CN103258754B - A kind of bonding frock of semiconductor module and processing technology thereof - Google Patents
A kind of bonding frock of semiconductor module and processing technology thereof Download PDFInfo
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- CN103258754B CN103258754B CN201310168246.5A CN201310168246A CN103258754B CN 103258754 B CN103258754 B CN 103258754B CN 201310168246 A CN201310168246 A CN 201310168246A CN 103258754 B CN103258754 B CN 103258754B
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- clamp
- pair
- coin storage
- copper coin
- copper
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
A kind of bonding frock of semiconductor module and processing technology thereof.Relate to field of fixtures, particularly relate to the bonding frock of semiconductor module and the improvement of processing technology thereof.Provide a kind of delicate structure, easy to use, the bonding frock of the semiconductor module that can effectively avoid DBC plate to damage when carrying out aluminium wire bonding and processing technology thereof.Comprise workbench and a pair clamp, described bench top offers some copper coin storage tanks, some described copper coin storage tanks are arranged in a crossed manner and center consistent, and the bottom land of some described copper coin storage tanks establishes elasticity absorbed layer; Clamp described in a pair is connected in described bench top.The present invention changes the processing technology of conventional aluminium wire bonding, effectively can avoid the damage to DBC plate and chip when carrying out aluminium wire bonding, thus significantly reduce the percent defective adding man-hour, accelerate operating efficiency, also improve processing effect.
Description
Technical field
The present invention relates to field of fixtures, particularly relate to the bonding frock of semiconductor module and the improvement of processing technology thereof.
Background technology
At present, in semiconductor module use material based on DBC plate (refer to cover copper ceramic substrate, be made up at ceramic surface by Copper Foil direct sintering of DBC (DirectBondCopper) technology) more, and with DBC plate on some chips are set.In the packaging technology of semiconductor, relate to multiple key technology, aluminium wire bonding is exactly one of wherein very important link.Existing bonding frock generally adopts mechanical type to be fixedly clamped, and is first fixed on bonder by frock, is then put in frock by product, carries out clamping, bonding; But use that existing mechanical type clamping tool is operationally easy causes physical property to injure to product, as DBC edge or right angle etc.To this, the document that the portion that State Bureau announced on October 31st, 2012 is called " the bonding vacuum suction frock for IGBT ", application number is " 201210231536.5 ", in this case, usual " product " is placed on sealing ring, at unlatching vacuum absorption holes, product is adsorbed on above pedestal firmly, thus aluminium wire bonding can be carried out on the end face of product.
But people find in practice, this type of frock is covered with groove due to upper surface, and supersonic bonding can make DBC plate shake in use, makes it very easily cause damage to chip internal, brings high percent defective, and operating efficiency is significantly reduced.Meanwhile, vacuum air pump continuous firing also causes great waste to the energy.
Summary of the invention
The present invention is directed to above problem, providing a kind of delicate structure, easy to use, the bonding frock of the semiconductor module that can effectively avoid when carrying out aluminium wire bonding DBC plate to damage and processing technology thereof.
Technical scheme of the present invention is: comprise workbench and a pair clamp, described bench top offers some copper coin storage tanks, and some described copper coin storage tanks are arranged in a crossed manner and center consistent, and the bottom land of some described copper coin storage tanks establishes elasticity absorbed layer; Clamp described in a pair is connected in described bench top.
The end positions of described copper coin storage tank bottom surface is respectively equipped with alignment pin.
The outside of some described copper coin storage tank two ends also offers clamp storage tank;
Be provided with Connection Block bottom described clamp, described Connection Block is dismountable to be connected in described clamp storage tank.
Described clamp comprises tong arm, tong arm frame, handle and quadric chain, the dismountable end being connected to described tong arm frame of described tong arm;
Described quadric chain comprises head and the tail hinged successively base, bar one, bar two and bar three;
Described base is fixedly connected on described Connection Block, and described tong arm frame is fixedly connected in the middle part of described bar one, and described handle is fixedly connected on described bar two.
A processing technology for the bonding frock of semiconductor module, process according to the following steps:
1), Feedstock treating: the DBC plate being connected with some chips is welded on the end face of a copper soleplate, and offers a pair location hole at copper soleplate two ends;
2), mounting tool: the workbench of bonding frock is arranged in bonder;
3), locate: copper soleplate is put into the copper coin storage tank being equipped with elasticity absorbed layer, and make a pair location hole be socketed on a pair alignment pin;
4), clamping: a pair clamp is rotated or be arranged on the two ends of the copper coin storage tank being placed with copper soleplate, and clamps copper soleplate by a pair clamp;
5), bonding: the two ends of aluminium wire are bonded on corresponding chip;
6), dismounting: open a pair clamp, take out copper soleplate; Complete.
The present invention changes the processing technology of conventional aluminium wire bonding, first by DBC plate and chips welding on copper soleplate, then by the clamping to copper soleplate, to realize the fixing of DBC plate and chip; Its method is ingenious, effectively can avoid the damage to DBC plate and chip when carrying out aluminium wire bonding.Hard rubber between copper coin storage tank and barrel soleplate can effectively cushion the chip vibrations produced due to supersonic bonding and weaken, thus effectively protects chip and DBC plate when aluminium wire bonding.
The present invention produces damage owing to effectively avoiding DBC plate and chip when carrying out aluminium wire bonding, thus significantly reduces the percent defective adding man-hour, accelerates operating efficiency, also improves processing effect.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention,
Fig. 2 is the vertical view of Fig. 1,
Fig. 3 be the A-A of Fig. 2 to cutaway view,
Fig. 4 is the structural representation of clamp in the present invention;
In figure, 1 is workbench, and 11 is copper coin storage tanks, and 110 is elasticity absorbed layers, 111 is alignment pins, and 12 is clamp storage tanks, and 13 is ring-shaped grooves, 2 is clamps, and 21 is Connection Blocks, and 22 is tong arms, 23 is tong arm framves, and 24 is quadric chains, and 241 is bases, 242 is bars one, 243 is bars two, and 244 is bars three, and 25 is handles.
Embodiment
The present invention as Figure 1-4, comprise workbench 1 and a pair clamp 2, described workbench 1 end face offers some copper coin storage tank 11(to adapt to the copper soleplate of different size), some described copper coin storage tanks 11 are arranged in a crossed manner and center is consistent, the bottom land of some described copper coin storage tanks 11 establishes elasticity absorbed layer 110(to can be hard rubber, hardrubber, hard and the tough and tensile vulcanizate be made up of unsaturated rubber high dose sulfur cross-linking), make it effectively cushion the chip vibrations produced due to supersonic bonding and weaken; Clamp 2 described in a pair is connected on described workbench 1 end face.Like this, by the clamping of a pair clamp, 2 pairs of copper soleplates, the fixing of DBC plate and chip can be realized; Its method is ingenious, effectively can avoid the damage to DBC plate and chip when carrying out aluminium wire bonding.
The end positions of described copper coin storage tank 11 bottom surface is respectively equipped with alignment pin 111.Can before clamping by a pair alignment pin 111, the placement location of fixed copper base plate, mates with the hole on copper soleplate.
The outside of some described copper coin storage tank 11 two ends also offers clamp storage tank 12;
Be provided with Connection Block 21 bottom described clamp 2, described Connection Block 21 is dismountable to be connected in described clamp storage tank 12.Like this, after loading copper soleplate, a pair clamp can be arranged on the two ends of the copper coin storage tank being placed with copper soleplate, thus simply, effectively clamp copper soleplate by a pair clamp; And Connection Block is connected by elongated hole with workbench, the adjustment of radial position can be realized.
Described clamp comprises tong arm 22, tong arm frame 23, handle 25 and quadric chain 24, the dismountable end being connected to described tong arm frame 23 of described tong arm 22;
Described quadric chain 24 comprises head and the tail hinged successively base 241, bar 1, bar 2 243 and bar 3 244;
Described base 241 is fixedly connected on described Connection Block 21, and described tong arm frame 23 is fixedly connected in the middle part of described bar 1, and described handle 25 is fixedly connected on described bar 2 243.
Because clamp is a kind of routine techniques means in those skilled in the art's eye, multiple change can be made according to factors such as processing environments, therefore, only provide a kind of clamp to explain herein.
The present invention processes according to the following steps:
1), Feedstock treating: the DBC plate being connected with some chips is welded on the end face of a copper soleplate, and offers a pair location hole at copper soleplate two ends;
2), mounting tool: the workbench 1 of bonding frock is arranged in bonder;
3), locate: copper soleplate is put into the copper coin storage tank being equipped with elasticity absorbed layer 110, and make a pair location hole be socketed on a pair alignment pin 111;
4), clamp: a pair clamp 2 is rotated or be arranged on the two ends of the copper coin storage tank 11 being placed with copper soleplate, and clamps copper soleplate by a pair clamp 2;
5), bonding: the two ends of aluminium wire are bonded on corresponding chip;
6), dismounting: open a pair clamp, take out copper soleplate; Complete.
Claims (3)
1. the bonding frock of a semiconductor module, comprise workbench and a pair clamp, described bench top offers some copper coin storage tanks, some described copper coin storage tanks are arranged in a crossed manner and center is consistent, it is characterized in that, the bottom land of some described copper coin storage tanks establishes elasticity absorbed layer; Clamp described in a pair is connected in described bench top; The outside of some described copper coin storage tank two ends also offers clamp storage tank;
Be provided with Connection Block bottom described clamp, described Connection Block is dismountable to be connected in described clamp storage tank;
Described clamp comprises tong arm, tong arm frame, handle and quadric chain, the dismountable end being connected to described tong arm frame of described tong arm;
Described quadric chain comprises head and the tail hinged successively base, bar one, bar two and bar three;
Described base is fixedly connected on described Connection Block, and described tong arm frame is fixedly connected in the middle part of described bar one, and described handle is fixedly connected on described bar two.
2. the bonding frock of a kind of semiconductor module according to claim 1, is characterized in that, the end positions of described copper coin storage tank bottom surface is respectively equipped with alignment pin.
3. a processing technology for the bonding frock of semiconductor module according to claim 1, is characterized in that, process according to the following steps:
1), Feedstock treating: the DBC plate being connected with some chips is welded on the end face of a copper soleplate, and offers a pair location hole at copper soleplate two ends;
2), mounting tool: the workbench of bonding frock is arranged in bonder;
3), locate: copper soleplate is put into the copper coin storage tank being equipped with elasticity absorbed layer, and make a pair location hole be socketed on a pair alignment pin;
4), clamping: a pair clamp is rotated or be arranged on the two ends of the copper coin storage tank being placed with copper soleplate, and clamps copper soleplate by a pair clamp;
5), bonding: the two ends of aluminium wire are bonded on corresponding chip;
6), dismounting: open a pair clamp, take out copper soleplate; Complete.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310168246.5A CN103258754B (en) | 2013-05-06 | 2013-05-06 | A kind of bonding frock of semiconductor module and processing technology thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310168246.5A CN103258754B (en) | 2013-05-06 | 2013-05-06 | A kind of bonding frock of semiconductor module and processing technology thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103258754A CN103258754A (en) | 2013-08-21 |
| CN103258754B true CN103258754B (en) | 2015-12-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310168246.5A Active CN103258754B (en) | 2013-05-06 | 2013-05-06 | A kind of bonding frock of semiconductor module and processing technology thereof |
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| Country | Link |
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| CN (1) | CN103258754B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105127629B (en) * | 2015-09-29 | 2016-08-17 | 武汉光迅科技股份有限公司 | A kind of general gold wire bonding loading attachment |
| CN110280885B (en) * | 2019-08-03 | 2023-08-11 | 捷捷半导体有限公司 | Automatic positioning tool for ultrasonic welding of semiconductor and processing technology thereof |
| CN113612101B (en) * | 2021-07-13 | 2024-02-13 | 杭州沃镭智能科技股份有限公司 | DBC board automatic assembly equipment |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100495819B1 (en) * | 2003-06-14 | 2005-06-16 | 미래산업 주식회사 | Apparatus for Seating Devices in Semiconductor Test Handler |
| CN200990375Y (en) * | 2006-12-29 | 2007-12-12 | 艾逖恩机电(深圳)有限公司 | Vertical lead wire frame support clamp |
| US20130075907A1 (en) * | 2011-09-23 | 2013-03-28 | Broadcom Corporation | Interconnection Between Integrated Circuit and Package |
| CN102856265A (en) * | 2012-09-28 | 2013-01-02 | 西安永电电气有限责任公司 | Bottom plate with arc-shaped bosses for IGBT (Insulated Gate Bipolar Transistor) module |
| CN203218228U (en) * | 2013-05-06 | 2013-09-25 | 江苏爱普特半导体有限公司 | Bonding tool for semiconductor module |
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2013
- 2013-05-06 CN CN201310168246.5A patent/CN103258754B/en active Active
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| CN103258754A (en) | 2013-08-21 |
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| CP01 | Change in the name or title of a patent holder |
Address after: 225008 No. 26 Middle Road, Pioneer Park, Weiyang Economic Development Zone, Jiangsu, Yangzhou Patentee after: Jiangsu Yang Jie Semiconductor Co., Ltd. Address before: 225008 No. 26 Middle Road, Pioneer Park, Weiyang Economic Development Zone, Jiangsu, Yangzhou Patentee before: Jiangsu APT Semiconductor Co., Ltd. |