CN103289626A - Epoxy resin pouring sealant for composite insulator and preparation method of epoxy resin pouring sealant - Google Patents
Epoxy resin pouring sealant for composite insulator and preparation method of epoxy resin pouring sealant Download PDFInfo
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- CN103289626A CN103289626A CN2013102328514A CN201310232851A CN103289626A CN 103289626 A CN103289626 A CN 103289626A CN 2013102328514 A CN2013102328514 A CN 2013102328514A CN 201310232851 A CN201310232851 A CN 201310232851A CN 103289626 A CN103289626 A CN 103289626A
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Abstract
The invention relates to the technical field of epoxy resin pouring sealants, and in particular relates to an epoxy resin pouring sealant for a composite insulator and a preparation method of the epoxy resin pouring sealant. The formula of the epoxy resin pouring sealant is prepared from the following components in parts by weight: 95-105 parts of epoxy resin, 0.5-1.5 parts of a curing accelerator, 5-30 parts of white carbon black and 5-30 parts of superfine aluminum hydroxide powder. Compared with the prior art, the epoxy resin pouring sealant has excellent mechanical strength and electric properties and is smaller in contraction percentage, so that the adhesive property and sealability of the epoxy resin pouring sealant are improved, a core rod and a flange can be connected with each other more firmly, the epoxy resin pouring sealant can be positioned in stronger electric field strength for a long time and meets high-voltage operating requirements, and the service life of the epoxy resin pouring sealant is prolonged. The epoxy resin pouring sealant provided by the invention is particularly suitable for a filling and sealing process of the composite insulator in flange type connection.
Description
Technical field
The present invention relates to the epoxy resin embedding adhesive technical field, particularly relate to a kind of epoxy resin embedding adhesive for composite insulator and preparation method.
Background technology
The insulator product mainly divides three major types: glass insulator, porcelain insulator and composite insulator, wherein the structure of composite insulator mainly comprises the gold utensil that is connected at plug, full skirt and plug both ends, and according to the difference of compound inslation subcategory, the gold utensil of plug end and to connect technology also different.Composite rod insulator for example, its plug adopts compression joint technique to fixedly connected with the gold utensil of end usually.But, for part post composite insulator or hollow combined insulator, what its end gold utensil adopted is flange, because the volume of this class composite insulator is bigger usually, flange often has Jia Qiang Zhu, is not suitable for adopting compression joint technique, the more important thing is, guarantee to fix better and sealing property between flange and the plug end, thereby need realize being tightly connected of flange and plug by pouring technology.
Adopt flange to connect the composite insulator (as post composite insulator and hollow combined insulator) of (being that flange form connects) for the end, its installation process is: after gold utensil flange and plug assemble, need be to the inner joint sealant that injects of flange, to fill the space between gold utensil flange and the plug, its effect one is bonding gold utensil, the 2nd, play the effect of sealing, thereby make the blanketing gas or the grease that charge in the plug can not produce leakage.
In the prior art, composite insulator for the flange form connection, the joint sealant that is filled between plug and the flange adopts pure epoxy resin glue to carry out embedding mostly, yet, for the voltage levels product, because pure epoxy resin glue is under the higher strength of electric field for a long time, its anti-electric arc, anti creepage trace and electric erosion resistance can be relatively poor, take place easily to wear out, cause work-ing life short, can't satisfy high-tension service requirements; On the other hand, the joint sealant shrinking percentage of prior art is bigger, and plug and gold utensil flange are two kinds of materials that shrinking percentage is widely different, after the adhesive curing of pouring Resins, epoxy, owing to the contraction of epoxy resin glue itself causes producing between plug and the flange bubble or forms the space, this can cause product to produce shelf depreciation at operational process, thereby produce electromagnetism damage and heating, have a strong impact on stopping property and the electric property of composite insulator integral body, even the serious consequence of the leakage of generation gas or liquid (for example, hollow combined insulator inner meeting filling liquid or gas, thereby product hermeticity had higher requirements, product need guarantee stopping property, prevent from leaking and take place), and then also can influence the physical strength of composite insulator integral body, can't bear various pressure at operational process, pulling force and torsion and producing is torn, and makes flange and plug bonding insecure.
Summary of the invention
One of purpose of the present invention be to avoid weak point of the prior art and provide that a kind of shrinking percentage is little, the epoxy resin embedding adhesive that is used for composite insulator of stopping property and good electric property, long service life so that bonding more firm between plug and the flange.
Two of purpose of the present invention is to avoid weak point of the prior art and a kind of preparation method of the epoxy resin embedding adhesive for composite insulator is provided.
Purpose of the present invention is achieved through the following technical solutions:
A kind of epoxy resin embedding adhesive for composite insulator, formed by the raw material of following mass parts:
Resins, epoxy: 95～105 parts
Epoxy curing agent: 75～85 parts
Curing catalyst: 0.5～1.5 part
White carbon black: 5～30 parts
Ultra fine aluminium hydroxide: 5～30 parts;
Wherein:
Described Resins, epoxy is E51 Resins, epoxy;
Described epoxy curing agent is methyl tetrahydro phthalic anhydride;
Described curing catalyst is DMP-30 promotor;
Described white carbon black is precipitated silica.
Preferably,Described a kind of epoxy resin embedding adhesive for composite insulator, formed by the raw material of following mass parts:
E51 Resins, epoxy: 98～105 parts
Methyl tetrahydro phthalic anhydride: 78～85 parts
DMP-30 promotor: 0.85～1.25 part
Precipitated silica: 8～17 parts
Ultra fine aluminium hydroxide: 10～20 parts.
It is preferred,Described a kind of epoxy resin embedding adhesive for composite insulator, formed by the raw material of following mass parts:
E51 Resins, epoxy: 100 parts
Methyl tetrahydro phthalic anhydride: 80 parts
DMP-30 promotor: 1.25 parts
Precipitated silica: 10 parts
Ultra fine aluminium hydroxide: 15 parts.
It is preferred,Described a kind of epoxy resin embedding adhesive for composite insulator, formed by the raw material of following mass parts:
E51 Resins, epoxy: 100 parts
Methyl tetrahydro phthalic anhydride: 82 parts
DMP-30 promotor: 1.0 parts
Precipitated silica: 8 parts
Ultra fine aluminium hydroxide: 10 parts.
Another is preferred,Described a kind of epoxy resin embedding adhesive for composite insulator, formed by the raw material of following mass parts:
E51 Resins, epoxy: 105 parts
Methyl tetrahydro phthalic anhydride: 85 parts
DMP-30 promotor: 0.85 part
Precipitated silica: 17 parts
Ultra fine aluminium hydroxide: 20 parts.
The present invention also providesThe preparation method of above-mentioned a kind of epoxy resin embedding adhesive for composite insulator comprises following preparation process:
The preparation of step 1, epoxy resin glue A:
1) earlier according to above-mentioned mass fraction proportioning weighing E51 Resins, epoxy and ultra fine aluminium hydroxide, then ultra fine aluminium hydroxide is slowly joined in the E51 Resins, epoxy, stir while adding, make epoxy resin glue A after stirring;
2) the epoxy resin glue A that stirs is joined in the A bucket of casting machine;
3) open the casting machine power supply, the A bucket is connected vacuum pump, open the vacuum pump valve, begin to vacuumize;
When 4) treating that tensimeter on the A bucket shows force value for-0.06MPa, open the agitator motor of A bucket, allow it vacuumize the 5min clock while stirring, stop then stirring and vacuumizing, leave standstill;
5) leave standstill 1h after, open again and vacuumize and agitator motor, begin to vacuumize, 1～3 time repeatedly, in guaranteeing epoxy resin glue A, do not have bubble;
The preparation of step 2, epoxy resin glue B:
1) according to above-mentioned mass fraction proportioning weighing methyl tetrahydro phthalic anhydride, precipitated silica, DMP-30 promotor, slowly join precipitated silica in the methyl tetrahydro phthalic anhydride then, and stir while adding, add DMP-30 promotor after stirring evenly again, make epoxy resin glue B after the mixing and stirring;
2) the epoxy resin glue B that stirs is joined in the B bucket of casting machine;
3) open the casting machine power supply, the B bucket is connected vacuum pump, open the vacuum pump valve, begin to vacuumize;
When 4) treating that tensimeter on the B bucket shows force value for-0.06MPa, open the agitator motor of B bucket, allow it vacuumize the 5min clock while stirring, stop then stirring and vacuumizing, leave standstill;
5) leave standstill 1h after, open again and vacuumize and agitator motor, begin to vacuumize, 1～3 time repeatedly, in guaranteeing epoxy resin glue B, do not have bubble;
Step 3, mixing:
After the epoxy resin glue A for preparing and epoxy resin glue B mixed, obtain to be used for the epoxy resin embedding adhesive of composite insulator.
Beneficial effect of the present invention:
A kind of epoxy resin embedding adhesive and preparation method for composite insulator of the present invention, wherein epoxy resin embedding adhesive is respectively 95～105 parts of Resins, epoxy by mass fraction, 0.5～1.5 parts of curing catalysts, 5～30 parts of white carbon blacks, 5～30 parts of ultra fine aluminium hydroxides are made, in the above-mentioned prescription, Resins, epoxy adopts E51 Resins, epoxy, epoxy curing agent is methyl tetrahydro phthalic anhydride, curing catalyst is DMP-30 promotor, white carbon black is precipitated silica, wherein, the consumption of precipitated silica directly has influence on hardness and the shrinking percentage of epoxy resin embedding adhesive, can increase simultaneously the insulating property of product, ultra fine aluminium hydroxide then is used for improving insulativity and the flame retardant resistance of product, prolongs the work-ing life of product.Compared with prior art, the present invention is particularly suitable for the composite insulator that flange form connects, and it has the following advantages:
1, improve the mechanical property of composite insulator:
1) owing to added a certain amount of precipitated silica, thereby improved the hardness of epoxy resin embedding adhesive, its tear resistance is strengthened, can guarantee that composite insulator can bear stronger pressure, pulling force and torsion in operational process, can not produce slight crack;
2) make the bonding more firm of flange and plug end, improve stopping property, for hollow combined insulator, filling liquid or gas are understood in its inside especially, thereby can prevent from taking place in the operational process phenomenon of gas or leak of liquid;
2, improve the electric property of composite insulator:
1) shrinking percentage is little, reduced the shrinking percentage difference between two kinds of materials of plug and flange, after epoxy resin embedding adhesive of the present invention solidifies, the back be can avoid solidifying and the excessive gap of formation between flange and the plug and the generation of bubble made because of the own contraction of epoxy resin embedding adhesive, farthest reduce the shelf depreciation that exists bubble, gap to cause because of inside in the product operational process, thereby prolonged the work-ing life of composite insulator greatly;
2) a certain amount of precipitated silica and ultra fine aluminium hydroxide have been added in the prescription of the present invention, thereby make the electric property of having improved epoxy resin embedding adhesive, have good insulativity and flame retardant resistance, this piece electrical performance to composite insulator also is favourable.
3, preparation technology is simple:
The epoxy resin embedding adhesive that adopts preparation method of the present invention to obtain has good viscosity and levelling property, and its solidification value is low and shortened set time.
Description of drawings
The present invention will be further described to utilize accompanying drawing, but the content in the accompanying drawing does not constitute any limitation of the invention.
The schematic appearance of Fig. 1 after for the epoxy resin embedding adhesive sample solidifies of the formulation that adopts Comparative Examples 1 to 4 and embodiment 1 to 3.
Embodiment
The invention will be further described to reach accompanying drawing with the following Examples, but embodiments of the present invention are not limited thereto.
Embodiment 1
A kind of epoxy resin embedding adhesive for composite insulator, formed by the raw material of following mass parts:
E51 Resins, epoxy: 100 parts
Methyl tetrahydro phthalic anhydride: 80 parts
DMP-30 promotor: 1.25 parts
Precipitated silica: 10 parts
Ultra fine aluminium hydroxide: 15 parts.
Embodiment 2
A kind of epoxy resin embedding adhesive for composite insulator, formed by the raw material of following mass parts:
E51 Resins, epoxy: 100 parts
Methyl tetrahydro phthalic anhydride: 82 parts
DMP-30 promotor: 1.0 parts
Precipitated silica: 8 parts
Ultra fine aluminium hydroxide: 10 parts.
Embodiment 3
A kind of epoxy resin embedding adhesive for composite insulator, formed by the raw material of following mass parts:
E51 Resins, epoxy: 105 parts
Methyl tetrahydro phthalic anhydride: 85 parts
DMP-30 promotor: 0.85 part
Precipitated silica: 17 parts
Ultra fine aluminium hydroxide: 20 parts.
Embodiment 4
A kind of preparation method of the epoxy resin embedding adhesive for composite insulator comprises following preparation process: (the following prescription that all adopts embodiment 1, embodiment 2 or embodiment 3)
The preparation of step 1, epoxy resin glue A:
1) first weighing E51 Resins, epoxy and ultra fine aluminium hydroxide slowly join ultra fine aluminium hydroxide in the E51 Resins, epoxy then, stir while adding, and make epoxy resin glue A after stirring;
2) the epoxy resin glue A that stirs is joined in the A bucket of casting machine;
3) open the casting machine power supply, the A bucket is connected vacuum pump, open the vacuum pump valve, begin to vacuumize;
When 4) treating that tensimeter on the A bucket shows force value for-0.06MPa, open the agitator motor of A bucket, allow it vacuumize the 5min clock while stirring, stop then stirring and vacuumizing, leave standstill;
5) leave standstill 1h after, open again and vacuumize and agitator motor, begin to vacuumize, 1～3 time repeatedly, in guaranteeing epoxy resin glue A, do not have bubble;
The preparation of step 2, epoxy resin glue B:
1) according to above-mentioned mass fraction proportioning weighing methyl tetrahydro phthalic anhydride, precipitated silica, DMP-30 promotor, slowly join precipitated silica in the methyl tetrahydro phthalic anhydride then, and stir while adding, add DMP-30 promotor after stirring evenly again, make epoxy resin glue B after the mixing and stirring;
2) the epoxy resin glue B that stirs is joined in the B bucket of casting machine;
3) open the casting machine power supply, the B bucket is connected vacuum pump, open the vacuum pump valve, begin to vacuumize;
When 4) treating that tensimeter on the B bucket shows force value for-0.06MPa, open the agitator motor of B bucket, allow it vacuumize the 5min clock while stirring, stop then stirring and vacuumizing, leave standstill;
5) leave standstill 1h after, open again and vacuumize and agitator motor, begin to vacuumize, 1～3 time repeatedly, in guaranteeing epoxy resin glue B, do not have bubble;
Step 3, mixing:
After the epoxy resin glue A for preparing and epoxy resin glue B mixed, obtain to be used for the epoxy resin embedding adhesive of composite insulator.
A kind of
The using method that is used for the epoxy resin embedding adhesive of composite insulator:
1) earlier flange and composite electric insulator core bar are assembled, seal with silicone rubber O-ring in the bottom of flange, the top seals with unvulcanized silicon rubber, smears a circle with silicon rubber at plug during assembling, just can excellent sealing during assembling;
2) composite insulator that will assemble flange is installed on the frock of preheating;
3) prepare epoxy resin embedding adhesive for composite insulator according to above-mentioned preparation method, begin pouring then, utilize sebific duct and metal mouth that epoxy resin embedding adhesive is imported in the flange during pouring, when treating that the venting hole of epoxy resin embedding adhesive on flange overflows, stop pouring;
4) remove the epoxy resin embedding adhesive that overflows on the flange, the wait epoxy resin embedding adhesive solidifies, and solidifies the back and with instrument metal mouth is back-outed, and will be bonded at the epoxy resin embedding adhesive removing of flange outside;
5) at last composite insulator is unloaded down from frock, waited for that its naturally cooling solidifies.
The experiment comparative analysis
Comparative Examples 1(does not add precipitated silica and ultra fine aluminium hydroxide)
A kind of epoxy resin embedding adhesive, constitutive material (by mass parts): 100 parts of E51 Resins, epoxy, 80 parts of methyl tetrahydro phthalic anhydrides, 1.5 parts of DMP-30 promotor.
Comparative Examples 2(does not add precipitated silica and ultra fine aluminium hydroxide)
A kind of epoxy resin embedding adhesive, constitutive material (by mass parts): 100 parts of E51 Resins, epoxy, 80 parts of methyl tetrahydro phthalic anhydrides, 1.0 parts of DMP-30 promotor.
Comparative Examples 3(does not add precipitated silica)
A kind of epoxy resin embedding adhesive, constitutive material (by mass parts): 100 parts of E51 Resins, epoxy, 80 parts of methyl tetrahydro phthalic anhydrides, 1.25 parts of DMP-30 promotor, 30 parts of ultra fine aluminium hydroxides.
Comparative Examples 4(does not add ultra fine aluminium hydroxide)
A kind of epoxy resin embedding adhesive, constitutive material (by mass parts): 100 parts of E51 Resins, epoxy, 80 parts of methyl tetrahydro phthalic anhydrides, 1.25 parts of DMP-30 promotor, 30 parts of precipitated silicas.
Detect and analyze:
One, outward appearance detects cure shrinkage
Respectively according to implement 1 to 3, the formulation epoxy resin embedding adhesive sample of Comparative Examples 1 to 4, then by the visual inspection outward appearance, solidify the sunk degree of depth of back upper surface per sample, come its surface compressed rate of comparative sample, the outward appearance after the sample solidifies as shown in Figure 1.
Judging criterion: the sunk degree of depth of upper surface outward appearance after the sample solidifies is more big, and the interpret sample cure shrinkage is more big, and it is more flat to solidify the back upper surface, and namely the sunk degree of depth is more little, and then the interpret sample cure shrinkage is more little.
Conclusion: by shown in Figure 1, the upper surface of the epoxy resin embedding adhesive sample appearance of the formulation of employing embodiment 1 to 3 is comparatively smooth, the sunk degree of depth is very little, thereby illustrates that its cure shrinkage is lower, is conducive to improve bonding stability and the stopping property of epoxy resin embedding adhesive like this.
Two, performance comparison
Epoxy resin embedding adhesive sample to the formulation of implementing 1 example to 3, Comparative Examples 1 to 4 carries out the detection of following index respectively, and detected result is as shown in table 1:
The Performance Detection of the epoxy resin embedding adhesive of table 1, embodiment 1 to 3, Comparative Examples 1 to 4 preparation
| Performance | Comparative Examples 1 | Comparative Examples 2 | Comparative Examples 3 | Comparative Examples 4 | Embodiment 1 to 3 |
| Its surface compressed rate value (mm) | 4.8 | 4.6 | 3.9 | 3.3 | 1.1 |
| With the gold utensil adhesive effect | Difference | Difference | Generally | Generally | Good |
| Air bubble content | Many | Many | Less | Less | Seldom |
| The sample slight crack | Quantity is many, and slight crack is big | Quantity is many, and slight crack is big | Quantity is many, and slight crack is big | Quantity is many, and slight crack is little | There is not obvious slight crack |
| Tear resistance test | Difference | Difference | Difference | Generally | Good |
Can be got by table 1, adopt the epoxy resin embedding adhesive of the prescription acquisition of embodiment 1 to 3, good appearance, shrinking percentage are little, can make plug and flange securely bonding and in tear resistance test performance good, do not have an obvious slight crack, its solidification effect is very desirable, thereby be conducive to improve cementability and the stopping property of epoxy resin embedding adhesive, prolonged work-ing life.Even composite insulator is in stronger strength of electric field for a long time, the solidification effect of epoxy resin embedding adhesive also can reach high-tension service requirements, is specially adapted to the composite insulator that flange form connects.
Should be noted that at last; above embodiment only is used for explanation technical scheme of the present invention but not limiting the scope of the invention; although with reference to preferred embodiment the present invention has been done detailed description; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement technical scheme of the present invention, and not break away from essence and the scope of technical solution of the present invention.
Claims (6)
1. epoxy resin embedding adhesive that is used for composite insulator, it is characterized in that: the raw material by following mass parts is formed:
Resins, epoxy: 95～105 parts
Epoxy curing agent: 75～85 parts
Curing catalyst: 0.5～1.5 part
White carbon black: 5～30 parts
Ultra fine aluminium hydroxide: 5～30 parts;
Wherein:
Described Resins, epoxy is E51 Resins, epoxy;
Described epoxy curing agent is methyl tetrahydro phthalic anhydride;
Described curing catalyst is DMP-30 promotor;
Described white carbon black is precipitated silica.
2. a kind of epoxy resin embedding adhesive for composite insulator according to claim 1, it is characterized in that: the raw material by following mass parts is formed:
E51 Resins, epoxy: 98～105 parts
Methyl tetrahydro phthalic anhydride: 78～85 parts
DMP-30 promotor: 0.85～1.25 part
Precipitated silica: 8～17 parts
Ultra fine aluminium hydroxide: 10～20 parts.
3. a kind of epoxy resin embedding adhesive for composite insulator according to claim 1, it is characterized in that: the raw material by following mass parts is formed:
E51 Resins, epoxy: 100 parts
Methyl tetrahydro phthalic anhydride: 80 parts
DMP-30 promotor: 1.25 parts
Precipitated silica: 10 parts
Ultra fine aluminium hydroxide: 15 parts.
4. a kind of epoxy resin embedding adhesive for composite insulator according to claim 1, it is characterized in that: the raw material by following mass parts is formed:
E51 Resins, epoxy: 100 parts
Methyl tetrahydro phthalic anhydride: 82 parts
DMP-30 promotor: 1.0 parts
Precipitated silica: 8 parts
Ultra fine aluminium hydroxide: 10 parts.
5. a kind of epoxy resin embedding adhesive for composite insulator according to claim 1, it is characterized in that: the raw material by following mass parts is formed:
E51 Resins, epoxy: 105 parts
Methyl tetrahydro phthalic anhydride: 85 parts
DMP-30 promotor: 0.85 part
Precipitated silica: 17 parts
Ultra fine aluminium hydroxide: 20 parts.
6. the preparation method of any described a kind of epoxy resin embedding adhesive for composite insulator of claim 1 to 5 is characterized in that: comprise following preparation process:
The preparation of step 1, epoxy resin glue A:
1) earlier according to above-mentioned mass fraction proportioning weighing E51 Resins, epoxy and ultra fine aluminium hydroxide, then ultra fine aluminium hydroxide is slowly joined in the E51 Resins, epoxy, stir while adding, make epoxy resin glue A after stirring;
2) the epoxy resin glue A that stirs is joined in the A bucket of casting machine;
3) open the casting machine power supply, the A bucket is connected vacuum pump, open the vacuum pump valve, begin to vacuumize;
When 4) treating that tensimeter on the A bucket shows force value for-0.06MPa, open the agitator motor of A bucket, allow it vacuumize the 5min clock while stirring, stop then stirring and vacuumizing, leave standstill;
5) leave standstill 1h after, open again and vacuumize and agitator motor, begin to vacuumize, 1～3 time repeatedly, in guaranteeing epoxy resin glue A, do not have bubble;
The preparation of step 2, epoxy resin glue B:
1) according to above-mentioned mass fraction proportioning weighing methyl tetrahydro phthalic anhydride, precipitated silica, DMP-30 promotor, slowly join precipitated silica in the methyl tetrahydro phthalic anhydride then, and stir while adding, add DMP-30 promotor after stirring evenly again, make epoxy resin glue B after the mixing and stirring;
2) the epoxy resin glue B that stirs is joined in the B bucket of casting machine;
3) open the casting machine power supply, the B bucket is connected vacuum pump, open the vacuum pump valve, begin to vacuumize;
When 4) treating that tensimeter on the B bucket shows force value for-0.06MPa, open the agitator motor of B bucket, allow it vacuumize the 5min clock while stirring, stop then stirring and vacuumizing, leave standstill;
5) leave standstill 1h after, open again and vacuumize and agitator motor, begin to vacuumize, 1～3 time repeatedly, in guaranteeing epoxy resin glue B, do not have bubble;
Step 3, mixing:
After the epoxy resin glue A for preparing and epoxy resin glue B mixed, obtain to be used for the epoxy resin embedding adhesive of composite insulator.
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| CN201310232851.4A CN103289626B (en) | 2013-06-13 | 2013-06-13 | Epoxy resin pouring sealant for composite insulator and preparation method of epoxy resin pouring sealant |
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| CN201310232851.4A CN103289626B (en) | 2013-06-13 | 2013-06-13 | Epoxy resin pouring sealant for composite insulator and preparation method of epoxy resin pouring sealant |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105255442A (en) * | 2015-11-17 | 2016-01-20 | 杨超 | Adhesive for direct-current supporting column insulator |
| CN105482370A (en) * | 2015-12-29 | 2016-04-13 | 浙江荣泰科技企业有限公司 | Insulation box filling adhesive and preparation method thereof |
| CN110349716A (en) * | 2019-08-07 | 2019-10-18 | 醴陵华鑫高能电气有限公司 | Hollow porcelain composite insulator and its processing method |
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| CN101633827A (en) * | 2009-09-01 | 2010-01-27 | 中国西电电气股份有限公司 | High-temperature curing adhesive for bonding electric insulators and preparation method thereof |
| CN102286260A (en) * | 2011-06-28 | 2011-12-21 | 上海景涵实业有限公司 | Non-yellowing high-transmittance insulated epoxy adhesive for light emitting diode (LED) and preparation method and use thereof |
| CN102391808A (en) * | 2011-07-08 | 2012-03-28 | 华烁科技股份有限公司 | Preparation of medium-temperature solidified epoxy adhesive and application of medium-temperature solidified epoxy adhesive in flexible polyester copper-clad plate |
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| CN1272424A (en) * | 1999-04-29 | 2000-11-08 | 北京化工大学 | Composite base laminated board covered with copper foil and its production method |
| CN101633827A (en) * | 2009-09-01 | 2010-01-27 | 中国西电电气股份有限公司 | High-temperature curing adhesive for bonding electric insulators and preparation method thereof |
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| CN105255442A (en) * | 2015-11-17 | 2016-01-20 | 杨超 | Adhesive for direct-current supporting column insulator |
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| CN110349716A (en) * | 2019-08-07 | 2019-10-18 | 醴陵华鑫高能电气有限公司 | Hollow porcelain composite insulator and its processing method |
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| CN103289626B (en) | 2014-10-08 |
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