CN103296473B - Method for manufacturing metamaterial - Google Patents
Method for manufacturing metamaterial Download PDFInfo
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- CN103296473B CN103296473B CN201210183329.7A CN201210183329A CN103296473B CN 103296473 B CN103296473 B CN 103296473B CN 201210183329 A CN201210183329 A CN 201210183329A CN 103296473 B CN103296473 B CN 103296473B
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- ultraviolet light
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Abstract
The invention discloses a method for manufacturing a metamaterial. The metamaterial comprises a metamaterial substrate and a metal microstructure arranged on the metamaterial substrate. The method for manufacturing the metamaterial comprises the following steps that the substrate allowing ultraviolet light to penetrate through is provided, ultraviolet light polymerization glue is selected, the ultraviolet light polymerization glue is stuck on the upper surface of the substrate by means of a sheet gluing machine, metal foil is rolled on the upper surface, with the ultraviolet light polymerization glue, of the substrate, ultraviolet light is emitted to the lower surface, covered with metal foil, of the substrate by means of an ultraviolet light polymerization machine and the ultraviolet light polymerization glue is solidified to obtain the metamaterial substrate, and the metal foil is etched to form the metal microstructure. The method for manufacturing the metamaterial has the advantages that copper cladding can be carried out on the substrate which has thermoplasticity and allows the ultraviolet light to penetrate through, in addition, due to the fact that the ultraviolet light polymerization glue can be solidified at room temperature, the solidifying speed is high, the shrinking percentage is small, and volatilization is avoided, the production efficiency can be greatly improved and the manufacturing cost can be greatly reduced.
Description
Technical field
The present invention relates to Meta Materials technical field, more particularly to a kind of manufacture method of Meta Materials.
Background technology
Light, used as one kind of electromagnetic wave, which is when through glass, because the wavelength of light is much larger than the chi of atom
It is very little, therefore we can use the univers parameter of glass, such as refractive index, rather than the details parameter of the atom of glass is constituted retouching
State response of the glass to light.Accordingly, when research material is to other electromagnetic responses, in material, any yardstick is far little
Can also be with the univers parameter of material, such as DIELECTRIC CONSTANT ε and magnetic permeability μ to responding for electromagnetic wave in the structure of electromagnetic wavelength
To describe.Cause the dielectric constant and pcrmeability of material each point all identical by the designing material structure of per or difference so as to
So that the overall dielectric constant of material and pcrmeability are arranged in certain rule, the pcrmeability and dielectric constant of rule arrangement can make
Material is obtained to electromagnetic wave with response macroscopically, for example, converges electromagnetic wave, divergent electromagnetic ripple etc..Such has rule arrangement
The material of pcrmeability and dielectric constant is referred to as Meta Materials.
As shown in figure 1, Fig. 1 is the dimensional structure diagram of the elementary cell for constituting Meta Materials.The elementary cell of Meta Materials
Including man-made microstructure 2 and the base material 1 of the man-made microstructure attachment.Man-made microstructure 2 is preferably artificial metal's micro structure, people
Make metal micro structure and there is the plane or three-dimensional topological structure that response can be produced to incident electromagnetic wave electric field and/or magnetic field, change
The pattern and/or size of the artificial metal's micro structure in each Meta Materials elementary cell can change each Meta Materials elementary cell
Response to incident electromagnetic wave.Coating 3, coating 3, man-made microstructure 2 and base material 1 are also covered with man-made microstructure 2
Constitute the elementary cell of Meta Materials.Multiple Meta Materials elementary cells cause Meta Materials to have electromagnetic wave by arranging according to certain rules
There is the response of macroscopic view.As Meta Materials integrally need have macroscopical electromagnetic response to incident electromagnetic wave, therefore each Meta Materials is substantially single
Unit need to form continuous response to the response of incident electromagnetic wave, and what this required each Meta Materials elementary cell is smaller in size than incoming electromagnetic
/ 5th of ripple wavelength, preferably 1/10th of incident electromagnetic wave wavelength.In this segment description, we are artificial by Meta Materials
Entirety is divided into multiple Meta Materials elementary cells, but should know this kind of division methods only for convenience of description, should not regard as Meta Materials by
Multiple Meta Materials elementary cell splicings assemble, and in practical application, Meta Materials are to be arranged in artificial metal the micro structure cycle
May make up on base material, process is simple and with low cost.Cycle arrangement refers to that each Meta Materials of above-mentioned artificial division are substantially single
Artificial metal's micro structure in unit can produce continuous electromagnetic response to incident electromagnetic wave.
The realization of metamaterial structure at present is main or is completed so that metal wire is made on pcb board, existing PCB industries
Cover process for copper mainly Copper Foil hot setting adhesive is formed by heat pressing process pressing, and the production cycle of heat pressing process
Longer, in 3 hours or so, and heatproof requirement of the heat pressing process to substrate is higher.The metamaterial structure of prior art is to base
The resistance to temperature of plate it is less demanding, many thermoplastic organic substrates, such as Merlon can be adopted（Polycarbonate,
PC）, acrylonitrile-butadiene-styrene copolymer（Acrylonitrile Butadiene Styrene, ABS）, it is poly- to benzene two
Formic acid glycol ester（Poyethylene Terephthalate, PET）, polybutylene terephthalate (PBT)（Polybutylene
Trerphthalate, PBT）, polyphenylene oxide（Polyphenylene Oxide, PPO）, polypropylene（Polypropylene, PP）、
Polyethylene（Polyethylene, PE）Deng.However, cannot be covered to above-mentioned thermoplastic material substrate using heat pressing process
Copper.
Accordingly, it is desirable to provide a kind of manufacture method of Meta Materials, to solve the above problems.
The content of the invention
The invention mainly solves the technical problem of a kind of manufacture method of Meta Materials is provided, with the substrate in saturating ultraviolet light
On carry out covering copper.
To solve above-mentioned technical problem, one aspect of the present invention is：A kind of manufacturer of Meta Materials is provided
Method, Meta Materials include metamaterial substrate and the metal micro structure being arranged in metamaterial substrate, wherein, manufacture method includes：
The substrate of one saturating ultraviolet light is provided；Choose ultraviolet cured adhesive；Ultraviolet cured adhesive is attached to into substrate using sheet material gluing machine
On upper surface；By metal forming roll-in on the upper surface of substrate for pasting ultraviolet cured adhesive；Launched using uv cure machine
To on the lower surface of the substrate for being covered with metal forming, solidification ultraviolet cured adhesive obtains metamaterial substrate to ultraviolet light；Etching metal forming,
Form metal micro structure.
According to one preferred embodiment of the present invention, manufacture method also includes：Substrate is extruded using single screw extrusion machine.
According to one preferred embodiment of the present invention, substrate is the organic resin class substrate of ultraviolet light.
According to one preferred embodiment of the present invention, substrate is polycarbonate substrate, polyethylene substrate, polypropylene substrate, polyphenyl
Vinyl tile or PET substrate.
According to one preferred embodiment of the present invention, the shrinkage factor of ultraviolet cured adhesive and the shrinkage factor of substrate are equal or close.
According to one preferred embodiment of the present invention, substrate is PET substrate, and ultraviolet cured adhesive is
Acrylic compounds ultraviolet cured adhesive.
According to one preferred embodiment of the present invention, the thickness of substrate is 1mm.
According to one preferred embodiment of the present invention, sheet material gluing machine is laminator.
According to one preferred embodiment of the present invention, metal forming is Copper Foil.
According to one preferred embodiment of the present invention, ultraviolet cured adhesive solidifies at room temperature.
The invention has the beneficial effects as follows：The situation of prior art is different from, the manufacture method of the Meta Materials of the present invention passes through
Solidification ultraviolet cured adhesive causes metal forming to be attached on substrate, and then obtains metamaterial substrate, realize with thermoplasticity and
Carry out covering process for copper on the substrate of ultraviolet light thoroughly；Further, since ultraviolet cured adhesive can solidify at room temperature, and curing rate
Hurry up, shrinkage factor is little, non-volatile, production efficiency can be greatly improved and production cost is reduced.
Description of the drawings
Fig. 1 is the dimensional structure diagram of the elementary cell for constituting Meta Materials；
Fig. 2 is the structural representation of Meta Materials according to a first embodiment of the present invention；
Fig. 3 is the flow chart of the manufacture method of Meta Materials according to a first embodiment of the present invention.
Specific embodiment
The present invention is intended to provide a kind of manufacture method of Meta Materials, for carrying out covering process for copper on the substrate of saturating ultraviolet light,
For example it is used for the organic resin class substrate of saturating ultraviolet light, organic resin class substrate includes：Polycarbonate substrate, polyethylene substrate,
Polypropylene substrate, polystyrene substrate or PET substrate.Hereafter will be with polyethylene terephthalate
As a example by ester group plate, technical scheme is described in detail.
Fig. 2 is referred to, Fig. 2 is the structural representation of Meta Materials according to a first embodiment of the present invention.As shown in Fig. 2 this
The disclosed Meta Materials 20 of invention include：Metamaterial substrate 21 and metal micro structure 22.Wherein, metal micro structure 22 is arranged on
In metamaterial substrate 21.
Referring again to Fig. 3, Fig. 3 is the flow chart of the manufacture method of Meta Materials according to a first embodiment of the present invention.Such as Fig. 3
Shown, the manufacture method of disclosed Meta Materials is comprised the following steps：
Step S1：The substrate of one saturating ultraviolet light is provided；
Step S2：Choose ultraviolet cured adhesive；
Step S3：Ultraviolet cured adhesive is attached on the upper surface of substrate using sheet material gluing machine；
Step S4：By metal forming roll-in on the upper surface of substrate for pasting ultraviolet cured adhesive；
Step S5：On lower surface using uv cure machine emitting ultraviolet light to the substrate for being covered with metal forming, solidification is purple
Outer optic-solidified adhesive obtains metamaterial substrate 21；
Step S6：Etching metal forming, forms metal micro structure 22.
In the embodiment of the present invention, also include in step sl：Substrate is extruded using single screw extrusion machine.Wherein, substrate is
PET substrate, the thickness of substrate are preferably 1mm.
In step s 2, ultraviolet cured adhesive includes the main constituents such as base resin, activated monomer, light trigger and stablizes
The auxiliary components such as agent, cross-linking agent, coupling agent.Ultraviolet cured adhesive under the ultraviolet light of appropriate wavelength, due to light trigger
It is rapid to produce free agent or ion, and then cause base resin with activated monomer polymerization crosslinking into network structure, so that ultraviolet
Optic-solidified adhesive realizes the effect of bonding.Wherein, choose ultraviolet cured adhesive shrinkage factor is equal with the shrinkage factor of substrate or phase
Closely.In the present embodiment, ultraviolet cured adhesive is acrylic compounds ultraviolet cured adhesive.
In step s3, sheet material gluing machine is laminator, and ultraviolet cured adhesive is attached to the upper table of substrate by laminator
On face.
In step s 4, metal forming is pressed on the upper surface of the substrate for pasting ultraviolet cured adhesive by liquid glue, at this
In embodiment, metal forming is Copper Foil.In other embodiments, metal forming can also be other metals, for example, native silver.
In step s 5, uv cure machine lower surface of the emitting ultraviolet light to the substrate for being covered with metal forming at room temperature
On, UV light permeability substrate solidification ultraviolet cured adhesive, so that metal forming is attached on the upper surface of substrate, is realized in substrate
On carry out covering copper, to obtain metamaterial substrate 21.
In step s 6, metal forming is etched by existing etching technique, to form metal micro structure 22.
The manufacture method of the Meta Materials of prior art is different from, the manufacture method of disclosed Meta Materials is by solidification
Ultraviolet cured adhesive causes metal forming to be attached on substrate, and then obtains metamaterial substrate 21, realizes with thermoplasticity and saturating
Carry out covering process for copper on the substrate of ultraviolet light.Due to the shrinkage factor of ultraviolet cured adhesive and the shrinkage factor of substrate it is equal or close,
So that the stress between substrate and metal forming after ultraviolet light polymerization adhesive curing is less, reliability is high.In addition, the system of the present invention
Make method and solidify ultraviolet cured adhesive at room temperature, no cold and hot exchange process is no stress-retained on substrate, even if in base
On plate, one side covers copper also with higher flatness.Additionally, the curing rate of ultraviolet cured adhesive is fast, shrinkage factor is little, non-volatile,
And the manufacture method can be completed in production line, production efficiency can be greatly improved and production cost is reduced.
Embodiments of the invention are the foregoing is only, the scope of the claims of the present invention is not thereby limited, it is every using this
Equivalent structure or equivalent flow conversion that bright description and accompanying drawing content are made, or directly or indirectly it is used in other related skills
Art field, is included within the scope of the present invention.
Claims (9)
1. a kind of manufacture method of Meta Materials, it is characterised in that the Meta Materials include metamaterial substrate and are arranged on described
Metal micro structure in metamaterial substrate, wherein, the manufacture method includes：
One substrate with thermoplasticity and saturating ultraviolet light is provided；
Ultraviolet cured adhesive is chosen, the shrinkage factor of the ultraviolet cured adhesive is equal with the shrinkage factor of the substrate or close；
The ultraviolet cured adhesive is attached on the upper surface of the substrate using sheet material gluing machine；
By metal forming roll-in on the upper surface of the substrate for having pasted ultraviolet cured adhesive；
On lower surface using uv cure machine emitting ultraviolet light to the substrate for being covered with metal forming, solidify the ultraviolet light
Solidification glue obtains the metamaterial substrate；
The metal forming is etched, the metal micro structure is formed.
2. manufacture method according to claim 1, it is characterised in that the manufacture method also includes：Squeezed using single screw rod
Go out machine and extrude the substrate.
3. manufacture method according to claim 1, it is characterised in that the substrate is the organic resin class base of ultraviolet light
Plate.
4. manufacture method according to claim 3, it is characterised in that the substrate is polycarbonate substrate, polyvinyl
Plate, polypropylene substrate, polystyrene substrate or PET substrate.
5. manufacture method according to claim 1, it is characterised in that the substrate is polyethylene terephthalate base
Plate, the ultraviolet cured adhesive are acrylic compounds ultraviolet cured adhesive.
6. manufacture method according to claim 5, it is characterised in that the thickness of the substrate is 1mm.
7. manufacture method according to claim 1, it is characterised in that the sheet material gluing machine is laminator.
8. manufacture method according to claim 1, it is characterised in that the metal forming is Copper Foil.
9. the manufacture method according to any one of claim 1-8, it is characterised in that the ultraviolet cured adhesive is at room temperature
Solidification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210183329.7A CN103296473B (en) | 2012-03-02 | 2012-06-05 | Method for manufacturing metamaterial |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210054870 | 2012-03-02 | ||
| CN201210054870.8 | 2012-03-02 | ||
| CN2012100548708 | 2012-03-02 | ||
| CN201210183329.7A CN103296473B (en) | 2012-03-02 | 2012-06-05 | Method for manufacturing metamaterial |
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| CN103296473A CN103296473A (en) | 2013-09-11 |
| CN103296473B true CN103296473B (en) | 2017-04-19 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1850897A (en) * | 2006-04-29 | 2006-10-25 | 天津富松塑料制品工贸有限公司 | Technical method for one-time shaping PPE-honeycomb plate |
| CN101527199A (en) * | 2008-02-29 | 2009-09-09 | 财团法人工业技术研究院 | Capacitor device and circuit |
| CN102164194A (en) * | 2011-04-11 | 2011-08-24 | 深圳市厚泽真空技术有限公司 | Mobile phone, vacuum coating surface treatment antenna and making method thereof |
| CN102185175A (en) * | 2011-04-11 | 2011-09-14 | 深圳市厚泽真空技术有限公司 | Mobile phone, vacuum coated antenna and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8129009B2 (en) * | 2004-04-13 | 2012-03-06 | E. I. Du Pont De Nemours And Company | Composition comprising ethylene copolymer |
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2012
- 2012-06-05 CN CN201210183329.7A patent/CN103296473B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1850897A (en) * | 2006-04-29 | 2006-10-25 | 天津富松塑料制品工贸有限公司 | Technical method for one-time shaping PPE-honeycomb plate |
| CN101527199A (en) * | 2008-02-29 | 2009-09-09 | 财团法人工业技术研究院 | Capacitor device and circuit |
| CN102164194A (en) * | 2011-04-11 | 2011-08-24 | 深圳市厚泽真空技术有限公司 | Mobile phone, vacuum coating surface treatment antenna and making method thereof |
| CN102185175A (en) * | 2011-04-11 | 2011-09-14 | 深圳市厚泽真空技术有限公司 | Mobile phone, vacuum coated antenna and manufacturing method thereof |
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| CN103296473A (en) | 2013-09-11 |
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Effective date of registration: 20160330 Address after: 518057 Guangdong City, Nanshan District province high tech Zone in the middle of a high tech building, building No. 2, No. 9, building Applicant after: Shenzhen Guangqi Innovative Technology Co., Ltd. Address before: 518034 A international business center, No. 1061, Xiang Mei Road, Guangdong, Shenzhen, Futian District, China 18B Applicant before: Shenzhen Kuang-Chi Innovation Technology Co., Ltd. |
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