CN103298269B - A kind of manufacture method of pcb board - Google Patents
A kind of manufacture method of pcb board Download PDFInfo
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- CN103298269B CN103298269B CN201310176171.5A CN201310176171A CN103298269B CN 103298269 B CN103298269 B CN 103298269B CN 201310176171 A CN201310176171 A CN 201310176171A CN 103298269 B CN103298269 B CN 103298269B
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Abstract
The present invention relates to PCB production technical field, particularly relate to a kind of manufacture method of pcb board.This manufacture method comprises sawing sheet, removes pretreatment procedure, the subsequent handling of pollutant and increase copper face roughness on copper face; Described pretreatment procedure adopts chemically cleaning operation.The present invention adopts chemically cleaning operation to come micelle and/or the glue mark in clean pcb board face, not only do not need the cost of manufacture increasing pcb board, and improve pcb board cleannes, reduce fraction defective, especially decrease cleaning course to the apparent destruction of causing of sheet material, improve the make efficiency of whole pcb board.
Description
Technical field
The present invention relates to PCB or CCL production technical field, particularly relate to a kind of manufacture method of pcb board.
Background technology
Copper-clad plate, also known as copper clad foil substrate (CopperCladLaminate, be abbreviated as CCL), it is the basic material of electron trade, by dielectric layer (resin Resin, glass fibre Glassfiber), and the two composite material formed of highly purified conductor (Copper Foil Copperfoil), conductive pattern can be formed thereon; CCL plate is that pcb board manufactures one of indispensable raw material.
In pcb board manufacturing process; first sawing sheet to be carried out to copper-clad plate; namely shearing is carried out to copper-clad plate; due to processing reasons such as operation, shearings; be easy to occur that resin dust micelle or glue mark remain in plate face, therefore in the making of pcb board, pre-treatment need be done to pcb board; PCB pattern of eliminating the effects of the act etches, and likely causes the factor of the problems such as the line short on pcb board.For this reason, enter the subsequent handlings such as boring at pcb board before, must clean plate face residual dust, to reduce the fraction defective of pcb board.At present in the manufacturing process of pcb board, the glue mark on removing pcb board face or micelle mainly reach cleaning purpose by such as nog plate, high-pressure washing, plate face physics clean (manually sweeping plate) etc.
Patent CN102240654.A discloses a kind of cleaner and clean method of pcb board face, this cleaner comprises outer cover and cleaning device, cleaning device is provided with stripe shape hairbrush, control of dust air-breathing groove and ionic air knife, ionic air knife has ion generator and ion wind rod barred body, is equipped with air outlet before and after ion wind rod barred body; Pcb board is being sucked away part dust particle through control of dust air-breathing groove generation region of negative air pressure, between the front air outlet blowout positive air pressure of ion wind rod barred body and control of dust air-breathing groove, positive and negative air-pressure junctional area produces draught head and removes PCB surface electrostatic, and takes away the dust granule on PCB surface.Cleaning device after patent 202162180.U copper-clad plate edging, comprise seal bootr, establish support in seal bootr, support is provided with transfer roller, air knife and hairbrush, and transfer roller comprises delivery wheel, and hairbrush is also provided with sweep-up pipe; By the sweep-up pipe on air knife and hairbrush and hairbrush, clean dedusting is carried out to copper-clad plate.These physical cleaning processes; designed cleaning device structure is simple; process flow is shorter; cleaning efficiency is also improved to a certain extent; but these methods can not stop the residual of glue mark or micelle completely, also may wear cut or concave point to pcb board, cause plate face destruction to a certain degree simultaneously; and above processing method complex operation, the operating time is longer.
Summary of the invention
For above-mentioned the deficiencies in the prior art, the problem that the present invention need solve is to provide a kind of manufacture method of pcb board.
To achieve these goals, technical scheme of the present invention is as follows: a kind of manufacture method of pcb board, comprises sawing sheet, removes pretreatment procedure, the subsequent handling of pollutant and increase copper face roughness on copper face; Described pretreatment procedure adopts chemically cleaning operation.
Preferably, described pretreatment procedure also comprises nog plate operation.
Preferably, described chemically cleaning operation comprises:
Except glue, substrate is put into be equipped with alkaline permanganate solution except glue cylinder rinsing 3 ~ 10 seconds;
Washing, adopts clear water rinsing except the substrate of glue, and remaining residue and solution on removing substrate, obtain clean substrate; Wherein, described alkaline sodium permanganate solution comprises concentration be 60 ~ 70g/L sodium permanganate solution and concentration is 35 ~ 45g/L sodium hydroxide solution.Particularly, described except in glue cylinder, solution temperature is 77 ~ 83 DEG C, and described sodium permanganate addition is 4.9 ~ 9.1mL/m
2, the addition of sodium hydroxide solution is 12.6 ~ 23.4mL/m
2, the described liquid level except glue cylinder is 165 ~ 190mm.
Preferably, described alkaline sodium permanganate solution also comprises sodium manganate solution, and the concentration of described sodium manganate solution is 0 ~ 30g/L.
Preferably, described substrate except before glue, also comprises washing process described.
Preferably, described substrate is described except after glue, and also comprise reduction adjusting process, its concrete technology is: substrate is put into the reduction that acidic reduction conditioning agent solution is housed and regulate cylinder rinsing 3 ~ 10 seconds; Wherein said acidic reduction regulates solution to comprise the azanol (NH that concentration is 100 ~ 160mL/L
2oH) sulfuric acid solution of solution and 60 ~ 100mL/L, the sulfuric acid that sulfuric acid solution is 50% by mass fraction is prepared.Particularly, described azanol (NH
2oH) addition of solution is 9.8 ~ 18.2mL/m
2, described sulfuric acid solution addition is 7.7 ~ 14.3mL/m
2, described reduction regulates the liquid level of cylinder to be 100 ~ 160mm, and temperature is 38 ~ 42 DEG C.
Preferably, described substrate also comprises washing process before reduction regulating step.
Pretreatment procedure during pcb board makes is on the one hand remove glue mark on pcb board face and micelle, can make plate face roughening on the other hand, be conducive to the copper facing of plate face; Chemically cleaning mainly removes glue mark on pcb board face and micelle, facilitates the subsequent handling of pcb board, also can cause the roughening in plate face simultaneously; It is micro-roughening that nog plate operation then mainly deepens plate face, is more conducive to the copper facing of plate face and plate face following process.
The principle of chemically cleaning process of the present invention is: the glue mark on pcb board and/or micelle main component are resin, utilize the strong oxidizing property of alkaline sodium permanganate, in the basic conditions, chemical reaction is carried out with the glue mark on plate and/or micelle, generate the carbonate of solubility, clear water rinsing clean substrate; Also by acidic reduction conditioning agent and the manganese dioxide of plate face remnants and permanganic acid salts substances, after rinsing in clear water, obtain clean substrate.
C (resin)+2MnO
4 -+ OH
-→ MnO
4 2-+ MnO
2+ CO
2+ H
2o
When utilizing the method to remove micelle on plate face or glue mark, being put into by substrate before except glue cylinder, first by water-washing step, helping substrate gluing mark and micelle to infiltrate, being conducive to follow-up except rinsing in glue cylinder, promoting the acceleration of reaction.Except after processing rinsing in glue cylinder, then by washing, float the alkaline sodium permanganate solution walking to remain on substrate, ensure substrate without other residues additional; Again substrate is regulated cylinder by reduction, remove the alkaline sodium permanganate solution that may remain on substrate.
The present invention changes traditional physical cleaning processes into chemical method, in the present invention, except substrate complete wetting is contacting with resin glue except solution in glue cylinder by adhesive process completely, the sodium permanganate of strong oxidizing property and glue mark and/or micelle fully react and carry out, change permanganate and the manganese oxide of solubility into, can go out the glue mark and/or micelle that stick to substrate surface completely, improve cleannes, reduce fraction defective; Whole rinsing only needs 3 ~ 10 seconds, and oxidation time is short, can not cause other influences to substrate itself, and shortens the pre-treatment time of pcb board, improves the make efficiency of whole pcb board.
Substrate except before glue, first with clear water to wafer rinse, substrate upper part dust can be removed, improve the follow-up efficiency except glue; Except in glue process, adding sodium manganate solution, for providing guiding except in glue reaction, promoting reaction; After glue, with clear water again to wafer rinse, reactant remaining on substrate and product can be removed, avoid the solution such as sodium permanganate, sodium manganate to remain and unfavorable factor is brought to the following process of substrate.
After substrate is except glue, increase reduction regulating step, alkaline manganese Barbiturates solution remaining on more effective removing substrate and manganese oxide precipitation, manganese oxide precipitation and the unification of manganate solution are converted into manganese sulfate simultaneously, convenient recovery, reduces the damage to environment, makes technique more environmental protection.
Inventive process avoids physical operations simultaneously and destruction is to a certain degree caused to sheet material, avoid the appearance of cut, concave point; And this process employs the existing resource that existing pcb board is produced, without the need to increasing excessive cost, also without the need to increasing operation, sheet material is only needed to remove glue process through this chemistry, operating time is short, saves the pretreatment procedure time, improves the make efficiency of whole pcb board; Reuse raw material, saved cost, the pollutant efficiency removed on plate face is high, adds the roughness of copper face simultaneously, is beneficial to the subsequent processing operations that pcb board makes.
Embodiment
For the ease of the understanding of those skilled in the art, below in conjunction with embodiment, the principle of the invention is described in further detail.
Embodiment 1
A manufacture method for pcb board, comprise sawing sheet, chemically cleaning operation and subsequent handling, wherein chemically cleaning process is as follows:
Upper plate, is placed on the substrate sheared transfer on the pending platform of cleaning device, facilitates the pickup of follow-up cleaning;
Except glue, the substrate on pending platform transfer to be equipped with alkaline sodium permanganate solution except in glue cylinder, rinsing 5 seconds, described except in glue cylinder, solution temperature is 80 DEG C, and the concentration of sodium permanganate is 60g/L, and addition is 8mL/m
2, the concentration of NaOH is 40g/L, and addition is 18mL/m
2, PCB or CCL plate except rinsing in glue cylinder 10 seconds, except the liquid level 170mm of glue cylinder.
Washing, adopts clear water to carry out rinsing 5 seconds to the substrate except glue, obtains clean substrate, in order to following process.
Embodiment 2
A manufacture method for pcb board, comprise sawing sheet, chemically cleaning operation, nog plate operation and subsequent handling successively, wherein chemically cleaning process is as follows:
Upper plate, is placed on the substrate sheared transfer on the pending platform of cleaning device, facilitates the pickup of follow-up cleaning;
Except glue, the substrate on pending platform transfer to be equipped with alkaline sodium permanganate solution except in glue cylinder, rinsing 10 seconds, described except in glue cylinder, solution temperature is 77 DEG C, and the concentration of sodium permanganate is 65g/L, and addition is 8mL/m
2, the concentration of NaOH is 40g/L, and addition is 18mL/m
2, PCB or CCL plate except rinsing in glue cylinder 10 seconds, except the liquid level 170mm of glue cylinder.
Washing, adopts clear water to rinse the substrate except glue, rinses 8 seconds, obtain clean substrate, in order to following process.
Embodiment 3
A manufacture method for pcb board, comprise sawing sheet, chemically cleaning operation, nog plate operation and subsequent handling successively, wherein chemically cleaning process is as follows:
Upper plate, is placed on the substrate sheared transfer on the pending platform of cleaning device, facilitates the pickup of follow-up cleaning;
Except glue, the substrate on pending platform transfer to be equipped with alkaline sodium permanganate solution except in glue cylinder, rinsing 3 seconds, described except in glue cylinder, solution temperature is 83 DEG C, and the concentration of sodium permanganate is 70g/L, and addition is 8mL/m
2, the concentration of NaOH is 35g/L, and addition is 23.4mL/m
2, PCB or CCL plate except rinsing in glue cylinder 5 seconds, except the liquid level 175mm of glue cylinder.
Washing, adopts clear water to rinse the substrate except glue, rinses 15 seconds, obtain clean substrate, in order to following process.
Embodiment 4
A manufacture method for pcb board, comprise sawing sheet, chemically cleaning operation and subsequent handling successively, wherein chemically cleaning process is as follows:
Upper plate, is placed on the substrate sheared transfer on the pending platform of cleaning device, facilitates the pickup of subsequent step;
Washing, picks up the substrate on pending platform, puts into clear water rinsing 5 seconds;
Except glue, the substrate after rinsing transfer to be equipped with alkaline sodium permanganate solution except in glue cylinder, rinsing 5 seconds, described except in glue cylinder, solution temperature is 80 DEG C, and the concentration of sodium permanganate is 60g/L, and addition is 8mL/m
2, the concentration of NaOH is 45g/L, and addition is 12.6mL/m
2, PCB or CCL plate except rinsing in glue cylinder 3 seconds, except the liquid level 190mm of glue cylinder.
Washing, adopts clear water to rinse the substrate except glue, rinses 10 seconds, obtain clean substrate, in order to following process.
Embodiment 5
A manufacture method for pcb board, comprise sawing sheet, chemically cleaning operation, nog plate operation and subsequent handling successively, wherein chemically cleaning process is as follows:
Upper plate, is placed on the substrate sheared transfer on the pending platform of cleaning device, facilitates the pickup of subsequent step;
Except glue, the substrate on pending platform transfer to be equipped with alkaline sodium permanganate solution except in glue cylinder, rinsing 5 seconds, described except in glue cylinder, solution temperature is 80 DEG C, and the concentration of sodium permanganate is 60g/L, and addition is 8mL/m
2, the concentration of NaOH is 40g/L, and addition is 18mL/m
2, PCB or CCL plate except rinsing in glue cylinder 10 seconds, except the liquid level 165mm of glue cylinder;
Washing, except the substrate after glue, to be placed in clear water rinsing 8 seconds;
Reduction regulates, and substrate is put into the reduction that acidic reduction conditioning agent solution is housed and regulate cylinder rinsing 8 seconds, described acidic reduction regulates solution to comprise the NH that concentration is 140mL/L
2the sulfuric acid solution of OH solution and 90mL/L, the sulfuric acid that sulfuric acid solution is 50% by mass percent is prepared.Described NH
2the addition of OH solution is 18.2mL/m
2, described sulfuric acid solution addition is 11mL/m
2, described reduction regulates the liquid level of cylinder to be 100mm, and temperature is 42 DEG C;
Washing, adopts clear water to rinse the substrate except glue, rinses 15 seconds, the residue that removing is remaining and solution.
Embodiment 6
A manufacture method for pcb board, comprise sawing sheet, chemically cleaning operation, nog plate operation and subsequent handling successively, wherein chemically cleaning process is as follows:
Upper plate, is placed on the substrate sheared transfer on the pending platform of cleaning device, facilitates the pickup of subsequent step;
Washing, picks up the substrate on pending platform, puts into clear water rinsing 5 seconds;
Except glue, the substrate after rinsing transfer to be equipped with alkaline sodium permanganate solution except in glue cylinder, rinsing 5 seconds, described except in glue cylinder, solution temperature is 80 DEG C, and the concentration of sodium permanganate is 60g/L, and addition is 8mL/m
2, the concentration of NaOH is 40g/L, and addition is 18mL/m
2, PCB or CCL plate except rinsing in glue cylinder 10 seconds, except the liquid level 170mm of glue cylinder;
Reduction regulates, and substrate is put into the reduction that acidic reduction conditioning agent solution is housed and regulate cylinder rinsing 3 seconds, described acidic reduction regulates solution to comprise the NH that concentration is 160mL/L
2the sulfuric acid solution of OH solution and 60mL/L, the sulfuric acid that sulfuric acid solution is 50% by mass percent is prepared.Described NH
2the addition of OH solution is 14mL/m
2, described sulfuric acid solution addition is 14.3mL/m
2, described reduction regulates the liquid level of cylinder to be 120mm, and temperature is 38 DEG C;
Washing, adopts clear water to rinse the substrate except glue, rinses 10 seconds, the residue that removing is remaining and solution.
Embodiment 7
A manufacture method for pcb board, comprise sawing sheet, chemically cleaning operation, nog plate operation and subsequent handling, wherein chemically cleaning process is as follows:
Upper plate, is placed on the substrate sheared transfer on the pending platform of cleaning device, facilitates the pickup of subsequent step;
Except glue, the substrate on pending platform transfer to be equipped with alkaline sodium permanganate solution except in glue cylinder, rinsing 5 seconds, described except in glue cylinder, solution temperature is 80 DEG C, and the concentration of sodium permanganate is 60g/L, and addition is 8mL/m
2, the concentration of NaOH is 40g/L, and addition is 18mL/m
2, PCB or CCL plate except rinsing in glue cylinder 10 seconds, except the liquid level 170mm of glue cylinder;
Reduction regulates, and substrate is put into the reduction that acidic reduction conditioning agent solution is housed and regulate cylinder rinsing 10 seconds, described acidic reduction regulates solution to comprise the NH that concentration is 100mL/L
2the sulfuric acid solution of OH solution and 90mL/L, the sulfuric acid that sulfuric acid solution is 50% by mass percent is prepared.Described NH
2the addition of OH solution is 18.2mL/m
2, described sulfuric acid solution addition is 11mL/m
2, described reduction regulates firm liquid level to be 110mm, and temperature is 38 DEG C;
Washing, adopts clear water to rinse the substrate except glue, rinses 15 seconds, the residue that removing is remaining and solution.
Embodiment 8
A manufacture method for pcb board, comprise sawing sheet, chemically cleaning operation, nog plate operation and subsequent handling successively, wherein chemically cleaning process is as follows:
Upper plate, is placed on the substrate sheared transfer on the pending platform of cleaning device, facilitates the pickup of subsequent step;
Washing, picks up the substrate on pending platform, puts into clear water rinsing 10 seconds;
Except glue, the substrate after rinsing transfer to be equipped with alkaline sodium permanganate solution except in glue cylinder, rinsing 5 seconds, described except in glue cylinder, solution temperature is 75 DEG C, and the concentration of sodium permanganate is 65g/L, and addition is 8mL/m
2, the concentration of NaOH is 40g/L, and addition is 18mL/m
2, PCB or CCL plate except rinsing in glue cylinder 10 seconds, except the liquid level 170mm of glue cylinder;
Washing, except the substrate after glue, to be placed in clear water rinsing 5 seconds;
Reduction regulates, and substrate is put into the reduction that acidic reduction conditioning agent solution is housed and regulate cylinder rinsing 5 seconds, described acidic reduction regulates solution to comprise the NH that concentration is 140mL/L
2the sulfuric acid solution of OH solution and 90mL/L, the sulfuric acid that sulfuric acid solution is 50% by mass percent is prepared.Described NH
2the addition of OH solution is 14mL/m
2, described sulfuric acid solution addition is 11mL/m
2, described reduction regulates the liquid level of cylinder to be 120mm, and temperature is 40 DEG C;
Washing, adopts clear water to rinse the substrate except glue, rinses 10 seconds, the residue that removing is remaining and solution.
Above-described embodiment, just preferred embodiment of the present invention, is not used for limiting the scope of the present invention, therefore all equivalences done with the structure described in the claims in the present invention, feature and principle change or modify, and all should be included within the claims in the present invention scope.
Comparative example 1
A manufacture method for pcb board, comprises sawing sheet, cleaning process, nog plate operation and subsequent handling successively, and wherein cleaning process (manually sweeping plate) is for artificial hairbrush is to resin-oatmeal dirt micelle on pcb board after sawing sheet, shearing or glue mark is residual cleans.
Comparative example 2
A kind of manufacture method of pcb board; comprise sawing sheet, cleaning process, nog plate operation and subsequent handling successively, wherein cleaning process (physics nog plate) is utilize the cleaning device of being furnished with brush and blowing to resin-oatmeal dirt micelle on pcb board after sawing sheet, shearing or glue mark is residual cleans.
The pcb board made through this chemical cleaning method relative to through manually sweeping plate, physics nog plate latter made pcb board effect is better, the comparative test result of its subsequent feedback is as shown in the table.
In upper table, fraction defective mainly refers to that in 100 plates, plate face exists the situation of glue mark/micelle; Defect refer to PCB is caused short circuit, open circuit defect problem.
Known by upper table, the inventive method is used to make substrate, easy to operate and rapidly, on the substrate of making, substantially glue-free mark and/or micelle remain, residual relative to the pcb board gluing mark manually swept after plate and the process of physics nog plate and/or micelle, the fraction defective that the present invention causes reduces greatly; And in subsequent handling, because removing residual glue mark and/or glue mark cause short circuit and open circuit on PCB or CCL on substrate, occur that the defect problem of PCB or CCL short circuit and open circuit reaches 35% relative to causing in following process after manually sweeping plate, substantially there is not short circuit and open circuit in the substrate after process of the present invention in following process.
Claims (9)
1. a manufacture method for pcb board, it comprises sawing sheet, removes pretreatment procedure, the subsequent handling of pollutant and increase copper face roughness on copper face; It is characterized in that: described pretreatment procedure adopts chemically cleaning operation; Described chemically cleaning operation comprises:
Except glue, substrate is put into be equipped with alkaline sodium permanganate solution except glue cylinder rinsing 3 ~ 10 seconds;
Washing, adopts clear water rinsing except the substrate of glue, obtains clean substrate.
2. the manufacture method of pcb board according to claim 1, is characterized in that, described pretreatment procedure also comprises nog plate operation.
3. the manufacture method of pcb board according to claim 1 and 2, is characterized in that: it be 60 ~ 70g/L sodium permanganate solution and concentration is 35 ~ 45g/L sodium hydroxide solution that described alkaline sodium permanganate solution comprises concentration.
4. the manufacture method of pcb board according to claim 3, it is characterized in that, described except after glue, also comprise reduction and regulate operation: substrate is put into the reduction that acid hydroxylamine solution is housed and regulate cylinder rinsing 3 ~ 10 seconds, it is the hydroxylamine solution of 100 ~ 160mL/L and the sulfuric acid solution of 60 ~ 100mL/L that wherein said acidic reduction regulates solution to comprise concentration, and the sulfuric acid that sulfuric acid solution is 50% by mass percent is prepared.
5. the manufacture method of pcb board according to claim 3, is characterized in that: described alkaline sodium permanganate solution also comprises sodium manganate solution, and the concentration of described sodium manganate solution is 0 ~ 30g/L.
6. the manufacture method of pcb board according to claim 3, is characterized in that: described except solution temperature in glue cylinder be 77 ~ 83 DEG C, the described liquid level except glue cylinder is 165 ~ 190mm.
7. the manufacture method of pcb board according to claim 3, is characterized in that: described sodium permanganate addition is 4.9 ~ 9.1mL/m
2, the addition of sodium hydroxide solution is 12.6 ~ 23.4mL/m
2.
8. the manufacture method of pcb board according to claim 4, is characterized in that: the addition of described hydroxylamine solution is 9.8 ~ 18.2mL/m
2, described sulfuric acid solution addition is 7.7 ~ 14.3mL/m
2.
9. the manufacture method of pcb board according to claim 4, is characterized in that: described reduction regulates the liquid level of cylinder to be 100 ~ 120mm, and described reduction regulates the temperature in cylinder to be 38 ~ 42 DEG C.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310176171.5A CN103298269B (en) | 2013-05-13 | 2013-05-13 | A kind of manufacture method of pcb board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310176171.5A CN103298269B (en) | 2013-05-13 | 2013-05-13 | A kind of manufacture method of pcb board |
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| CN103298269A CN103298269A (en) | 2013-09-11 |
| CN103298269B true CN103298269B (en) | 2016-03-09 |
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| CN110381671B (en) * | 2019-07-30 | 2020-06-09 | 衢州市川特电子科技有限公司 | Processing technology of circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1522105A (en) * | 2002-10-28 | 2004-08-18 | ϣ | Desmear and texturing method |
| CN102438405A (en) * | 2011-11-29 | 2012-05-02 | 电子科技大学 | Method for cleaning through hole smears of rigid-flexible printed circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5811789A (en) * | 1981-07-15 | 1983-01-22 | Matsushita Electric Works Ltd | Cleaning method for surface of copper clad laminate |
| US20020164836A1 (en) * | 2001-05-07 | 2002-11-07 | Advanced Semiconductor Engineering Inc. | Method of manufacturing printed circuit board |
-
2013
- 2013-05-13 CN CN201310176171.5A patent/CN103298269B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1522105A (en) * | 2002-10-28 | 2004-08-18 | ϣ | Desmear and texturing method |
| CN102438405A (en) * | 2011-11-29 | 2012-05-02 | 电子科技大学 | Method for cleaning through hole smears of rigid-flexible printed circuit board |
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