CN103289601B - A kind of containing modified zeolite powder low-temperature resistant hot melt glue and preparation method thereof - Google Patents
A kind of containing modified zeolite powder low-temperature resistant hot melt glue and preparation method thereof Download PDFInfo
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- CN103289601B CN103289601B CN201310163953.5A CN201310163953A CN103289601B CN 103289601 B CN103289601 B CN 103289601B CN 201310163953 A CN201310163953 A CN 201310163953A CN 103289601 B CN103289601 B CN 103289601B
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- hot melt
- zeolite powder
- butadiene
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- acrylonitrile rubber
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Abstract
The invention discloses a kind of containing modified zeolite powder low-temperature resistant hot melt glue, be prepared from by the component of following weight part: EAA resin 90-95, Atactic Polypropelene APP? 5-6, butadiene-acrylonitrile rubber N240 tackifying resin? 10-14, Fischer-Tropsch wax PX-105? 5-7<b>, </b> stearic acid 1-2<b>, </b> modified zeolite powder 15-18, antioxidant 300? 0.2-0.3, oxidation inhibitor 736? 0.1-0.2, oxidation inhibitor 626? 0.1-0.2, tri(2-ethylhexyl)acetocitrate 2-3, epoxidation tri-glyceride 4-5.First prepare butadiene-acrylonitrile rubber tackifying resin, then mix with other raw material, extruded by forcing machine, cooling, pelletizing.Hot melt adhesive cohesiveness of the present invention is strong, with the addition of homemade rubber tackifying resin in formula, the hot melt adhesive cohesiveness obtained is strengthened, has good resistance to low temperature, weathering resistance, good toughness.
Description
Technical field
The present invention relates to hot melt adhesive field, be specifically related to a kind of containing modified zeolite powder low-temperature resistant hot melt glue and preparation method thereof.
Background technology
Hot melt adhesive is with thermoplastic resin or elastomerics for base-material, adds viscosity increaser, softening agent, antioxidant, fire retardant and filler, through the solid adhesive agent of melting mixing.To compare with water-based adhesive with heat curing-type, solvent-borne type and there is lot of superiority, so from the 1950's so far, hot melt adhesive is developed rapidly in a lot of fields, especially having replaced with hot melt adhesive in industries such as printing, packagings binds with traditional thread binding, and starts for fields such as building, aircraft, naval vessel and automobile interior trims.
On existing market, hot melt adhesive related products is more, but along with the change of temperature, the performance of traditional hot-melt adhesive is also in change, and the performance being raised to certain high temperature when temperature or dropping to certain low-temperature hot melt adhesive all can reduce, the bonding strength of material is weakened, finally affects the intensity of material.
Summary of the invention
The invention provides a kind of containing modified zeolite powder low-temperature resistant hot melt glue, hot melt adhesive of the present invention, cohesiveness has good resistance to low temperature, weathering resistance by force, simultaneously, good toughness.
The technical solution used in the present invention is as follows:
A kind of containing modified zeolite powder low-temperature resistant hot melt glue, it is characterized in that, be prepared from by the component of following weight part:
EAA resin 90-95, Atactic Polypropelene APP5-6, butadiene-acrylonitrile rubber N240 tackifying resin 10-14, Fischer-Tropsch wax PX-1055-7
,stearic acid 1-2
,modified zeolite powder 15-18, antioxidant 300 0.2-0.3, oxidation inhibitor 7360.1-0.2, oxidation inhibitor 6260.1-0.2, tri(2-ethylhexyl)acetocitrate 2-3, epoxidation tri-glyceride 4-5,
Wherein, described butadiene-acrylonitrile rubber N240 tackifying resin is prepared by following method and obtains:
(1) 15-19 weight part butadiene-acrylonitrile rubber N240,24-28 parts by weight of xylene, 6-9 weight part tripoly phosphate sodium STPP, the cold resistant plasticizer DOS of 0.1-0.2 weight part, the linking agent TAC of 0.2-0.3 weight part are mixed, at 80-110 DEG C, reaction 2-3 hour;
(2) nilox resin, anti-aging agent RD is then added, at 135-148 DEG C, reaction 2-3 hour, requirement, the weight ratio of nilox resin, butadiene-acrylonitrile rubber N240, anti-aging agent RD three is: 100:15-19:0.5-0.6;
(3) add aminopropyl triethoxysilane again, dioctyl ester reacts 1-2 hour at 145-175 DEG C, requirement, the weight ratio of nilox resin, aminopropyl triethoxysilane alkane, dioctyl ester is 100:1-3:1-2;
(4) finally distillation removing xylene solvent, obtains butadiene-acrylonitrile rubber N240 tackifying resin.
The preparation method of the described low-temperature resistant hot melt glue containing modified zeolite powder, is characterized in that, comprise the following steps:
(1) butadiene-acrylonitrile rubber tackifying resin is first prepared;
(2) take each formula material by formula rate, pour raw material into homogenizer and mix;
(3) compound stirred is by extruding pelletization in twin screw extruder, setting barrel heat temperature is 133-171 DEG C, die temperature is 170-192 DEG C, screw speed is 16-58rpm, reinforced rotating speed is 7-38rpm, until material after die extrusion through tank cooling after blank, obtain finished product hot melt adhesive.
Described contains modified zeolite powder low-temperature resistant hot melt glue, it is characterized in that: the preparation method of described modified zeolite powder is: NaCl solution zeolite powder being put into 0.3mol/L, control solution temperature at 95-100 DEG C in be dipped into 2-3 hour after, taking-up deionized water wash several, dry at 70 DEG C, grinding to form nano powder.
Compared with prior art, the present invention has following beneficial effect:
Hot melt adhesive cohesiveness of the present invention is strong, with the addition of homemade rubber tackifying resin, the adhesive property of the hot melt adhesive obtained is strengthened, has good resistance to low temperature, weathering resistance, good toughness simultaneously in formula.
Embodiment
Take the component raw material of following weight (kg): EAA resin 95, Atactic Polypropelene APP6, butadiene-acrylonitrile rubber N240 tackifying resin 12, Fischer-Tropsch wax PX-1056
,stearic acid 1
,modified zeolite powder 16, antioxidant 300 0.2, oxidation inhibitor 7360.1, oxidation inhibitor 6260.2, tri(2-ethylhexyl)acetocitrate 3, epoxidation tri-glyceride 5,
Preparation method, comprises the following steps:
(1) the cold resistant plasticizer DOS of 18kg butadiene-acrylonitrile rubber N240,26kg dimethylbenzene, 8kg tripoly phosphate sodium STPP, 0.2kg, the linking agent TAC of 0.3kg are mixed, at 80-110 DEG C, reaction 2-3 hour;
(2) 100kg nilox resin, 0.5kg anti-aging agent RD is then added, at 140 DEG C, reaction 2-3 hour;
(3) add 2kg aminopropyl triethoxysilane again, 1kg dioctyl ester reacts 1-2 hour at 150 DEG C;
(4) finally distillation removing xylene solvent, obtains butadiene-acrylonitrile rubber N240 tackifying resin;
(5) other raw material in butadiene-acrylonitrile rubber N240 tackifying resin and formula is taken by formula rate;
(6) pour the raw material taken into homogenizer to mix;
(7) compound stirred is by extruding pelletization in twin screw extruder, setting barrel heat temperature is 133-171 DEG C, die temperature is 170-192 DEG C, screw speed is 16-58rpm, reinforced rotating speed is 7-38rpm, until material after die extrusion through tank cooling after blank, obtain finished product hot melt adhesive.
The hot melt adhesive that the inventive method obtains the key technical indexes as follows:
Tensile strength (Mpa) 3.5
Bonding strength (N/2.5cm) 89
Set time (s) 3
Ring and ball softening point (DEG C) 96
Melt viscosity (Pa.s) 2.6-2.9
Embrittlement temperature-18 DEG C.
Claims (3)
1. one kind contains modified zeolite powder low-temperature resistant hot melt glue, it is characterized in that, be prepared from by the component of following weight part: EAA resin 90-95, Atactic Polypropelene APP5-6, butadiene-acrylonitrile rubber N240 tackifying resin 10-14, Fischer-Tropsch wax PX-1055-7, stearic acid 1-2, modified zeolite powder 15-18, antioxidant 300 0.2-0.3, oxidation inhibitor 7360.1-0.2, oxidation inhibitor 6260.1-0.2, tri(2-ethylhexyl)acetocitrate 2-3, epoxidation tri-glyceride 4-5, wherein, described butadiene-acrylonitrile rubber N240 tackifying resin is prepared by following method and obtains:
(1) 15-19 weight part butadiene-acrylonitrile rubber N240,24-28 parts by weight of xylene, 6-9 weight part tripoly phosphate sodium STPP, the cold resistant plasticizer DOS of 0.1-0.2 weight part, the linking agent TAC of 0.2-0.3 weight part are mixed, at 80-110 DEG C, reaction 2-3 hour;
(2) nilox resin, anti-aging agent RD is then added, at 135-148 DEG C, reaction 2-3 hour, requirement, the weight ratio of nilox resin, butadiene-acrylonitrile rubber N240, anti-aging agent RD three is: 100:15-19:0.5-0.6;
(3) add aminopropyl triethoxysilane again, dioctyl ester reacts 1-2 hour at 145-175 DEG C, requirement, the weight ratio of nilox resin, aminopropyl triethoxysilane, dioctyl ester is 100:1-3:1-2;
(4) finally distillation removing xylene solvent, obtains butadiene-acrylonitrile rubber N240 tackifying resin.
2. the preparation method of the low-temperature resistant hot melt glue containing modified zeolite powder according to claim 1, is characterized in that, comprise the following steps:
(1) butadiene-acrylonitrile rubber N240 tackifying resin is first prepared;
(2) take each formula material by formula rate, pour raw material into homogenizer and mix;
(3) compound stirred is by extruding pelletization in twin screw extruder, setting barrel heat temperature is 133-171 DEG C, die temperature is 170-192 DEG C, screw speed is 16-58rpm, reinforced rotating speed is 7-38rpm, until material after die extrusion through tank cooling after blank, obtain finished product hot melt adhesive.
3. according to claim 1 containing modified zeolite powder low-temperature resistant hot melt glue, it is characterized in that: the preparation method of described modified zeolite powder is: NaCl solution zeolite powder being put into 0.3mol/L, control solution temperature at 95-100 DEG C in be dipped into 2-3 hour after, taking-up deionized water wash several, dry at 70 DEG C, grind to form nano powder again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310163953.5A CN103289601B (en) | 2013-05-07 | 2013-05-07 | A kind of containing modified zeolite powder low-temperature resistant hot melt glue and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310163953.5A CN103289601B (en) | 2013-05-07 | 2013-05-07 | A kind of containing modified zeolite powder low-temperature resistant hot melt glue and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN103289601A CN103289601A (en) | 2013-09-11 |
| CN103289601B true CN103289601B (en) | 2016-01-06 |
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| CN201310163953.5A Active CN103289601B (en) | 2013-05-07 | 2013-05-07 | A kind of containing modified zeolite powder low-temperature resistant hot melt glue and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1052882A (en) * | 1989-12-30 | 1991-07-10 | 邮电部成都电缆厂 | Thermally adherent polymer film |
| CN1687280A (en) * | 2005-06-03 | 2005-10-26 | 江苏工业学院 | New type hot-melt adhesive and preparation method thereof |
| CN101289605A (en) * | 2008-06-04 | 2008-10-22 | 金尔昇 | Environment protection type colourful flashing hot-melt adhesive |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000204336A (en) * | 1999-01-13 | 2000-07-25 | Sekisui Chem Co Ltd | Hot-melt adhesive |
-
2013
- 2013-05-07 CN CN201310163953.5A patent/CN103289601B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1052882A (en) * | 1989-12-30 | 1991-07-10 | 邮电部成都电缆厂 | Thermally adherent polymer film |
| CN1687280A (en) * | 2005-06-03 | 2005-10-26 | 江苏工业学院 | New type hot-melt adhesive and preparation method thereof |
| CN101289605A (en) * | 2008-06-04 | 2008-10-22 | 金尔昇 | Environment protection type colourful flashing hot-melt adhesive |
Non-Patent Citations (1)
| Title |
|---|
| 聚乙烯-丙烯酸的应用研究;连萌 等;《山西化工》;20100430;第30卷(第2期);第39-43页 * |
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| CN103289601A (en) | 2013-09-11 |
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