CN103289626B - Epoxy resin pouring sealant for composite insulator and preparation method of epoxy resin pouring sealant - Google Patents
Epoxy resin pouring sealant for composite insulator and preparation method of epoxy resin pouring sealant Download PDFInfo
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- CN103289626B CN103289626B CN201310232851.4A CN201310232851A CN103289626B CN 103289626 B CN103289626 B CN 103289626B CN 201310232851 A CN201310232851 A CN 201310232851A CN 103289626 B CN103289626 B CN 103289626B
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Abstract
The invention relates to the technical field of epoxy resin pouring sealants, and in particular relates to an epoxy resin pouring sealant for a composite insulator and a preparation method of the epoxy resin pouring sealant. The formula of the epoxy resin pouring sealant is prepared from the following components in parts by weight: 95-105 parts of epoxy resin, 0.5-1.5 parts of a curing accelerator, 5-30 parts of white carbon black and 5-30 parts of superfine aluminum hydroxide powder. Compared with the prior art, the epoxy resin pouring sealant has excellent mechanical strength and electric properties and is smaller in contraction percentage, so that the adhesive property and sealability of the epoxy resin pouring sealant are improved, a core rod and a flange can be connected with each other more firmly, the epoxy resin pouring sealant can be positioned in stronger electric field strength for a long time and meets high-voltage operating requirements, and the service life of the epoxy resin pouring sealant is prolonged. The epoxy resin pouring sealant provided by the invention is particularly suitable for a filling and sealing process of the composite insulator in flange type connection.
Description
Technical field
The present invention relates to epoxy resin embedding adhesive technical field, particularly relate to a kind of epoxy resin embedding adhesive for composite insulator and preparation method.
Background technology
Insulator product mainly divides three major types: glass insulator, porcelain insulator and composite insulator, wherein the structure of composite insulator mainly comprises the connection gold utensil at plug, full skirt and plug both ends, and according to the difference of compound inslation subcategory, the gold utensil of core rod end and connection technique are also different.Composite rod insulator for example, its plug adopts compression joint technique to be fixed with the gold utensil of end to be connected conventionally.But, for part post composite insulator or hollow combined insulator, what its end metal fitting adopted is flange, because the volume of this class composite insulator is conventionally larger, flange often, with Jia Qiang Zhu, is not suitable for adopting compression joint technique, the more important thing is, guarantee to fix better and sealing property between flange and core rod end, thereby need to realize being tightly connected of flange and plug by pouring technique.
For end, adopt flange to connect the composite insulator (as post composite insulator and hollow combined insulator) of (being that flange form connects), its installation process is: after gold utensil flange and plug assemble, need to be to the inner joint sealant that injects of flange, to fill the space between gold utensil flange and plug, its effect one is for bonding gold utensil, the 2nd, play the effect of sealing, thereby the blanketing gas or the grease that make to be filled with in plug can not produce leakage.
In prior art, the composite insulator connecting for flange form, the joint sealant being filled between plug and flange adopts pure epoxy resin glue to carry out embedding mostly, yet, for voltage levels product, because pure epoxy resin glue is for a long time under higher strength of electric field, its resistance to electric arc, anti creepage trace and electric erosion resistance can be poor, easily generation is aging, causes work-ing life short, cannot meet high-tension service requirements, on the other hand, the joint sealant shrinking percentage of prior art is larger, and plug and gold utensil flange are two kinds of materials that shrinking percentage is widely different, after the adhesive curing of pouring epoxy resin, because the contraction of epoxy resin glue itself causes producing between plug and flange bubble or forms space, this can cause product to produce shelf depreciation at operational process, thereby produce electromagnetic failure and heating, have a strong impact on stopping property and the electric property of composite insulator integral body, even occur gas or liquid leakage serious consequence (for example, hollow combined insulator inner meeting filling liquid or gas, thereby product hermeticity is had higher requirements, product need guarantee stopping property, Leakage prevention occurs), and then also can affect the physical strength of composite insulator integral body, at operational process, cannot bear various pressure, pulling force and torsion and producing is torn, make flange and plug bonding insecure.
Summary of the invention
One of object of the present invention be to avoid weak point of the prior art and provide that a kind of shrinking percentage is little, the epoxy resin embedding adhesive for composite insulator of stopping property and good electric property, long service life so that bonding more firm between plug and flange.
Two of object of the present invention is to avoid weak point of the prior art and preparation method that a kind of epoxy resin embedding adhesive for composite insulator is provided.
Object of the present invention is achieved through the following technical solutions:
For an epoxy resin embedding adhesive for composite insulator, by the raw material of following mass parts, formed:
Epoxy resin: 95～105 parts
Epoxy curing agent: 75～85 parts
Curing catalyst: 0.5～1.5 part
White carbon black: 5～30 parts
Ultra fine aluminium hydroxide: 5～30 parts;
Wherein:
Described epoxy resin is E51 epoxy resin;
Described epoxy curing agent is methyl tetrahydro phthalic anhydride;
Described curing catalyst is DMP-30 promotor;
Described white carbon black is precipitated silica.
preferably,described a kind of epoxy resin embedding adhesive for composite insulator, is comprised of the raw material of following mass parts:
E51 epoxy resin: 98～105 parts
Methyl tetrahydro phthalic anhydride: 78～85 parts
DMP-30 promotor: 0.85～1.25 part
Precipitated silica: 8～17 parts
Ultra fine aluminium hydroxide: 10～20 parts.
it is preferred,described a kind of epoxy resin embedding adhesive for composite insulator, is comprised of the raw material of following mass parts:
E51 epoxy resin: 100 parts
Methyl tetrahydro phthalic anhydride: 80 parts
DMP-30 promotor: 1.25 parts
Precipitated silica: 10 parts
Ultra fine aluminium hydroxide: 15 parts.
it is preferred,described a kind of epoxy resin embedding adhesive for composite insulator, is comprised of the raw material of following mass parts:
E51 epoxy resin: 100 parts
Methyl tetrahydro phthalic anhydride: 82 parts
DMP-30 promotor: 1.0 parts
Precipitated silica: 8 parts
Ultra fine aluminium hydroxide: 10 parts.
another is preferred,described a kind of epoxy resin embedding adhesive for composite insulator, is comprised of the raw material of following mass parts:
E51 epoxy resin: 105 parts
Methyl tetrahydro phthalic anhydride: 85 parts
DMP-30 promotor: 0.85 part
Precipitated silica: 17 parts
Ultra fine aluminium hydroxide: 20 parts.
the present invention also providesthe preparation method of above-mentioned a kind of epoxy resin embedding adhesive for composite insulator, comprises following preparation process:
The preparation of step 1, epoxy resin glue A:
1) first according to above-mentioned mass fraction proportioning, weigh E51 epoxy resin and ultra fine aluminium hydroxide, then ultra fine aluminium hydroxide is slowly joined in E51 epoxy resin, stir while adding, after stirring, make epoxy resin glue A;
2) the epoxy resin glue A being stirred is joined in the A bucket of casting machine;
3) open casting machine power supply, A bucket is connected to vacuum pump, open vacuum pump valve, start to vacuumize;
4) tensimeter on A bucket show force value be-during 0.06MPa, open the agitator motor of A bucket, allow it vacuumize while stirring 5min clock, then stop stirring and vacuumizing, standing;
5) after standing 1h, again open and vacuumize and agitator motor, start to vacuumize, 1～3 time repeatedly, until guarantee there is no bubble in epoxy resin glue A;
The preparation of step 2, epoxy resin glue B:
1) according to above-mentioned mass fraction proportioning, weigh methyl tetrahydro phthalic anhydride, precipitated silica, DMP-30 promotor, then precipitated silica is slowly joined in methyl tetrahydro phthalic anhydride, and stir while adding, after stirring evenly, add again DMP-30 promotor, after mixing and stirring, make epoxy resin glue B;
2) the epoxy resin glue B being stirred is joined in the B bucket of casting machine;
3) open casting machine power supply, B bucket is connected to vacuum pump, open vacuum pump valve, start to vacuumize;
4) tensimeter on B bucket show force value be-during 0.06MPa, open the agitator motor of B bucket, allow it vacuumize while stirring 5min clock, then stop stirring and vacuumizing, standing;
5) after standing 1h, again open and vacuumize and agitator motor, start to vacuumize, 1～3 time repeatedly, until guarantee there is no bubble in epoxy resin glue B;
Step 3, mixing:
After the epoxy resin glue A preparing and epoxy resin glue B are mixed, obtain the epoxy resin embedding adhesive for composite insulator.
beneficial effect of the present invention:
A kind of epoxy resin embedding adhesive for composite insulator of the present invention and preparation method, wherein epoxy resin embedding adhesive is respectively 95～105 parts of epoxy resin by mass fraction, 0.5～1.5 part of curing catalyst, 5～30 parts of white carbon blacks, 5～30 parts of ultra fine aluminium hydroxides are made, in above-mentioned formula, epoxy resin adopts E51 epoxy resin, epoxy curing agent is methyl tetrahydro phthalic anhydride, curing catalyst is DMP-30 promotor, white carbon black is precipitated silica, wherein, the consumption of precipitated silica directly has influence on hardness and the shrinking percentage of epoxy resin embedding adhesive, can increase the insulating property of product simultaneously, ultra fine aluminium hydroxide is for improving insulativity and the flame retardant resistance of product, extend the work-ing life of product.Compared with prior art, the present invention is particularly suitable for the composite insulator that flange form connects, and it has the following advantages:
1, improve the mechanical property of composite insulator:
1) owing to having added a certain amount of precipitated silica, thereby improved the hardness of epoxy resin embedding adhesive, its tear resistance is strengthened, can guarantee that composite insulator can bear stronger pressure, pulling force and torsion in operational process, can not produce slight crack;
2) make the bonding more firm of flange and core rod end, improve stopping property, for hollow combined insulator, filling liquid or gas are understood in its inside especially, thereby can prevent from occurring in operational process the phenomenon of gas or leak of liquid;
2, improve the electric property of composite insulator:
1) shrinking percentage is little, reduced the shrinking percentage difference between plug and flange bi-material, after epoxy resin embedding adhesive of the present invention solidifies, after can avoiding solidifying because the own contraction of epoxy resin embedding adhesive makes to form between flange and plug excessive gap and the generation of bubble, farthest reduce the shelf depreciation that exists bubble, gap to cause because of inside in product operational process, thereby greatly extended the work-ing life of composite insulator;
2) in formula of the present invention, a certain amount of precipitated silica and ultra fine aluminium hydroxide have been added, thereby made to improve the electric property of epoxy resin embedding adhesive, have good insulativity and flame retardant resistance, this piece electrical performance to composite insulator is also favourable.
3, preparation technology is simple:
The epoxy resin embedding adhesive that adopts preparation method of the present invention to obtain has good viscosity and levelling property, and its solidification value is low and shortened set time.
Accompanying drawing explanation
The present invention will be further described to utilize accompanying drawing, but content in accompanying drawing does not form any limitation of the invention.
The schematic appearance of Fig. 1 after for the epoxy resin embedding adhesive sample solidifies that adopts the formula of comparative example 1 to 4 and embodiment 1 to 3 and prepare.
Embodiment
With the following Examples and accompanying drawing the invention will be further described, but embodiments of the present invention are not limited to this.
embodiment 1
For an epoxy resin embedding adhesive for composite insulator, by the raw material of following mass parts, formed:
E51 epoxy resin: 100 parts
Methyl tetrahydro phthalic anhydride: 80 parts
DMP-30 promotor: 1.25 parts
Precipitated silica: 10 parts
Ultra fine aluminium hydroxide: 15 parts.
embodiment 2
For an epoxy resin embedding adhesive for composite insulator, by the raw material of following mass parts, formed:
E51 epoxy resin: 100 parts
Methyl tetrahydro phthalic anhydride: 82 parts
DMP-30 promotor: 1.0 parts
Precipitated silica: 8 parts
Ultra fine aluminium hydroxide: 10 parts.
embodiment 3
For an epoxy resin embedding adhesive for composite insulator, by the raw material of following mass parts, formed:
E51 epoxy resin: 105 parts
Methyl tetrahydro phthalic anhydride: 85 parts
DMP-30 promotor: 0.85 part
Precipitated silica: 17 parts
Ultra fine aluminium hydroxide: 20 parts.
embodiment 4
A preparation method for the epoxy resin embedding adhesive of composite insulator, comprises following preparation process: (all adopting below the formula of embodiment 1, embodiment 2 or embodiment 3)
The preparation of step 1, epoxy resin glue A:
1) first weigh E51 epoxy resin and ultra fine aluminium hydroxide, then ultra fine aluminium hydroxide is slowly joined in E51 epoxy resin, stir while adding, after stirring, make epoxy resin glue A;
2) the epoxy resin glue A being stirred is joined in the A bucket of casting machine;
3) open casting machine power supply, A bucket is connected to vacuum pump, open vacuum pump valve, start to vacuumize;
4) tensimeter on A bucket show force value be-during 0.06MPa, open the agitator motor of A bucket, allow it vacuumize while stirring 5min clock, then stop stirring and vacuumizing, standing;
5) after standing 1h, again open and vacuumize and agitator motor, start to vacuumize, 1～3 time repeatedly, until guarantee there is no bubble in epoxy resin glue A;
The preparation of step 2, epoxy resin glue B:
1) according to above-mentioned mass fraction proportioning, weigh methyl tetrahydro phthalic anhydride, precipitated silica, DMP-30 promotor, then precipitated silica is slowly joined in methyl tetrahydro phthalic anhydride, and stir while adding, after stirring evenly, add again DMP-30 promotor, after mixing and stirring, make epoxy resin glue B;
2) the epoxy resin glue B being stirred is joined in the B bucket of casting machine;
3) open casting machine power supply, B bucket is connected to vacuum pump, open vacuum pump valve, start to vacuumize;
4) tensimeter on B bucket show force value be-during 0.06MPa, open the agitator motor of B bucket, allow it vacuumize while stirring 5min clock, then stop stirring and vacuumizing, standing;
5) after standing 1h, again open and vacuumize and agitator motor, start to vacuumize, 1～3 time repeatedly, until guarantee there is no bubble in epoxy resin glue B;
Step 3, mixing:
After the epoxy resin glue A preparing and epoxy resin glue B are mixed, obtain the epoxy resin embedding adhesive for composite insulator.
A kind of
the using method that is used for the epoxy resin embedding adhesive of composite insulator:
1) first flange and composite electric insulator core bar are assembled, in the bottom of flange, with silicone rubber O-ring, seal, top seals with unvulcanized silicon rubber, during assembling, with silicon rubber, at plug, smears a circle, just can excellent sealing during assembling;
2) composite insulator that assembles flange is installed in the frock of preheating;
3) according to above-mentioned preparation method, prepare the epoxy resin embedding adhesive for composite insulator, then start pouring, during pouring, utilize sebific duct and metal mouth that epoxy resin embedding adhesive is imported in flange, when the venting hole until epoxy resin embedding adhesive on flange overflows, stop pouring;
4) remove the epoxy resin embedding adhesive overflowing on flange, wait for that epoxy resin embedding adhesive solidifies, after solidifying, with instrument, metal mouth is back-outed, and the epoxy resin embedding adhesive that is bonded at flange outside is removed;
5) finally composite insulator is unloaded down from frock, waited for that its naturally cooling solidifies.
experiment comparative analysis
comparative example 1(does not add precipitated silica and ultra fine aluminium hydroxide)
An epoxy resin embedding adhesive, constitutive material (by mass parts): 100 parts of E51 epoxy resin, 80 parts of methyl tetrahydro phthalic anhydrides, 1.5 parts of DMP-30 promotor.
comparative example 2(does not add precipitated silica and ultra fine aluminium hydroxide)
An epoxy resin embedding adhesive, constitutive material (by mass parts): 100 parts of E51 epoxy resin, 80 parts of methyl tetrahydro phthalic anhydrides, 1.0 parts of DMP-30 promotor.
comparative example 3(does not add precipitated silica)
An epoxy resin embedding adhesive, constitutive material (by mass parts): 100 parts of E51 epoxy resin, 80 parts of methyl tetrahydro phthalic anhydrides, 1.25 parts of DMP-30 promotor, 30 parts of ultra fine aluminium hydroxides.
comparative example 4(does not add ultra fine aluminium hydroxide)
An epoxy resin embedding adhesive, constitutive material (by mass parts): 100 parts of E51 epoxy resin, 80 parts of methyl tetrahydro phthalic anhydrides, 1.25 parts of DMP-30 promotor, 30 parts of precipitated silicas.
detect and analyze:
one, outward appearance detects cure shrinkage
According to the formula of enforcement 1 to 3, comparative example 1 to 4, prepare epoxy resin embedding adhesive sample respectively, then by visual inspection outward appearance, solidify per sample the rear sunk degree of depth of upper surface, carry out its surface compressed rate of comparative sample, the outward appearance after sample solidifies as shown in Figure 1.
Judging criterion: the sunk degree of depth of upper surface outward appearance after sample solidifies is larger, and interpret sample cure shrinkage is larger, after solidifying, upper surface is more flat, and the sunk degree of depth is less, and interpret sample cure shrinkage is less.
Conclusion: as shown in Figure 1, the upper surface of epoxy resin embedding adhesive sample appearance prepared by the formula of employing embodiment 1 to 3 is comparatively smooth, the sunk degree of depth is very little, thereby illustrates that its cure shrinkage is lower, is conducive to like this improve bonding stability and the stopping property of epoxy resin embedding adhesive.
two, performance comparison
To implementing epoxy resin embedding adhesive sample prepared by 1 example to 3, the formula of comparative example 1 to 4, carry out the detection of following index respectively, detected result is as shown in table 1:
The Performance Detection of the epoxy resin embedding adhesive of table 1, embodiment 1 to 3, comparative example 1 to 4 preparation
| Performance | Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 | Embodiment 1 to 3 |
| Its surface compressed rate value (mm) | 4.8 | 4.6 | 3.9 | 3.3 | 1.1 |
| With gold utensil adhesive effect | Poor | Poor | Generally | Generally | Good |
| Air bubble content | Many | Many | Less | Less | Seldom |
| Sample slight crack | Quantity is many, and slight crack is large | Quantity is many, and slight crack is large | Quantity is many, and slight crack is large | Quantity is many, and slight crack is little | Without obvious slight crack |
| Tear resistance test | Poor | Poor | Poor | Generally | Good |
By table 1, can be obtained, adopt the epoxy resin embedding adhesive of the formula acquisition of embodiment 1 to 3, good appearance, shrinking percentage are little, can make plug and flange securely bonding and in tear resistance test, show good, without obvious slight crack, its solidification effect is ideal, thereby be conducive to improve cementability and the stopping property of epoxy resin embedding adhesive, extended work-ing life.Even if composite insulator is for a long time in stronger strength of electric field, the solidification effect of epoxy resin embedding adhesive also can reach high-tension service requirements, is specially adapted to the composite insulator that flange form connects.
Finally should be noted that; above embodiment is only for illustrating technical scheme of the present invention but not limiting the scope of the invention; although the present invention is explained in detail with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify or be equal to replacement technical scheme of the present invention, and not depart from essence and the scope of technical solution of the present invention.
Claims (4)
1. for an epoxy resin embedding adhesive for composite insulator, it is characterized in that: the raw material by following mass parts forms:
E51 epoxy resin: 98～105 parts
Methyl tetrahydro phthalic anhydride: 78～85 parts
DMP-30 promotor: 0.85～1.25 part
Precipitated silica: 8～17 parts
Ultra fine aluminium hydroxide: 10～20 parts;
The preparation method of the described epoxy resin embedding adhesive for composite insulator, comprises following preparation process:
The preparation of step 1, epoxy resin glue A:
1) first according to above-mentioned mass fraction proportioning, weigh E51 epoxy resin and ultra fine aluminium hydroxide, then ultra fine aluminium hydroxide is slowly joined in E51 epoxy resin, stir while adding, after stirring, make epoxy resin glue A;
2) the epoxy resin glue A being stirred is joined in the A bucket of casting machine;
3) open casting machine power supply, A bucket is connected to vacuum pump, open vacuum pump valve, start to vacuumize;
4) tensimeter on A bucket show force value be-during 0.06MPa, open the agitator motor of A bucket, allow it vacuumize while stirring 5min clock, then stop stirring and vacuumizing, standing;
5) after standing 1h, again open and vacuumize and agitator motor, start to vacuumize, 1～3 time repeatedly, until guarantee there is no bubble in epoxy resin glue A;
The preparation of step 2, epoxy resin glue B:
1) according to above-mentioned mass fraction proportioning, weigh methyl tetrahydro phthalic anhydride, precipitated silica, DMP-30 promotor, then precipitated silica is slowly joined in methyl tetrahydro phthalic anhydride, and stir while adding, after stirring evenly, add again DMP-30 promotor, after mixing and stirring, make epoxy resin glue B;
2) the epoxy resin glue B being stirred is joined in the B bucket of casting machine;
3) open casting machine power supply, B bucket is connected to vacuum pump, open vacuum pump valve, start to vacuumize;
4) tensimeter on B bucket show force value be-during 0.06MPa, open the agitator motor of B bucket, allow it vacuumize while stirring 5min clock, then stop stirring and vacuumizing, standing;
5) after standing 1h, again open and vacuumize and agitator motor, start to vacuumize, 1～3 time repeatedly, until guarantee there is no bubble in epoxy resin glue B;
Step 3, mixing:
After the epoxy resin glue A preparing and epoxy resin glue B are mixed, obtain the epoxy resin embedding adhesive for composite insulator.
2. a kind of epoxy resin embedding adhesive for composite insulator according to claim 1, is characterized in that: the raw material by following mass parts forms:
E51 epoxy resin: 100 parts
Methyl tetrahydro phthalic anhydride: 80 parts
DMP-30 promotor: 1.25 parts
Precipitated silica: 10 parts
Ultra fine aluminium hydroxide: 15 parts.
3. a kind of epoxy resin embedding adhesive for composite insulator according to claim 1, is characterized in that: the raw material by following mass parts forms:
E51 epoxy resin: 100 parts
Methyl tetrahydro phthalic anhydride: 82 parts
DMP-30 promotor: 1.0 parts
Precipitated silica: 8 parts
Ultra fine aluminium hydroxide: 10 parts.
4. a kind of epoxy resin embedding adhesive for composite insulator according to claim 1, is characterized in that: the raw material by following mass parts forms:
E51 epoxy resin: 105 parts
Methyl tetrahydro phthalic anhydride: 85 parts
DMP-30 promotor: 0.85 part
Precipitated silica: 17 parts
Ultra fine aluminium hydroxide: 20 parts.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310232851.4A CN103289626B (en) | 2013-06-13 | 2013-06-13 | Epoxy resin pouring sealant for composite insulator and preparation method of epoxy resin pouring sealant |
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| CN201310232851.4A CN103289626B (en) | 2013-06-13 | 2013-06-13 | Epoxy resin pouring sealant for composite insulator and preparation method of epoxy resin pouring sealant |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105255442A (en) * | 2015-11-17 | 2016-01-20 | 杨超 | Adhesive for direct-current supporting column insulator |
| CN105482370B (en) * | 2015-12-29 | 2018-03-13 | 浙江荣泰科技企业有限公司 | Insulate box filled glue and preparation method thereof |
| CN110349716A (en) * | 2019-08-07 | 2019-10-18 | 醴陵华鑫高能电气有限公司 | Hollow porcelain composite insulator and its processing method |
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| CN1272424A (en) * | 1999-04-29 | 2000-11-08 | 北京化工大学 | Composite base laminated board covered with copper foil and its production method |
| CN101633827A (en) * | 2009-09-01 | 2010-01-27 | 中国西电电气股份有限公司 | High-temperature curing adhesive for bonding electric insulators and preparation method thereof |
| CN102286260A (en) * | 2011-06-28 | 2011-12-21 | 上海景涵实业有限公司 | Non-yellowing high-transmittance insulated epoxy adhesive for light emitting diode (LED) and preparation method and use thereof |
| CN102391808A (en) * | 2011-07-08 | 2012-03-28 | 华烁科技股份有限公司 | Preparation of medium-temperature solidified epoxy adhesive and application of medium-temperature solidified epoxy adhesive in flexible polyester copper-clad plate |
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Patent Citations (4)
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|---|---|---|---|---|
| CN1272424A (en) * | 1999-04-29 | 2000-11-08 | 北京化工大学 | Composite base laminated board covered with copper foil and its production method |
| CN101633827A (en) * | 2009-09-01 | 2010-01-27 | 中国西电电气股份有限公司 | High-temperature curing adhesive for bonding electric insulators and preparation method thereof |
| CN102286260A (en) * | 2011-06-28 | 2011-12-21 | 上海景涵实业有限公司 | Non-yellowing high-transmittance insulated epoxy adhesive for light emitting diode (LED) and preparation method and use thereof |
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Address after: 523128 No. 2, Fai Fai Road, Dongguan, Guangdong, Dongcheng District Applicant after: LONG YUAN HIGH-ENERGY ELECTRICAL LIMITED BY SHARE LTD. Address before: 523128 No. 2, Fai Fai Road, Dongguan, Guangdong, Dongcheng District Applicant before: Dongguan Gaoneng Electric Co., Ltd. |
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