CN103262012A - Touch panel, display device provided with same, and method for producing touch panel - Google Patents

Touch panel, display device provided with same, and method for producing touch panel Download PDF

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Publication number
CN103262012A
CN103262012A CN2011800597089A CN201180059708A CN103262012A CN 103262012 A CN103262012 A CN 103262012A CN 2011800597089 A CN2011800597089 A CN 2011800597089A CN 201180059708 A CN201180059708 A CN 201180059708A CN 103262012 A CN103262012 A CN 103262012A
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China
Prior art keywords
articulamentum
wiring lead
touch panel
pattern
conductive pattern
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Granted
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CN2011800597089A
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Chinese (zh)
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CN103262012B (en
Inventor
美崎克纪
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Sharp Corp
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Sharp Corp
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Priority to CN201510824197.5A priority Critical patent/CN105320388B/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Position Input By Displaying (AREA)

Abstract

An external connection terminal (35) is constructed by electrically connecting a first connection layer (36A) and a second connection layer (36B) to a lead-out wiring (31) at an area where same overlap the lead-out wiring (31), and by electrically connecting the first connection layer and the second connection layer with one another at an area outside the lead-out wiring (31), the first connection layer (36A) being formed of the same film as a first electroconductive pattern that underlies an interlayer insulating film (23) and that is for detecting the touched position, the second connection layer (36B) being formed of the same film as a second electroconductive pattern that overlies the interlayer insulating film (23) and that is for detecting the touched position.

Description

Touch panel and possess the display device of this touch panel and the manufacture method of touch panel
Technical field
The present invention relates to touch panel and possess the display device of this touch panel and the manufacture method of touch panel, particularly relate to the bad countermeasure of detection of tackling touch location.
Background technology
Touch panel is input media, it is arranged on the display panels such as display panels or Plasmia indicating panel and constitutes display device, is used for coming the display device main body is imported information by carrying out various operations with finger or pen etc. at the display screen of this display panel.
Touch panel can be divided into according to its operating principle: resistance membrane type, electrostatic capacitive, infrared-type, ultrasonic type, induction etc.The touch panel of known wherein electrostatic capacitive relatively is not easy to damage the optical characteristics of display device, is applicable to display device.Especially, (proiected capacitive: projected capacitive) the touch panel multiple spot that contact such as can point detects the projection type electrostatic capacitive, therefore, has the excellent operability that can import complicated indication information.
In the touch panel of projection type electrostatic capacitive, the electrode of using as touch location detection, be arranged with multiple row in the touch area that can detect touch location in parallel to each other and comprise in one direction the first electrode group of a plurality of first electrodes of arranging, and be arranged with the second electrode group that multiple row is included in a plurality of second electrodes of arranging on the direction with this each first electrode group quadrature in parallel to each other.First electrode and second electrode are formed by the low transparent conductive oxides of indium tin oxide conductances such as (Indium Tin Oxide are called ITO below), make the display screen of display panel to have an X-rayed.
The first adjacent electrode of each first electrode group utilizes first linking part to link each other, and the second adjacent electrode of each second electrode group utilizes second linking part to link each other.These first linking parts and second linking part and first electrode and second electrode similarly contain transparent conductive oxides.And at each cross part of the first electrode group and the second electrode group, first linking part and second linking part are across the interlayer dielectric setting and mutually insulated.These each first electrode groups and each second electrode group with lead to the terminal area side that is positioned at outside it from the touch area side each independently wiring lead be electrically connected.
The leading section of drawing at each wiring lead is provided with external connection terminals.Each external connection terminals applies alternating voltage to the first electrode group and the second electrode group, and is connected with the capacitive detection circuit that detects each first electrode and the electrostatic capacitance at each corresponding position of second electrode.Above-mentioned first electrode, second electrode and wiring lead by for the protection of dielectric film cover.
And, in this touch panel, when when the touch area dielectric film is touched, first electrode and second electrode that are in touch location pass through human body grounding through the electrostatic capacitance that is formed between this first electrode and the contacts such as second electrode and finger, the variation that be in the electrostatic capacitance that forms between first electrode of touch location and second electrode and the contact this moment is detected by capacitive detection circuit.Like this, become the structure that detects touch location based on the variation of above-mentioned electrostatic capacitance.
Dense arrangement has a plurality of said external splicing ears in the terminal area of this projection type capacitive touch panel.These each external connection terminals are in order to be connected with outside terminal, need expose from dielectric film, therefore, countermeasure as the reply corrosion, sometimes the electrode of using with touch location detection, the transparent conductive oxides such as ITO that by force, relatively are not easy to be corroded by moisture-resistant gas and hot performance form (for example, with reference to patent documentation 1).
The prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2009-87118 communique
Summary of the invention
The technical matters that invention will solve
But, in above-mentioned projection type capacitive touch panel, the intensive terminal area that is arranged at of a plurality of external connection terminals, therefore, the terminal width of each external connection terminals has to narrow down.And, formed by transparent conductive oxides such as ITO under the situation of external connection terminals, the conductance of transparent conductive oxides likens to into the conductance of the copper (Cu) of common wiring material use or aluminium metals such as (Al) is low, so the resistance ratio of this external connection terminals is higher.Therefore, may in electrode that touch location detection is used and capacitive detection circuit, produce poor flow, and damage the touch location detection function.
Though so, but when the high conductive material of the electrode that uses conductance to use than touch location detection forms external connection terminals, the operation that needs increase and the operation of the electrode that the formation touch location detection is used is separated the formation external connection terminals that carries out, therefore, manufacturing process increases, and manufacturing cost increases.
The present invention researches and develops in view of such aspect, and its purpose is, does not increase the resistance that manufactures local reduction external connection terminals, thereby obtains good touch location detection function.
The technological means of technical solution problem
In order to realize described purpose, in the present invention, external connection terminals is made the structure that is connected in parallel that is made of the bilayer that is connected in parallel with wiring lead, and each conductive pattern that this be connected in parallel structure and the existing touch location detection up and down that is positioned at interlayer dielectric are used is formed by same film.
Particularly, the present invention is with touch panel and possess the display device of this touch panel and the manufacture method of touch panel is object, solution below adopting, this touch panel comprises: the touch area, it is the zone for detection of the touch location that is contacted by contact; Terminal area, it is the outside that is arranged at this touch area, is used for the zone that is connected with external circuit; First conductive pattern that touch location detection is used, it is disposed at above-mentioned touch area and contains transparent conductive oxides; Interlayer dielectric, its mode with at least a portion of covering above-mentioned first conductive pattern arranges; Second conductive pattern that touch location detection is used, it is arranged on this interlayer dielectric and comprises transparent conductive oxides; The protection dielectric film, it arranges in the mode that covers this second conductive pattern; Wiring lead, it is electrically connected with in above-mentioned first conductive pattern and second conductive pattern at least one, leads to above-mentioned terminal area side from above-mentioned touch area side, and is insulated film and covers; And external connection terminals, it is connected with the leading section of drawing of this wiring lead, and leads to the outside of above-mentioned dielectric film and be arranged at above-mentioned terminal area.
Namely, first invention provides a kind of touch panel, it is characterized in that, the said external splicing ear constitutes: with above-mentioned first conductive pattern by same film formed first articulamentum and with above-mentioned second conductive pattern by same film formed second articulamentum, be electrically connected with this wiring lead with the overlapping position of above-mentioned wiring lead, and be electrically connected mutually at the outside left of above-mentioned wiring lead.
In this first invention, external connection terminals has the structure that is connected in parallel that is made of first articulamentum that is connected in parallel with wiring lead and second articulamentum.Resistance in this structure that is connected in parallel is the sum reciprocal of the resistance value of the inverse of resistance value of first articulamentum and second articulamentum.Thus, compare with the situation that the individual layer that is made of transparent conductive oxides that this external connection terminals utilization and wiring lead are connected in series constitutes, can make the resistance low resistanceization of external connection terminals.
In addition, first articulamentum and first conductive pattern are formed by same film, and second articulamentum and second conductive pattern are formed by same film.That is, utilize the existing operation that forms first conductive pattern and second conductive pattern, just external connection terminals can be constituted the above-mentioned structure that is connected in parallel.Therefore, the operation that does not need to increase with forming first conductive pattern and second conductive pattern is separated the operation that is used to form this external connection terminals of carrying out, and does not increase manufacturing process and just can finish.
Therefore, according to this first invention, do not increase manufacturing cost, just can reduce the resistance of external connection terminals, thereby obtain good touch location detection function.
Second invention is characterised in that above-mentioned first articulamentum and second articulamentum are stacked mutually in above-mentioned terminal area on the basis of the touch panel of first invention.
In this second invention, external connection terminals has the lit-par-lit structure that is made of first articulamentum and second articulamentum in terminal area.In this lit-par-lit structure part, to compare with the situation that individual layer that this external connection terminals utilization is made of transparent conductive oxides constitutes, the layer that constitutes this external connection terminals is many 1 layer, correspondingly the external connection terminals thickening.Thus, can make the external connection terminals low resistanceization well.
The 3rd invention is on the basis of the touch panel of first invention or second invention, be characterised in that, on the above-mentioned interlayer dielectric, be formed with contact hole or notch part at the overlapping position of leading section of drawing with above-mentioned wiring lead, above-mentioned wiring lead and second articulamentum are electrically connected mutually through above-mentioned contact hole or notch part.
In the 3rd invention, wiring lead and second articulamentum contact hole or the notch part through being formed at interlayer dielectric is electrically connected.Therefore, the zone beyond at the position that is formed with contact hole or notch part also can make the protected dielectric film of wiring lead and interlayer dielectric cover.Thus, cover wiring lead by utilizing interlayer dielectric and this double hyer insulation film of protection dielectric film, can stop moisture etc. to enter as much as possible, thereby prevent that well wiring lead is corroded.
On the basis of the 4th invention touch panel of arbitrary invention in first invention～the three invention, be characterised in that, above-mentioned wiring lead draw the outside that leading section extends to above-mentioned dielectric film, at least one in above-mentioned first articulamentum and second articulamentum covers the integral body of the extension of above-mentioned wiring lead.
In the 4th invention, the extension of wiring lead that extends to the outside of dielectric film is covered by first articulamentum or second articulamentum.Therefore, though the extension of wiring lead is positioned at the outside of dielectric film, it is damp proof etc. that first articulamentum by covering the extension or second articulamentum carry out, thereby be not easy to be corroded.Like this, wiring lead draw the structure that leading section extends to the outside of dielectric film, the structure that is contained in the inboard of dielectric film with the integral body of wiring lead is compared, and can dwindle the frame region in the outside, touch area.
On the basis of the 5th invention touch panel of arbitrary invention in first invention～the four invention, be characterised in that above-mentioned first articulamentum is electrically connected with above-mentioned wiring lead at mutual different position with second articulamentum.
By the 5th invention, also can realize action effect of the present invention particularly.
On the basis of the 6th invention touch panel of arbitrary invention in first invention～the five invention, be characterised in that above-mentioned wiring lead is by being made of with second wiring layer that contains metal material is stacked same film formed first wiring layer with above-mentioned first conductive pattern.
In the 6th invention, wiring lead has the lit-par-lit structure that is made of first wiring layer and second wiring layer.Wiring lead with this lit-par-lit structure is compared with layer situation about constituting that this wiring lead only utilizes the metal material corresponding with second wiring layer to constitute, and the layer that constitutes this wiring lead has thickened 1 layer (first wiring layer) that has more.Thus, can make the wiring lead low resistanceization.
In addition, first wiring layer and first conductive pattern are formed by same film.That is, utilize the existing operation that forms first conductive pattern wiring lead can be constituted above-mentioned lit-par-lit structure, therefore, do not increase manufacturing process and just can finish.
On the basis of the 7th invention touch panel of arbitrary invention in first invention～the six invention, be characterised in that one in above-mentioned first conductive pattern and second conductive pattern has: comprise a plurality of first electrodes of arranging in one direction and a plurality of first electrode groups of arranging in parallel to each other separately; Be included in a plurality of second electrodes of arranging on the direction of intersecting with this each first electrode group and a plurality of second electrode groups of arranging in parallel to each other separately; With the first adjacent electrode, first linking part connected to each other with above-mentioned each first electrode group, another in above-mentioned first conductive pattern and second conductive pattern has second linking part that the second adjacent electrode of the above-mentioned second electrode group is connected to each other.
In the 7th invention, can realize projection type electrostatic capacitive (projected capacitive) touch panel particularly.And in this touch panel, the first electrode group and the second electrode group are arranged at on one deck, therefore, the variation of the electrostatic capacitance that forms between first electrode of touch location and contacts such as second electrode and finger are produced with degree ground.Thus, can reduce the poor sensitivity to electrostatic capacitance change between first electrode and second electrode.Therefore, can carry out the detection of the good touch location of sensitivity.
On the basis of the 8th invention touch panel of arbitrary invention in first invention～the seven invention, be characterised in that, the transparent conductive oxides that forms above-mentioned first conductive pattern and second conductive pattern is ITO or indium-zinc oxide (Indium Zinc Oxide, below, be called IZO).
In the 8th invention, first conductive pattern and second conductive pattern are made of ITO or IZO.ITO and IZO keep electric conductivity and have than higher transparency, therefore, can realize pellucidity in the touch area, and the display screen of display panel is formed and can have an X-rayed well.
In addition, according to the 8th invention, first articulamentum and second articulamentum of external connection terminals also are made of ITO or IZO.ITO compares with the copper (Cu) or the aluminium metals such as (Al) that use as wiring material with IZO, and the ability of moisture-proof gas etc. is strong and have the characteristic that is not easy to be corroded, and therefore, can make external connection terminals have good anti-corrosion.
The 9th invention provides a kind of display device, it is characterized in that, possesses the touch panel of arbitrary invention in first invention～the eight invention.
In the 9th invention, the touch panel of first invention～the eight invention possesses and does not increase the resistance that manufacturing cost just can reduce external connection terminals, thereby obtain the characteristic of the excellence of good touch location detection function, therefore, can realize at an easy rate by using contacts such as finger or pen to carry out the display device that information can be correctly imported in various operations.
The tenth invention is characterised in that on the basis of the display device of the 9th invention above-mentioned touch panel is formed directly on the substrate surface that constitutes display panel.
In the tenth invention, on the substrate surface that constitutes display panel, directly be formed with touch panel, therefore, can form the display device integral body that possesses the touch panel with good touch location detection function slim.
The 11 invention provides a kind of method of making the touch panel of first invention, it is characterized in that, comprise: first pattern forms operation, form the nesa coating that contains transparent conductive oxides at the matrix substrate, use first photomask that this nesa coating is carried out pattern and form, form above-mentioned first conductive pattern and first articulamentum thus; Second pattern forms operation, forms metal film in the mode that covers above-mentioned first conductive pattern and first articulamentum, uses second photomask that this metal film is carried out pattern and forms, thus to form above-mentioned wiring lead with the above-mentioned first articulamentum ways of connecting; The 3rd pattern forms operation, form dielectric film in the mode that covers above-mentioned first conductive pattern, first articulamentum and wiring lead, use the 3rd photomask that this dielectric film is carried out pattern and form, thus so that the mode that at least a portion of above-mentioned first articulamentum and wiring lead is exposed forms above-mentioned interlayer dielectric; The 4th pattern forms operation, form the nesa coating that contains transparent conductive oxides at above-mentioned interlayer dielectric, using the 4th photomask that this nesa coating is carried out pattern forms, thus, form above-mentioned second conductive pattern, and to form above-mentioned second articulamentum with above-mentioned first articulamentum and wiring lead ways of connecting; Form operation with the 5th pattern; form dielectric film in the mode that covers above-mentioned second conductive pattern and second articulamentum; use the 5th photomask that this dielectric film is carried out pattern and form, thus so that the mode that at least a portion of above-mentioned second articulamentum is exposed forms above-mentioned protection dielectric film.
In the 11 invention, form in the operation at first pattern, use a photomask to form first articulamentum with first conductive pattern by same film.In addition, form in the operation at second pattern, use a photomask to form second articulamentum with second conductive pattern by same film.Like this, utilize the existing operation that forms first conductive pattern and second conductive pattern to form first articulamentum and second articulamentum, do not increase manufacturing process, just external connection terminals can be constituted the above-mentioned structure that is connected in parallel, therefore, do not increase manufacturing cost, just can reduce the resistance of external connection terminals, thereby can make the touch panel of first invention that possesses good touch location detection function.
The 12 invention provides a kind of method of making the touch panel of first invention, it is characterized in that, comprise: first pattern forms operation, forms metal film at the matrix substrate, use first photomask that this metal film is carried out pattern and form, form above-mentioned wiring lead thus; Second pattern forms operation, form the nesa coating that contains transparent conductive oxides in the mode that covers above-mentioned wiring lead, using second photomask that this nesa coating is carried out pattern forms, thus, form above-mentioned first conductive pattern, and with an above-mentioned wiring lead part overlappingly ways of connecting form above-mentioned first articulamentum; The 3rd pattern forms operation, form dielectric film in the mode that covers above-mentioned wiring lead, first conductive pattern and first articulamentum, using the 3rd photomask that this dielectric film is carried out pattern forms, thus, with the overlapping position of above-mentioned wiring lead at least a portion of this wiring lead or above-mentioned first articulamentum exposed and to be formed above-mentioned interlayer dielectric in the mode that the outside left of above-mentioned wiring lead exposes at least a portion of above-mentioned first articulamentum; The 4th pattern forms operation, form the nesa coating that contains transparent conductive oxides at above-mentioned interlayer dielectric, using the 4th photomask that this nesa coating is carried out pattern forms, thus, form above-mentioned second conductive pattern, and to be connected with this wiring lead or above-mentioned first articulamentum with the overlapping position of above-mentioned wiring lead and to form above-mentioned second articulamentum in outside left and the above-mentioned first articulamentum ways of connecting of above-mentioned wiring lead; The 5th pattern forms operation; form dielectric film in the mode that covers above-mentioned second conductive pattern and second articulamentum; use the 5th photomask that this dielectric film is carried out pattern and form, thus, so that the mode that at least a portion of above-mentioned second articulamentum is exposed forms above-mentioned protection dielectric film.
In the 12 invention, also utilize the existing operation that forms first conductive pattern and second conductive pattern to form first articulamentum and second articulamentum, do not increase manufacturing process and just external connection terminals can be constituted the above-mentioned structure that is connected in parallel, therefore, do not increase manufacturing cost, just can reduce the resistance of external connection terminals, thereby make the touch panel of first invention that possesses good touch location detection function.
The effect of invention
According to the present invention, external connection terminals is made the structure that is connected in parallel that is constituted by first articulamentum that is connected in parallel with wiring lead and second articulamentum, and make this be connected in parallel structure be positioned at first conductive pattern and second conductive pattern that interlayer dielectric existing touch location detection up and down uses and formed by same film, therefore, do not increase manufacturing cost, just can reduce the resistance of external connection terminals, thereby obtain good touch location detection function.Its result can prevent from producing poor flow between conductive pattern that touch location detection is used and external circuit, and can realize at an easy rate by using contacts such as finger or pen to carry out the display device that various operations just can be imported correct information.
Description of drawings
Fig. 1 is the cut-open view of profile construction of the liquid crystal indicator of expression embodiment 1.
Fig. 2 is the vertical view of roughly representing the touch panel of embodiment 1.
Fig. 3 amplifies electrode that the touch location detection of the touch panel of expression embodiment 1 uses and the vertical view that is connected structure of external connection terminals.
Fig. 4 is the cut-open view of profile construction of the IV-IV line of presentation graphs 3.
Fig. 5 is the cut-open view of profile construction of the V-V line of presentation graphs 3.
Fig. 6 amplifies the external connection terminals of the touch panel of representing embodiment 1 and the vertical view that is connected structure of wiring lead.
Fig. 7 is the cut-open view of profile construction of the VII-VII line of presentation graphs 6.
Fig. 8 is the cut-open view of profile construction of the VIII-VIII line of presentation graphs 6.
Fig. 9 is the cut-open view of profile construction of the IX-IX line of presentation graphs 6.
Figure 10 is the process flow diagram of manufacture method of the liquid crystal indicator of embodiment 1.
Figure 11 is that first pattern of manufacture method of the touch panel of expression embodiment 1 forms Fig. 5 of operation and the cut-open view of Fig. 9 corresponding position.
Figure 12 is that second pattern of manufacture method of the touch panel of expression embodiment 1 forms Fig. 5 of operation and the cut-open view of Fig. 9 corresponding position.
Figure 13 is that the 3rd pattern of manufacture method of the touch panel of expression embodiment 1 forms Fig. 5 of operation and the cut-open view of Fig. 9 corresponding position.
Figure 14 is that the 4th pattern of manufacture method of the touch panel of expression embodiment 1 forms Fig. 5 of operation and the cut-open view of Fig. 9 corresponding position.
Figure 15 is that the 5th pattern of manufacture method of the touch panel of expression embodiment 1 forms Fig. 5 of operation and the cut-open view of Fig. 9 corresponding position.
Figure 16 amplifies the external connection terminals of touch panel of variation 1 of expression embodiment 1 and the vertical view that is connected structure of wiring lead.
Figure 17 is the cut-open view of profile construction of the XVII-XVII line of expression Figure 16.
Figure 18 amplifies the external connection terminals of touch panel of variation 2 of expression embodiment 1 and the vertical view that is connected structure of wiring lead.
Figure 19 is the cut-open view of profile construction of the XIX-XIX line of expression Figure 18.
Figure 20 amplifies the vertical view that the connection of the wiring lead of touch panel of variation 3 of expression embodiment 1 and each splicing ear that is connected with its both ends is constructed.
Figure 21 is that the profile construction of the XXIA-XXIA line of Figure 20, the cut-open view of the profile construction of the XXIB-XXIB line of left side expression Figure 20 are in the drawings represented in the right side in the drawings.
Figure 22 amplifies the external connection terminals of touch panel of variation 4 of expression embodiment 1 and the vertical view that is connected structure of wiring lead.
Figure 23 is the cut-open view of profile construction of the XXIII-XXIII line of expression Figure 22.
Figure 24 amplifies the external connection terminals of touch panel of variation 5 of expression embodiment 1 and the vertical view that is connected structure of wiring lead.
Figure 25 is the cut-open view of profile construction of the XXV-XXV line of expression Figure 24.
Figure 26 amplifies the external connection terminals of the touch panel of representing embodiment 2 and the vertical view that is connected structure of wiring lead.
Figure 27 is the cut-open view of profile construction of the XXVII-XXVII line of expression Figure 26.
Figure 28 is that the profile construction of the XXVIIIA-XXVIIIA line of Figure 26, the cut-open view of the profile construction of the XXVIIIB-XXVIIIB line of left side expression Figure 26 are in the drawings represented in the right side in the drawings.
Figure 29 is the cut-open view that first pattern of manufacture method of the touch panel of expression embodiment 2 forms right side corresponding position among the suitable position of Fig. 5 of operation and Figure 28.
Figure 30 is the cut-open view that second pattern of manufacture method of the touch panel of expression embodiment 2 forms right side corresponding position among the suitable position of Fig. 5 of operation and Figure 28.
Figure 31 is the cut-open view that the 3rd pattern of manufacture method of the touch panel of expression embodiment 2 forms right side corresponding position among the suitable position of Fig. 5 of operation and Figure 28.
Figure 32 is the cut-open view that the 4th pattern of manufacture method of the touch panel of expression embodiment 2 forms right side corresponding position among the suitable position of Fig. 5 of operation and Figure 28.
Figure 33 amplifies the external connection terminals of touch panel of variation 1 of expression embodiment 2 and the vertical view that is connected structure of wiring lead.
Figure 34 is the cut-open view of profile construction of the XXXIV-XXXIV line of expression Figure 33.
Figure 35 amplifies the external connection terminals of touch panel of variation 2 of expression embodiment 2 and the vertical view that is connected structure of wiring lead.
Figure 36 is the cut-open view of profile construction of the XXXVI-XXXVI line of expression Figure 35.
Figure 37 amplifies the vertical view that the connection of the wiring lead of touch panel of variation 3 of expression embodiment 2 and each splicing ear that is connected with its both ends is constructed.
Figure 38 is that the profile construction of the XXXVIIIA-XXXVIIIA line of Figure 37, the cut-open view of the profile construction of the XXXVIIIB-XXXVIIIB line of left side expression Figure 37 are in the drawings represented in the right side in the drawings.
Figure 39 amplifies the external connection terminals of touch panel of variation 4 of expression embodiment 2 and the vertical view that is connected structure of wiring lead.
Figure 40 is the cut-open view of profile construction of the XL-XL line of expression Figure 39.
Figure 41 amplifies the external connection terminals of touch panel of variation 5 of expression embodiment 2 and the vertical view that is connected structure of wiring lead.
Figure 42 is the cut-open view of profile construction of the XLII-XLII line of expression Figure 41.
Figure 43 amplifies the external connection terminals of the touch panel of representing other embodiment and the vertical view that is connected first mode of constructing of wiring lead.
Figure 44 is the cut-open view of profile construction of the XLIV-XLIV line of expression Figure 43.
Figure 45 amplifies the external connection terminals of the touch panel of representing other embodiment and the vertical view that is connected second mode of constructing of wiring lead.
Figure 46 is the cut-open view of profile construction of the XLVI-XLVI line of expression Figure 45.
Figure 47 is the vertical view that amplifies the touch area of the touch panel of representing other embodiment.
Figure 48 is the cut-open view of profile construction of the XLVIII-XLVIII line of expression Figure 47.
Embodiment
Below, based on accompanying drawing embodiments of the present invention are described in detail.In addition, the present invention is not limited to each following embodiment.
" working of an invention mode 1 "
In this embodiment 1, as an example of display device, describe as the liquid crystal indicator S of display panel having display panels DP.
The structure of-liquid crystal indicator S-
The profile construction of expression liquid crystal indicator S among Fig. 1.
Liquid crystal indicator S is the transmissive liquid crystal display device of band touch panel TP, and it comprises: display panels DP; Backlight unit BL, it is the light supply apparatus that is disposed at the rear side of this display panels DP; With touch panel TP, its face side that is arranged at above-mentioned display panels DP i.e. a side opposite with backlight unit BL side.
The structure of＜display panels DP 〉
Display panels DP comprises: the thin film transistor (TFT) (Thin Film Transistor is called TFT below) substrate 1 and the counter substrate 3 that dispose in mutual relative mode; The frame shape encapsulant 5 that two outer peripheral edges portions of these TFT substrates 1 and counter substrate 3 are bonded to each other; Sealed material 5 surrounds and encloses the liquid crystal layer 7 between TFT substrate 1 and the counter substrate 3.
This display panels DP is TFT substrate 1 and counter substrate 3 overlapping areas, and it has the zone that namely is provided with liquid crystal layer 7 in the inboard of encapsulant 5 and carries out the viewing area D that image shows.This viewing area D will be by constituting as the picture element matrix shape ground arrangement of image least unit is a plurality of.In addition, it is outstanding and be exposed to outside terminal area (not shown) from counter substrate 3 that display panels DP has TFT substrate 1 in the outside of viewing area D.Through anisotropic conductive film etc. integrated circuit (IC) chip and wiring substrate etc. are installed in this terminal area, so that input shows and uses signal from external circuit to display panels DP.
Though not shown, TFT substrate 1 comprises: be arranged at as a plurality of gate wirings on the insulativity substrates such as glass substrate of matrix substrate in the mode of extending in parallel to each other; The a plurality of source electrode distributions that arrange in the mode of on the direction of intersecting with this each gate wirings, extending in parallel to each other; Be arranged at the TFT and the pixel electrode that is connected with its drain electrode of these each gate wirings and each cross part of each source electrode distribution in the mode corresponding with each pixel, TFT substrate 1 constitutes: by switching conducting/disconnection of each TFT, selectively the pixel electrode corresponding with this each TFT applied current potential.
Though not shown, counter substrate 3 comprises: with the mode clathrate corresponding with above-mentioned gate wirings and source electrode distribution be arranged at as the black matrix on the insulativity substrates 10 such as glass substrate of matrix substrate; The a plurality of colored filters that constituted by red color layer, green layer and cyan coloring layer between the grid that is arranged at this black matrix in mode corresponding with each pixel and that periodically arrange; Arrange and the common electrode relative with the group of pixel electrodes in the mode that covers these black matrixes and each colored filter; With column be arranged at sensitization sept on this common electrode.
These TFT substrates 1 and counter substrate 3 form for example rectangular-shaped and be respectively arranged with alignment films (not shown) on mutual opposed inside surface.In addition, the outer surface at TFT substrate 1 is respectively arranged with Polarizer (not shown) with the outer surface that is positioned at the touch panel TP on the counter substrate 3.Liquid crystal layer 7 is made of nematic liquid crystalline material with electrooptics characteristic etc.
The structure of＜backlight unit BL 〉
Light emitting diode) or light source such as cold-cathode tube though not shown, backlight unit BL possesses: LED (Light Emitting Diode:; Light guide plate; With a plurality of optical sheets such as prismatic lens, and backlight unit BL constitutes: will penetrate to display panels DP side through each optical sheet as the outgoing plane of uniformly planar light from this light guide plate from the light that light source is incident to light guide plate.
The display action of＜liquid crystal indicator S 〉
In the display panels DP of above-mentioned formation, in each pixel, signal is sent to the grid of TFT through gate wirings, when this TFT becomes conducting state, source signal is sent to the source electrode of TFT through the source electrode distribution, writes the electric charge of regulation through the pixel electrode of this TFT.At this moment, between the common electrode of each pixel electrode of TFT substrate 1 and counter substrate 3, produce potential difference (PD), thereby liquid crystal layer 7 is applied the voltage of regulation.And, in liquid crystal indicator S, change the orientation of liquid crystal molecule according to the size of the voltage that liquid crystal layer 7 is applied, thus, the optical transmission rate from backlight unit BL of regulator solution crystal layer 7, thus image shown.
The structure of＜touch panel TP 〉
The structure of expression touch panel TP in Fig. 2～Fig. 9.Fig. 2 is the approximate vertical view of touch panel TP.Fig. 3 be amplify electrode 11 that the touch location detection of expression touch panel TP uses, 17 with the vertical view that is connected structure of external connection terminals 35.Fig. 4 is the cut-open view of profile construction of the IV-IV line of presentation graphs 3, and Fig. 5 is the cut-open view of profile construction of the V-V line of presentation graphs 3.Fig. 6 amplifies the external connection terminals 35 of expression touch panel TP and the vertical view that is connected structure of wiring lead 31.Fig. 7 is the cut-open view of profile construction of the VII-VII line of presentation graphs 6, and Fig. 8 is the cut-open view of profile construction of the VIII-VIII line of presentation graphs 6, and Fig. 9 is the cut-open view of profile construction of the IX-IX line of presentation graphs 6.
The touch panel TP of present embodiment directly is formed on the outer surface of the counter substrate 3 that constitutes display panels DP, makes the liquid crystal indicator S of band touch panel constitute slim on the whole.Touch panel TP constitutes projection type electrostatic capacitive (projected capacitive) touch panel, as shown in Figure 2, comprising: touch area T1, and it is the zone for detection of the touch location that is contacted by contact (user's finger etc.), for example is rectangular-shaped; Frame region T2, it is the zone that can not detect touch location on every side that is arranged at this touch area T1, for example is rectangular box-like; With terminal area T3, its side at this frame region T2 (right side among Fig. 2) is along the ora terminalis setting of counter substrate 3.Touch area T1 is disposed at the zone corresponding with the viewing area D of display panels DP, and frame region T2 is disposed at the zone corresponding with non-display area.
And touch panel TP comprises: be disposed at the electrode 11,17 that the touch location detection of touch area T1 is used; The a plurality of wiring leads 31 that are electrically connected and on frame region T2, draw from touch area T1 lateral ends subregion T3 side with electrode 11,17 that this touch location detection is used; Be arranged at drawing the destination and being arranged in the external connection terminals 35 of terminal area T3 of this each wiring lead 31; Controller 41, it is the external circuit that is electrically connected with this each external connection terminals 35.
The electrode 11 that＜touch location detection is used, 17 structure 〉
The electrode 11 that touch location detection is used, 17 is by being configured to rectangular a plurality of first electrodes 11 (among Fig. 2, the electrode that blank box is represented), being configured to rectangular a plurality of second electrodes 17 electrode of oblique line (among the Fig. 2 mark) equally and constituting.These first electrodes 11 become cellular with the mode configured in one piece of in an inclined direction alternately arranging with second electrode 17 in Fig. 2.
First electrode 11 forms for example essentially rectangular shape, and in Fig. 2 to make each other bight to the mode on top arranged spaced according to the rules at left and right directions (X-direction) and above-below direction (Y direction).And, as shown in Figure 3, at a plurality of first electrodes 11 that X-direction is arranged, utilize first linking part 13 that adjacent first electrode 11 is connected to each other and form as one, constitute the first electrode group 15.That is, first electrode 11 and first linking part 13 be in alternately configuration of X-direction, by the first electrode group 15 that the row of first electrode 11 that forms as one by this first linking part 13 constitute, arranges multiple row in parallel to each other on Y direction.First electrode 11 and first linking part 13 are made of ITO or IZO etc.
Second electrode 17 also forms for example essentially rectangular shape, and to make each other bight to the mode on top arranged spaced according to the rules in X-direction and Y direction.And, at a plurality of second electrodes 17 that Y direction is arranged, utilize second linking part 19 that adjacent second electrode 17 is connected to each other and be electrically connected, constitute the second electrode group 21.That is, second electrode 17 and second linking part 19 be in alternately configuration of Y direction, arranges multiple row in parallel to each other by the second electrode group 21 that the row of second electrode 17 that is electrically connected through this second linking part 19 constitute on X-direction.Second electrode 17 and second linking part 19 are made of ITO or IZO etc.
As shown in Figure 4, the above-mentioned first electrode group 15 (first electrode 11), first linking part 13 and the second electrode group 21 (second electrode 17) are formed on the outer surface of the insulativity substrate 10 that constitutes counter substrate 3, and are covered by interlayer dielectric film 23.
On the other hand, second linking part 19 is arranged on the interlayer dielectric 23, and the protection dielectric film 25 that is arranged at equally on this interlayer dielectric 23 covers.This second linking part 19 constitutes the bridge formation structure that strides across first linking part 13 across interlayer dielectric 23, and the contact hole 23a of the both ends of second linking part 19 through being formed at this interlayer dielectric 23 is connected with the bight of second electrode 17.
Like this, in the present embodiment, the first electrode group 15 and the second electrode group 21 are arranged at on one deck, therefore, the variation of the electrostatic capacitance that forms between first electrode 11 of touch location and contacts such as second electrode 17 and finger are produced with degree ground.Thus, can reduce in first electrode 11 and 17 poor sensitivity to electrostatic capacitance change of second electrode, can carry out the detection of the good touch location of sensitivity.
In addition, in the present embodiment, the first electrode group 15 (first electrode 11), first linking part 13 and the second electrode group 21 (second electrode 17) constitute first conductive pattern that touch location detection of the present invention is used, and second linking part 19 constitutes second conductive pattern that touch location detection of the present invention is used.
In addition, protection dielectric film 25 is by being protected dielectric film 27 and protect dielectric film 29 to be laminated by second of the formations such as organic insulation of acrylic (acrylic base) by first of silicon nitride (SiN) formations of etc.ing, and with interlayer dielectric 23 coverings.In terminal area T3, do not form these interlayer dielectrics 23 and protection dielectric film 25, and make above-mentioned each external connection terminals 35 be exposed to the outside.
The structure of＜wiring lead 31 〉
As shown in Figure 3, wiring lead 31 extends to the front of terminal area T3 from the periphery of touch area T1.This wiring lead 31 is covered by interlayer dielectric film 23 and protection dielectric film 25, and as shown in Figure 6, the configured in one piece of wiring lead 31 is in than two dielectric films 23,25 outer rim in the inner part.Thus, utilize interlayer dielectric 23 and protection dielectric film 25 these 2 layers of dielectric films prevention moistures etc. to enter wiring lead 31 sides from the outside, can prevent the corrosion of wiring lead 31 well.
Wiring lead 31 is by stacking gradually for example molybdenum niobium alloy (MoNb) layer, aluminium (Al) layer and molybdenum niobium alloy (MoNb) layer, perhaps molybdenum nitride (MoN) layer, aluminium (Al) layer and molybdenum nitride (MoN) layer, perhaps molybdenum (Mo) layer, aluminium (Al) layer and molybdenum (Mo) layer form.
The base end part 31a that draws at wiring lead 31 is connected with the inside splicing ear 33 that is connected with the first electrode group 15 or the second electrode group 21.On the other hand, the leading section 31b that draws at wiring lead 31 is connected with said external splicing ear 35.
As shown in Figure 3, inner splicing ear 33 is arranged a plurality of along the periphery of touch area T1.First electrode 11 of these each inner splicing ears 33 and a side's who is positioned at the first electrode group 15 end or form as one with second electrode 17 of a side's who is positioned at the second electrode group 21 end, as shown in Figure 5, these each inner splicing ears 33 are arranged at the lower floor of wiring lead 31 and are connected with the downside surface of wiring lead 31.
As shown in Figure 3, external connection terminals 35 leads to the outside of interlayer dielectric 23 and protection dielectric film 25 and has a plurality of in terminal area T3 dense arrangement.As Fig. 6～shown in Figure 9, these each external connection terminals 35 are made of the first articulamentum 36A and the second articulamentum 36B, and these first articulamentum 36A and the second articulamentum 36B have the structure that is connected in parallel that is connected in parallel with wiring lead 31.
The first articulamentum 36A is arranged at the lower floor of wiring lead 31 and is connected with the downside surface of wiring lead 31, and the first articulamentum 36A extends to the terminal area T3 outside this zone from the zone that is provided with interlayer dielectric 23 and protection dielectric film 25.On the other hand, the second articulamentum 36B is being arranged on the interlayer dielectric 23 with the overlapping position of wiring lead 31, is being connected with the uper side surface of wiring lead 31 with the overlapping contact hole 23b of position through being formed at interlayer dielectric 23 of the first articulamentum 36A.This second articulamentum 36B also extends to the terminal area T3 outside this zone from the zone that is provided with interlayer dielectric 23 and protection dielectric film 25.And as Fig. 8 and shown in Figure 9, external connection terminals 35 is by being laminated the first articulamentum 36A and the second articulamentum 36B at terminal area T3.
Utilize this structure that is connected in parallel, can reduce the resistance of external connection terminals 35 well.That is, external connection terminals 35 is made of the first articulamentum 36A and the second articulamentum 36B that are connected in parallel with wiring lead 31, therefore, its resistance become the inverse of resistance value of the first articulamentum 36A and the second articulamentum 36B resistance value inverse and.Thus, compare with the situation that this individual layer that is made of same transparent conductive oxides such as ITO or IZO that external connection terminals 35 utilizes with wiring lead 31 is connected in series constitutes, can make the resistance low resistanceization of this external connection terminals 35.
And, external connection terminals 35 has the lit-par-lit structure that the first articulamentum 36A and the second articulamentum 36B are laminated at terminal area T3, therefore, in this lit-par-lit structure part, compare with the situation that this external connection terminals 35 utilizes the individual layer that is made of same transparent conductive oxides such as ITO or IZO to constitute, the layer that constitutes this external connection terminals 35 has thickened the one deck that has more, and can make its resistance low resistanceization well.
The back is described in detail, the first articulamentum 36A and the first electrode group 15 (first electrode 11), first linking part 13, the second electrode group 21 (second electrode 17) and inner splicing ear 33 are formed by same film, and the second articulamentum 36B and second linking part 19 are formed by same film.
The structure of＜controller 41 〉
(Tape Automated Bonding: the drive integrated circult automatic combination of winding) is installed among the terminal area T3 controller 41 as for example being called as TAB.As testing circuit 43, controller 41 possesses electrostatic capacitance detection circuit or impedance detection circuit, this electrostatic capacitance detection circuit detects because touch area T1 is touched body touches the electrostatic capacitance that produces between first electrode 11 that is in touch location and second electrode 17 and contact variation, and this impedance detection circuit detects the variation of the impedance that produces separately at first electrode 11 that is in touch location and second electrode 17 because being touched.And controller 41 constitutes: by testing circuit 43 detected signals from each external connection terminals 35, detect the touch location of contact of touch area T1 and the shift action of this touch location by relatively.
-manufacture method-
Then, being listed as the manufacture method of giving one example to above-mentioned touch panel TP and liquid crystal indicator DP with reference to Figure 10 describes.In the present embodiment, illustrate and respectively make a TFT substrate 1 and counter substrate 3, and make these two substrates 1,3 applyings make the manufacture method of the single sided board mode of 1 display panels DP, also go for comprising by making the generatrix plate of a plurality of unit of cells, and cut apart this generatrix plate by each unit of cells, thereby make the manufacture method of the multiaspect plate mode of a plurality of display panels DP simultaneously.
Figure 10 is the process flow diagram of the manufacture method of liquid crystal indicator S.The manufacture method of liquid crystal indicator S comprises the St1 of touch panel manufacturing process, the St2 of counter substrate manufacturing process, the TFT substrate St3 of manufacturing process, bonding process St4 and modularization operation St5.
The St1 of＜touch panel manufacturing process 〉
On insulativity substrates 10 such as pre-prepd glass substrate, carry out known photoetching repeatedly; form first electrode 11, first linking part 13, second electrode 17, inner splicing ear 33, wiring lead 31, interlayer dielectric 23, second linking part 19, external connection terminals 35 (the first articulamentum 36A and the second articulamentum 36B) and protection dielectric film 25; thus, make touch panel TP.
The St2 of＜counter substrate manufacturing process 〉
Substrate 10 rear side at touch panel TP form black matrix, colored filter, common electrode and sensitization sept according to the known method of carrying out photoetching repeatedly, thus, make the counter substrate 3 of band touch panel TP.
＜TFT substrate the St3 of manufacturing process 〉
On insulativity substrates such as pre-prepd glass substrate, form gate wirings, source electrode distribution, TFT and pixel electrode according to the known method of carrying out photoetching repeatedly, thus, make TFT substrate 1.
＜bonding process St4 〉
By print process after the surface of TFT substrate 1 and counter substrate 3 forms alignment films, carry out milled processed as required.Then, depict encapsulant 5 as the frame shape by divider (dispenser) etc., and to the drip liquid crystal material of ormal weight of the medial region of sealing material 5.And, make TFT substrate 1 and counter substrate 3 across encapsulant 5 and liquid crystal material under reduced pressure fit constitute liquid crystal layer 7 after, the fitting body after this applying is placed under the atmospheric pressure, thus, pressurizeed in the surface of fitting body.Under this state, further by ultraviolet irradiation or heat treated encapsulant 5 is solidified, thus, and bonding TFT substrate 1 and counter substrate 3, thus display panels DP made.
Then, between TFT substrate 1 and counter substrate 3, exist under the situation in gap in encapsulant 5 outsides, as required to this gap packing matcrial 5 and make it to solidify this gap of landfill.Then, be respectively that the outer surface of TFT substrate 1 and the outer surface of the touch panel TP on the counter substrate 3 attach Polarizer on the two sides of above-mentioned fitting body.
＜modularization operation St5 〉
At the terminal area T3 of display panels DP integrated circuit (IC) chip and wiring substrate are installed through anisotropic conductive film etc.In addition, the terminal area T3 at touch panel TP installs controller 41.And, in the rear side of display panels DP backlight unit BL is installed.Like this, with display panels DP, backlight unit BL and touch panel TP modularization.
By carrying out above operation, can make the liquid crystal indicator S of band touch panel TP shown in Figure 1.
Liquid crystal indicator S of the present invention especially has feature in the structure of touch panel TP, therefore, is described in detail below with reference to the touch panel St1 of manufacturing process of Figure 11～Figure 15.The St1 of touch panel manufacturing process comprises first pattern and forms operation～the 5th pattern formation operation.Figure 11～Figure 15 represents that successively first pattern of the St1 of touch panel manufacturing process forms operation～the 5th pattern and forms operation.
＜the first pattern forms operation 〉
At first, shown in Figure 11 (a), form the nesa coating 51 that is for example constituted by ITO or IZO by sputtering method at insulativity substrate 10.And, form by using first photomask that this nesa coating 51 is carried out pattern, shown in Figure 11 (b), form first electrode 11, first linking part 13, second electrode 17, inner splicing ear 33 and the first articulamentum 36A, constitute the first electrode group 15 and the second electrode group 21.
＜the second pattern forms operation 〉
On the substrate that is formed with the first electrode group 15 (first electrode 11), first linking part 13, the second electrode group 21 (second electrode 17), inner splicing ear 33 and the first articulamentum 36A, form for example molybdenum niobium alloy (MoNb) film, aluminium (Al) film and molybdenum niobium alloy (MoNb) film by sputtering method successively in the mode that covers them, perhaps molybdenum nitride (MoN) film, aluminium (Al) film and molybdenum nitride (MoN) film, perhaps molybdenum (Mo) film, aluminium (Al) film and molybdenum (Mo) film, thus the metal stacking film 53 shown in Figure 12 (a) formed.Then, form by using second photomask that this metal stacking film 53 is carried out pattern, shown in Figure 12 (b), so that an end is connected and the other end and inner splicing ear 33 overlapping ways of connecting formation wiring leads 31 with the first articulamentum 36A is overlapping.
＜the three pattern forms operation 〉
On the substrate that is formed with wiring lead 31, by chemical vapor deposition (Chemical Vapor Deposition, be called CVD below) method, to cover the mode of the first electrode group 15 (first electrode 11), first linking part 13, the second electrode group 21 (second electrode 17), inner splicing ear 33, the first articulamentum 36A and wiring lead 31, form the dielectric film 54 that is for example constituted by silicon nitride (SiN) shown in Figure 13 (a).Then, form by using the 3rd photomask that this dielectric film 54 is carried out pattern, shown in Figure 13 (b), form contact hole 23a, 23b at this dielectric film 54, the bight of second electrode 17 and the leading section 31b that draws of wiring lead 31 are exposed partly, and remove the dielectric film part that is in terminal area T3, the first articulamentum 36A is exposed from this dielectric film 54, and form interlayer dielectric 23 by dielectric film 54.
＜the four pattern forms operation 〉
On the substrate that is formed with interlayer dielectric 23, by sputtering method, shown in Figure 14 (a), like that, form the nesa coating 55 that is for example constituted by ITO or IZO.And, form by using the 4th photomask that this nesa coating 55 is carried out pattern, shown in Figure 14 (b), to form second linking part 19 through contact hole 23a and second electrode, 17 ways of connecting, to be connected with wiring lead 31 through contact hole 23b and to form the second articulamentum 36B in the mode that terminal area T3 covers the first articulamentum 36A, constitute external connection terminals 35.
＜the five pattern forms operation 〉
On the substrate that is formed with second linking part 19 and the second articulamentum 36B, form first dielectric film 57 that is for example constituted by silicon nitride (SiN) in the mode that covers them by the CVD method.Then, by spin-coating method or slit coating method, shown in Figure 15 (a), form second dielectric film 58 that the organic insulation by acrylic constitutes at first dielectric film 57, form stacked dielectric film 59.And; form by using the 5th photomask that this protection dielectric film 25 is carried out pattern, shown in Figure 15 (b), remove the stacked dielectric film part that is in terminal area T3; external connection terminals 35 is exposed from this stacked dielectric film 59, and form protection dielectric film 25 by stacked dielectric film 59.
In addition; form in the operation at the 5th pattern; in the lump the first protection dielectric film 27 and the second protection dielectric film 29 are carried out pattern formation; but also can be after utilizing the photoetching of using the 5th photomask to form the second protection dielectric film 29; this second protection dielectric film 29 as the mask etching first protection dielectric film 27, is carried out pattern thus and forms.
By above operation, can make touch panel TP.
The effect of-embodiment 1-
According to this embodiment 1, external connection terminals 35 has the structure that is connected in parallel that is made of the first articulamentum 36A that is connected in parallel with wiring lead 31 and the second articulamentum 36B, and has the lit-par-lit structure that the first articulamentum 36A and the second articulamentum 36B are laminated at terminal area T3, therefore, compare with the situation that this individual layer that is made of same transparent conductive oxides such as ITO or IZO that external connection terminals 35 utilizes with wiring lead 31 is connected in series constitutes, can reduce the resistance of external connection terminals 35 well.
In addition, the first articulamentum 36A and first electrode 11 and second electrode 17 etc. are formed by same film, the second articulamentum 36B and second linking part 19 are formed by same film, therefore, do not increase manufacturing process and just external connection terminals 35 can be made the above-mentioned structure that is connected in parallel.
Therefore, do not increase manufacturing cost, just can reduce the resistance of external connection terminals 35.Thus, the poor flow of the first electrode group 15 and the second electrode group 21 and controller 41 can be prevented, good touch location detection function can be accessed.Its result can realize at an easy rate by using contacts such as finger or pen to carry out the liquid crystal indicator S that information just can be correctly imported in various operations.
" variation 1 of embodiment 1 "
Figure 16 amplifies the external connection terminals 35 of the touch panel TP that represents this variation 1 and the vertical view that is connected structure of wiring lead 31.Figure 17 is the cut-open view of profile construction of the XVII-XVII line of expression Figure 16.
In above-mentioned embodiment 1, the contact hole 23b of the second articulamentum 36B through being formed at interlayer dielectric 23 of external connection terminals 35 is connected with wiring lead 31, but in this variation, replace contact hole 23b, form for example rectangular-shaped notch part 23c that opens to the outer rim outside of this interlayer dielectric 23 at interlayer dielectric 23, and the second articulamentum 36B is connected with wiring lead 31 through this notch part 23c.
The effect of the variation 1 of-embodiment 1-
According to variation 1, compare with the situation that wiring lead 31 is connected with the above-mentioned embodiment 1 contact hole 23a of such second articulamentum 36B through being formed at interlayer dielectric 23, the contact area of the second articulamentum 36B and wiring lead 31 has increased the amount that notch part 23c opens to the outer rim outside of interlayer dielectric 23, therefore, can reduce contact resistance between these second articulamentum 36B and the wiring lead 31.Thus, can prevent the poor flow of external connection terminals 35 and wiring lead 31 well.
" variation 2 of embodiment 1 "
Figure 18 amplifies the external connection terminals 35 of the touch panel TP that represents this variation 2 and the vertical view that is connected structure of wiring lead 31.Figure 19 is the cut-open view of profile construction of the XIX-XIX line of expression Figure 18.
In above-mentioned embodiment 1, the configured in one piece of wiring lead 31 is in the inboard of interlayer dielectric 23, but in this variation, the leading section 31b that draws of wiring lead 31 extends to the terminal area T3 outside it from interlayer dielectric 23 and protection dielectric film 25 partly.And the second articulamentum 36B covers the integral body of the extension of wiring lead 31.
The effect of the variation 2 of-embodiment 1-
According to this variation 2, though the extension of wiring lead 31 is positioned at the outside of interlayer dielectric 23 and protection dielectric film 25, it is damp proof etc. that the second articulamentum 36B by the covering extension carries out, thereby be not easy to be corroded.And, the leading section 31b that draws at such wiring lead 31 extends in the structure in dielectric film 23,25 the outside at least partly, the structure that is accommodated in dielectric film 23,25 inboard with the integral body of wiring lead 31 is compared, frame region T2 that can constriction terminal area T3 side.
" variation 3 of embodiment 1 "
Figure 20 is the vertical view that wiring lead 31 and each splicing ear 33 that is connected with its both ends of amplifying the touch panel TP of this variation 3 of expression, 35 connection are constructed.Figure 21 is the cut-open view of the profile construction of the XXIB-XXIB line of left side expression Figure 20 among the XXIA-XXIA line of Figure 20 is represented on the right side among the figure profile construction, the figure.
In above-mentioned embodiment 1, wiring lead 31 is laminated by a plurality of metal levels of pattern formation in the lump, but in this variation, wiring lead 31 is by downside wiring layer 32A and upside wiring layer 32B is stacked constitutes, this downside wiring layer 32A and the first electrode group 15 (first electrode 11), first linking part 13 and the second electrode group 21 (second electrode 17) are formed by same film, this upside wiring layer 32B is by constituting with the same a plurality of metal levels (for example, MoNb/Al/MoNb, MoN/Al/MoN or Mo/Al/Mo) of the wiring lead 31 of above-mentioned embodiment 1.
Downside wiring layer 32A and inner splicing ear 33 and the first articulamentum 36A form as one, and these inner splicing ears 33 and the first articulamentum 36A are linked.In this variation, downside wiring layer 32A constitutes first wiring layer of the present invention, and upside wiring layer 32B constitutes second wiring layer of the present invention.
This touch panel TP can form in the operation by first pattern at above-mentioned embodiment 1 and form downside wiring layer 32A by nesa coating 51 in the lump with first electrode 11 and second electrode 17 etc., forms upside wiring layer 32B and make in second pattern formation operation.
The effect of the variation 3 of-embodiment 1-
According to this variation 3, wiring lead 31 has the lit-par-lit structure that is made of downside wiring layer 32A and upside wiring layer 32B, therefore, with above-mentioned embodiment 1 like that only with by comparing with the situation that layer that the same metal material of upside wiring layer 32B constitutes constitutes, the layer that constitutes this wiring lead 31 has thickened the one deck (downside wiring layer 32A) that has more.Thus, can make wiring lead 31 low resistanceizations.Its result can further prevent the poor flow of the first electrode group 15 and the second electrode group 21 and controller 41 reliably.
In addition, downside wiring layer 32A and first electrode 11 and second electrode 17 etc. are formed by same film, therefore, can form simultaneously with first electrode 11 and second electrode 17 etc., do not increase manufacturing process and just can finish.
" variation 4 of embodiment 1 "
Figure 22 amplifies the external connection terminals 35 of the touch panel TP that represents this variation 4 and the vertical view that is connected structure of wiring lead 31.Figure 23 is the cut-open view of profile construction of the XXIII-XXIII line of expression Figure 22.
In above-mentioned embodiment 1, in terminal area T3, do not form interlayer dielectric 23, but in this variation, in terminal area T3, be formed with interlayer dielectric 23 yet.In this variation, protection dielectric film 25 is not formed among the terminal area T3 yet, and the first articulamentum 36A and the second articulamentum 36B extend to the terminal area T3 in the outside of protection dielectric film 25 from protection dielectric film 25.The second articulamentum 36B also is arranged on the interlayer dielectric 23 in terminal area T3, and the contact hole 23d through being formed at this interlayer dielectric 23 is connected with the first articulamentum 36A.
The effect of the variation 4 of-embodiment 1-
According to this variation 4, external connection terminals 35 also has the structure that is connected in parallel that is made of the first articulamentum 36A that is connected in parallel with wiring lead 31 and the second articulamentum 36B, therefore, do not increase manufacturing cost, just can reduce the resistance of external connection terminals 35, thereby obtain good touch location detection function.
" variation 5 of embodiment 1 "
Figure 24 amplifies the external connection terminals 35 of the touch panel TP that represents this variation 5 and the vertical view that is connected structure of wiring lead 31.Figure 25 is the cut-open view of profile construction of the XXV-XXV line of Figure 24.
In above-mentioned embodiment 1, the second articulamentum 36B is being connected with wiring lead 31 with the overlapping position of the first articulamentum 36A, but in this variation, the first articulamentum 36A and the second articulamentum 36B are electrically connected at different mutually positions with above-mentioned wiring lead 31.
Particularly, the contact hole 23b that draws leading section 31b that reaches wiring lead 31 is formed at the inside line (left-hand portion among Figure 24 and Figure 25) by interlayer dielectric 23 than the first articulamentum 36A, and the second articulamentum 36B is being connected with wiring lead 31 through this contact hole 23b by inboard (drawing basic side) than the first articulamentum 36A.
This touch panel TP can form by the 3rd pattern at above-mentioned embodiment 1 in the operation, with than the first articulamentum 36A by the overlapping position of the wiring lead 31 of interlayer dielectric 23 inboards so that the mode that leading section 31b exposes partly of drawing of wiring lead 31 forms contact hole 23b, in the 4th pattern forms operation, make to form the second articulamentum 36B through contact hole 23b and wiring lead 31 ways of connecting.
The effect of the variation 5 of-embodiment 1-
According to this variation 5, external connection terminals 35 also has the structure that is connected in parallel that is made of the first articulamentum 36A that is connected in parallel with wiring lead 31 and the second articulamentum 36B, therefore, do not increase manufacturing cost, just can reduce the resistance of external connection terminals 35, thereby obtain good touch location detection function.
" working of an invention mode 2 "
Figure 26 is the vertical view that wiring lead 31 and each splicing ear 33 that is connected with its both ends of amplifying the touch panel TP of this embodiment 2 of expression, 35 connection are constructed.Figure 27 is the cut-open view of profile construction of the XXVII-XXVII line of expression Figure 26.Figure 28 is that the profile construction of the XXVIIIA-XXVIIIA line of Figure 26 is represented on the right side in the drawings, in the drawings the cut-open view of the profile construction of the XXVIIIB-XXVIIIB line of left side expression Figure 26.
In the present embodiment, the structure of touch panel TP is different with above-mentioned embodiment 1 part, in addition similarly constitutes with above-mentioned embodiment 1, therefore, only the different touch panel of structure is partly described.In addition, in the embodiment afterwards, to the structure position mark prosign identical with Fig. 1～Figure 25, and the explanation of quoting above-mentioned embodiment 1, omit its detailed explanation.
In above-mentioned embodiment 1, the first articulamentum 36A of external connection terminals 35 is arranged at the lower floor of wiring lead 31 with inner splicing ear 33 and is connected with the downside surface of wiring lead 31, but in the present embodiment, these first articulamentums 36A is arranged at the upper strata of wiring lead 31 with inner splicing ear 33 and is connected with the uper side surface of wiring lead 31.
The first articulamentum 36A forms in the mode of the terminal area T3 side of drawing leading section 31b of covering wiring lead 31.On the other hand, the second articulamentum 36B is being connected with the first articulamentum 36A with the overlapping contact hole 23b of position through being formed at interlayer dielectric 23 of wiring lead 31, and is electrically connected with wiring lead 31 through this first articulamentum 36A.And, with above-mentioned embodiment 1 similarly, these first articulamentum 36A and the second articulamentum 36B extend to terminal area T3 and stacked mutually.
-manufacture method-
Then, with reference to Figure 29～Figure 32 the method for the touch panel TP of manufacturing present embodiment is described.With above-mentioned embodiment 1 similarly, the St1 of touch panel manufacturing process that makes above-mentioned touch panel TP comprises first pattern and forms operation～the 5th pattern and form operation.Figure 29～Figure 32 represents that successively first pattern forms operation～the 4th pattern and forms operation.In these Figure 29～Figure 32, presentation graphs 5 suitable positions, left side among the figure, presentation graphs 9 corresponding positions in right side among the figure.In addition, the 5th pattern formation operation and above-mentioned embodiment are same, therefore, omit its detailed explanation.
＜the first pattern forms operation 〉
At first, pass through sputtering method, on pre-prepd insulativity substrate 10, form for example molybdenum niobium alloy (MoNb) film, aluminium (Al) film and molybdenum niobium alloy (MoNb) film successively, perhaps molybdenum nitride (MoN) film, aluminium (Al) film and molybdenum nitride (MoN) film, perhaps molybdenum (Mo) film, aluminium (Al) film and molybdenum (Mo) film, shown in Figure 29 (a), form metal stacking film 53.And, form by using first photomask that this metal stacking film 53 is carried out pattern, shown in Figure 29 (b), form wiring lead 31.
＜the second pattern forms operation 〉
On the substrate that is formed with wiring lead 31, to cover the mode of wiring lead 31, form the nesa coating 51 that is for example constituted by ITO or IZO shown in Figure 30 (a) by sputtering method.Then, form by using first photomask that this nesa coating 51 is carried out pattern, shown in Figure 30 (b), form first electrode 11, first linking part 13, second electrode 17, constitute the first electrode group 15 and the second electrode group, and with will with wiring lead 31 parts overlappingly ways of connecting form inner splicing ear 33 and the first articulamentum 36A.
＜the three pattern forms operation 〉
On the substrate that is formed with first electrode 11, first linking part 13, second electrode 17, inner splicing ear 33 and the first articulamentum 36A, to cover the mode of they and wiring lead 31, form the dielectric film 54 that is for example constituted by silicon nitride (SiN) shown in Figure 31 (a) by the CVD method.Then, form by using the 3rd photomask that this dielectric film 54 is carried out pattern, shown in Figure 31 (b), form contact hole 23a, 23b at this dielectric film 54, and the bight of second electrode 17 is exposed, and at the overlapping position of leading section 31b of drawing with wiring lead 31 the first articulamentum 36A is exposed partly.Meanwhile, remove the dielectric film part that is in terminal area T3, the first articulamentum 36A is exposed from this dielectric film 54, and form interlayer dielectric 23 by dielectric film 54.
＜the four pattern forms operation 〉
By sputtering method, shown in Figure 32 (a), like that, form the nesa coating 55 that is for example constituted by ITO or IZO at the substrate that is formed with interlayer dielectric 23.And, using the 4th photomask that this nesa coating 55 is carried out pattern forms, thus, shown in Figure 32 (b), to form second linking part 19 through contact hole 23a and second electrode, 17 ways of connecting, and be connected with the first articulamentum 36A and form the second articulamentum 36B at terminal area T3 in the mode that covers this first articulamentum 36A through contact hole 23b, thereby constitute external connection terminals 35.
Then, by carrying out forming operation with same the 5th pattern of above-mentioned embodiment 1, can make the touch panel TP of present embodiment.
The effect of-embodiment 2-
According to embodiment 2, external connection terminals 35 also has the structure that is connected in parallel that is made of the first articulamentum 36A that is connected in parallel with wiring lead 31 and the second articulamentum 36B, and has the lit-par-lit structure that the first articulamentum 36A and the second articulamentum 36B are laminated at terminal area T3, therefore, can access the effect same with above-mentioned embodiment 1.
" variation 1 of embodiment 2 "
Figure 33 amplifies the external connection terminals 35 of the touch panel TP that represents this variation 1 and the vertical view that is connected structure of wiring lead 31.Figure 34 is the cut-open view of profile construction of the XXXIV-XXXIV line of expression Figure 33.
In above-mentioned embodiment 2, illustrate the structure that the contact hole 23b of the second articulamentum 36B through being formed at interlayer dielectric 23 of external connection terminals 35 is connected with the first articulamentum 36A, but in this variation, replace contact hole 23a, be formed with for example rectangular-shaped notch part 23c that opens to the outer rim of this interlayer dielectric 23 outside at interlayer dielectric 23, the second articulamentum 36B is being connected with the first articulamentum 36A with the overlapping position of wiring lead 31 through this notch part 23c.
The effect of the variation 1 of-embodiment 2-
According to variation 1, compare with the situation that the contact hole 23b of wiring lead 31 through being formed at interlayer dielectric 23 is connected with above-mentioned embodiment 1 such second articulamentum 36B, the contact area of the second articulamentum 36B and wiring lead 31 has increased the amount that notch part 23c opens to the outer rim outside of interlayer dielectric 23, therefore, can reduce contact resistance between the second articulamentum 36B and the wiring lead 31.Thus, can prevent the poor flow of external connection terminals 35 and wiring lead 31 well.
" variation 2 of embodiment 2 "
Figure 35 amplifies the external connection terminals 35 of the touch panel TP that represents this variation 2 and the vertical view that is connected structure of wiring lead 31.Figure 36 is the cut-open view of profile construction of the XXXVI-XXXVI line of expression Figure 35.
In above-mentioned embodiment 2; illustrate the configured in one piece of wiring lead 31 in the structure of the inboard of interlayer dielectric 23; but in this variation, wiring lead 31 draw leading section 31b extends to its outside partly from interlayer dielectric 23 and protection dielectric film 25 terminal area T3.And the first articulamentum 36A and the second articulamentum 36B cover the integral body of the extension of wiring lead 31.
The effect of the variation 2 of-embodiment 2-
According to this variation 2; though the extension of wiring lead 31 is positioned at the outside of interlayer dielectric 23 and protection dielectric film 25; but it is damp proof etc. that the first articulamentum 36A of extension that can be by covering wiring lead 31 and the second articulamentum 36B come, thereby be not easy to be corroded.And, the leading section 31b that draws at wiring lead 31 like this extends in the structure in dielectric film 23,25 the outside at least partly, the structure that is accommodated in dielectric film 23,25 inboard with the integral body of wiring lead 31 is compared, and the frame region T2 of terminal area T3 side is narrowed down.
" variation 3 of embodiment 2 "
Figure 37 is the vertical view that wiring lead 31 and each splicing ear 33 that is connected with its both ends of amplifying the touch panel TP of this variation 3 of expression, 35 connection are constructed.Figure 38 is the cut-open view of the profile construction of the XXXVIIIB-XXXVIIIB of left side expression Figure 37 among the XXXVIIIA-XXXVIIIA line of Figure 37 is represented on the right side among the figure profile construction, the figure.
In above-mentioned embodiment 2, same with above-mentioned embodiment 1, wiring lead 31 is structures that a plurality of metal levels of only being formed by pattern in the lump constitute, but in this variation, and wiring lead 31 is by downside wiring layer 32A and upside wiring layer 32B is stacked constitutes.This downside wiring layer 32A by with the same a plurality of metal levels of the wiring lead 31 of above-mentioned embodiment 2 (for example, MoNb/Al/MoNb, MoN/Al/MoN or Mo/Al/Mo) constitute, this upside wiring layer 32B and the first electrode group 15 (first electrode 11), first linking part 13, the second electrode group 21 (second electrode 17) and inner splicing ear 33 are formed by same film.
Upside wiring layer 32B and inner splicing ear 33 and the first articulamentum 36A form as one, and these inner splicing ears 33 and the first articulamentum 36A are linked.In this variation, downside wiring layer 32A constitutes second wiring layer of the present invention, and upside wiring layer 32B constitutes first wiring layer of the present invention.
This touch panel TP can form by first pattern at above-mentioned embodiment 2 and form downside wiring layer 32A in the operation, forms upside wiring layer 32B by nesa coating 51 in the lump with first electrode 11 and second electrode 17 etc. and make in second pattern formation operation.
The effect of the variation 3 of-embodiment 2-
According to this variation 3, wiring lead 31 has the lit-par-lit structure that is made of downside wiring layer 32A and upside wiring layer 32B, therefore, with above-mentioned embodiment 1 like that only by comparing with the situation that layer that the same metal material of downside wiring layer 32A constitutes constitutes, the layer that constitutes this wiring lead 31 has thickened the one deck (upside wiring layer 32B) that has more.Thus, can make wiring lead 31 low resistanceizations.Its result can further prevent the poor flow of the first electrode group 15 and the second electrode group 21 and controller 41 reliably.
In addition, upside wiring layer 32B and first electrode 11 and second electrode 17 etc. are formed by same film, therefore, can form in the lump with first electrode 11 and second electrode 17 etc., do not increase manufacturing process and just can finish.
" variation 4 of embodiment 2 "
Figure 39 amplifies the external connection terminals 35 of the touch panel TP that represents this variation 4 and the vertical view that is connected structure of wiring lead 31.Figure 40 is the cut-open view of profile construction of the XL-XL line of Figure 39.
In above-mentioned embodiment 2, illustrate the structure that in terminal area T3, does not form interlayer dielectric 23, but in this variation, even in terminal area T3, also be formed with interlayer dielectric 23.In this variation, protection dielectric film 25 is not formed among the terminal area T3 yet, and the first articulamentum 36A and the second articulamentum 36B extend to the terminal area T3 in its outside from protection dielectric film 25.The second articulamentum 36B also is arranged on the interlayer dielectric 23 in terminal area T3, and the contact hole 23d through being formed at this interlayer dielectric 23 is connected with the first articulamentum 36A.
The effect of the variation 4 of-embodiment 2-
According to this variation 4, external connection terminals 35 has the structure that is connected in parallel that is made of the first articulamentum 36A that is connected in parallel with wiring lead 31 and the second articulamentum 36B, therefore, do not increase manufacturing cost, just can reduce the resistance of external connection terminals 35, thereby obtain good touch location detection function.
" variation 5 of embodiment 2 "
Figure 41 amplifies the external connection terminals 35 of the touch panel TP that represents this variation 5 and the vertical view that is connected structure of wiring lead 31.Figure 42 is the cut-open view of profile construction of the XLII-XLII line of expression Figure 41.
In above-mentioned embodiment 2, illustrate the second articulamentum 36B in the structure that is connected with wiring lead 31 with the overlapping position of the first articulamentum 36A, but in this variation, the first articulamentum 36A is electrically connected with above-mentioned wiring lead 31 at mutual different position with the second articulamentum 36B.Particularly, the contact hole 23b that draws leading section 31b that arrives wiring lead 31 is formed at the inside line (left-hand portion among Figure 41 and Figure 42) by interlayer dielectric 23 than the first articulamentum 36A, and the second articulamentum 36B is being connected with wiring lead 31 by the position of inboard (drawing basic side) than the first articulamentum 36A through this contact hole 23b.
This touch panel TP can form by the 3rd pattern at above-mentioned embodiment 2 in the operation, with than the first articulamentum 36A by the overlapping position of the wiring lead 31 of interlayer dielectric 23 inboards so that the mode that leading section 31b exposes partly of drawing of wiring lead 31 forms contact hole 23b, in the 4th pattern forms operation, make to form the second articulamentum 36B through contact hole 23b and wiring lead 31 ways of connecting.
The effect of the variation 5 of-embodiment 2-
According to this variation 5, external connection terminals 35 has the structure that is connected in parallel that is made of the first articulamentum 36A that is connected in parallel with wiring lead 31 and the second articulamentum 36B, therefore, do not increase manufacturing cost, just can reduce the resistance of external connection terminals 35, thereby obtain good touch location detection function.
" other embodiment "
For above-mentioned embodiment 1,2 and their variation, also can be following structure and manufacture method.
The configuration of＜wiring lead 31 〉
Wiring lead 31 and each splicing ear 33 that is connected with its both ends of the touch panel TP of other embodiment of expression among Figure 43～Figure 46,35 connection are constructed.
Figure 43 is the cut-open view of expression wiring lead 31 and each splicing ear 33 that is connected with its both ends, 35 connection first mode of constructing.Figure 44 is that the profile construction of the XLVIA-XLVIA line of Figure 43 is represented on the right side in the drawings, in the drawings the cut-open view of the profile construction of the XLVIB-XLVIB line of left side expression Figure 43.Figure 45 is the cut-open view of expression wiring lead 31 and each splicing ear 33 that is connected with its both ends, 35 connection second mode of constructing.Figure 46 is that the profile construction of the XLVIA-XLVIA line of Figure 45 is represented on the right side in the drawings, in the drawings the cut-open view of the profile construction of the XLVIB-XLVIB line of left side expression Figure 46.
Above-mentioned embodiment 1,2 and their variation in, the structure that the lower floor at interlayer dielectric 23 is provided with wiring lead 31 is illustrated, but the invention is not restricted to this.For example, as Figure 43 and shown in Figure 44, also can be provided with wiring lead 31 on the upper strata of interlayer dielectric 23, the contact hole 23b of this wiring lead 31 through being formed at interlayer dielectric 23 is connected with the first articulamentum 36A, and the second articulamentum 36B is arranged at the upper strata of wiring lead 31 and is connected with the uper side surface of wiring lead 31.In this case, for example, wiring lead 31 is being connected with inner splicing ear 33 with the contact hole 23e of the overlapping position of base end part 31a through being formed at interlayer dielectric 23 that draw of wiring lead 31.
In addition, also can be as Figure 45 and shown in Figure 46, the second articulamentum 36B is arranged at the lower floor of wiring lead 31 and is connected with its downside surface, and the first articulamentum 36A is electrically connected with wiring lead 31 through the second articulamentum 36B.
Even each above-mentioned structure, external connection terminals 35 also has the structure that is connected in parallel that is made of the first articulamentum 36A that is connected in parallel with wiring lead 31 and the second articulamentum 36B, therefore, do not increase manufacturing cost, just can reduce the resistance of external connection terminals 35, thereby obtain good touch location detection function.
The configuration of＜the first electrode group 15, first linking part 13, the second electrode group 21, second linking part 19 〉
Figure 47 is the vertical view that amplifies the touch area T1 of the touch panel TP that represents other embodiment.Figure 48 is the cut-open view of profile construction of the XLVIII-XLVIII line of expression Figure 47.
Above-mentioned embodiment 1,2 and their variation in, lower floor at interlayer dielectric 23 is provided with the first electrode group 15 (first electrode 11), first linking part 13, the second electrode group 21 (second electrode 17), the structure that is provided with second linking part 19 on the upper strata of interlayer dielectric 23 is illustrated, but the invention is not restricted to this.For example, as Figure 47 and shown in Figure 48, also can adopt the lower floor at interlayer dielectric 23 to be provided with second linking part 19, and be provided with the first electrode group 15 (first electrode 11) on the upper strata of interlayer dielectric 23, first linking part 13, the second electrode group 21 (second electrode 17) put upside down structure.In this case, second linking part 19 constitutes first conductive pattern of the present invention, and the first electrode group 15 (first electrode 11), first linking part 13, the second electrode group 21 (second electrode 17) constitute second conductive pattern of the present invention.And, in the touch panel TP of this configuration upside down, the first articulamentum 36A and second linking part 19 are formed by same film, and the second articulamentum 36B and the first electrode group 15 (first electrode 11), first linking part 13, the second electrode group 21 (second electrode 17) are formed by same film.
Even this touch panel TP that puts upside down structure is also same with above-mentioned embodiment 1, the first electrode group 15 and the second electrode group 21 are arranged at same one deck, therefore, can carry out the detection of the good touch location of sensitivity.
In addition, also can be provided with the first electrode group 15 (first electrode 11) and first linking part 13 in the lower floor of interlayer dielectric 23, be provided with the second electrode group 21 (second electrode 17) and second linking part 19 on the upper strata of interlayer dielectric 23.In this case, the first electrode group 15 (first electrode 11) and first linking part 13 constitute first conductive pattern of the present invention, and the second electrode group 21 (second electrode 17) and second linking part 19 constitute second conductive pattern of the present invention.And, in the touch panel TP of this structure, the first articulamentum 36A and the first electrode group 15 (first electrode 11) and first linking part 13 are formed by same film, and the second articulamentum 36B and the second electrode group 21 (second electrode 17) and second linking part 19 are formed by same film.
＜touch panel TP is with respect to the structure of liquid crystal indicator S 〉
Above-mentioned embodiment 1,2 and their variation in, touch panel TP directly is formed at the outer surface of counter substrate 3, but the invention is not restricted to this, touch panel TP also can be formed on the different transparency carriers such as glass substrate with counter substrate 3, this touch panel TP is fitted in constitute liquid crystal indicator S on the counter substrate 3.
The manufacture method of＜liquid crystal indicator S 〉
In above-mentioned embodiment 1, among the bonding process St4, make display panels DP by the so-called injection method that drips, this method is as follows: depict encapsulant 5 as the frame shape on TFT substrate 1 or counter substrate 3, after liquid crystal material is dripped in the inboard of sealing material 5, TFT substrate 1 and counter substrate 3 are fitted across these encapsulants 5 and liquid crystal material, but also can make display panels DP by so-called vacuum impregnation, this method is as follows: encapsulant depicted as the roughly frame shape with slit on TFT substrate 1 or counter substrate 3, make TFT substrate 1 and counter substrate 3 across the applying of sealing material and constitute the fitting body with cell voids, the inlet that the draught head that utilizes the vacuum traction to produce constitutes from the slit by encapsulant injects liquid crystal material to the cell voids of this fitting body, then, utilize envelope to end material sealing inlet.
In addition, in above-mentioned embodiment 1, carried out the St1 of touch panel manufacturing process before the St2 of counter substrate manufacturing process, but the invention is not restricted to this, the St1 of touch panel manufacturing process also can carry out after bonding process St4.Namely; also can be on the surface of the fitting body that is fitted with TFT substrate 1 and counter substrate 3; carry out known photoetching repeatedly and form first electrode 11, first linking part 13, second electrode 17, inner splicing ear 33, wiring lead 31, interlayer dielectric 23, second linking part 19, external connection terminals 35 (the first articulamentum 36A and the second articulamentum 36B) and protection dielectric film 25; thus, make touch panel TP.
More than, preferred embodiment be illustrated with its variation of the present invention, but technical scope of the present invention is not limited to the scope of above-mentioned embodiment and variation.Above-mentioned embodiment and variation are example, it will be appreciated by those skilled in the art that on the basis of the combination of these each inscapes and each handling procedure to have various variation, and such variation also belong to scope of the present invention.
For example, above-mentioned embodiment 1,2 and their variation in, for example understand liquid crystal indicator, but the invention is not restricted to this, be not only applicable to liquid crystal indicator, but also go for organic EL (Electro Luminescence: electroluminescence) display device or inorganic EL display device, plasma display system, FED (Field Emission DispLay; Field Emission Display), SED (Surface-conduction Electron-emitter Display; Surface-conduction-electron emission display) wait in other various display device, so long as possess the display device of this touch panel, just can widespread use.
Industrial utilizability
As described above, the present invention is to touch panel and possess the display device of this touch panel and the manufacture method of touch panel is useful, be particularly suitable for wishing not increase manufacturing process, just the resistance of external connection terminals being reduced, thereby obtain the touch panel of good touch location detection function and possess the display device of this touch panel and the manufacture method of touch panel.
Symbol description
The S liquid crystal indicator
The DP display panels
The TP touch panel
The T1 touch area
The T3 terminal area
11 first electrodes (first conductive pattern)
13 first linking parts (first conductive pattern)
15 first electrode groups (first conductive pattern)
17 second electrodes (first conductive pattern)
19 second linking parts (second conductive pattern)
21 second electrode groups (first conductive pattern)
23 interlayer dielectrics
The 23b contact hole
The 23c notch part
25 protection dielectric films
31 wiring leads
31b draws leading section
35 external connection terminals
36A first articulamentum
36B second articulamentum
41 controllers (external circuit)
51,55 nesa coatings
53 metal stacking films (metal film)
54 dielectric films
59 stacked dielectric films (dielectric film)

Claims (12)

1. a touch panel is characterized in that, comprising:
The touch area, it is the zone for detection of the touch location that is contacted by contact;
Terminal area, it is the outside that is arranged at described touch area, is used for the zone that is connected with external circuit;
First conductive pattern that touch location detection is used, it is disposed at described touch area and contains transparent conductive oxides;
Interlayer dielectric, its mode with at least a portion of covering described first conductive pattern arranges;
Second conductive pattern that touch location detection is used, it is arranged on the described interlayer dielectric and contains transparent conductive oxides;
The protection dielectric film, it arranges in the mode that covers described second conductive pattern;
Wiring lead, it is electrically connected with in described first conductive pattern and second conductive pattern at least one, leads to described terminal area side from described touch area side, and is insulated film and covers; With
External connection terminals, it is connected with the leading section of drawing of described wiring lead, and leads to the outside of described dielectric film and be arranged at described terminal area,
Described external connection terminals constitutes: with described first conductive pattern by same film formed first articulamentum and with described second conductive pattern by same film formed second articulamentum, be electrically connected with this wiring lead with the overlapping position of described wiring lead, and be electrically connected mutually at the outside left of described wiring lead.
2. touch panel as claimed in claim 1 is characterized in that:
Described first articulamentum and second articulamentum are stacked mutually in described terminal area.
3. touch panel as claimed in claim 1 or 2 is characterized in that:
On the described interlayer dielectric, be formed with contact hole or notch part at the overlapping position of leading section of drawing with described wiring lead,
Described wiring lead and second articulamentum are electrically connected mutually through described contact hole or notch part.
4. as each described touch panel in the claim 1～3, it is characterized in that:
Described wiring lead draw the outside that leading section extends to described dielectric film,
In described first articulamentum and second articulamentum at least one covers the integral body of the extension of described wiring lead.
5. as each described touch panel in the claim 1～4, it is characterized in that:
Described first articulamentum is electrically connected with described wiring lead at mutual different position with second articulamentum.
6. as each described touch panel in the claim 1～5, it is characterized in that:
Described wiring lead is by being made of with second wiring layer that contains metal material is stacked same film formed first wiring layer with described first conductive pattern.
7. as each described touch panel in the claim 1～6, it is characterized in that:
One in described first conductive pattern and second conductive pattern has: comprise a plurality of first electrodes of arranging in one direction and a plurality of first electrode groups of arranging in parallel to each other separately; Be included in a plurality of second electrodes of arranging on the direction of intersecting with this each first electrode group and a plurality of second electrode groups of arranging in parallel to each other separately; With the first adjacent electrode, first linking part connected to each other with described each first electrode group,
In described first conductive pattern and second conductive pattern another has second linking part that the second adjacent electrode of the described second electrode group is connected to each other.
8. as each described touch panel in the claim 1～7, it is characterized in that:
The transparent conductive oxides that forms described first conductive pattern and second conductive pattern is indium tin oxide or indium-zinc oxide.
9. display device is characterized in that:
Possesses each described touch panel in the claim 1～8.
10. display device as claimed in claim 9 is characterized in that:
Described touch panel is formed directly on the substrate surface that constitutes display panel.
11. the manufacture method of a touch panel is characterized in that:
It is the method for making the described touch panel of claim 1,
The manufacture method of described touch panel comprises:
First pattern forms operation, forms the nesa coating that contains transparent conductive oxides at the matrix substrate, uses first photomask that this nesa coating is carried out pattern and forms, and forms described first conductive pattern and first articulamentum thus;
Second pattern forms operation, forms metal film in the mode that covers described first conductive pattern and first articulamentum, uses second photomask that this metal film is carried out pattern and forms, thus to form described wiring lead with the described first articulamentum ways of connecting;
The 3rd pattern forms operation, form dielectric film in the mode that covers described first conductive pattern, first articulamentum and wiring lead, use the 3rd photomask that this dielectric film is carried out pattern and form, thus so that the mode that at least a portion of described first articulamentum and wiring lead is exposed forms described interlayer dielectric;
The 4th pattern forms operation, form the nesa coating that contains transparent conductive oxides at described interlayer dielectric, using the 4th photomask that this nesa coating is carried out pattern forms, thus, form described second conductive pattern, and to form described second articulamentum with described first articulamentum and wiring lead ways of connecting; With
The 5th pattern forms operation; form dielectric film in the mode that covers described second conductive pattern and second articulamentum; use the 5th photomask that this dielectric film is carried out pattern and form, thus so that the mode that at least a portion of described second articulamentum is exposed forms described protection dielectric film.
12. the manufacture method of a touch panel is characterized in that:
It is the method for making the described touch panel of claim 1,
The manufacture method of described touch panel comprises:
First pattern forms operation, forms metal film at the matrix substrate, uses first photomask that this metal film is carried out pattern and forms, and forms described wiring lead thus;
Second pattern forms operation, form the nesa coating that contains transparent conductive oxides in the mode that covers described wiring lead, using second photomask that this nesa coating is carried out pattern forms, thus, form described first conductive pattern, and with a described wiring lead part overlappingly ways of connecting form described first articulamentum;
The 3rd pattern forms operation, form dielectric film in the mode that covers described wiring lead, first conductive pattern and first articulamentum, using the 3rd photomask that this dielectric film is carried out pattern forms, thus, with the overlapping position of described wiring lead at least a portion of this wiring lead or described first articulamentum exposed and to be formed described interlayer dielectric in the mode that the outside left of described wiring lead exposes at least a portion of described first articulamentum; With
The 4th pattern forms operation, form the nesa coating that contains transparent conductive oxides at described interlayer dielectric, using the 4th photomask that this nesa coating is carried out pattern forms, thus, form described second conductive pattern, and to be connected with this wiring lead or described first articulamentum with the overlapping position of described wiring lead and to form described second articulamentum in outside left and the described first articulamentum ways of connecting of described wiring lead;
The 5th pattern forms operation; form dielectric film in the mode that covers described second conductive pattern and second articulamentum; use the 5th photomask that this dielectric film is carried out pattern and form, thus, so that the mode that at least a portion of described second articulamentum is exposed forms described protection dielectric film.
CN201180059708.9A 2010-12-09 2011-12-02 Touch panel and possess the display device of this touch panel and the manufacture method of touch panel Expired - Fee Related CN103262012B (en)

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