CN103293866B - High-modal small-mass bearing piece platform of photoetching machine - Google Patents
High-modal small-mass bearing piece platform of photoetching machine Download PDFInfo
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- CN103293866B CN103293866B CN201210055795.7A CN201210055795A CN103293866B CN 103293866 B CN103293866 B CN 103293866B CN 201210055795 A CN201210055795 A CN 201210055795A CN 103293866 B CN103293866 B CN 103293866B
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Abstract
The invention provides a high-modal small-mass bearing piece platform of a photoetching machine. The bearing piece platform comprises a top structural module of the bearing piece platform and a bottom sealing plate of the bearing piece platform, wherein the top structural module of the bearing piece platform and the bottom sealing plate of the bearing piece platform are adhered into a whole so as to form two upper and lower layers of sandwich board structures; the top structural module of the bearing piece platform is provided with a plane vector motor mounting cavity, a vertical driving mechanism mounting cavity, a differential sensor mounting cavity and a lightening hole; the bottom sealing plate of the bearing piece platform is provided with an open pore to fit for the assembly of the bearing piece platform and a microchecker. The high-modal small-mass bearing piece platform of the photoetching machine, provided by the invention, can effectively reduce the weight of the structure and materials and lighten the mass of a bearing piece, and meanwhile, the modal value index and the dynamic performance of a workpiece platform are ensured.
Description
Technical field
The present invention relates to litho machine field, and in particular to a kind of litho machine high mode lightweight wafer-supporting platform.
Background technology
Wafer-supporting platform is one of essential elements of photo-etching machine work-piece platform, in order to carry silicon chip.In magnetic levitation work stage, the planar motor that is driven through of workpiece platform micro-motion platform realizes, and due to the pursuit to photoetching efficiency, work stage is proposed to the demand of higher acceleration of motion.But for improving work stage acceleration, according to Newton's law F=Ma, have two kinds of methods: 1) improve planar motor driving and exert oneself; 2) micropositioner own wt is alleviated.With under current industry technical conditions, what the driving of raising planar motor was exerted oneself is very difficult, develops, manufacturing cost is large, the cycle is long.So selecting to alleviate micropositioner quality is a kind of effective and economic method, and wherein wafer-supporting platform accounts for again the quality of the overwhelming majority of micropositioner.
Because litho machine resolution and alignment precision improve constantly, this just has the demand of higher dynamic property to kinematic system, so require that the wafer-supporting platform of work stage has higher mode and rigidity.Therefore, alleviate hold tablet quality while must ensure again mode value index and the dynamic property of work stage.
Wafer-supporting platform in existing industry generally adopts the low-down dense material of thermal expansivity (as: devitrified glass) to manufacture, and adopts construction design method to alleviate wafer-supporting platform quality.Strengthen being a kind of random geometry and size to gusset due to bottom, manufacture process is comparatively complicated, and according to the convergence limit of this type of method design at mode and mass values, is difficult to improve again.
Summary of the invention
The present invention proposes a kind of litho machine high mode lightweight wafer-supporting platform, effectively can realize structure loss of weight and material loss of weight, alleviate hold tablet quality while must ensure again mode value index and the dynamic property of work stage.
In order to achieve the above object, the present invention proposes a kind of litho machine high mode lightweight wafer-supporting platform, comprising:
Shrouding bottom wafer-supporting platform top structure module and wafer-supporting platform, bottom described wafer-supporting platform top structure module and wafer-supporting platform, shrouding is bonded as one, and forms bilevel sandwich construction;
Described wafer-supporting platform top structure module has plane vector motor installation cavity, vertical driving mechanism installation cavity, differential sensor installation cavity and lightening hole;
Bottom described wafer-supporting platform, shrouding has perforate to adapt to the assembling of wafer-supporting platform with micropositioner.
Further, described lightening hole is array loss of weight circular hole, regular hexagon hole or tri-angle-holed.
Further, the distance of center circle staggered arrangement such as the circular hole position employing of described array loss of weight circular hole, laterally two row hole distance of center circle skew equidistances, and in layout, any two adjacent hole circle hearts are apart from equal, the distance of center circle line of any three adjacent circular holes is between two equilateral triangle.
Further, in described regular hexagon hole arrangement, any two adjacent regular hexagon limit spacing are equal, are evenly distributed.
Further, in described tri-angle-holed layout, any two adjacent equilateral triangle spacing are equal, are evenly distributed.
Further, the quantity of described layout perforate controls between 40 ~ 300, and minimum edge distance controlling is at 2 ~ 4mm, and the numerical value of dutycycle is between 70% ~ 95%.
Further, described lightening hole is realized by Making mold, described mould divides patrix and counterdie two parts, patrix is bearing material chamber, counterdie is by the pre-buried pin-and-hole identical with lightening hole layout, and by material feeding after upper and lower mould laminating and die cast, being at wafer-supporting platform can under machining state, by machine work, its profile is repaired, finally sintered the manufacture of porous wafer-supporting platform.
Further, described wafer-supporting platform top structure module also comprises the main muscle of topological reinforcement and the secondary muscle of topological reinforcement, described main muscle refers to that described secondary muscle refers to by the supporting rib stiffener taken between knot internal main muscle by taking the supporting rib stiffener of knot central plane vector motor installation cavity to wafer-supporting platform surrounding.
Further, the wall thickness of described main muscle is 8 ~ 30mm, and the wall thickness of described secondary muscle is 3 ~ 10mm.
Further, described wafer-supporting platform adopts the manufactures of devitrified glass, carbon fiber or other densified composite.
Further, described wafer-supporting platform adopts foamed ceramics, ceramic honey comb or other loose porous material manufactures.
The litho machine high mode lightweight wafer-supporting platform that the present invention proposes, its beneficial effect is as follows:
1. effectively alleviate wafer-supporting platform quality, comparatively conventional topologies structural design mode loss of weight accounts for 10% ~ 15%;
2. effectively improve wafer-supporting platform kinetic simulation state value, mode value improves about 20% ~ 30%;
3. adopt Mould Machining to ensure product quality, effectively reduce manufacturing risk, controlled working cost;
4. adopt porosint to make the layout that work stage is convenient to its structural design and sensor, surveying instrument.
Accompanying drawing explanation
Figure 1 shows that micropositioner structural representation in prior art.
Figure 2 shows that the wafer-supporting platform inner structure cross-sectional schematic of present pre-ferred embodiments.
Figure 3 shows that the wafer-supporting platform composite structure three-dimensional plot of present pre-ferred embodiments.
Figure 4 shows that the circular hole work stage inner structure of present pre-ferred embodiments.
Figure 5 shows that the honeycomb type work stage inner structure of present pre-ferred embodiments.
Figure 6 shows that the circular hole schematic layout pattern of present pre-ferred embodiments.
Figure 7 shows that the regular hexagon schematic layout pattern of present pre-ferred embodiments.
Figure 8 shows that the equilateral triangle schematic layout pattern of present pre-ferred embodiments.
Figure 9 shows that the porous type work stage manufacturing process flow of present pre-ferred embodiments.
Figure 10 shows that the wafer-supporting platform mfg. moulding die schematic diagram of present pre-ferred embodiments.
Figure 11 shows that the topological structure wafer-supporting platform inner structure of present pre-ferred embodiments.
Embodiment
In order to more understand technology contents of the present invention, institute's accompanying drawings is coordinated to be described as follows especially exemplified by specific embodiment.
This patent relates to a kind of invention of litho machine lightweight porous type wafer-supporting platform.Be illustrated in figure 1 workpiece platform micro-motion platform structural representation, wherein wafer-supporting platform 1 is the main structural member of micropositioner, and wafer-supporting platform 1 is arranged on the top of micropositioner, below mounting plane vector motor 2, vertical driving mechanism 3 and differential sensor 4.
Please refer to the wafer-supporting platform inner structure cross-sectional schematic that Fig. 2 Figure 2 shows that present pre-ferred embodiments.The present invention proposes a kind of litho machine high mode lightweight wafer-supporting platform, comprise: shrouding 16 bottom wafer-supporting platform top structure module 11 and wafer-supporting platform, bottom described wafer-supporting platform top structure module 11 and wafer-supporting platform, shrouding 16 is bonded as one, form bilevel sandwich construction, to reach the designing requirement improving wafer-supporting platform mode and loss of weight; Described wafer-supporting platform top structure module 11 has plane vector motor installation cavity 12, vertical driving mechanism installation cavity 13, differential sensor installation cavity 14 and lightening hole 15; Bottom described wafer-supporting platform, shrouding 16 has perforate to adapt to the assembling of wafer-supporting platform with micropositioner.
Please refer to Fig. 3, Figure 3 shows that the wafer-supporting platform composite structure three-dimensional plot of present pre-ferred embodiments..Wherein wafer-supporting platform is made up of two parts, and shrouding 22 bottom wafer-supporting platform top structure module 21 and wafer-supporting platform, can assemble formation has panel itself to have the complex structure 23 of hollow up and down.Bottom top structure module 21 and wafer-supporting platform, shrouding 22 is mutually bonded to and is integrated, and wherein bonded areas is the surrounding 24 of surface in contact and bottom shrouding, and wafer-supporting platform forms an one-piece construction 23 and installs and uses for micropositioner.
Be the structure of wafer-supporting platform inner lightening holes as shown in Figure 4 and Figure 5, comprise: plane vector motor installation cavity 10, vertical driving mechanism installation cavity 20 and array lightening hole 30.
Above-mentioned plane vector motor installation cavity 10, vertical driving mechanism installation cavity 20 are that current work stage must headspace.Array lightening hole 30 is realized by two kinds of modes: the array porous 1) manufactured by dense material; 2) porous manufactured by open structure material.Above-mentioned machining hole shape adopts the array loss of weight of three kinds of shapes: circle, regular hexagon and triangle.The position must reserved in layout comprises plane vector motor installation cavity 10, vertical driving mechanism installation cavity 20, and all the other are array lightening hole 30.
Be illustrated in figure 6 circular hole layout Local map, adopt the center of circle by equidistant staggered arrangement mode, wherein D is Circularhole diameter is that b is any two row distance of center circle side-play amounts, and laterally any two row's circular hole d values are equal; A is any two adjacent circular holes distance of center circle, and wherein any three adjacent between two circular hole distance of center circle are equal, are evenly distributed.Arrange that the controllable quantity of perforate is between 40 ~ 300, controlling minimum edge distance is 2 ~ 4mm, and the numerical value of dutycycle is between 70%-95%.
Be illustrated in figure 7 regular hexagon hole arrangement (i.e. cellular structure) Local map, l is the regular hexagon length of side, and b is any holes limit spacing, and a is positive hexagon centre distance, and wherein any two adjacent regular hexagon limit spacing are equal, are evenly distributed.Arrange that the controllable quantity of perforate is between 40 ~ 300, controlling minimum edge distance is 2 ~ 4mm, and the numerical value of dutycycle is between 70%-95%.
Be illustrated in figure 8 equilateral triangle hole arrangement Local map, a is the length of side of equilateral triangle, and b is the back gauge of adjacent two equilateral triangles, and r is the chamfer radius of equilateral triangle.Wherein any two adjacent equilateral triangle spacing are equal, are evenly distributed.Arrange that the controllable quantity of perforate is between 40 ~ 300, minimum edge distance controlling is at 2 ~ 4mm, and the numerical value of dutycycle is between 70%-95%.
Be illustrated in figure 9 wafer-supporting platform fabrication processing, material feeding after upper and lower mould laminating is mixed merga pass mould molding, the lightening hole of required form and position is formed with this, after this wafer-supporting platform is in the state that can be machined, by machine work, finishing is carried out to its profile and size and reach designing requirement, finally can carry out after wafer-supporting platform sintering or other mode curing moldings the making that special surface process grinding-polishing completes porous wafer-supporting platform.
If Figure 10 is mould schematic diagram, comprise patrix 31, counterdie 32 and pre-buried pin-and-hole 33 (straight pin or regular hexagon pin).Wherein be designed with bearing material chamber 34 in patrix 31, the reserved circle in counterdie 32 surface, regular hexagon or position, equilateral triangle hole, Kong Weiyu work stage mesopore position layout is consistent, the pre-buried pin-and-hole 33 identical with lightening hole layout of Kong Weizhong, for forming the hole position identical with lightening hole layout in shot process, and can accurate pilot hole position ensure hole dimension by the method for Making mold.
Be topological structure wafer-supporting platform inner structure as shown in figure 11, it comprises inner installation vestibule: plane vector motor installs vestibule 100, vertical driving mechanism vestibule 200 and differential sensor vestibule 300.In addition, the secondary muscle 600 of inner lightening holes chamber 400, the main muscle of topological reinforcement 500 and topological reinforcement is also comprised.Wherein main muscle 500 refers to install the main support reinforcement of vestibule to wafer-supporting platform surrounding catoptron wall by taking knot central plane vector motor, and they bear inner Main Load, and wall thickness comparatively thick (between 8-30mm).Secondary muscle 600 refers to that they bear inner minor loading by the supporting rib stiffener taken between knot internal main muscle, and wall thickness thinner (between 3-10mm).As shown in figure 11, be arranged symmetrically with center line, have the secondary muscle 600 in 3 main muscle 500 and 2 places of place, its mode of arranging and position form the important topological structure in whole inside.
Further, described wafer-supporting platform adopts the manufactures of devitrified glass, carbon fiber or other densified composite.As shown in table 1 for adopting carbon fiber reinforcement silica-based glass with the material behavior contrast table of traditional silica-based glass, as the embodiment of wafer-supporting platform material, no matter be all greatly improved than Conventional glass sill in intensity or fracture toughness, density declines about 10% simultaneously.Bending strength increases more than 10 doubly, and work to break increases by two orders of magnitude.Comprise the possibility manufactured as wafer-supporting platform using densified composite such as carbon fibre reinforced resinous bases in addition.
Table 1 carbon fiber reinforcement silica-based glass contrasts
And for example following another program alleviating wafer-supporting platform weight for applying compound substance, namely bulk material manufacture is adopted to carry out the loss of weight of wafer-supporting platform, adopt the structured material of porous, as foamed ceramics, ceramic honey comb etc., ceramic foam filter product is that a kind of special process makes, and has the ceramic of foam-like porous structures.Table 2 and table 3 are the major parameter of two kinds of porosints.All wafer-supporting platform property requirements is applicable in parameters such as density of material, coefficient of heat conductivity, thermal expansivity and compressive strength.Utilize the feature of porosint self voided internal structure, declining to a great extent of wafer-supporting platform quality can be realized meet work stage mode value simultaneously under the condition of identical processing volume.Wherein the peripheral X of wafer-supporting platform can adopt the mode of paster to be connected with wafer-supporting platform inside to Y-direction catoptron.The wafer-supporting platform of the present embodiment can adopt foamed ceramics, ceramic honey comb etc. to loosen or compound substance manufacture.
Table 2 foam ceramic material characterisitic parameter
Table 3 Extruded Monolithic Celluar Ceramics characterisitic parameter
Although the present invention with preferred embodiment disclose as above, so itself and be not used to limit the present invention.Persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is when being as the criterion depending on those as defined in claim.
Claims (11)
1. a litho machine high mode lightweight wafer-supporting platform, is characterized in that, comprising:
Shrouding bottom wafer-supporting platform top structure module and wafer-supporting platform, bottom described wafer-supporting platform top structure module and wafer-supporting platform, shrouding is bonded as one, and forms bilevel sandwich construction;
Described wafer-supporting platform top structure module has plane vector motor installation cavity, vertical driving mechanism installation cavity, differential sensor installation cavity and lightening hole;
Bottom described wafer-supporting platform, shrouding has perforate to adapt to the assembling of wafer-supporting platform with micropositioner.
2. litho machine high mode lightweight wafer-supporting platform according to claim 1, it is characterized in that, described lightening hole is array loss of weight circular hole, regular hexagon hole or tri-angle-holed.
3. litho machine high mode lightweight wafer-supporting platform according to claim 2, it is characterized in that, the distance of center circle staggered arrangement such as the circular hole position employing of described array loss of weight circular hole, laterally two row hole distance of center circle skew equidistances, and any two adjacent hole circle hearts are apart from equal in layout, the distance of center circle line of any three adjacent circular holes is between two equilateral triangle.
4. litho machine high mode lightweight wafer-supporting platform according to claim 2, is characterized in that, in described regular hexagon hole arrangement, any two adjacent regular hexagon limit spacing are equal, are evenly distributed.
5. litho machine high mode lightweight wafer-supporting platform according to claim 2, is characterized in that, in described tri-angle-holed layout, any two adjacent equilateral triangle spacing are equal, are evenly distributed.
6. litho machine high mode lightweight wafer-supporting platform according to claim 2, it is characterized in that, the quantity of described top structure module arrangement perforate controls between 40 ~ 300, and minimum edge distance controlling is at 2 ~ 4mm, and the numerical value of dutycycle is between 70% ~ 95%.
7. litho machine high mode lightweight wafer-supporting platform according to claim 1, it is characterized in that, described lightening hole is realized by Making mold, described mould divides patrix and counterdie two parts, and patrix is bearing material chamber, and counterdie is by the pre-buried pin-and-hole identical with lightening hole layout, by material feeding die cast after upper and lower mould laminating, be under machining state, by machine work, its profile can be repaired, finally sintered the manufacture of porous wafer-supporting platform at wafer-supporting platform.
8. litho machine high mode lightweight wafer-supporting platform according to claim 1, it is characterized in that, described wafer-supporting platform top structure module also comprises the main muscle of topological reinforcement and the secondary muscle of topological reinforcement, described main muscle refers to that described secondary muscle refers to by the supporting rib stiffener taken between knot internal main muscle by taking the supporting rib stiffener of knot central plane vector motor installation cavity to wafer-supporting platform surrounding.
9. litho machine high mode lightweight wafer-supporting platform according to claim 8, it is characterized in that, the wall thickness of described main muscle is 8 ~ 30mm, and the wall thickness of described secondary muscle is 3 ~ 10mm.
10. litho machine high mode lightweight wafer-supporting platform according to claim 1, is characterized in that, described wafer-supporting platform adopts devitrified glass, carbon fibre material manufacture.
11. litho machine high mode lightweight wafer-supporting platforms according to claim 1, is characterized in that, described wafer-supporting platform adopts foamed ceramics, Extruded Monolithic Celluar Ceramics manufacture.
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| CN105065896A (en) * | 2015-07-28 | 2015-11-18 | 中国电子科技集团公司第二十九研究所 | Closed-cell aluminum foam sandwich mounting board of load-carrying structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US5780943A (en) * | 1996-04-04 | 1998-07-14 | Nikon Corporation | Exposure apparatus and method |
| CN102270596A (en) * | 2010-06-02 | 2011-12-07 | 上海微电子装备有限公司 | Sucking disc and sheet-holding table |
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| JP2001057325A (en) * | 1999-08-17 | 2001-02-27 | Nikon Corp | Stage device and aligner |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5780943A (en) * | 1996-04-04 | 1998-07-14 | Nikon Corporation | Exposure apparatus and method |
| CN102270596A (en) * | 2010-06-02 | 2011-12-07 | 上海微电子装备有限公司 | Sucking disc and sheet-holding table |
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Address after: 201203 Pudong New Area East Road, No. 1525, Shanghai Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Pudong New Area East Road, No. 1525, Shanghai Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |