CN103311190B - Micro-projector chip-packaging structure and method for packing thereof - Google Patents
Micro-projector chip-packaging structure and method for packing thereof Download PDFInfo
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- CN103311190B CN103311190B CN201310176735.5A CN201310176735A CN103311190B CN 103311190 B CN103311190 B CN 103311190B CN 201310176735 A CN201310176735 A CN 201310176735A CN 103311190 B CN103311190 B CN 103311190B
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- projector chip
- projector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
Present invention is disclosed a kind of micro-projector chip-packaging structure and method for packing thereof, wherein, this encapsulating structure comprises: micro-projector chip, glass, be arranged at cavity wall between described micro-projector chip and glass, and the liquid crystal be arranged in described cavity wall, it is characterized in that, described cavity wall comprises coating adhesive, and the multiple contour particle of evenly arrangement in described coating adhesive, and described particle defines described cavity wall height.Compared with prior art, micro-projector chip-packaging structure of the present invention and method for packing thereof effectively improve performance and the production qualification rate of micro-projector chip-packaging structure.
Description
Technical field
The invention belongs to technical field of manufacturing semiconductors, be specifically related to a kind of micro-projector chip-packaging structure and method for packing thereof.
Background technology
In recent years, flourish along with projection industry, projector's market expanding day, in the middle of the daily life that projection has been deep into ordinary populace.With us, be seen everywhere projection miscellaneous, such as: large conference room, and Imax cinema etc.But under the demand that projecting apparatus is day by day frivolous, at present, micro projector has just like become carry-on amusing products, and formally by business market across foot to consumer electronics product market.
As shown in Figure 1 and Figure 2, traditional micro-projector chip-packaging structure comprises: substrate 1, the micro-projector chip 2 that described substrate 1 is arranged, with the glass 3 of described micro-projector chip 2 pressing, and the liquid crystal 4 poured in described cavity wall 6, wherein, described glass 3 is by the cavity wall that is formed thereon 6 and the pressing of described micro-projector chip 2.Weld pad 5 on it, by lead-in wire, is electrically connected to described substrate 1 by described micro-projector chip 2.Usually, described cavity wall 6 is formed by putting glue on glass 3, but, during owing to putting glue or printing gluing on glass 3, be difficult to height and the evenness of accurate control points glue or print glue, make the planarization after pressing not good, thus affect performance and the production qualification rate of micro-projector chip-packaging structure.
Summary of the invention
For solving the problems of the technologies described above, the object of the present invention is to provide a kind of micro-projector chip-packaging structure and method for packing thereof, it by arranging uniform particle, to control the evenness of cavity wall in cavity wall.
For achieving the above object, the invention provides a kind of micro-projector chip-packaging structure, comprising:
Micro-projector chip, glass, be arranged at cavity wall between described micro-projector chip and glass, and the liquid crystal be arranged in described cavity wall, wherein, described cavity wall comprises coating adhesive, and the multiple contour particle of evenly arrangement in described coating adhesive, described particle defines described cavity wall height.
As a further improvement on the present invention, micro-projector chip-packaging structure also comprises the line layer being arranged at described micro-projector chip surface, and described line layer is electrically connected and is arranged at the described weld pad of micro-projector chip upper surface and the soldered ball of lower surface.
Correspondingly, the invention provides a kind of micro-projector chip packaging method, comprising:
There is provided a glass, described glass forms cavity wall, wherein, described cavity wall comprises coating adhesive, and the multiple contour particle of evenly arrangement in described coating adhesive, and described particle defines described cavity wall height;
One micro-projector chip is provided, by described glass and the pressing of described micro-projector chip upper surface, described cavity wall is arranged between described micro-projector chip and described glass.
As a further improvement on the present invention, described method also comprises:
Mixing coating adhesive and multiple contour granulated resulting mixture, and by some glue or printing gluing, described mixture is formed cavity wall on glass.
Correspondingly, the invention provides another kind of micro-projector chip packaging method, comprising:
There is provided a glass, described glass forms cavity wall, wherein, described cavity wall comprises coating adhesive, and the multiple contour particle of evenly arrangement in described coating adhesive, and described particle defines described cavity wall height;
One wafer is provided, by the upper surface pressing of described glass and described wafer, described cavity wall is arranged between described wafer and described glass.
As a further improvement on the present invention, described method also comprises:
Mixing coating adhesive and multiple contour granulated resulting mixture, and by some glue or printing gluing, described mixture is formed cavity wall on glass.
As a further improvement on the present invention, described method also comprises:
Described wafer forms multiple groove, and described multiple groove exposes the multiple weld pads corresponding to multiple micro-projector chip;
Form line layer at the outer surface of described wafer, described line layer is electrically connected the soldered ball of weld pad and the described wafer lower surface formation that described groove inner wall exposes.
Compared with prior art, micro-projector chip-packaging structure of the present invention and method for packing thereof strictly control the height after cavity wall pressing, effectively improve performance and the production qualification rate of micro-projector chip-packaging structure.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing micro-projector chip-packaging structure.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the structural representation of micro-projector chip-packaging structure in an embodiment of the present invention.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the flow chart of micro-projector chip packaging method in an embodiment of the present invention.
Fig. 6 is the flow chart of micro-projector chip packaging method in another execution mode of the present invention.
Embodiment
Describe the present invention below with reference to embodiment shown in the drawings.But these execution modes do not limit the present invention, the structure that those of ordinary skill in the art makes according to these execution modes, method or conversion functionally are all included in protection scope of the present invention.
As shown in Figure 3, Figure 4, in an embodiment of the present invention, described micro-projector chip-packaging structure comprises:
Micro-projector chip 20, glass 10, be arranged at cavity wall 30 between described micro-projector chip 20 and glass 10, and be arranged at the liquid crystal 50 in described cavity wall 30.Preferably, described cavity wall 30 is provided with an opening, to pour into liquid crystal 50 in described cavity wall 30 by this opening.
In an embodiment of the present invention, described cavity wall 30 is formed by some glue or printing gluing on described glass 10, it comprises coating adhesive, and the multiple contour particle 40 of evenly arrangement in described coating adhesive, the height of cavity wall described in described particle definable.Like this, because each particle height 40 is identical, therefore when a glue or printing gluing, height and the evenness of described cavity wall 30 strictly can be controlled easily by the height of described particle 40, to improve performance and the production qualification rate of micro-projector chip-packaging structure.Preferably, the thickness of described cavity wall 30 is 1.3um or 1.6um.
Shown in composition graphs 5, in an embodiment of the present invention, described micro-projector chip packaging method is used for encapsulating single chips, and it comprises:
Mixing coating adhesive and multiple contour granulated resulting mixture, provide a glass 10, by a glue or printing gluing, described mixture formed cavity wall 30 on glass 10.
Wherein, described cavity wall 30 comprises coating adhesive, and the multiple contour particle 40 of evenly arrangement in described coating adhesive, the height of cavity wall described in described particle definable.Like this, because each particle height 40 is identical, therefore when a glue or printing gluing, the evenness of described cavity wall 30 can be controlled easily by the height of described particle 40, to improve performance and the production qualification rate of micro-projector chip-packaging structure.Preferably, the thickness of described cavity wall 30 is 1.3um or 1.6um.
One micro-projector chip 20 is provided, by described glass 10 and the pressing of described micro-projector chip 20 upper surface, described cavity wall 30 is arranged between described micro-projector chip 20 and described glass 10.
Weld pad 60 on described micro-projector chip can be electrically connected by routing mode with substrate.
It is worth mentioning that: the method also comprises: in the space that described cavity wall is formed, pour into liquid crystal 50, this pours into liquid crystal 50 step, can formation cavity wall 30 after first pour into, then with the pressing of described micro-projector chip 20, also can after completing the procedure, finally pour into.
Shown in composition graphs 6, in another embodiment of the present invention, described micro-projector chip packaging method is used for wafer-level packaging, and it comprises:
Mixing coating adhesive and multiple contour granulated resulting mixture, provide a glass 10, by a glue or printing gluing, described mixture formed cavity wall 30 on glass 10.
Wherein, described cavity wall 30 comprises coating adhesive, and the multiple contour particle 40 of evenly arrangement in described coating adhesive, the height of cavity wall described in described particle definable.Like this, because each particle height 40 is identical, therefore when a glue or printing gluing, height and the evenness of described cavity wall 30 can be controlled easily by the height of described particle 40, to improve performance and the production qualification rate of micro-projector chip-packaging structure.Preferably, the thickness of described cavity wall 30 is 1.3um or 1.6um.
One wafer is provided, by the upper surface pressing of described glass and described wafer, makes described cavity wall be arranged between described wafer and described glass;
Described wafer forms multiple groove by the mode such as photoetching, plasma etching, and described multiple groove exposes the multiple weld pads corresponding to multiple micro-projector chip;
Form line layer at the outer surface of described wafer by the mode such as photoetching, plating, namely described outer surface comprises the inwall of this wafer lower surface and groove.Described line layer is electrically connected the soldered ball of weld pad and the described wafer lower surface formation that described groove inner wall exposes.
Cut described wafer, form multiple micro-projector chip-packaging structure.
It is worth mentioning that: the method also comprises: in the space that described cavity wall is formed, pour into liquid crystal 50.This pours into liquid crystal 50 step, can formation cavity wall 30 after first pour into, then with described wafer pressing, also can after completing the procedure, finally pour into.
Be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, technical scheme in each execution mode also through appropriately combined, can form other execution modes that it will be appreciated by those skilled in the art that.
A series of detailed description listed is above only illustrating for feasibility execution mode of the present invention; they are also not used to limit the scope of the invention, all do not depart from the skill of the present invention equivalent implementations done of spirit or change all should be included within protection scope of the present invention.
Claims (5)
1. a micro-projector chip packaging method, is characterized in that, described method comprises:
There is provided a glass, described glass forms cavity wall, wherein, described cavity wall comprises coating adhesive, and the multiple contour particle of evenly arrangement in described coating adhesive, and described particle defines described cavity wall height;
One micro-projector chip is provided, by described glass and the pressing of described micro-projector chip upper surface, described cavity wall is arranged between described micro-projector chip and described glass.
2. micro-projector chip packaging method according to claim 1, is characterized in that, described method also comprises:
Mixing coating adhesive and some contour granulated resulting mixtures, and by some glue or printing gluing, described mixture is formed cavity wall on glass.
3. a micro-projector chip packaging method, is characterized in that, described method comprises:
There is provided a glass, described glass forms cavity wall, wherein, described cavity wall comprises coating adhesive, and the multiple contour particle of evenly arrangement in described coating adhesive, and described particle defines described cavity wall height;
One wafer is provided, by the upper surface pressing of described glass and described wafer, described cavity wall is arranged between described wafer and described glass.
4. micro-projector chip packaging method according to claim 3, is characterized in that, described method also comprises:
Mixing coating adhesive and some contour granulated resulting mixtures, and by some glue or printing gluing, described mixture is formed cavity wall on glass.
5. micro-projector chip packaging method according to claim 3, is characterized in that, described method also comprises:
Described wafer forms multiple groove, and described multiple groove exposes the multiple weld pads corresponding to multiple micro-projector chip;
Form line layer at the outer surface of described wafer, described line layer is electrically connected the soldered ball of weld pad and the described wafer lower surface formation that described groove inner wall exposes.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310176735.5A CN103311190B (en) | 2013-05-14 | 2013-05-14 | Micro-projector chip-packaging structure and method for packing thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310176735.5A CN103311190B (en) | 2013-05-14 | 2013-05-14 | Micro-projector chip-packaging structure and method for packing thereof |
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| CN103311190A CN103311190A (en) | 2013-09-18 |
| CN103311190B true CN103311190B (en) | 2016-04-13 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101246268A (en) * | 2007-02-16 | 2008-08-20 | 欧姆龙株式会社 | Manufacture method for mount body, mount body and substrate |
| CN201293898Y (en) * | 2008-11-20 | 2009-08-19 | 天津力伟创科技有限公司 | Space mixed color silicon-based liquid crystal display |
| CN102436108A (en) * | 2011-12-20 | 2012-05-02 | 浙江大学 | Reflective silicon-based ferroelectric liquid crystal chip for projection display and manufacturing method thereof |
| CN203232864U (en) * | 2013-05-14 | 2013-10-09 | 苏州晶方半导体科技股份有限公司 | Chip-packaging structure of micro-projector |
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2013
- 2013-05-14 CN CN201310176735.5A patent/CN103311190B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101246268A (en) * | 2007-02-16 | 2008-08-20 | 欧姆龙株式会社 | Manufacture method for mount body, mount body and substrate |
| CN201293898Y (en) * | 2008-11-20 | 2009-08-19 | 天津力伟创科技有限公司 | Space mixed color silicon-based liquid crystal display |
| CN102436108A (en) * | 2011-12-20 | 2012-05-02 | 浙江大学 | Reflective silicon-based ferroelectric liquid crystal chip for projection display and manufacturing method thereof |
| CN203232864U (en) * | 2013-05-14 | 2013-10-09 | 苏州晶方半导体科技股份有限公司 | Chip-packaging structure of micro-projector |
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| CN103311190A (en) | 2013-09-18 |
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