CN103294115B - Electronic equipment - Google Patents
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- CN103294115B CN103294115B CN201210055705.4A CN201210055705A CN103294115B CN 103294115 B CN103294115 B CN 103294115B CN 201210055705 A CN201210055705 A CN 201210055705A CN 103294115 B CN103294115 B CN 103294115B
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- Prior art keywords
- shell
- circuit board
- product identification
- electronic equipment
- camera module
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- 239000000463 material Substances 0.000 claims description 10
- 239000007769 metal material Substances 0.000 claims description 4
- 235000007466 Corylus avellana Nutrition 0.000 claims 1
- 240000007582 Corylus avellana Species 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- 239000000047 product Substances 0.000 description 45
- 239000000758 substrate Substances 0.000 description 9
- 230000005611 electricity Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 3
- 210000004556 Brain Anatomy 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000003068 static Effects 0.000 description 1
Abstract
Electronic equipment, including：First shell；Second shell, it is opposite with the first shell, there is preset space between the first shell and the second shell；Product identification is arranged on the first area of the second shell；Circuit board is arranged on the first surface of the product identification；Camera module, setting are connect on the circuit board, and by the circuit on the circuit board with the mainboard of the electronic equipment.
Description
Technical field
The present invention relates to a kind of electronic equipment.
Background technology
As user is to the lightening demand of electronic equipment, the electronics of such as laptop or tablet computer etc is set
Standby thickness constantly reduces.In this case, since the volume of high-pixel camera (height) is usually taken the photograph than low pixel
Picture head is big, therefore is difficult the camera that high pixel is arranged on the electronic equipment of the thickness with very little.However, if in electronics
The camera of low pixel is arranged in equipment would generally influence the shooting quality of camera, and this may influence the use body of user
It tests.Therefore, the camera of high pixel how to be arranged on the electronic equipment of the thickness with very little becomes difficulty in the prior art
Topic.
Invention content
In order to solve above-mentioned technical problem in the prior art, according to an aspect of the present invention, a kind of electronic equipment is provided,
Including：First shell；Second shell, it is opposite with the first shell, have between the first shell and the second shell
There is preset space；Product identification is arranged on the first area of the second shell；Circuit board is arranged in the product mark
On the first surface of knowledge；Camera module is arranged on the circuit board, and passes through circuit on the circuit board and institute
State the mainboard connection of electronic equipment.
In addition, according to one embodiment of present invention, wherein be open by being arranged in the first area of second shell, and
The product identification is embedded into the opening product identification is arranged in the second shell；And described first
Surface is towards the space between the first shell and second shell.
In addition, according to one embodiment of present invention, wherein the area of the product identification is more than the camera module
Area and the circuit board area.
In addition, according to one embodiment of present invention, wherein the thickness of the product identification is less than the second shell
Thickness.
In addition, according to one embodiment of present invention, wherein the circuit board is flexible printed circuit board.
In addition, according to one embodiment of present invention, wherein the flexible printed circuit board is set by way of adherency
It sets on the first surface of product identification.
In addition, the sensing unit of the camera module is arranged described by way of encapsulating chip (COB) on plate
On flexible printed circuit board.
In addition, according to one embodiment of present invention, wherein the second shell is made of metal material, and with it is described
Product identification is connected to；And the product identification is used as the ground terminal of the camera module.
In addition, according to one embodiment of present invention, wherein the second shell is made of nonmetallic materials；And
Ground wire is arranged in the second surface of two shells, and the ground wire and the ground terminal of the camera module is made to connect.
By above-mentioned configuration, circuit board is set in product identification, and camera module is set on circuit boards.Due to production
The thickness of product mark is usually less than the thickness of electronic equipment casing and forms additional space, thus by by camera module and
The space that can be further increased and accommodate camera module is arranged on product identification in circuit board, it is possible thereby to by larger camera shooting
Head module is arranged in the electronic device.In addition, in the case where circuit board is flexible printed circuit board, due in flexible printing electricity
Wiring needs that high-strength substrate is arranged in the circuit board bottom to make circuit (gold thread) compacting on the board on the plate of road, and hard
Product identification can play high-strength substrate made of the higher material of degree, it is possible thereby to which the space for saving high-strength substrate is come
Place the camera module of bigger.
Description of the drawings
Fig. 1 is the sectional view for illustrating electronic equipment according to the ... of the embodiment of the present invention.
Specific implementation mode
It will be described in detail with reference to the accompanying drawings each embodiment according to the present invention.Here it is to be noted that it in the accompanying drawings,
It assigns identical reference numeral to the substantially component part with same or like structure and function, and will omit about it
Repeated description.
Electronic equipment according to the ... of the embodiment of the present invention is described below with reference to Fig. 1.Fig. 1 is that diagram is according to embodiments of the present invention
Electronic equipment sectional view.Here, electronic equipment according to the ... of the embodiment of the present invention can be such as laptop or tablet
The electronic equipment of computer etc.
As shown in Figure 1, electronic equipment according to the ... of the embodiment of the present invention can include at least first shell 1, second shell 2,
Product identification 3, circuit board 4 and camera module 5.
First shell 1 can be realized by metal or nonmetallic materials, and a part for the shell for the electronic equipment.
Second shell 2 can be realized by metal or nonmetallic materials, and be oppositely arranged with first shell 1.Here, in electricity
In the case that sub- equipment is laptop, first shell 1 and second shell 2 can form the display screen of laptop
Shell.In addition, in the case where electronic equipment is tablet computer, first shell 1 and second shell 2 can form tablet electricity
The shell of the display screen and arithmetic unit (e.g., mainboard, processor etc.) of brain.
In addition, having preset space to accommodate each portion of electronic equipment between first shell 1 and second shell 2
Part.For example, in the case where electronic equipment is laptop, the space between first shell 1 and second shell 2 can hold
It receives and shows screen.In addition, in the case where electronic equipment is tablet computer, the space between first shell 1 and second shell 2
Display screen and arithmetic unit can be accommodated.In this case, due to existing between first shell 1 and second shell 2
Preset space, therefore the device of such as camera module etc can be set between first shell 1 and second shell 2.This
In, first shell 1 can show the positive shell of screen, and second shell 2 can be the shell at the back side for showing screen.
According to an embodiment of the invention, the product identification 3 of electronic equipment can be set on the predeterminable area of second shell 2
(e.g., the mark of Lenovo), and product identification 3 can be made of flaky metallic material, if you do not need to it assists static conductive,
Product identification 3 can also be made of the enough hard materials of the quality such as plastics.Here, predeterminable area can be the display screen of electronic equipment
The arbitrary region of curtain periphery.In general, the predeterminable area can be located at the positive top of display screen.
Circuit board 4 is arranged on the inner surface of product identification 3, i.e., circuit board 4 is arranged in product identification 3 towards first shell
On the surface in the space between body 1 and second shell 2.Circuit board 4 can be by the electricity of flexible printed circuit board or pcb board etc
Road plate is realized.
Camera module 5 is arranged on the circuit board 4, and passes through circuit (e.g., the printing electricity in setting on the circuit board 4
Road) it is connect with the mainboard (not shown) of electronic equipment, and pass through the line transmission data on circuit board 4.
According to an embodiment of the invention, by the way that product identification 3 to be embedded in the predeterminable area of second shell 2 by product mark
Know 3 to be arranged in second shell 2.Specifically, as shown in Figure 1, opening can be arranged on the predeterminable area of second shell 2, and
And product identification 3 is embedded into the opening so that product identification 3 to be arranged on the predeterminable area of second shell 2.
According to an embodiment of the invention, the thickness of product identification 3 is less than the thickness of second shell 2.For example, due to second shell
Body 2 needs to shield to the component of its inside, therefore the thickness of second shell 2 is typically larger than 1mm, and product identification 3 is not
It needs to protect the component inside second shell 2, therefore can usually make ultra-thin product identification 3 (e.g., 0.1mm).
Here, since the thickness of product identification 3 is less than the thickness of second shell 2 and product identification 3 is embedded into opening for the second shell 2
On mouth, therefore product identification 3 can form groove with the opening in second shell 2.
Here, since product identification 3 generally comprises the multiple Chinese characters or letter (e.g., Lenovo) that print or etch on it
And area is larger (e.g., 20mm*10mm), and the length of side of current circuit board 4 and camera module 5 all several millimeters with
It is interior, therefore the area of product identification 3 is greater than the area of circuit board 4 and camera module 5.
In this case, since product identification 3 can form groove, circuit board 4 with the opening in second shell 2
And camera module 5 can be arranged and is formed by groove in circuit board 4 and camera module 5.In this case, recessed
Slot can provide additional space to accommodate circuit board 4 and camera module 5.It is possible thereby to by larger camera module 5
Setting is in the electronic device.Therefore, receiving circuit can be further increased in the case where the outer casing thickness of electronic equipment is constant
The space of plate 4 and camera module 5, it is possible thereby to by existing with the setting of the camera module 5 of higher pixel and camera lens quality
In electronic equipment according to the ... of the embodiment of the present invention.
In addition, according to another embodiment of the invention, opening can be set on the predeterminable area of second shell 2, and
And product identification 3 and the opening are bonded so that product identification 3 to be arranged on the predeterminable area of second shell 2.Here, product identification
3 area can be more than the area of the opening so that when product identification 3 and the opening are bonded, product identification 3 and second shell
Opening on body 2 forms groove, so as to the camera module 5 for providing additional space to accommodate larger.
In addition, if it is made of metal in second shell 2, since product identification 3 can be by metal material
Material is made, therefore second shell 2 is connected to product identification 3.In this case, product identification 3 is also used as camera shooting head mould
The ground terminal of block 5, and be grounded by product identification 3 and second shell 2, to simplify the design complexities of camera module 5.
It, can be in second shell 2 made of nonmetallic materials in addition, according to one embodiment of present invention
Ground wire is set in the inner surface of second shell 2, and ground wire and the ground terminal of camera module 5 is made to connect.
It here, can be after integrated by circuit board 4 and camera module 5 in the case where circuit board 4 is pcb board
In the groove that opening directly by it on product identification 3 and second shell 2 is formed.
In addition, in the case where circuit board 4 is flexible printed circuit board, need to encapsulate (COB) technique by chip on board
On the circuit board 4 by the sensing unit setting of camera module.In this case, since the material of flexible printed circuit board is determined
Determine directly the sensing unit of camera module to be arranged in circuit board 4 by COB techniques.Therefore, in the prior art,
When using flexible printed circuit board as circuit board 4, circuit board 4 also needs to come in its bottom one high-strength substrate of setting
The sensing unit of camera module is arranged in the support of circuit board 4 circuit board 4 by COB techniques, and the thickness of high-strength substrate
Degree can also increase the thickness of circuit board 4, thus lead to the increase of circuit board 4 and the integral thickness of camera module 5.
In this case, according to one embodiment of present invention, by COB techniques by the sensing list of camera module
Member setting is arranged before circuit board 4, and by product identification 3 before the first area of second shell 2, by circuit board 4
It is fixed on the inner surface of product identification 3 in advance.Here, it is realized by sheet metal or high-strength material due to product identification 3,
It has very high intensity.In this case, the sensing unit of camera module is being arranged in circuit board by COB techniques
When 4, product identification 3 can support circuit board 4 instead of high-strength substrate completely.Therefore, according to embodiments of the present invention, even if it is electric
Road plate 4 is flexible printed circuit board, and electronic equipment according to the ... of the embodiment of the present invention also need not be in 4 times setting high intensity of circuit board
Substrate, it is possible thereby to save the space of high-strength substrate to place the camera module 5 of bigger.That is, by using production
Product mark 3 replaces high-strength substrate, can further decrease the integral thickness of circuit board 4 and camera module 5.In such case
Under, larger camera module 5 can be arranged in the groove that the opening on product identification 3 and second shell 2 is formed.
By above-mentioned configuration, receiving circuit can be further increased in the case where the outer casing thickness of electronic equipment is constant
The space of plate 4 and camera module 5, it is possible thereby to by existing with the setting of the camera module 5 of higher pixel and camera lens quality
In electronic equipment according to the ... of the embodiment of the present invention.In this case, the frivolous characteristic of electronic equipment can have not only been ensured, but also can
To provide the camera unit with high pixel and high image quality, so as to be obviously improved the usage experience of user.
As described above, having been described above each embodiment for specifically describing the present invention, but the invention is not restricted to this.
It should be appreciated by those skilled in the art, can be carry out various modifications, be combined according to design requirement or other factors, sub-portfolio or
Person replaces, and they are in the range of appended claims and its equivalent.
Claims (6)
1. a kind of electronic equipment, including：
First shell；
Second shell, it is opposite with the first shell, there is preset sky between the first shell and the second shell
Between；
Product identification is arranged on the first area of the second shell；
Circuit board is arranged on the first surface of the product identification；
Camera module is arranged on the circuit board, and passes through circuit on the circuit board and the electronic equipment
Mainboard connection,
Wherein
On the first area of the second shell be arranged opening, and by by the product identification be embedded into it is described opening come
The product identification is arranged in the second shell；
The first surface is towards the space between the first shell and second shell；
The thickness of the product identification is less than the thickness of the second shell；And
The circuit board is flexible printed circuit board.
2. electronic equipment as described in claim 1, wherein
The area of the product identification is more than the area of the camera module and the area of the circuit board.
3. electronic equipment as described in claim 1, wherein
The flexible printed circuit board is arranged on the first surface of product identification by way of adherency.
4. electronic equipment as claimed in claim 3, wherein
(COB) is electric in the flexible printing by the sensing unit setting of the camera module by way of chip on board encapsulation
On the plate of road.
5. electronic equipment as described in claim 1, wherein
The second shell is made of metal material, and is connected to the product identification；And
The product identification is used as the ground terminal of the camera module.
6. electronic equipment as described in claim 1, wherein
The second shell is made of nonmetallic materials；And
Ground wire is set in the second surface of second shell, and the ground wire and the ground terminal of the camera module is made to connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210055705.4A CN103294115B (en) | 2012-03-05 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210055705.4A CN103294115B (en) | 2012-03-05 | Electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103294115A CN103294115A (en) | 2013-09-11 |
| CN103294115B true CN103294115B (en) | 2018-08-31 |
Family
ID=
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2331009Y (en) * | 1998-07-28 | 1999-07-28 | 大众电脑股份有限公司 | Notebook type computer hidden pickup camera composite body |
| CN101419324A (en) * | 2007-10-24 | 2009-04-29 | 鸿富锦精密工业（深圳）有限公司 | Camera shooting module |
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2331009Y (en) * | 1998-07-28 | 1999-07-28 | 大众电脑股份有限公司 | Notebook type computer hidden pickup camera composite body |
| CN101419324A (en) * | 2007-10-24 | 2009-04-29 | 鸿富锦精密工业（深圳）有限公司 | Camera shooting module |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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