CN103247613B - The packaged chip of the multi-chip of enhancement mode Flash, communication means and method for packing - Google Patents

The packaged chip of the multi-chip of enhancement mode Flash, communication means and method for packing Download PDF

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Publication number
CN103247613B
CN103247613B CN201310121693.5A CN201310121693A CN103247613B CN 103247613 B CN103247613 B CN 103247613B CN 201310121693 A CN201310121693 A CN 201310121693A CN 103247613 B CN103247613 B CN 103247613B
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China
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chip
instruction
rpmc
pin
spiflash
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CN201310121693.5A
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Chinese (zh)
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CN103247613A (en
Inventor
胡洪
舒清明
张赛
张建军
刘江
潘荣华
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北京兆易创新科技股份有限公司
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Publication of CN103247613A publication Critical patent/CN103247613A/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements

Abstract

The invention provides the packaged chip of the multi-chip of a kind of enhancement mode Flash, communication means and method for packing.Chip of the present invention, comprising: be packaged with SPI? FLASH chip and RPMC chip; SPI? FLASH chip and RPMC chip have interconnective interchip communication pin; Wherein communications pins is used for providing self mark of processing instruction state for the other side.The invention provides the communication means of the packaged chip of the multi-chip of a kind of enhancement mode Flash, the present invention also provides the method for packing of the multi-chip of a kind of enhancement mode Flash, the present invention due to adopt two can the chip of independent design, and establish the communication connection of chip chamber, the 26S Proteasome Structure and Function of each chip can be adjusted according to the scope of the application function of various product.

Description

The packaged chip of the multi-chip of enhancement mode Flash, communication means and method for packing

Technical field

The present invention relates to semiconductor applications, particularly relate to a kind of packaged chip of enhancement mode Flash multi-chip, communication means and method for packing.

Background technology

Enhancement mode FLASH containing the dull calculator (ReplayProtectionMonotonicCounter, RPMC) of response protection is basic input output system (BasicInput-OutputSystem, the BIOS) chip that Intel will promote mainly.It comprises a jumbo SPIFLASH function and RPMC function.Wherein, the capacity of SPIFLASH can be 8M, 16M, 32M, 64M, 128M, 256M or higher, is used for storing code and the data of CPUBIOS; The function of RPMC ensures the confidentiality and integrity read and write data.The device of the RPMC function SPIFLASH integrated with it together form the hardware platform of BIOS in personal computer (PersonalComputer, PC) system.

At present, design there is the chip of RPMC function time, designer can Large Copacity SPIFLASH and RPMC function i ntegration on a single die, namely design together with RPMC with SPIFLASH usually.

But there is following shortcoming in the product of this design:

Along with the range of the application function of each electronic product increases, this integrated overall chip with SPIFLASH function and RPMC function, is not easy to adjust SPIFLASH function wherein or RPMC function and the communication function of the two thereof.

Summary of the invention

The present invention will solve above-mentioned technical problem, provides a kind of packaged chip of enhancement mode Flash multi-chip, communication means and method for packing.

The invention provides the packaged chip of the multi-chip of a kind of enhancement mode Flash, comprising: be packaged with SPIFLASH chip and RPMC chip;

Described SPIFLASH chip and described RPMC chip have interconnective interchip communication pin; Wherein said communications pins is used for providing self mark of processing instruction state for the other side.

The invention provides the communication means of the packaged chip of the multi-chip of a kind of enhancement mode Flash, in the chip of described encapsulation, be packaged with SPIFLASH chip and RPMC chip; Described SPIFLASH chip and described RPMC chip have interconnective interchip communication pin; Wherein said communications pins is used for providing self mark of processing instruction state for the other side;

Said method comprising the steps of:

Described SPIFLASH chip and RPMC chip, receive instruction separately and analyze;

Described SPIFLASH chip according to the analysis result of instruction, and from the mark to square chip processing instruction state that described interchip communication pin obtains, determines the operation processing this instruction;

Described RPMC chip according to the analysis result of instruction, and from the mark to square chip processing instruction state that described interchip communication pin obtains, determines the operation processing this instruction.

The invention provides the method for packing of the multi-chip of a kind of enhancement mode Flash, comprising:

One is packaged into after interconnected for the communications pins of described SPIFLASH chip and described RPMC chip; Wherein, described communications pins is for providing the mark of processing instruction for the other side.

Compared with prior art, the present invention includes following advantage: the chip in embodiments of the invention after encapsulation, due to adopt two can the SPIFLASH chip of independent design and RPMC chip, and establish the connection of the communications pins of chip chamber, the 26S Proteasome Structure and Function of each chip can be adjusted according to the range of the application function of each electronic product; In addition, the inside of the chip after encapsulation, the communication between two chips can adjust according to the break-make of pin.

Accompanying drawing explanation

Fig. 1 is the schematic diagram that two chips in the chip in embodiment after encapsulation connect;

Fig. 2 is the lead-in wire connection diagram that two chips in the chip in embodiment after encapsulation stack;

Fig. 3 is the communication flow diagram of the chip in embodiment after encapsulation;

Fig. 4 is the flow chart of embodiment chips encapsulation.

Embodiment

For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, and below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.

Embodiments of the invention show the packaged chip of the multi-chip of a kind of enhancement mode Flash of the present invention, comprising: be packaged with SPIFLASH chip and RPMC chip;

Described SPIFLASH chip and described RPMC chip have interconnective interchip communication pin; Wherein said communications pins is used for providing self mark of processing instruction state for the other side.

Chip in embodiments of the invention after encapsulation, due to adopt two can the SPIFLASH chip of independent design and RPMC chip, and establish the connection of the communications pins of chip chamber, the 26S Proteasome Structure and Function of each chip can be adjusted according to the range of the application function of each electronic product; In addition, the inside of the chip after encapsulation, the communication between two chips can adjust according to the break-make of pin.

See the preferred implementation of one that Fig. 1, Fig. 1 are in embodiments of the invention, in this implementation, the respective wip pin of described SPIFLASH chip and described RPMC chip and wip_rst pin are as described communications pins;

Wherein, whether described wip pin is for arranging chip self just in the mark of processing instruction; Described wip_rst pin is for arranging the mark of present instruction process progress.

Preferably, in FIG, except the communications pins of chip chamber, between SPIFLASH chip and described RPMC chip, there is the interconnective shared pins for controlling, accepting instruction and Output rusults;

These shared pins comprise: CSB, SCLK, SI, WPB, HOLDB and SO pin; Wherein, CSB pin is for transmitting chip selection signal, and SCLK pin is used for transmit clock signal; SI pin is for transmitting the signal such as data, instruction; WPB pin is used for realizing write-protect, and HOLDB pin is used for when chip is selected, chip can be made to suspend and receive external command.

Described SPIFLASH chip and described both RPMC chips are the chip that inside has the controller for the treatment of data.

External command can be transferred in described SPIFLASH and described RPMC by the outside shared pins of described chip, then judge whether respectively to perform described external command by the controller of SPIFLASH and the controller of RPMC, and perform corresponding operating according to output control SPIFLASH and RPMC judged.

In addition, described SPIFLASH chip or described RPMC chip have separately independently I/O pin respectively.For the device transmission Various types of data signal be connected with outside.

(1) relevant to SPIFLASH outside individual pin

In the embodiment of the present invention, also comprise the independent IO pin realizing SPIFLASH function be connected with SPIFLASH in described SPIFLASH, the described independent IO pin be connected to SPIFLASH is connected in the outside individual pin (namely relevant with SPIFLASH outside individual pin) of described chip.

Such as, the IO_F_0 in Fig. 1 ..., IO_F_0 is outside stand-alone interface (i.e. pin) relevant to SPIFLASH on described chip, with IO_F_0 in SPIFLASH ..., the I/O interface that IO_F_0 connects is the described independent IO interface be connected with SPIFLASH.

In the embodiment of the present invention, external command can be transferred in described SPIFLASH by outside individual pin relevant to SPIFLASH on described chip, the controller of SPIFLASH can judge whether to need SPIFLASH to perform described external command, if needed, then perform corresponding operating by SPIFLASH according to described external command.

(2) relevant to RPMC outside individual pin

In the embodiment of the present invention, also comprise the independent IO pin realizing RPMC function be connected with RPMC in described RPMC, the described independent IO pin be connected to RPMC is connected in the other outside individual pin (namely relevant with RPMC outside individual pin) of described chip.

Such as, the IO_R_0 in Fig. 1 ..., IO_R_0 be on described chip to the relevant outside stand-alone interface (i.e. pin) of RPMC, with IO_R_0 in RPMC ..., the I/O interface that IO_R_0 connects is the described independent IO interface be connected with RPMC.

In the embodiment of the present invention, external command can be transferred in described RPMC by outside individual pin relevant to RPMC on described chip, the controller of RPMC can judge whether to need RPMC to perform described external command, if needed, then performs corresponding operating by RPMC according to described external command.

In above-mentioned (1) and (2), the independent IO pin be connected with SPIFLASH and the independent IO pin be connected with described RPMC are not connected mutually.

The relation that pin when illustrating that two chip packages in embodiment together below in conjunction with Fig. 2 connects.In the above embodiments, describe the pin of the shared pins between two chips, outside individual pin and chip chamber, below by Fig. 2, the relation between each pin after encapsulation is described.

Fig. 2 is the encapsulation schematic diagram of the packaged chip of the multi-chip of a kind of enhancement mode Flash in the embodiment of the present invention.

In Fig. 2, Package is wrapper, and the area of Die_a to be SPIFLASH, Die_b be RPMC, SPIFLASH is greater than the area of RPMC.In Fig. 2, PAD_0 ..., PAD_# ..., PAD_n is the outside shared pins of chip, and these outside shared pins are used for the independent I/O pin of two chips and this kind of shared pins of CSB, SCLK, SI, WPB, HOLDB and SO to draw.

Pin_a_0 ..., Pin_a_# ..., Pin_a_n is the pin of SPIFLASH, which includes the shared pins identical with RPMC, be connected with other SPIFLASH realize the independent IO pin of SPIFLASH function and the communications pins of SPIFLASH; As wip pin.

Pin_b_0 ..., Pin_b_# ..., Pin_b_n is the pin of RPMC, which includes the shared pins identical with SPIFLASH, be connected with RPMC realize the independent IO pin of RPMC function and the communications pins of RPMC.Wherein, # represents any one number between 0 to n.

The connection of I, outside shared pins

In the embodiment of the present invention, described SPIFLASH interconnects with the identical shared pins in described RPMC, and is connected in the same outside shared pins of described chip, can comprise:

The shared pins a_x of described SPIFLASH interconnects with the identical shared pins b_y in described RPMC (function of the shared pins b_y of shared pins a_x and the RPMC of SPIFLASH is identical), and the shared pins a_x of described SPIFLASH is connected on the same outside shared pins PAD_z of described chip;

Such as, upper right corner place in Fig. 2, Pin_a_0(and a_x, x=0) and Pin_b_#(and b_y, y=#) interconnect, Pin_a_0 is connected to same outside shared pins PAD_0(and PAD_z, the z=0 of chip) on; And lower right corner place in Fig. 2, Pin_a_#(and a_x, x=#) with the identical IO pin interconnection in RPMC, Pin_a_# is connected to same outside shared pins PAD_#(and PAD_z, the z=# of chip) on.Above-mentioned two kinds of situations all belonging to this kind of outside shared pins and connect.

Or,

The shared pins a_x of described SPIFLASH interconnects with the identical shared pins b_y in described RPMC, and the identical shared pins b_y in described RPMC is connected on the same outside shared pins PAD_z of described chip.

Such as, in Fig. 2, Pin_a_n(and a_x, x=n) and Pin_b_0(and b_y, y=0) interconnect, Pin_b_0 is connected to same outside shared pins PAD_#(and PAD_z, the z=# of chip) on, namely belong to the situation that this kind of outside shared pins connects.

Wherein, described a represents the shared pins of SPIFLASH, and described x represents the IO pin mark of SPIFLASH, x=0,1 ..., n; Described b represents the shared pins of RPMC, and described y represents the shared pins mark of RPMC, y=0,1 ..., n; Described PAD represents the outside shared pins of chip package, and described z represents the shared pins mark of chip package, z=0,1 ..., n.

The connection of the communications pins of II, chip chamber

The communications pins of described SPIFLASH and the communications pins of described RPMC interconnect, and can comprise: the communications pins a_x of described SPIFLASH is connected to the communications pins b_y of described RPMC.Wherein, the communications pins b_y of communications pins a_x and RPMC of SPIFLASH can represent the mode bit of processing instruction.

Such as, Pin_a_#(and a_x, x=# in Fig. 2) interconnect with the communications pins in RPMC, and Pin_b_n(and b_y, y=n) interconnect with the communications pins in SPIFLASH, the situation that the communications pins of above-mentioned two kinds of communications pins and RPMC all belonging to SPIFLASH interconnects.

The connection of III, outside individual pin

(i) the described independent IO pin be connected with SPIFLASH is connected in the outside individual pin of described chip, can comprise: the IO pin a_x of described SPIFLASH is connected on the outside individual pin PAD_z of described chip.

Such as, lower right-hand corner in Fig. 2, the independent IO pin a_x be connected with SPIFLASH is connected to outside individual pin PAD_n(and PAD_z, the z=n of described chip) on.

(ii) the described independent IO pin be connected with RPMC is connected in the other outside individual pin of described chip, can comprise: the IO pin b_y of described RPMC is connected on the outside individual pin PAD_z of described chip.

Such as, in Fig. 2, the independent IO pin Pin_b_#(be connected with RPMC and b_y, y=#) be connected to outside individual pin PAD_#(and PAD_z, the z=# of described chip) on.

For the connection of other pin in Fig. 2, the embodiment of the present invention is discussed no longer in detail at this.

Finally, it should be noted that, in Fig. 2, SPIFLASH and RPMC is longitudinal stack encapsulation, and in the chips, described SPIFLASH and described RPMC also can encapsulate side by side, and the embodiment of the present invention is not limited this.Further, when described SPIFLASH and described RPMC longitudinal stack encapsulate: if the area of described SPIFLASH is greater than the area of described RPMC, then described RPMC vertical pile is on described SPIFLASH; If the area of described RPMC is greater than the area of described SPIFLASH, then described SPIFLASH vertical pile is on described RPMC, namely also can be Die_a in Fig. 2 be RPMC, Die_b is SPIFLASH.

The enhancement mode Flash chip of the RPMC function of the embodiment of the present invention, by on the basis of SPIFLASH chip, encapsulated together by RPMC and SPIFLASH chip, thus form the enhancement mode Flash chip that has RPMC function, RPMC and SPIFLASH can share unified communications pins.The embodiment of the present invention reduces design complexities and the design cost of chip, and, can be intercomed mutually to carrying out inside by the inside IO pin of interconnection between RPMC and SPIFLASH, thus ensure the synchronism of RPMC and SPIFLASH.In addition, in the embodiment of the present invention, SPIFLASH and RPMC can also perform different instructions simultaneously, and namely SPIFLASH and RPMC can concurrent working, this improves the performance of chip.

Embodiments of the invention also provide the communication means of the packaged chip of the multi-chip of a kind of enhancement mode Flash, and the method adopts the chip after encapsulation, is packaged with SPIFLASH chip and RPMC chip; Described SPIFLASH chip and described RPMC chip have interconnective interchip communication pin; Wherein said communications pins is used for providing self mark of processing instruction state for the other side;

Said method comprising the steps of:

S10: described SPIFLASH chip and RPMC chip, receive instruction separately and analyze;

S12: described SPIFLASH chip according to the analysis result of instruction, and from the mark to square chip processing instruction state that described interchip communication pin obtains, determines the operation processing this instruction;

S14: described RPMC chip according to the analysis result of instruction, and from the mark to square chip processing instruction state that described interchip communication pin obtains, determines the operation processing this instruction.

Preferably, described communications pins comprises: respective wip pin; Wherein, whether described wip pin is for arranging chip self just in the mark of processing instruction;

Described analytic process comprises:

Described SPIFLASH chip or described RPMC chip judge that current instruction belongs to self process and needs to obtain the wip pin mark of the opposing party's chip;

Describedly determine that the process of the operation processing this instruction comprises:

If be judged as the instruction belonging to self process, then judge whether according to the wip mark of the opposing party's chip the operation needing to perform this instruction;

If the wip of the opposing party's chip is designated perform, then abandon this instruction; If the wip of the opposing party's chip is designated do not perform any operation, then perform the operation of this instruction.

Two chips can accept identical instruction by shared pins, also can accept different instructions by respective independently I/O pin.The controller of each chip can carry out analysis to instruction and judge, judges whether to need self to process, or the need of the state processing of reference to square chip.

Such as:

In Fig. 1, the wip communications pins by interconnecting between described SPIFLASH with described RPMC intercoms mutually to carrying out inside.

The internal interface of the wip communications pins in Fig. 1 in SPIFLASH and the core on-chip interconnect described in forming with the wip communications pins in the RPMC of its interconnection is to (the inside IO pin namely interconnected to), and the internal interface of described interconnection is to for multiple.Such as, except wip pin, also has wip_rst pin.

And inside can be carried out with the wip communications pins in the RPMC of its interconnection and intercom mutually by the wip communications pins in SPIFLASH between described SPIFLASH with described RPMC.

In the embodiment of the present invention, can be intercomed mutually to carrying out inside by the inside IO pin of interconnection between SPIFLASH and RPMC.Such as, SPIFLASH chip, in execution first instruction process, judges the wip pin needing to arrange self, such as, during wip=1, is busy; During wip=0, be idle.

RPMC chip is in the first identical instruction of execution or the second different instruction process, if the instruction analyzing current execution belongs to self process, and needs the wip mode bit of SPIFLASH chip, then reads the wip mode bit of SPIFLASH chip.

If what the wip mode bit read showed is designated busy, then abandon current instruction.If what the wip mode bit read showed is designated idle, then continue to perform current instruction or this instruction temporary.

Preferably, described communications pins also comprises: respective wip_rst pin; Wherein, described wip_rst pin is for arranging the mark of present instruction process progress;

Described analytic process comprises:

Described SPIFLASH chip judges that the first current instruction belongs to self process and needs to obtain wip pin mark and the wip_rst pin mark of the opposing party RPMC chip; Then read wip pin mark and the wip_rst pin mark of RPMC chip;

If read wip pin to be designated busy and wip_rst pin and to be designated 1, represent that RPMC chip is near completion, then preserve current instruction to be processed, until the process of RPMC chip terminates, then process.

If read wip pin to be designated busy and wip_rst pin and to be designated 0, then do not consider that wip_rst identifies, abandon this instruction.

Describe in detail in the chip after encapsulation above, the Control on Communication flow process between two chips.Embodiments of the invention also provide the method for packing of the multi-chip of a kind of enhancement mode Flash, see Fig. 4, comprising:

Step 300, will the SPIFLASH of encapsulation and response protection monotone counter RPMC be needed to be placed on chip carrier, described SPIFLASH and described RPMC be separate.

In the embodiment of the present invention, mainly SPIFLASH and RPMC is packaged together, thus obtains the enhancement mode Flash chip with RPMC function, and SPIFLASH described in chip and described RPMC is separate.

First, can be placed on chip carrier by needing SPIFLASH and RPMC of encapsulation, the chip carrier described in the embodiment of the present invention can correspond to the Package in Fig. 2.

Preferably, this step 300 can comprise: by placed side by side on chip carrier for described SPIFLASH and described RPMC, or described SPIFLASH and described RPMC vertical pile are on chip carrier.

Encapsulation principle shown in Fig. 2 is described SPIFLASH and described RPMC vertical pile on chip carrier.

In the embodiment of the present invention, when described SPIFLASH and described RPMC vertical pile are on chip carrier:

If the area of described SPIFLASH is greater than the area of described RPMC, then described RPMC vertical pile is on described SPIFLASH;

If the area of described RPMC is greater than the area of described SPIFLASH, then described SPIFLASH vertical pile is on described RPMC.

Step 302, adopts metal lead wire to interconnect with the identical shared pins in described RPMC described SPIFLASH.

In the embodiment of the present invention, some identical shared pins (function is identical) can be there are in SPIFLASH and RPMC, metal lead wire can be adopted to interconnect for these identical shared pins.Concrete, can metal lead wire be adopted to interconnect with the identical shared pins b_y in described RPMC the shared pins a_x of described SPIFLASH.

Described shared pins comprises: CSB, SCLK, SI, WPB, HOLDB and SO pin;

Step 304, adopts metal lead wire to be connected in the same outside shared pins of described chip carrier the identical shared pins after described interconnection.

Preferably, this step 304 can comprise: adopt metal lead wire to be connected on the same outside shared pins PAD_z of described chip carrier the shared pins a_x of described SPIFLASH, or, adopt metal lead wire to be connected on the same outside shared pins PAD_z of described chip carrier the identical shared pins b_y in described RPMC;

Wherein, the shared pins a_x of described SPIFLASH is the identical shared pins interconnected with the shared pins b_y in described RPMC;

Described a represents the shared pins of SPIFLASH, and described x represents the shared pins mark of SPIFLASH; Described b represents the shared pins of RPMC, and described y represents the shared pins mark of RPMC; Described PAD represents the shared pins of chip package, and described z represents the shared pins mark of chip package.

Above-mentioned steps 302-step 304 can be combined into the situation that outside shared pins connects.Such as, upper right corner place in Fig. 2, Pin_a_0(and a_x, x=0) and Pin_b_#(and b_y, y=#) interconnect, Pin_a_0 is connected to same outside shared pins PAD_0(and PAD_z, the z=0 of chip) on; Lower right corner place in Fig. 2, Pin_a_#(and a_x, x=#) with the identical IO pin interconnection in RPMC, Pin_a_# is connected to same outside shared pins PAD_#(and PAD_z, the z=# of chip) on; And in Fig. 2, Pin_a_n(and a_x, x=n) and Pin_b_0(and b_y, y=0) interconnect, Pin_b_0 is connected to same outside shared pins PAD_#(and PAD_z, the z=# of chip) on.Above-mentioned situation all belongs to the situation that outside shared pins connects.

Metal lead wire described in the embodiment of the present invention can be represented for the dotted line connecting two pins in Fig. 2.

Step 306, adopts metal lead wire to interconnect the communications pins of the communications pins of described SPIFLASH and described RPMC.

In the embodiment of the present invention, in SPIFLASH and RPMC, respective communications pins can also be comprised, can metal lead wire be adopted to be connected to the communications pins b_y of described RPMC the communications pins a_x of SPIFLASH.Wherein, the pin a_x of Flash is used for the output of mode bit, and the pin b_y of RPMC is used for the input of mode bit; Or the pin a_x in FLASH is used for the input of mode bit, the pin b_y in RPMC is used for the output of mode bit.

Communications pins is wip pin in Fig. 1 and/or wip_rst pin, and communications pins is also referred to as interchip communication pin or intercommunication pin.Wherein, whether described wip pin is for arranging chip self just in the mark of processing instruction; Described wip_rst pin is for arranging the mark of present instruction process progress.

Such as, Pin_a_#(and a_x in Fig. 2, x=#) interconnected by metal lead wire with the communications pins in RPMC, and Pin_b_n(and b_y, y=n) interconnected by metal lead wire with the communications pins in SPIFLASH, the situation that the communications pins of above-mentioned two kinds of communications pins and RPMC all belonging to SPIFLASH adopts metal lead wire to interconnect.

Step 308, adopts metal lead wire to be connected in the outside individual pin of described chip carrier the independent IO pin realizing SPIFLASH function in described SPIFLASH.

In the embodiment of the present invention, the independent IO pin realizing SPIFLASH function in described SPIFLASH, can also be comprised, the independent IO pin in these SPIFLASH can be adopted metal lead wire be connected in the outside individual pin of described chip carrier.

Such as, lower right-hand corner in Fig. 2, the independent IO pin a_x be connected with SPIFLASH is connected to outside individual pin PAD_n(and PAD_z, the z=n of described chip by metal lead wire) on.

Step 310, adopts metal lead wire to be connected in the other outside individual pin of described chip carrier the independent IO pin realizing RPMC function in described RPMC.

Same, the independent IO pin realizing RPMC function can also be comprised in described RPMC, the independent IO pin in these RPMC can be adopted metal lead wire be connected in the other outside individual pin of described chip carrier.

Such as, in Fig. 2, the independent IO pin Pin_b_n(be connected with RPMC and b_y, y=n) be connected on the outside individual pin PAD_z of described chip by metal lead wire.

Wherein, the independent IO pin in described SPIFLASH is not connected mutually with the independent IO pin in described RPMC.

Described SPIFLASH, described RPMC and described chip carrier plastic packaging are the enhancement mode Flash chip with RPMC function by step 312.

After above-mentioned steps 300-step 310, complete the connection of each pin on the placement of SPIFLASH and RPMC and chip.Finally, can be the enhancement mode Flash chip with RPMC function by described SPIFLASH, described RPMC and described chip carrier plastic packaging, after plastic packaging, namely complete the encapsulation of chip.

In sum, the embodiment of the present invention can comprise following advantage:

The enhancement mode Flash chip of RPMC function that what 1, the embodiment of the present invention proposed have is packaged together by SPIFLASH and RPMC; Wherein, described SPIFLASH chip and described RPMC chip comprise separately independently controller respectively; Described SPIFLASH interconnects with the identical shared pins in described RPMC, and is connected in the same outside shared pins of described chip; External command is transferred in SPIFLASH and RPMC by the outside shared pins of described chip, and the controller of SPIFLASH and the controller of RPMC judge whether to perform described external command respectively; Described SPIFLASH and described RPMC also comprises intercommunication pin separately, the intercommunication pin of described SPIFLASH and the same communication pin interconnection of described RPMC, the communications pins by interconnecting between described SPIFLASH with described RPMC intercoms mutually to carrying out inside.In the embodiment of the present invention, owing to being packaged together by SPIFLASH and RPMC, thus can package area be reduced, reduce design cost; Further, SPIFLASH chip module can reuse existing SPIFLASH chip, and designer only need design RPMC chip module, and therefore, chip design complexity is low, the design cycle is short, cost is low.

2, SPIFLASH and RPMC can also perform different instructions simultaneously, and namely SPIFLASH and RPMC can concurrent working, this improves the performance of chip.

3, together with multi-chip package can encapsulate SPIFLASH with RPMC of different process, thus can multiplexing existing resource, reduce development cost.

4, the capacity of SPIFLASH can be expanded, and such as, can increase the capacity of monolithic SPIFLASH, or is packaged together by multiple SPIFLASH.

Each embodiment in this specification all adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar part mutually see.

For aforesaid embodiment of the method, in order to simple description, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the present invention is not by the restriction of described sequence of movement, because according to the present invention, some step can adopt other orders or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and involved action and module might not be that the present invention is necessary.

Finally, also it should be noted that, in this article, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operating space, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, commodity or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, commodity or equipment.When not more restrictions, the key element limited by statement " comprising ... ", and be not precluded within process, method, commodity or the equipment comprising described key element and also there is other identical element.

A kind of there is the enhancement mode Flash chip of RPMC function and a kind of chip packaging method to provided by the present invention above, be described in detail, apply specific case herein to set forth principle of the present invention and execution mode, the explanation of above embodiment just understands method of the present invention and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.

Claims (11)

1. a packaged chip for the multi-chip of enhancement mode Flash, is characterized in that, comprising: be packaged with SPIFLASH chip and RPMC chip;
Described SPIFLASH chip and described RPMC chip have interconnective interchip communication pin; Wherein said communications pins is used for providing self mark of processing instruction state for the other side, comprising: respective wip pin; Wherein, whether described wip pin is for arranging chip self just in the mark of processing instruction; Described SPIFLASH chip or described RPMC chip are analyzed the instruction received, and are specially and judge that current instruction belongs to self process and needs to obtain the wip pin mark of the opposing party's chip;
Described SPIFLASH chip according to the analysis result of instruction, and from the mark to square chip processing instruction state that described interchip communication pin obtains, determines the operation processing this instruction; Described RPMC chip according to the analysis result of instruction, and from the mark to square chip processing instruction state that described interchip communication pin obtains, determines the operation processing this instruction; Wherein, describedly determine that the process of the operation processing this instruction comprises: if be judged as belonging to the instruction of self process, then judge whether according to the wip mark of the opposing party's chip the operation needing to perform this instruction; If the wip of the opposing party's chip is designated perform, then abandon this instruction; If the wip of the opposing party's chip is designated do not perform any operation, then perform the operation of this instruction.
2. chip according to claim 1, is characterized in that, described SPIFLASH chip and described RPMC chip wip_rst pin are separately as described communications pins;
Wherein, described wip_rst pin is for arranging the mark of present instruction process progress.
3. chip according to claim 2, is characterized in that, described SPIFLASH chip and described RPMC chip have the interconnective shared pins for controlling, accepting instruction and Output rusults;
Described SPIFLASH chip or described RPMC chip have separately independently I/O pin respectively.
4. chip according to claim 3, is characterized in that, described shared pins comprises: CSB, SCLK, SI, WPB, HOLDB and SO pin;
Described SPIFLASH chip and described both RPMC chips are the chip that inside has the controller for the treatment of data.
5. chip according to claim 3, is characterized in that, the shared pins of described SPIFLASH chip and described RPMC chip is connected in the same outside shared pins of the chip after encapsulation;
Comprise:
The shared pins a_x of described SPIFLASH chip interconnects with the identical shared pins b_y in described RPMC chip, and the shared pins a_x of described SPIFLASH chip is connected on the same outside shared pins PAD_z of the chip after encapsulation, or the identical shared pins b_y in described RPMC is connected on the same outside shared pins PAD_z of the chip after encapsulation;
Wherein, described a represents the shared pins of SPIFLASH chip, and described x represents the shared pins mark of SPIFLASH chip; Described b represents the shared pins of RPMC chip, and described y represents the shared pins mark of RPMC chip; Described PAD represents the shared pins of chip package, and described z represents that chip package shared pins identifies;
The independently I/O pin of described SPIFLASH chip or described RPMC chip is connected to the outside individual pin of the chip after encapsulation.
6. chip according to claim 1, is characterized in that, described SPIFLASH chip and described RPMC chip mutually stacked or placed side by side;
Under mutually stacked state, the chip that area is larger is positioned at below, and the chip that area is less is positioned at top.
7. a communication means for the packaged chip of the multi-chip of enhancement mode Flash, is characterized in that, in the chip of described encapsulation, is packaged with SPIFLASH chip and RPMC chip; Described SPIFLASH chip and described RPMC chip have interconnective interchip communication pin; Wherein said communications pins is used for providing self mark of processing instruction state for the other side, comprising: respective wip pin; Wherein, whether described wip pin is for arranging chip self just in the mark of processing instruction;
Said method comprising the steps of:
Described SPIFLASH chip and RPMC chip, receive instruction separately and analyze; Described analytic process comprises: described SPIFLASH chip or described RPMC chip judge that current instruction belongs to self process and needs to obtain the wip pin mark of the opposing party's chip;
Described SPIFLASH chip according to the analysis result of instruction, and from the mark to square chip processing instruction state that described interchip communication pin obtains, determines the operation processing this instruction;
Described RPMC chip according to the analysis result of instruction, and from the mark to square chip processing instruction state that described interchip communication pin obtains, determines the operation processing this instruction;
Describedly determine that the process of the operation processing this instruction comprises: if be judged as belonging to the instruction of self process, then judge whether according to the wip mark of the opposing party's chip the operation needing to perform this instruction; If the wip of the opposing party's chip is designated perform, then abandon this instruction; If the wip of the opposing party's chip is designated do not perform any operation, then perform the operation of this instruction.
8. communication means according to claim 7, is characterized in that, described communications pins also comprises: respective wip_rst pin; Wherein, described wip_rst pin is for arranging the mark of present instruction process progress;
Described analytic process comprises:
Described SPIFLASH chip or described RPMC chip judge that current instruction belongs to self process and needs to obtain wip pin mark and the wip_rst pin mark of the opposing party's chip;
Describedly determine that the process of the operation processing this instruction comprises:
If the wip pin determining the opposing party's chip be designated process, wip_rst pin be designated to complete by process and analysis result for needing self process, then preserve current instruction to be processed, until the process of described the opposing party's chip terminates.
9. a method for packing for the multi-chip of enhancement mode Flash, is characterized in that, comprising:
One is packaged into after interconnected for the communications pins of SPIFLASH chip and RPMC chip; Wherein, described communications pins, for providing the mark of processing instruction for the other side, comprising: respective wip pin; Wherein, whether described wip pin is for arranging chip self just in the mark of processing instruction; Described SPIFLASH chip or described RPMC chip are analyzed the instruction received, and are specially and judge that current instruction belongs to self process and needs to obtain the wip pin mark of the opposing party's chip;
Described SPIFLASH chip according to the analysis result of instruction, and from the mark to square chip processing instruction state that described interchip communication pin obtains, determines the operation processing this instruction; Described RPMC chip according to the analysis result of instruction, and from the mark to square chip processing instruction state that described interchip communication pin obtains, determines the operation processing this instruction; Wherein, describedly determine that the process of the operation processing this instruction comprises: if be judged as belonging to the instruction of self process, then judge whether according to the wip mark of the opposing party's chip the operation needing to perform this instruction; If the wip of the opposing party's chip is designated perform, then abandon this instruction; If the wip of the opposing party's chip is designated do not perform any operation, then perform the operation of this instruction.
10. method for packing according to claim 9, is characterized in that, the communications pins of described encapsulation also comprises: described SPIFLASH chip and described RPMC chip wip_rst pin separately;
Wherein, described wip_rst pin is for arranging the mark of present instruction process progress;
Also comprise:
The shared pins that described SPIFLASH chip and described RPMC chip are used for controlling, accepting instruction and Output rusults is interconnected rear encapsulation;
Meanwhile, by described SPIFLASH chip and described RPMC chip independently I/O pin package separately;
Wherein, described shared pins comprises: CSB, SCLK, SI, WPB, HOLDB and SO pin.
11. method for packing according to claim 10, is characterized in that, the encapsulation process of described shared pins is: described shared pins be connected in the same outside shared pins of the chip after encapsulation;
Comprise:
The shared pins a_x of described SPIFLASH chip is interconnected with the identical shared pins b_y in described RPMC chip, and the shared pins a_x of described SPIFLASH chip is connected on the same outside shared pins PAD_z of the chip after encapsulation, or the identical shared pins b_y in described RPMC is connected on the same outside shared pins PAD_z of the chip after encapsulation;
Wherein, described a represents the shared pins of SPIFLASH chip, and described x represents the shared pins mark of SPIFLASH chip; Described b represents the shared pins of RPMC chip, and described y represents the shared pins mark of RPMC chip; Described PAD represents the shared pins of chip package, and described z represents the shared pins mark of chip package;
The encapsulation process of described individual pin is: the outside individual pin independently I/O pin of described SPIFLASH chip or described RPMC chip being connected to the chip after encapsulation.
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