CN103325694B - Dispensing method for flip chip manufacturing process - Google Patents
Dispensing method for flip chip manufacturing process Download PDFInfo
- Publication number
- CN103325694B CN103325694B CN201210076497.6A CN201210076497A CN103325694B CN 103325694 B CN103325694 B CN 103325694B CN 201210076497 A CN201210076497 A CN 201210076497A CN 103325694 B CN103325694 B CN 103325694B
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- China
- Prior art keywords
- edge
- groove
- manufacturing process
- dispensing method
- flip chip
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Abstract
The invention discloses a kind of dispensing method for flip chip manufacturing process, in order to a chip is bound to a substrate.Substrate has a first surface and a second surface and this first surface has a groove in order to this chip accommodating, and the inventive method comprises the following steps: that (a) forms colloid layer at least one this edge of this groove；B () inserts this chip in this groove；And (c) forms colloid layer in the remaining edge of this groove.The inventive method can reduce the excessive glue situation in the middle of flip chip manufacturing process, can reduce the volume of substrate simultaneously.
Description
Technical field
The present invention is about dispensing method, especially with respect to the dispensing method for flip chip manufacturing process.
Background technology
Flip Chip (flip chip) method for packing, is greatly improved chip pin density owing to having, and reduction is made an uproar
Sound interference, improves heat-sinking capability etc. effect, the most significantly replaces and use routing (wire bonding) technology
Method for packing, and be widely used.
In flip chip assembly process, work as chip, such as sensitive chip, be placed in the groove of a substrate each other
After bond, need to perform some glue program, in order to the gold goal on protection sensitive chip is attached on substrate.?
There is between sensitive chip and each edge of groove the gap accommodating colloid.
Existing some glue program is after chip is attached to the step of substrate, re-uses spot gluing equipment in sense
Gap point last layer colloid between optical chip and substrate.Colloid expands by capillary flow (capillary flow)
It is dissipated between other sensitive chip with substrate the position contacted, the gold goal between coated sensation optical chip and substrate,
Protection gold goal sticks and is fixed on substrate.
But, owing to the gap between sensitive chip and substrate recess is the most small, during a glue often
Because the amount of colloid cannot accurately be controlled, and cause the situation of excessive glue, the photographic department of sensitive chip is caused dirt
Dye, or pollute and extraneous pad, cause the yield of flip chip manufacturing process to decline.Additionally, when spot gluing equipment is stretched
When entering gap injecting glue, if careless manipulation, chip or substrate may be touched during injecting glue, and to chip
Or substrate causes damage.
Furthermore, in order to accommodate colloid, the gap between chip and substrate needs certain width, is unfavorable for unit
Reducing of part size.
It is therefore desirable to provide a kind of new method to improve problem of the prior art.
Summary of the invention
Technical problem underlying to be solved by this invention is, for deficiencies of the prior art, carries
For a kind of dispensing method for flip chip manufacturing process reducing chip package volume.
Another technical problem to be solved by this invention is, for deficiencies of the prior art, carries
For a kind of dispensing method for flip chip manufacturing process reducing excessive glue situation.
Another technical problem to be solved by this invention is, for deficiencies of the prior art, carries
The dispensing method for flip chip manufacturing process of sensitive chip and the probability of substrate is damaged for a kind of spot gluing equipment that reduces.
The technical solution adopted for the present invention to solve the technical problems is to provide a kind of some glue for flip chip manufacturing process
Method, in order to a chip to be bound to a substrate, wherein this substrate has a first surface and a second surface,
This first surface has a groove in order to this chip accommodating, and this groove has four edges, this dispensing method bag
Include the following step:
A () forms colloid layer at least one this edge of this groove；
B () inserts this chip in this groove；And
C () forms colloid layer in the remaining edge of this groove.
It is preferred that this four edge of this groove include one first edge, one second edge, one the 3rd edge with
And one the 4th edge, this at least one edge in this step (a) includes this first edge and this second edge,
This remaining edge in this step (c) includes the 3rd edge and the 4th edge.
It is preferred that this second edge is positioned at the opposite at this first edge, the 3rd edge is positioned at the 4th edge
Opposite.
It is preferred that this substrate is made up of pottery.
It is preferred that this substrate is printed circuit board (PCB).
It is preferred that this four edge of this groove is formed with the multiple electrical pin of this printed circuit board (PCB).
It is preferred that this chip is photo-sensitive cell.
It is preferred that the viscosity of this colloid is 1000～40000mPas.
It is preferred that the bottom of this groove includes the perforate through this first surface and this second surface, and this point
Gluing method also includes after step (c): be fixed on this second surface of this substrate by a camera lens should
In place of perforate.
The present invention, for the dispensing method of flip chip manufacturing process, compares prior art flip encapsulation process the most for dispensing glue,
In advance at the edge-coating colloid of substrate recess, thus in the middle of follow-up encapsulation process, can reduce or be not required to
It is carried out at this marginal gap again and injects the program of colloid, that is minimizing spot gluing equipment stretches into the step in gap, mat
This can reduce the probability of spot gluing equipment damage chip and substrate, and because of this glue during minimizing chip package
Scale of construction improper use and produce excessive glue produced pollution sensitive chip situation occur；Additionally, due to chip
Need the quantity carrying out edge for dispensing glue to reduce after being placed on substrate recess, therefore need not subsequent point glue
The width of the marginal gap processed can be reduced, thus reduces chip package volume.
Accompanying drawing explanation
Fig. 1: be a preferred embodiment schematic diagram of the image sensing module using the inventive method.
Fig. 2: be the image sensing module in Fig. 1 before chip is attached to substrate in two groove limits of substrate
Edge schematic diagram the most for dispensing glue.
Fig. 3: be the image sensing module in Fig. 1 after chip is attached to substrate, in remaining recess edge
Schematic diagram for dispensing glue.
Fig. 4: be the schematic flow sheet of the inventive method.
Detailed description of the invention
The following description present invention is for the step of the dispensing method of flip chip manufacturing process.
Refer to Fig. 1, it is a preferred embodiment schematic diagram of the image sensing module using the inventive method.
The image sensing module 100 of Fig. 1 comprises a substrate 1, sensitive chip 4 and a lens member 5.
This sensitive chip 4 can be charge coupled cell (Charge Coupled Device, CCD) or complementary oxidation
Metal semiconductor (Complementary Metal-Oxide Semiconductor, CMOS).Substrate 1 is with pottery
Printed circuit board (PCB) made by ceramic material, but material is not limited with ceramic material.Substrate 1 has one first table
Face 11 and second surface 12, this first surface 11 has a groove 111 in order to this sensitive chip 4 accommodating.Should
Groove 111 has four edges, respectively edge 111A, edge 111B, edge 111C and edge 111D.
This edge 111A and this edge 111C is furnished with multiple electrical pin P, the plurality of electrical pin P and is somebody's turn to do
On sensitive chip 4, projection (bump) (not shown) of opposite position links.The plurality of electrical pin
P does different configurations according to the chip applied, and does not limit and is configured at specific recess edge.This groove
111 have a perforate 3 running through this first surface 11 and this second surface 12.This second surface 12 can connect
This lens member 5.
Refer to Fig. 2, which show use the inventive method in the signal of the two edges gluing in advance of groove 111
Figure.For simplifying explanation, Fig. 2 does not demonstrate lens member 5.As in figure 2 it is shown, utilize spot gluing equipment prior to
This edge 111B and this edge 111D of this groove 111 uniformly put colloid E.It is preferred that this colloid E
Viscosity between 1000～40000mPas (mpas).In advance some glue position be this groove 111 extremely
A few edge, or two, three, four edges, the present embodiment is as a example by two edges.Additionally, it is the most for dispensing glue
Edge is not limited to whether this edge is furnished with electrical pin P.After this colloid E has been coated with, by this sense
Optical chip 4 is inserted in this groove 111, and now colloid E can diffuse to other this photosensitive core by capillary flow
The position that sheet 4 contacts with this groove 111.
Refer to Fig. 3, sensitive chip 4 is attached to base after the two edges gluing in advance of groove 111 by its expression
Schematic diagram in the groove 111 of plate 1.As it is shown on figure 3, after this sensitive chip 4 inserts this groove 111,
This sensitive chip 4 forms a gap 111A ', a gap 111B ', a gap 111C ' and with this groove 111
Gap 111D ', wherein the width of this gap 111A ' be W1, the width of this gap 111B ' be W2, should between
Gap 111C ' width be W3, the width of this gap 111D ' be W4.Due to the most in advance at this groove 111
This edge 111B and this colloid E on this edge 111D point, therefore inserting this sensitive chip 4 in this groove 111
After, it is only necessary to this gap 111A ' formed at this edge 111A not being pre-coated with this colloid E and this edge
This gap 111C ' that 111C is formed injects this colloid E, i.e. completes the some glue program of chip package.
Owing to need not after chip 4 is attached to substrate 11 in the position of this gap 111B ' Yu this gap 111D '
Form colloid layer, therefore the width W4 of the width W2 of gap 111B ' and this gap 111D ' can be reduced with fall
The size of low element.Such as, in the middle of embodiment of the present invention, W2 can be made to be equal to W4, W1 etc.
In W3, and W2, W4 are less than W1, W3.But the big I of clearance distance described herein is according to entirety
Design adjust, and the width of indefinite, i.e. gap optional in position the most for dispensing glue reduces, amplifies
Or remain unchanged.
Refer to Fig. 4, be preferably used for the schematic flow sheet of the dispensing method of flip chip manufacturing process for the present invention one.This use
Dispensing method in flip chip manufacturing process includes:
Step S1: at least one marginal point glue of groove 111；
Step S2: sensitive chip 4 is inserted in groove 111；And
Step S3: carry out a glue in other edge without colloid and process.
Compare prior art flip encapsulation process the most for dispensing glue, in the present invention due to the most in advance at this groove
The edge-coating colloid of 111, therefore in the middle of follow-up encapsulation process, reduce or be not required to be carried out at this gap note again
Enter the program of this colloid, that is minimizing spot gluing equipment stretches into the step in gap, thereby reduces spot gluing equipment and damages
Excessive glue is produced because of this colloid amount improper use during chip and the probability of substrate, and minimizing chip package
The situation of produced pollution sensitive chip 4 occurs.
Additionally, due to chip needs to carry out number of edges minimizing for dispensing glue after being placed on substrate recess, therefore
The width that need not the marginal gap that subsequent point glue processes can be reduced, to reduce the volume of sensing module.When
So, if carry out a glue the most in advance in four edges, then this groove 111 can be allowed the most closely sealed with this sensitive chip 4,
Significantly to reduce the volume of overall image sensing module 100.
The present invention must be appointed by those of ordinary skill in the art execute craftsman think and be all as modify, the most all without departing from this
The bright scope to be protected.
Claims (9)
1. for a dispensing method for flip chip manufacturing process, in order to a chip to be bound to a substrate, wherein this base
Plate has a first surface and a second surface, and this first surface has a groove in order to this chip accommodating, and
This groove has four edges, it is characterised in that this dispensing method comprises the following steps:
A () forms colloid layer at least one this edge of this groove；
B () inserts this chip in this groove, wherein, form at least two gap between this groove and this chip；
And
C () makes spot gluing equipment stretch into corresponding to putting glue in the gap of the remaining edge of this groove, to form colloid layer
Remaining edge in this groove；Wherein, the width corresponding to the gap at this at least one edge is less than corresponding to it
The width in the gap at remaining edge.
2. the dispensing method for flip chip manufacturing process as claimed in claim 1, it is characterised in that this groove
This four edge includes one first edge, one second edge, one the 3rd edge and one the 4th edge, this step
A this at least one edge in () includes this first edge and this second edge, in this step (c) this remaining
Edge includes the 3rd edge and the 4th edge.
3. the dispensing method for flip chip manufacturing process as claimed in claim 2, it is characterised in that this second limit
Edge is positioned at the opposite at this first edge, and the 3rd edge is positioned at the opposite at the 4th edge.
4. the dispensing method for flip chip manufacturing process as claimed in claim 1, it is characterised in that this substrate is
It is made up of pottery.
5. the dispensing method for flip chip manufacturing process as claimed in claim 1, it is characterised in that this substrate is
Printed circuit board (PCB).
6. the dispensing method for flip chip manufacturing process as claimed in claim 5, it is characterised in that this groove
This four edge is formed with the multiple electrical pin of this printed circuit board (PCB).
7. the dispensing method for flip chip manufacturing process as claimed in claim 1, it is characterised in that this chip is
Photo-sensitive cell.
8. the dispensing method for flip chip manufacturing process as claimed in claim 1, it is characterised in that this colloid
Viscosity is 1000～40000mPas.
9. the dispensing method for flip chip manufacturing process as claimed in claim 1, it is characterised in that this groove
Bottom includes the perforate through this first surface and this second surface, and this dispensing method is after step (c)
Also include: a camera lens is fixed on this second surface of this substrate to should be in place of perforate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210076497.6A CN103325694B (en) | 2012-03-21 | 2012-03-21 | Dispensing method for flip chip manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210076497.6A CN103325694B (en) | 2012-03-21 | 2012-03-21 | Dispensing method for flip chip manufacturing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103325694A CN103325694A (en) | 2013-09-25 |
| CN103325694B true CN103325694B (en) | 2016-08-24 |
Family
ID=49194369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210076497.6A Expired - Fee Related CN103325694B (en) | 2012-03-21 | 2012-03-21 | Dispensing method for flip chip manufacturing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103325694B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101114622A (en) * | 2006-07-27 | 2008-01-30 | 矽品精密工业股份有限公司 | Flip-chip type semiconductor packaging structure and chip bearing member |
| CN101136341A (en) * | 2006-09-01 | 2008-03-05 | 今湛光学科技股份有限公司 | Crystal coated encapsulation method for preventing image sensing chip sensing section from polluting |
| CN101393922A (en) * | 2008-10-30 | 2009-03-25 | 旭丽电子(广州)有限公司 | Lens module and manufacturing process thereof |
| TW201034092A (en) * | 2009-03-06 | 2010-09-16 | Univ Nat Chiao Tung | Positioning and constant-amount mounting package method and structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4415717B2 (en) * | 2004-03-23 | 2010-02-17 | ソニー株式会社 | Semiconductor device and manufacturing method thereof |
-
2012
- 2012-03-21 CN CN201210076497.6A patent/CN103325694B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101114622A (en) * | 2006-07-27 | 2008-01-30 | 矽品精密工业股份有限公司 | Flip-chip type semiconductor packaging structure and chip bearing member |
| CN101136341A (en) * | 2006-09-01 | 2008-03-05 | 今湛光学科技股份有限公司 | Crystal coated encapsulation method for preventing image sensing chip sensing section from polluting |
| CN101393922A (en) * | 2008-10-30 | 2009-03-25 | 旭丽电子(广州)有限公司 | Lens module and manufacturing process thereof |
| TW201034092A (en) * | 2009-03-06 | 2010-09-16 | Univ Nat Chiao Tung | Positioning and constant-amount mounting package method and structure |
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| Publication number | Publication date |
|---|---|
| CN103325694A (en) | 2013-09-25 |
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Granted publication date: 20160824 Termination date: 20210321 |