CN103326097A - Design realization method for raising standing wave resistance capability of high power component - Google Patents
Design realization method for raising standing wave resistance capability of high power component Download PDFInfo
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- CN103326097A CN103326097A CN2013102743625A CN201310274362A CN103326097A CN 103326097 A CN103326097 A CN 103326097A CN 2013102743625 A CN2013102743625 A CN 2013102743625A CN 201310274362 A CN201310274362 A CN 201310274362A CN 103326097 A CN103326097 A CN 103326097A
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Abstract
The invention relates to a design realization method for raising the standing wave resistance capability of a high power component. According to the method, a large power ring device is employed by an output end of a high power component, a third port of the large power ring device is connected with large power loads in parallel connection, and the standing wave resistance capability of the high power component is raised. The 50 Omega matching of the two large power loads in parallel connection is realized through a microstrip circuit with specific topology, and the standing wave performance of the third port of the large power ring device is ensured. The method belongs to the technical field of radio frequency microwave.
Description
Technical field
The present invention relates to a kind of design implementation method that improves the anti-standing wave ability of high power assembly, anti-standing wave belongs to the frequency microwave technical field.
Background technology
Along with improving constantly that radar transmitter technical indicator and tactics index require, power output to the centralized solid state transmitter of high power is had higher requirement, and namely the power output of the core component high power assembly of solid state transmitter has been proposed more harsh requirement.In order to obtain large transmitting power, often adopt the synthetic method of power.Power synthesizer adopts air printed line synthesizer usually, and this synthesizer interchannel is without isolation, and when certain passage high power assembly breaks down, worsening will appear in the output standing wave of other assemblies; Directly connect antenna by feeder line after the high power assembly is synthetic, the standing wave of antenna is generally relatively poor, and the power of reflection is directly got back to the output of high power assembly.Above-mentioned situation requires the high power assembly must carry out necessary output vswr protection, to avoid that the power tube in the assembly is caused damage.Add circulator at the emitting module output and can significantly reduce the adaptive standing wave reflection problems that causes of system, the power of reflection is not reflected back radio frequency path by the high-power circulator load end absorption of design, thereby improved the anti-standing wave ability of large power assembly, greatly improved the reliability of high power assembly.
Summary of the invention
The object of the present invention is to provide a kind of design implementation method that improves the anti-standing wave ability of high power assembly.
The present invention is that the technical solution that its technical problem of solution adopts is: the output at the high power assembly adopts high-power circulator, output high-power from 1 port input, the output of 2 ports, 3 ports connect high power load (as shown in Figure 1) in parallel.Two high power loads in parallel are realized 50 Ω coupling by the microstrip circuit of particular topology, guarantee the standing wave performance of high-power circulator the 3rd port.When high power assembly generation load mismatch, reflection power enters from 2 ports, by the high power load absorption of 3 ports.High power load adopts the form of two-way parallel connection, further improves anti-power-performance.By the ADS software emulation, obtain topological structure as shown in Figure 2, guarantee the coupling of two high power load circuit in parallel.
The present invention compared with prior art, its remarkable advantage is: can significantly improve the ability of the anti-high-power mismatch of assembly, simultaneously the volume and weight of not obvious increase assembly.
Description of drawings
Fig. 1 is principle of the invention figure: 1 port is the power input of circulator, and 2 ports are power take-off, and 3 ports are the circulator load end, and resistance R 1, R2 are the paster high power loads.Resistance R 1, R2 are connected to 3 ports by the microstrip circuit of particular topology.
Fig. 2 is the high-power absorbing load circuit diagram of the present invention.
Fig. 3 is the standing wave analogous diagram of shunt load end of the present invention.
Embodiment
Specific implementation method of the present invention is:
1 utilizes the dummy load of ADS simulation software to absorb the S parameter of port, makes standing wave satisfy system requirements.
2 because the power amplifier components power output is larger, and the reflection power that output mistermination produces is also larger.Reflection power is absorbed by the circulator load end at last, therefore needs high power load to be used as absorbing load.Through comparing and testing and select the 32-1026 load of RF company to be used as absorbing load.
3 utilize Ferrite Material as medium, on put the high-power circulator of three ports that conduction band structure designs little band forms.
4 are assembled to heat dissipation base with printed board and absorbing load, form absorbing load.
5 is interconnected with circulator 3 ports and absorbing load end.
Because the physical characteristic of circulator, electromagnetic transmission can only be along the one direction annular, and the power of last high-power power amplifier components output is from the 1 port input of circulator, 2 ports (as shown in fig. 1) output.When high power assembly generation load mismatch, reflection power enters from 2 ports, is absorbed by the high power load of 3 ports, and does not affect circuit before the circulator.
Claims (3)
1. design implementation method that improves the anti-standing wave ability of high power assembly, it is characterized by: the high-power circulator that adopts the 3rd port to connect high-power matched load in parallel by high power assembly output realizes improving the ability of the anti-standing wave of high power assembly, two high power loads are realized 50 Ω coupling by specific microstrip circuit, guarantee the standing wave performance of high-power circulator the 3rd port.
2. a kind of design implementation method that improves the anti-standing wave ability of high power assembly according to claim 1 is characterized in that: assembly output high-power from the input of 1 port, and the output of 2 ports, 3 ports connect high power load in parallel.
3. a kind of design implementation method that improves the anti-standing wave ability of high power assembly according to claim 1 is characterized in that: described high power load adopts the form of two-way parallel connection, realizes 50 Ω coupling by the microstrip circuit of particular topology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102743625A CN103326097A (en) | 2013-07-03 | 2013-07-03 | Design realization method for raising standing wave resistance capability of high power component |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102743625A CN103326097A (en) | 2013-07-03 | 2013-07-03 | Design realization method for raising standing wave resistance capability of high power component |
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| CN103326097A true CN103326097A (en) | 2013-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013102743625A Pending CN103326097A (en) | 2013-07-03 | 2013-07-03 | Design realization method for raising standing wave resistance capability of high power component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105576334A (en) * | 2015-12-29 | 2016-05-11 | 中国工程物理研究院电子工程研究所 | Method for improving matching effect of isolated end of PCB or thin-film circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005318293A (en) * | 2004-04-28 | 2005-11-10 | Mitsubishi Electric Corp | Stop filter |
| CN201117776Y (en) * | 2007-08-27 | 2008-09-17 | 武汉虹信通信技术有限责任公司 | Gain adjustable radio frequency attenuator |
| CN101699650A (en) * | 2009-10-16 | 2010-04-28 | 电子科技大学 | High-frequency large-power microwave thin film resistor |
-
2013
- 2013-07-03 CN CN2013102743625A patent/CN103326097A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005318293A (en) * | 2004-04-28 | 2005-11-10 | Mitsubishi Electric Corp | Stop filter |
| CN201117776Y (en) * | 2007-08-27 | 2008-09-17 | 武汉虹信通信技术有限责任公司 | Gain adjustable radio frequency attenuator |
| CN101699650A (en) * | 2009-10-16 | 2010-04-28 | 电子科技大学 | High-frequency large-power microwave thin film resistor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105576334A (en) * | 2015-12-29 | 2016-05-11 | 中国工程物理研究院电子工程研究所 | Method for improving matching effect of isolated end of PCB or thin-film circuit board |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130925 |