ended or difference.For example, if signal path is shown as single-ended path, then signal also can be represented differential signal path.Similarly, if signal path is shown as the difference path, then signal also can be represented the single-ended signal path.Recognize as those of ordinary skills, although this paper has described an above particular architecture, can implement to use other architectures that couple indirectly between an above data/address bus that does not clearly illustrate, interelement direct connection and/or other elements equally.
Term " module " is used in the description to various execution modes of the present invention.Can be as described in this article, module comprises for processing module, functional block, the hardware of carrying out one or more functions and/or is stored in the software of memory.Notice that if this module is implemented via hardware, then hardware can independently and/or in conjunction with software and/or firmware move.As used herein, module can comprise one or more submodules, and it can be one or more modules separately.
Although this paper has clearly described the concrete combination of various function of the present invention and feature, other combinations of these features and function are feasible equally.The present invention can't help instantiation disclosed herein and limits, and clearly comprises these other combinations.