CN103293866A - High-modal small-mass bearing piece platform of photoetching machine - Google Patents
High-modal small-mass bearing piece platform of photoetching machine Download PDFInfo
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- CN103293866A CN103293866A CN2012100557957A CN201210055795A CN103293866A CN 103293866 A CN103293866 A CN 103293866A CN 2012100557957 A CN2012100557957 A CN 2012100557957A CN 201210055795 A CN201210055795 A CN 201210055795A CN 103293866 A CN103293866 A CN 103293866A
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Abstract
The invention provides a high-modal small-mass bearing piece platform of a photoetching machine. The bearing piece platform comprises a top structural module of the bearing piece platform and a bottom sealing plate of the bearing piece platform, wherein the top structural module of the bearing piece platform and the bottom sealing plate of the bearing piece platform are adhered into a whole so as to form two upper and lower layers of sandwich board structures; the top structural module of the bearing piece platform is provided with a plane vector motor mounting cavity, a vertical driving mechanism mounting cavity, a differential sensor mounting cavity and a lightening hole; the bottom sealing plate of the bearing piece platform is provided with an open pore to fit for the assembly of the bearing piece platform and a microchecker. The high-modal small-mass bearing piece platform of the photoetching machine, provided by the invention, can effectively reduce the weight of the structure and materials and lighten the mass of a bearing piece, and meanwhile, the modal value index and the dynamic performance of a workpiece platform are ensured.
Description
Technical field
The present invention relates to the litho machine field, and be particularly related to the high mode lightweight of a kind of litho machine wafer-supporting platform.
Background technology
Wafer-supporting platform is one of essential elements of photo-etching machine work-piece platform, in order to carry silicon chip.In the magnetic levitation work stage, the driving of work stage micropositioner realizes by planar motor, and owing to the pursuit to photoetching efficient, work stage has been proposed the demand of higher acceleration of motion.Yet for improving the work stage acceleration, according to Newton's law F=Ma as can be known, two kinds of methods are arranged: 1) improve the planar motor driving and exert oneself; 2) alleviate the micropositioner own wt.Under current industry technical conditions, improving planar motor, to drive what exert oneself be very difficult, and development, manufacturing cost is big, the cycle is long.So selecting to alleviate the micropositioner quality is a kind of effective and economic method, wherein wafer-supporting platform accounts for the quality of the overwhelming majority of micropositioner again.
Because litho machine resolution and alignment precision improve constantly, this just has the demand of higher dynamic property to kinematic system, so require the wafer-supporting platform of work stage to have higher mode and rigidity.Therefore, alleviating mode value index and the dynamic property that must guarantee work stage when holding tablet quality again.
Wafer-supporting platform in the existing industry generally adopts the low-down dense material of thermal expansivity (as: devitrified glass) manufacturing, adopts construction design method to alleviate the wafer-supporting platform quality.Because it is a kind of random geometry and size that the bottom is strengthened gusset, manufacture process is comparatively complicated, and according to the convergence limit of this class methods design at mode and quality ratio, is difficult to improve again.
Summary of the invention
The present invention proposes the high mode lightweight of a kind of litho machine wafer-supporting platform, and effectively implementation structure loss of weight and material loss of weight are alleviating mode value index and the dynamic property that must guarantee work stage when holding tablet quality again.
In order to achieve the above object, the present invention proposes the high mode lightweight of a kind of litho machine wafer-supporting platform, comprising:
Wafer-supporting platform top structure module and wafer-supporting platform bottom shrouding, described wafer-supporting platform top structure module and wafer-supporting platform bottom shrouding are bonded as one, and form bilevel sandwich construction;
Described wafer-supporting platform top structure module has plane vector motor installation cavity, vertical driving mechanism installation cavity, differential sensor installation cavity and lightening hole;
Described wafer-supporting platform bottom shrouding has perforate to adapt to wafer-supporting platform with the assembling of micropositioner.
Further, described lightening hole is array loss of weight circular hole, regular hexagon hole or tri-angle-holed.
Further, distance of center circle such as the circular hole position employing dislocation layout of described array loss of weight circular hole, horizontal two row hole distance of center circle skew equidistances, and in the layout any two adjacent hole circle hearts apart from equating, any three in twos the distance of center circle line of adjacent circular holes be equilateral triangle.
Further, any two adjacent regular hexagon limit spacings equate in the described regular hexagon hole arrangement, are evenly distributed.
Further, any two adjacent equilateral triangle spacings equate in the described tri-angle-holed layout, are evenly distributed.
Further, the quantity of described layout perforate controls between 40～300, and at 2～4mm, the numerical value of dutycycle is between 70%～95% apart from control for minimum edge.
Further, described lightening hole is realized by the mould manufacturing, described mould divides patrix and counterdie two parts, patrix is the bearing material chamber, counterdie passes through the pre-buried pin-and-hole identical with the lightening hole layout, material feeding and die cast after upper and lower mould is fitted, but under wafer-supporting platform is in machining state, by machine work its profile is repaired, last sintering is finished the manufacturing of porous wafer-supporting platform.
Further, described wafer-supporting platform top structure module also comprises topological reinforcement master muscle and the secondary muscle of topological reinforcement, described main muscle refers to that described secondary muscle refers to by the supporting rib stiffener of taking between the inner main muscle of knot by taking knot central plane vector motor installation cavity to wafer-supporting platform supporting rib stiffener all around.
Further, the wall thickness of described main muscle is 8～30mm, and the wall thickness of described secondary muscle is 3～10mm.
Further, described wafer-supporting platform adopts the manufacturings of devitrified glass, carbon fiber or other densified composite.
Further, described wafer-supporting platform adopts foamed ceramics, ceramic honey comb or other loose porous material manufacturings.
The high mode lightweight of the litho machine wafer-supporting platform that the present invention proposes, its beneficial effect is as follows:
1. effectively alleviate the wafer-supporting platform quality, account for 10%～15% than conventional topologies structural design mode loss of weight;
2. effectively improve wafer-supporting platform dynamics mode value, the mode value improves about 20%～30%;
3. adopt Mould Machining to guarantee product quality, effectively reduce and make risk, the control processing cost;
4. adopt porosint to make the layout that work stage is convenient to its structural design and sensor, surveying instrument.
Description of drawings
Figure 1 shows that micropositioner structural representation in the prior art.
Figure 2 shows that the wafer-supporting platform inner structure section diagram of preferred embodiment of the present invention.
Figure 3 shows that the wafer-supporting platform composite structure three-dimensional plot of preferred embodiment of the present invention.
Figure 4 shows that the circular hole work stage inner structure of preferred embodiment of the present invention.
Figure 5 shows that the honeycomb type work stage inner structure of preferred embodiment of the present invention.
Figure 6 shows that the circular hole schematic layout pattern of preferred embodiment of the present invention.
Figure 7 shows that the regular hexagon schematic layout pattern of preferred embodiment of the present invention.
Figure 8 shows that the equilateral triangle schematic layout pattern of preferred embodiment of the present invention.
Figure 9 shows that the porous type work stage manufacturing process flow of preferred embodiment of the present invention.
Figure 10 shows that the wafer-supporting platform mfg. moulding die synoptic diagram of preferred embodiment of the present invention.
Figure 11 shows that the topological structure wafer-supporting platform inner structure of preferred embodiment of the present invention.
Embodiment
In order more to understand technology contents of the present invention, especially exemplified by specific embodiment and cooperate appended graphic being described as follows.
This patent relates to a kind of invention of litho machine lightweight porous type wafer-supporting platform.Be illustrated in figure 1 as work stage micropositioner structural representation, wherein wafer-supporting platform 1 is the main structural member of micropositioner, and wafer-supporting platform 1 is installed in the top of micropositioner, below mounting plane vector motor 2, vertical driving mechanism 3 and differential sensor 4.
Please refer to the wafer-supporting platform inner structure section diagram that Fig. 2 Figure 2 shows that preferred embodiment of the present invention.The present invention proposes the high mode lightweight of a kind of litho machine wafer-supporting platform, comprise: wafer-supporting platform top structure module 11 and wafer-supporting platform bottom shrouding 16, described wafer-supporting platform top structure module 11 and wafer-supporting platform bottom shrouding 16 are bonded as one, form bilevel sandwich construction, to reach the designing requirement that improves wafer-supporting platform mode and loss of weight; Described wafer-supporting platform top structure module 11 has plane vector motor installation cavity 12, vertical driving mechanism installation cavity 13, differential sensor installation cavity 14 and lightening hole 15; Described wafer-supporting platform bottom shrouding 16 has perforate to adapt to wafer-supporting platform with the assembling of micropositioner.
Please refer to Fig. 3, Figure 3 shows that the wafer-supporting platform composite structure three-dimensional plot of preferred embodiment of the present invention..Wherein wafer-supporting platform is made up of two parts, wafer-supporting platform top structure module 21 and wafer-supporting platform bottom shrouding 22, and can assemble formation has panel inside that the complex structure 23 of hollow is arranged up and down.Top structure module 21 and wafer-supporting platform bottom shrouding 22 bonding mutually becomes one, wherein bonded areas be surface in contact and bottom shrouding around 24, wafer-supporting platform forms an one-piece construction 23 and installs and uses for micropositioner.
Be the structure of the inner lightening hole of wafer-supporting platform as shown in Figure 4 and Figure 5, comprise: plane vector motor installation cavity 10, vertical driving mechanism installation cavity 20 and array lightening hole 30.
Above-mentioned plane vector motor installation cavity 10, vertical driving mechanism installation cavity 20 are that present work stage must headspace.Array lightening hole 30 is realized by dual mode: 1) the array porous of being made by dense material; 2) porous of being made by the open structure material.Above-mentioned machining hole shape adopts the array loss of weight of three kinds of shapes: circle, regular hexagon and triangle.The position that must reserve in layout comprises plane vector motor installation cavity 10, vertical driving mechanism installation cavity 20, and all the other are array lightening hole 30.
Be illustrated in figure 6 as the local figure of circular hole layout, adopt the center of circle by equidistant dislocation layout type, wherein D is that Circularhole diameter is, b is any two row distance of center circle side-play amounts, and laterally any two row's circular hole d values equate; A is any two adjacent circular hole distance of center circle, wherein any three in twos adjacent circular hole distance of center circle equate, be evenly distributed.Arrange the controllable number of perforate between 40～300, control minimum edge distance is 2～4mm, and the numerical value of dutycycle is between 70%-95%.
Be illustrated in figure 7 as the local figure of regular hexagon hole arrangement (being cellular structure), l is the regular hexagon length of side, and b is limit, any two hole spacing, and a is positive hexagon centre distance, and wherein any two adjacent regular hexagon limit spacings equate, are evenly distributed.Arrange the controllable number of perforate between 40～300, control minimum edge distance is 2～4mm, and the numerical value of dutycycle is between 70%-95%.
Be illustrated in figure 8 as the local figure of equilateral triangle hole arrangement, a is the length of side of equilateral triangle, and b is the back gauge of adjacent two equilateral triangles, and r is the chamfer radius of equilateral triangle.Wherein any two adjacent equilateral triangle spacings equate, are evenly distributed.Arrange the controllable number of perforate between 40～300, at 2～4mm, the numerical value of dutycycle is between 70%-95% apart from control for minimum edge.
Be illustrated in figure 9 as wafer-supporting platform manufacture craft flow process, the upper and lower mould back material feeding of fitting is mixed and passes through mould molding, form the lightening hole of required form and position with this, after this wafer-supporting platform is in the state that can be machined, by machine work its profile and size are repaired and to reach designing requirement, can carry out special surface at last behind wafer-supporting platform sintering or other mode curing moldings and handle the making that grinding-polishing is finished the porous wafer-supporting platform.
Be the mould synoptic diagram as Figure 10, comprise patrix 31, counterdie 32 and pre-buried pin-and-hole 33 (straight pin or regular hexagon pin).Wherein design has bearing material chamber 34 in the patrix 31, circle, regular hexagon or position, equilateral triangle hole are reserved in counterdie 32 surfaces, Kong Weiyu work stage mesopore position layout unanimity, the pre-buried pin-and-hole 33 identical with the lightening hole layout of Kong Weizhong, be used for forming the hole position identical with the lightening hole layout in the material feeding process, and the accurate pilot hole position and guarantee hole dimension of the method by the mould manufacturing.
Be topological structure wafer-supporting platform inner structure as shown in figure 11, it comprises the inner vestibule of installing: the plane vector motor is installed vestibule 100, vertical driving mechanism vestibule 200 and differential sensor vestibule 300.In addition, also comprise the secondary muscle 600 of inner loss of weight vestibule 400, topological reinforcement master muscle 500 and topological reinforcement.Wherein main muscle 500 refers to by taking knot central plane vector motor the main support reinforcement of vestibule catoptron wall around the wafer-supporting platform is installed, and they have born inner main load, and wall thickness slightly (between the 8-30mm).Secondary muscle 600 refers to that they have born inner minor loading, and wall thickness thinner (between the 3-10mm) by the supporting rib stiffener of taking between the inner main muscle of knot.As shown in figure 11, with the center line symmetric arrangement, have the secondary muscle 600 in 3 master of place muscle 500 and 2 places, the mode of its layout and position constitute the important topological structure in whole inside.
Further, described wafer-supporting platform adopts the manufacturings of devitrified glass, carbon fiber or other densified composite.As shown in table 1 for adopting the carbon fiber reinforcement silica-based glass with the material behavior contrast table of traditional silica-based glass, embodiment as the wafer-supporting platform material, no matter all be greatly improved than conventional glass-based material aspect intensity or the fracture toughness, density descends about 10% simultaneously.Surplus bending strength increases by 10 times, work to break increases by two orders of magnitude.Comprise the possibility of making as wafer-supporting platform with densified composite such as carbon fiber reinforcement resin-based in addition.
The contrast of table 1 carbon fiber reinforcement silica-based glass
And for example following for using another program that compound substance alleviates wafer-supporting platform weight, namely adopt the bulk material manufacturing to carry out the loss of weight of wafer-supporting platform, adopt the structured material of porous, as foamed ceramics, ceramic honey comb etc., the ceramic foam filter product is a kind of with the special process making, has the ceramic of spumescence porous structure.Table 2 and table 3 are the major parameter of two kinds of porosints.All be fit to wafer-supporting platform characteristic demand in parameters such as density of material, coefficient of heat conductivity, thermal expansivity and compressive strength.Utilize the characteristics of porosint self voided internal structure, can realize that under the condition of identical processing volume declining to a great extent of wafer-supporting platform quality satisfy work stage mode value simultaneously.Wherein the peripheral X-direction of wafer-supporting platform can adopt the mode of paster to be connected with wafer-supporting platform is inner with the Y-direction catoptron.The wafer-supporting platform of present embodiment can adopt loose or compound substance manufacturing such as foamed ceramics, ceramic honey comb.
Table 2 foam ceramic material characterisitic parameter
Table 3 ceramic honey comb material characteristic parameter
Though the present invention discloses as above with preferred embodiment, so it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (11)
1. the high mode lightweight of a litho machine wafer-supporting platform is characterized in that, comprising:
Wafer-supporting platform top structure module and wafer-supporting platform bottom shrouding, described wafer-supporting platform top structure module and wafer-supporting platform bottom shrouding are bonded as one, and form bilevel sandwich construction;
Described wafer-supporting platform top structure module has plane vector motor installation cavity, vertical driving mechanism installation cavity, differential sensor installation cavity and lightening hole;
Described wafer-supporting platform bottom shrouding has perforate to adapt to wafer-supporting platform with the assembling of micropositioner.
2. the high mode lightweight of litho machine according to claim 1 wafer-supporting platform is characterized in that, described lightening hole is array loss of weight circular hole, regular hexagon hole or tri-angle-holed.
3. the high mode lightweight of litho machine according to claim 2 wafer-supporting platform, it is characterized in that, distance of center circle such as the circular hole position employing dislocation layout of described array loss of weight circular hole, horizontal two row hole distance of center circle skew equidistances, and any two adjacent hole circle hearts are apart from equating in the layout, any three in twos the distance of center circle line of adjacent circular holes be equilateral triangle.
4. the high mode lightweight of litho machine according to claim 2 wafer-supporting platform is characterized in that, any two adjacent regular hexagon limit spacings equate in the described regular hexagon hole arrangement, are evenly distributed.
5. the high mode lightweight of litho machine according to claim 2 wafer-supporting platform is characterized in that, any two adjacent equilateral triangle spacings equate in the described tri-angle-holed layout, are evenly distributed.
6. the high mode lightweight of litho machine according to claim 2 wafer-supporting platform is characterized in that, the quantity control of described layout perforate is between 40～300, and at 2～4mm, the numerical value of dutycycle is between 70%～95% apart from control for minimum edge.
7. the high mode lightweight of litho machine according to claim 1 wafer-supporting platform, it is characterized in that, described lightening hole is realized by the mould manufacturing, described mould divides patrix and counterdie two parts, and patrix is the bearing material chamber, and counterdie is by the pre-buried pin-and-hole identical with the lightening hole layout, with upper and lower mould applying back material feeding and die cast, under but wafer-supporting platform is in machining state, by machine work its profile is repaired, last sintering is finished the manufacturing of porous wafer-supporting platform.
8. the high mode lightweight of litho machine according to claim 1 wafer-supporting platform, it is characterized in that, described wafer-supporting platform top structure module also comprises topological reinforcement master muscle and the secondary muscle of topological reinforcement, described main muscle refers to that described secondary muscle refers to by the supporting rib stiffener of taking between the inner main muscle of knot by taking knot central plane vector motor installation cavity to wafer-supporting platform supporting rib stiffener all around.
9. the high mode lightweight of litho machine according to claim 8 wafer-supporting platform is characterized in that, the wall thickness of described main muscle is 8～30mm, and the wall thickness of described secondary muscle is 3～10mm.
10. the high mode lightweight of litho machine according to claim 1 wafer-supporting platform is characterized in that, described wafer-supporting platform adopts the manufacturings of devitrified glass, carbon fiber or other densified composite.
11. the high mode lightweight of litho machine according to claim 1 wafer-supporting platform is characterized in that, described wafer-supporting platform adopts foamed ceramics, ceramic honey comb or other loose porous material manufacturings.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104749897A (en) * | 2013-12-27 | 2015-07-01 | 上海微电子装备有限公司 | Lithography machine motion station support platform |
| CN105065896A (en) * | 2015-07-28 | 2015-11-18 | 中国电子科技集团公司第二十九研究所 | Closed-cell aluminum foam sandwich mounting board of load-carrying structure |
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| US5780943A (en) * | 1996-04-04 | 1998-07-14 | Nikon Corporation | Exposure apparatus and method |
| JP2001057325A (en) * | 1999-08-17 | 2001-02-27 | Nikon Corp | Stage device and aligner |
| CN102270596A (en) * | 2010-06-02 | 2011-12-07 | 上海微电子装备有限公司 | Sucking disc and sheet-holding table |
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- 2012-03-05 CN CN201210055795.7A patent/CN103293866B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5780943A (en) * | 1996-04-04 | 1998-07-14 | Nikon Corporation | Exposure apparatus and method |
| JP2001057325A (en) * | 1999-08-17 | 2001-02-27 | Nikon Corp | Stage device and aligner |
| CN102270596A (en) * | 2010-06-02 | 2011-12-07 | 上海微电子装备有限公司 | Sucking disc and sheet-holding table |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104749897A (en) * | 2013-12-27 | 2015-07-01 | 上海微电子装备有限公司 | Lithography machine motion station support platform |
| CN105065896A (en) * | 2015-07-28 | 2015-11-18 | 中国电子科技集团公司第二十九研究所 | Closed-cell aluminum foam sandwich mounting board of load-carrying structure |
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Address after: 201203 Pudong New Area East Road, No. 1525, Shanghai Patentee after: Shanghai microelectronics equipment (Group) Limited by Share Ltd Address before: 201203 Pudong New Area East Road, No. 1525, Shanghai Patentee before: Shanghai Micro Electronics Equipment Co., Ltd. |