CN103311091B - Laminator is changed the method for wafer with protection film - Google Patents
Laminator is changed the method for wafer with protection film Download PDFInfo
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- CN103311091B CN103311091B CN201210062628.5A CN201210062628A CN103311091B CN 103311091 B CN103311091 B CN 103311091B CN 201210062628 A CN201210062628 A CN 201210062628A CN 103311091 B CN103311091 B CN 103311091B
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Abstract
The invention provides a kind of method changing wafer with protection film on laminator, belong to semiconductor chip and manufacture field.The method comprises the following steps: cut off the first wafer with protection film in primary importance; The first wafer with protection film is removed from described delivery roller; Described delivery roller is installed the second wafer with protection film; Divide described second wafer with protection film from head pulling unit, use adhesive tape to join on the first wafer with protection film on described laminator by described second wafer with protection film; And film feeding; Wherein, described primary importance is the position before the blue film of the first wafer with protection film is separated with lining form.The method has that process is simple, operation also simple feature, substantially increases the replacing efficiency of wafer with protection film.
Description
Technical field
The invention belongs to semiconductor chip and manufacture field, relate to a kind of method changing wafer with protection film on laminator.
Background technology
In the preparation process of semiconductor chip; need to protect a certain surface of wafer in some technical process; such as, in the process needing thinning back side of silicon wafer of preparation DMOS chip, usually wafer with protection film to be sticked to protect wafer frontside to the front of wafer.
Therefore, in semiconductor foundry, for realizing the operation of high efficiency streamlined pad pasting, usually use the high laminator of automaticity to carry out pad pasting to wafer.Normally; wafer with protection film is usually made up of two membranes; wherein; ground floor is for attaching to the blue film on wafer face in pad pasting process; the second layer to be bonded together with blue film before being pad pasting so that the lining form in bundled of wafer with protection film, and blue film and the bonding one side of lining form (also i.e. adhesive faces) are attached on wafer face when pad pasting.Therefore, wafer with protection film by lining form and blue UF membrane, meanwhile, must reclaim lining form, and was partly attached to after on wafer face in blue film before carrying out pad pasting, and remaining blue film is defined as " residual film " and needs to reclaim.
Normally; in pad pasting hands-operation film coating process process; there is standardized operating procedure; wherein; some is exactly the technique about changing wafer with protection film on laminator, and this is due in pad pasting process, along with constantly the carrying out of pad pasting, may run out and need to change by a certain wafer with protection film in bundled; or the reasons such as the conversion of the type due to wafer (such as, becoming 8 cun of wafers from 6 cun of wafers), need the type of corresponding replacing wafer with protection film.The process changing wafer with protection film is a process consuming time normally, therefore, is the preparation efficiency improving semiconductor chip, needs to improve constantly the efficiency changing wafer with protection film.
Summary of the invention
The object of the invention is to, improve the efficiency changing wafer with protection film on laminator.
For realizing above object or other objects, the invention provides a kind of method changing wafer with protection film on laminator, described laminator comprises:
For installing and transmitting the delivery roller of wafer with protection film,
For reclaiming the lining form roller of the lining form of described wafer with protection film, and
Blue film for reclaiming described wafer with protection film is partly pasted to the residual film roller of the residual film formed after on wafer face;
Said method comprising the steps of:
The first wafer with protection film is cut off in primary importance,
The first wafer with protection film is removed from described delivery roller,
Described delivery roller is installed the second wafer with protection film,
Divide described second wafer with protection film from head pulling unit, use adhesive tape to be joined on the first wafer with protection film on described laminator by described second wafer with protection film, and
Film feeding reclaims on described lining form roller with the lining form realizing described second wafer with protection film;
Wherein, described primary importance is the position before the blue film of the first wafer with protection film is separated with lining form.
According to the replacing options of one embodiment of the present invention; wherein; when using adhesive tape to engage; between the blue film that the first wafer with protection film on described laminator is inserted in the second wafer with protection film and lining form; and; the blue film of the first wafer with protection film attaches relative to the blue film of the second wafer with protection film, and the lining form of the first wafer with protection film attaches relative to the lining form of the second wafer with protection film.
In the replacing options of described embodiment before, preferably, described primary importance is to be arranged on by delivery roller and the first wafer with protection film does not walk around position before any other wheel shaft.
In the replacing options of described embodiment before, selectively, in described installation second wafer with protection film step, mounting and adjusting pad on described delivery roller.
In the replacing options of described embodiment before, preferably, described cut off step before, also comprise step: confirm that laminator stops pad pasting work.
In the replacing options of described embodiment before, preferably, also step is comprised before removing the first wafer with protection film step described in: make described delivery roller unclamp to prepare to remove described first wafer with protection film.
In the replacing options of described embodiment before, preferably, after described film feeding step, also comprise step:
Described residual film is cut off on described residual film roller side;
The residual film of described first wafer with protection film is removed by described residual film roller; And
The residual film of described second wafer with protection film is fastened on described residual film roller.
In the replacing options of described embodiment before, particularly, described laminator is also provided with the chuck assembly for fixing wafer.
Technique effect of the present invention is; by changing cutting off position and cutting off mode and adopt adhesive tape juncture of the first wafer with protection film of wish replacing; the method changing wafer with protection film on laminator of the present invention does not need to change lining form on lining form roller; also eliminate the correlation step changing lining form; procedure is simple; operation is also simple, substantially increases the replacing efficiency of wafer with protection film.
Accompanying drawing explanation
From following detailed description by reference to the accompanying drawings, will make above and other object of the present invention and advantage more completely clear, wherein, same or analogous key element adopts identical label to represent.
Fig. 1 is the laminator basic structure schematic diagram operationally used in semiconductor foundry.
Fig. 2 is the existing method flow schematic diagram changing wafer with protection film on laminator.
Fig. 3 is the method flow schematic diagram changing wafer with protection film on laminator according to one embodiment of the invention.
Fig. 4 is the juncture schematic diagram of the second wafer with protection film and the first wafer with protection film.
Embodiment
Introduce below be of the present invention multiple may some in embodiment, aim to provide basic understanding of the present invention, be not intended to confirm key of the present invention or conclusive key element or limit claimed scope.Easy understand, according to technical scheme of the present invention, do not changing under connotation of the present invention, one of ordinary skill in the art can propose other implementations that can mutually replace.Therefore, following embodiment and accompanying drawing are only the exemplary illustrations to technical scheme of the present invention, and should not be considered as of the present invention all or the restriction be considered as technical solution of the present invention or restriction.
Figure 1 shows that the laminator basic structure schematic diagram operationally used in semiconductor foundry.As shown in Figure 1; laminator can transmit wafer with protection film 210 automatically; usually; wafer with protection film 210 is installed on the delivery roller 110 of laminator with the form of in bundling; after wafer with protection film is located through several wheel shafts, before preparation pad pasting; need the blue film 211 of wafer with protection film 210 to be separated with lining form 212, to prepare blue film 211 to be attached on wafer face.In laminator, comprise the chuck assembly 140 for fixing wafer, each wafer for pad pasting can pad pasting on chuck assembly 140 successively, when pad pasting, in the middle of blue film 211, a part is cut off by correspondence being attached to after on wafer, thus blue film 211 becomes residual film 213.Usually, residual film 213 and lining form 212 all need to reclaim, and therefore, on laminator, are respectively arranged with the lining form roller 120 for reclaiming lining form 212 and the residual film roller 130 for reclaiming residual film 213.Lining form 212 is in bundled on residual film roller 130, and residual film 130 is in bundled on residual film roller 130.Therefore, the laminator shown in Fig. 1 can realize streamline ground pad pasting to wafer, and automaticity is high, and efficiency is high.Also achieve the automatic recovery to residual film and lining form simultaneously.
But, laminator often needs change wafer with protection film.Such as, when needing the type changing wafer with protection film.If need the first wafer with protection film to be replaced by the second wafer with protection film to mount the wafer with protection film of another kind of type on corresponding wafer, can be changed by the wafer with protection film replacing options flow process shown in Fig. 2.Figure 2 shows that the existing method flow schematic diagram changing wafer with protection film on laminator, shown in composition graphs 1 and Fig. 2, the wafer with protection film replacing options shown in Fig. 2 is described.
First, step S11, confirms that laminator stops pad pasting work.
Further, step S12, position 310 and position 320 cut off blue film 211 and lining form 212 respectively in FIG.Position 310 is blue film 211 and the position of lining form 212 after separating and before pad pasting of wafer with protection film; position 320 is after the lining form 212 of wafer with protection film is separated with blue film 211 and prepares the position before in bundling; therefore, need to cut off blue film 211 and lining form 212 respectively.
Further, step S13, makes delivery roller 110 unclamp to prepare to remove the first wafer with protection film.
Further, step S14, removes the first wafer with protection film from delivery roller 110.
Further, step S15, removes the lining form of the first wafer with protection film from lining form roller 120.
Further, step S16, delivery roller 110 is installed the second wafer with protection film.
Further, step S17, divides the second wafer with protection film from head pulling unit, and the adhesive faces of lining form from blue film is separated.Therefore, the adhesive faces of blue film directly can be aimed at wafer face and attached.
Further, step S18, walks around the wheel shaft in precalculated position by lining form.
Further, step S19, is joined to the blue film of the separation of the second wafer with protection film on the blue film of the first wafer with protection film by adhesive tape.This first wafer with protection film is the part stayed on laminator.
Further, step S20, is fastened lining form on lining form roller 120.
Further, step S21, cuts off residual film on residual film roller 130 side.
Further, step S22, the residual film of the first wafer with protection film is removed by residual film roller 130.
Further, step S23, is fastened the residual film of the second wafer with protection film on residual film roller 130.
So far, realize basically changing wafer with protection film on laminator.
Applicant finds, in above procedure, operating process is complicated, particularly need remove the lining form (S14) of the first wafer with protection film at delivery roller 110 and again the lining form of the second wafer with protection film be fastened on lining form roller 110 (S20), consuming time long, easily the efficiency of wafer with protection film is changed in impact; Meanwhile, being wound around lining form process generally needs skilled operation, easily makes a fault owing to operating unskilled, causes the positional fault that lining form is wound around, and needs to occur extremely in the pad pasting course of work after causing.
Figure 3 shows that the method flow schematic diagram changing wafer with protection film on laminator according to one embodiment of the invention.Laminator shown in composition graphs 1, describes in detail method embodiment illustrated in fig. 3.
First, step S31, confirms that laminator stops pad pasting work.
Further, step S32, the first wafer with protection film is cut off in position 330 in FIG.
As shown in Figure 1, position 330 is blue film 211a and the lining form 212a position before separation of the first wafer with protection film 210a, therefore, by once cutting off the first wafer with protection film 210a.Preferably, position 330 is arranged on other and the first wafer with protection film 210a of delivery roller 110 and does not walk around position before any other wheel shaft, so conveniently cuts off.Certainly, in other embodiments, also position 330 can be arranged on blue film 211a and lining form 212a other positions before separation, those skilled in the art, according to above enlightenment, can carry out concrete desired location 330 according to the structure of concrete laminator, the comfort level of cutting out etc.
Further, step S33, makes delivery roller 110 unclamp to prepare to remove the first wafer with protection film.When delivery roller 110 is in releasing orientation, the first wafer with protection film 210a on delivery roller 110 can be removed safely.In this embodiment, the first wafer with protection film 210a is the wafer with protection film be replaced, and is usually also referred to as " surplus film ".
Further, step S34, removes the first wafer with protection film from delivery roller 110.
Further, step S35, delivery roller 110 is installed the second wafer with protection film.
In this step, the second wafer with protection film 210b is the wafer with protection film that update contruction uses, and is usually also referred to as " new film ".In the concrete installation process of the second wafer with protection film 210b; whether mounting and adjusting pad (spacer) can be selected before installation second wafer with protection film according to the width dimensions of the second wafer with protection film 210b and by the width dimensions of the wafer of pad pasting, thus make the blue film of the second wafer with protection film 210b alignedly can attach wafer.Such as, if wafer size be 5 inches, the width dimensions of the second wafer with protection film 210b is 150mm, then need mounting and adjusting pad.
Further, step S36, divides the second wafer with protection film from head pulling unit, uses adhesive tape to be joined to by the second wafer with protection film on the first wafer with protection film on laminator.
Figure 4 shows that the juncture schematic diagram of the second wafer with protection film and the first wafer with protection film.The first wafer with protection film on laminator is the part that the first wafer with protection film cut off stays on laminator.Preferably, in this step, adopt juncture as shown in Figure 4, by the second wafer with protection film 210b head part from, also namely blue film 211b is separated with lining form 212b, the the first wafer with protection film 210a cut off is inserted between blue film 211b and lining form 212b, the blue film 211a of the first wafer with protection film 210a attaches relative to the blue film 211b of the second wafer with protection film 210b, the lining form 212a of the first wafer with protection film 210a attaches relative to the lining form 212b of the second wafer with protection film 210b, then adhesive tape 900 is adopted to be bonded together by blue film 211a and blue film 211b, and lining form 212a and lining form 212b is bonded together, thus achieve the juncture of the coated first wafer with protection film of the second wafer with protection film.Like this in the process of film feeding below, the blue film 211a and the lining form 212a that are separated subsequently can pull open blue film 211b with lining form 212b to realize easily being separated.
Further, step S37, film feeding.By using the film feeding order of laminator; automatically being separated of blue film 211b and lining form 212b can be realized; lining form 212b connects lining form 212a; thus; further; the lining form 212b of the second wafer with protection film 210b can continue to realize reclaiming on lining form roller 120, does not need to change lining form, also eliminates the correlation step changing lining form.
Similarly, in the process of film feeding, blue film 211a can be continued to be recycled on residual film roller 130 with residual form membrane, and the blue film 211b of the second wafer with protection film 210b also can be recycled on residual film roller 130 with residual form membrane.
If need to change the residual film on residual film roller, can continue to perform following steps.
Further, step S38, cuts off residual film on residual film roller side.
Further, step S39, the residual film of the first wafer with protection film is removed by residual film roller.
Further, step S40, is fastened the residual film of the second wafer with protection film on residual film roller.
So far, achieve basically change wafer with protection film on laminator.Compared to method embodiment illustrated in fig. 2, the method process is simple, low to the operation requirements of operating personnel, greatly can improve the efficiency changing wafer with protection film.
Above example mainly describes the method changing wafer with protection film on laminator of the present invention.Although be only described some of them embodiments of the present invention, those of ordinary skill in the art should understand, and the present invention can implement with other forms many not departing from its purport and scope.Therefore, the example shown and execution mode are regarded as illustrative and not restrictive, when do not depart from as appended each claim define the present invention spirit and scope, the present invention may contain various amendments and replacement.
Claims (8)
1. on laminator, change a method for wafer with protection film, described laminator comprises:
For installing and transmitting the delivery roller of wafer with protection film,
For reclaiming the lining form roller of the lining form of described wafer with protection film, and
Blue film for reclaiming described wafer with protection film is partly pasted to the residual film roller of the residual film formed after on wafer face;
It is characterized in that, said method comprising the steps of:
The first wafer with protection film is cut off in primary importance,
The first wafer with protection film is removed from described delivery roller,
Described delivery roller is installed the second wafer with protection film,
Divide described second wafer with protection film from head pulling unit, use adhesive tape to be joined on the first wafer with protection film on described laminator by described second wafer with protection film, and
Film feeding reclaims on described lining form roller with the lining form realizing described second wafer with protection film;
Wherein, described primary importance is the position before the blue film of the first wafer with protection film is separated with lining form.
2. the method for claim 1; it is characterized in that; when using adhesive tape to engage; between the blue film that the first wafer with protection film on described laminator is inserted in the second wafer with protection film and lining form; and; the blue film of the first wafer with protection film attaches relative to the blue film of the second wafer with protection film, and the lining form of the first wafer with protection film attaches relative to the lining form of the second wafer with protection film.
3. method as claimed in claim 1 or 2, is characterized in that, described primary importance is to be arranged on by delivery roller and the first wafer with protection film does not walk around position before any other wheel shaft.
4. method as claimed in claim 1 or 2, is characterized in that, in described installation second wafer with protection film step, and mounting and adjusting pad on described delivery roller.
5. method as claimed in claim 1 or 2, is characterized in that, described cut off step before, also comprise step: confirm that laminator stops pad pasting work.
6. method as claimed in claim 1 or 2, is characterized in that, described in remove the first wafer with protection film step before also comprise step: make described delivery roller unclamp to prepare to remove described first wafer with protection film.
7. method as claimed in claim 1 or 2, is characterized in that, also comprise step after described film feeding step:
Described residual film is cut off on described residual film roller side;
The residual film of described first wafer with protection film is removed by described residual film roller; And
The residual film of described second wafer with protection film is fastened on described residual film roller.
8. method as claimed in claim 1 or 2, it is characterized in that, described laminator is also provided with the chuck assembly for fixing wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210062628.5A CN103311091B (en) | 2012-03-12 | 2012-03-12 | Laminator is changed the method for wafer with protection film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210062628.5A CN103311091B (en) | 2012-03-12 | 2012-03-12 | Laminator is changed the method for wafer with protection film |
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| CN103311091A CN103311091A (en) | 2013-09-18 |
| CN103311091B true CN103311091B (en) | 2015-12-16 |
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| CN116053167B (en) * | 2023-01-18 | 2023-08-22 | 浙江露语尔半导体设备有限公司 | Multi-film switching control method, system and structure based on film sticking machine |
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|---|---|---|---|---|
| US4925515A (en) * | 1987-11-27 | 1990-05-15 | Takatori Corporation | Method and apparatus for applying a protective tape on a wafer and cutting it out to shape |
| CN1610071A (en) * | 2003-10-17 | 2005-04-27 | 日东电工株式会社 | Method and apparatus for cutting protective tape |
| KR20090011168A (en) * | 2007-07-25 | 2009-02-02 | 세크론 주식회사 | Wafer protection film attachment device, and attachment method using the same |
| CN101572222A (en) * | 2008-05-02 | 2009-11-04 | 日东电工株式会社 | Protective tape joining apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08133585A (en) * | 1994-11-09 | 1996-05-28 | Hitachi Ltd | Anisotropic film applying machine |
| JP2001156159A (en) * | 1999-11-29 | 2001-06-08 | Sony Corp | Apparatus for applying protective tape to wafer |
| JP4407933B2 (en) * | 2004-10-07 | 2010-02-03 | 日東電工株式会社 | Adhesive tape attaching method and apparatus using the same |
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2012
- 2012-03-12 CN CN201210062628.5A patent/CN103311091B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4925515A (en) * | 1987-11-27 | 1990-05-15 | Takatori Corporation | Method and apparatus for applying a protective tape on a wafer and cutting it out to shape |
| CN1610071A (en) * | 2003-10-17 | 2005-04-27 | 日东电工株式会社 | Method and apparatus for cutting protective tape |
| KR20090011168A (en) * | 2007-07-25 | 2009-02-02 | 세크론 주식회사 | Wafer protection film attachment device, and attachment method using the same |
| CN101572222A (en) * | 2008-05-02 | 2009-11-04 | 日东电工株式会社 | Protective tape joining apparatus |
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