CN101303885A - Multi-chip encapsulation storage module - Google Patents
Multi-chip encapsulation storage module Download PDFInfo
- Publication number
- CN101303885A CN101303885A CNA2008101160093A CN200810116009A CN101303885A CN 101303885 A CN101303885 A CN 101303885A CN A2008101160093 A CNA2008101160093 A CN A2008101160093A CN 200810116009 A CN200810116009 A CN 200810116009A CN 101303885 A CN101303885 A CN 101303885A
- Authority
- CN
- China
- Prior art keywords
- interface
- card chip
- intelligent card
- memory module
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Storage Device Security (AREA)
Abstract
The invention discloses a multi-chip packaging (MCP) memory module. The MCP memory module of the invention not only packages a plurality of types of memorizers for memory but also packages an interface conversion controller and a smart card chip; wherein, the smart card chip can realize relevant safety business of the smart card chip; the interface conversion controller can realize interface specification conversion when the outer part interacts with a plurality of types of memorizers and the smart card chip through an external interface so that the MCP memory module is not limited to the memory function but realizes functional extension. Moreover, the interface conversion controller can realize interface specification conversion, so the external interface arranged on the MCP memory module of the invention can correspond to a plurality of types of memorizers and the smart card chip one by one. Preferably, less external interfaces are needed, e.g. one or two, so that the number of external interface pins of the MCP memory module can be reduced.
Description
Technical field
The present invention relates to the interface accessing technology, the particularly a kind of encapsulation of multicore sheet (Multi-ChipPackage, MCP) memory module.
Background technology
MCP is a kind of advanced person's a technique of integrated circuit packaging, utilizes the MCP technology that various types of memory dice (being also referred to as nude film usually) are packaged together, and has promptly constituted the MCP memory module.And the memory dice of corresponding each type of MCP memory module has external interface one to one respectively.
As shown in Figure 1, the various types of storeies that encapsulate in the existing MCP memory module are (for the ease of statement, " tube core " two words are all omitted in the follow-up statement of this paper, in Fig. 1, then use " die " expression tube core) can comprise: static memory (SRAM) and with non-flash memory (NAND Flash), and this MCP memory module has corresponding SRAM and coupled SRAM bus external interface and corresponding NAND Flash and coupled NAND Flash bus external interface respectively.
Like this, external host can have access to the storer of corresponding types by different bus interface.
Because the MCP memory module is littler than the area that the independent encapsulation of each storer takies, so it has obtained widespread use in mobile devices such as for example mobile phone.
Yet existing MCP memory module only limits to memory function, can't realize the function expansion.
Summary of the invention
In view of this, the invention provides a kind of MCP memory module, can realize the smart card security related service.
A kind of MCP memory module provided by the invention is packaged with the storer of some types and has the external interface that is used for the external host visit,
Also be packaged with interface conversion controller and intelligent card chip in the described MCP memory module, wherein,
The storer of some types is connected to the interface conversion controller by each self-corresponding bus respectively;
Intelligent card chip is connected to the interface conversion controller by the intelligent card chip bus;
The interface conversion controller then links to each other with external interface by the pairing bus of external interface, be used for main frame externally by external interface visit corresponding types storer or during intelligent card chip, set up external host and the storer of corresponding types or communicating by letter of intelligent card chip.
The quantity of described external interface is smaller or equal to the storer sum and intelligent card chip quantity sum of some types.
Described MCP memory module only has an external interface.
A described external interface is static RAM SRAM bus interface or dynamic RAM DRAM, synchronous DRAM SDRAM bus interface, inclusive NAND flash memory NANDFlash bus interface.
Described a plurality of external interface storer and intelligent card chip with some types respectively is corresponding one by one.
The storer of described some types comprises: random access memory ram, SRAM, DRAM, SDRAM, read only memory ROM, non-volatile ROM (read-only memory) E
2PROM or non-flash memory NORFLASH, with non-flash memory NAND FLASH.
The interface conversion controller was further set up external host and communicated by letter with intelligent card chip before the communicating by letter of the storer of setting up external host and corresponding types, and is mutual with the authentication that realizes external host and intelligent card chip
As seen from the above technical solution, not only be packaged with the storer of the some types that are used to store in the MCP memory module among the present invention, also be packaged with interface conversion controller and intelligent card chip, wherein, intelligent card chip can be realized the smart card security related service, the interface conversion controller can realize that then outside storer and the interface specification of intelligent card chip when mutual by external interface and some types change, and makes the MCP memory module be not limited only to memory function, has realized the function expansion.
And, because the interface conversion controller can be realized the interface specification conversion, therefore, the external interface that MCP memory module among the present invention is had not storer and the intelligent card chip with some types is corresponding one by one, preferably can only have an external interface, thereby can reduce the external interface number of pin of MCP memory module.
Further,, then can adopt transmission speeds such as SRAM or SDRAM bus interface interface faster, so that improve outside access efficiency to the MCP memory module if the MCP memory module only has an external interface.
Again further, in order to improve security, can also authenticate all external references by intelligent card chip to the visit of MCP memory module.
Description of drawings
Fig. 1 is the structural representation of existing a kind of MCP memory module.
Fig. 2 is the exemplary block diagram of MCP memory module among the present invention.
Fig. 3 is the structural representation of MCP memory module in the embodiment of the invention one.
Fig. 4 is the schematic flow sheet of the access mode 1 of MCP memory module in the embodiment of the invention one.
Fig. 5 is the schematic flow sheet of the access mode 2 of MCP memory module in the embodiment of the invention one.
Fig. 6 is the structural representation of MCP memory module in the embodiment of the invention two.
Fig. 7 is the schematic flow sheet of the access mode 1 of MCP memory module in the embodiment of the invention two.
Fig. 8 is the schematic flow sheet of the access mode 2 of MCP memory module in the embodiment of the invention two.
Fig. 9 is the structural representation of MCP memory module in the embodiment of the invention three.
Figure 10 is the schematic flow sheet of the access mode 1 of MCP memory module in the embodiment of the invention three.
Figure 11 is the schematic flow sheet of the access mode 2 of MCP memory module in the embodiment of the invention three.
Figure 12 is the structural representation of MCP memory module in the embodiment of the invention four.
Figure 13 is the schematic flow sheet of the access mode 1 of MCP memory module in the embodiment of the invention four.
Figure 14 is the schematic flow sheet of the access mode 2 of MCP memory module in the embodiment of the invention four.
Embodiment
For making purpose of the present invention, technical scheme and advantage clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, the present invention is described in more detail.
Fig. 2 is the exemplary block diagram of MCP memory module among the present invention.(" die " expression tube core among Fig. 2) is packaged with n type storer (n is a natural number), and has the external interface that is used for the external host visit in the MCP memory module among the present invention as shown in Figure 2.
Than existing MCP memory module, also be packaged with interface conversion controller and intelligent card chip in the MCP memory module as shown in Figure 2.Need to prove, be tube core owing to be encapsulated in the various components and parts of MCP inside, therefore, described herein and interface conversion controller hereinafter described and intelligent card chip difference finger mouth switching controller tube core and intelligent card chip tube core.
N type storer is connected to the interface conversion controller by each self-corresponding bus respectively.For example, suppose that the storer 1 among Fig. 2 is synchronous DRAM (SDRAM), then storer 1 is connected to the interface conversion controller by the SDRAM bus.
Intelligent card chip then is connected to the interface conversion controller by the intelligent card chip bus, is used to realize the smart card security related service.
The interface conversion controller links to each other with external interface by the pairing bus of external interface, be used for main frame externally by external interface visit corresponding types storer or during intelligent card chip, set up external host and the storer of corresponding types or communicating by letter of intelligent card chip, and this communication is carried out the conversion of interface specification.
Wherein, aforesaid foundation communication is meant that the conducting external host is connected with the storer of corresponding types or the logic between the intelligent card chip, and this process can realize by existing manner, not repeat them here.
This shows, not only be packaged with the storer of the some types that are used to store in the MCP memory module as shown in Figure 2, also be packaged with interface conversion controller and intelligent card chip, wherein, intelligent card chip can be realized the smart card security related service, the interface conversion controller can realize that then outside storer and the interface specification of intelligent card chip when mutual by external interface and some types change, and makes the MCP memory module be not limited only to memory function, has realized the function expansion.
In MCP memory module as shown in Figure 2, external interface can be a plurality of and corresponding one by one with n type storer and intelligent card chip, and external interface is can be not corresponding one by one with n type storer and intelligent card chip even can have only one yet.
External interface for varying number, the working method of the interface conversion controller in the MCP memory module is also inequality, fail situation one to one for the storer among external interface and the MCP and intelligent card chip, after the communication of setting up external host and storer or intelligent card chip, also need the interface specification conversion is carried out in the communication of setting up.
Wherein, the interface specification conversion is meant that distinct interface is for the conversion of the bit width conversion and the read/write control mode of each read/write data, and this process can realize by existing manner, also repeat no more at this.
Below, specify in conjunction with several embodiment.
Embodiment one
Fig. 3 is the structural representation of MCP memory module in the embodiment of the invention one.As shown in Figure 3, storer with two types of SDRAM and NAND Flash is an example, in Fig. 3 (" die " expression tube core among Fig. 3), SDRAM in the MCP memory module and NAND Flash are connected to the interface conversion controller by SDRAM bus and NAND Flash bus respectively, and intelligent card chip then is connected to the interface conversion controller by the intelligent card chip bus.
MCP memory module as shown in Figure 3 have 3 with SDRAM, NAND Flash and intelligent card chip external interface one to one, promptly corresponding SDRAM bus external interface with SDRAM, with corresponding NAND Flash bus external interface of NAND Flash and the intelligent card chip bus external interface corresponding with intelligent card chip.
Like this, the interface conversion controller is by SDRAM bus, NAND Flash bus and intelligent card chip bus, link to each other with SDRAM bus external interface, NAND Flash bus external interface and intelligent card chip bus external interface respectively, be used for main frame externally by external interface visit corresponding types storer or during intelligent card chip, set up external host and the storer of corresponding types or communicating by letter of intelligent card chip.
In the present embodiment, the interface conversion controller can send access instruction by which external interface according to external host, and what judge host access is the storer or the intelligent card chip of any type.The interface conversion controller can directly be judged after receiving access instruction, sets up external host and the storer of its visit or communicating by letter of intelligent card chip then, and this mode is referred to as access mode 1; The interface conversion controller also can be after receiving access instruction, authenticate alternately to judge whether the main frame that sends this access instruction has the NAND Flash in the authority visit MCP memory module with intelligent card chip earlier, and the authentication by after judge again, set up external host and the storer of its visit or communicating by letter of intelligent card chip then, this mode is referred to as access mode 2.
Need to prove; owing to only can store some intermediate data and accessed usually in the random access memory such as SDRAM through regular meeting; therefore, mutual for the authentication that access mode 2 is related, usually not at for example SDRAM, static RAM (SRAM), RAM.
Fig. 4 is the schematic flow sheet of the access mode 1 of MCP memory module in the embodiment of the invention one.As shown in Figure 4, the concrete treatment scheme of access mode 1 comprises the steps: in the present embodiment
Whether step 402, interface conversion controller judge the access instruction that receives from SDRAM bus external interface, if then execution in step 403, otherwise, execution in step 404.
Whether step 404, interface conversion controller judge the access instruction that receives from NAND Flash bus external interface, if then execution in step 405, otherwise, execution in step 406.
Whether step 406, interface conversion controller judge the access instruction that receives from intelligent card chip bus external interface, if then execution in step 407, otherwise, return step 401 and continue to receive access instruction or the process ends that external host sends.
In the above-mentioned flow process, be SDRAM bus external interface, NANDFlash bus external interface, intelligent card chip bus external interface in proper order, in the practical application, also can adjust above-mentioned judgement order as required arbitrarily for the judgement of external interface.
Fig. 5 is the schematic flow sheet of the access mode 2 of MCP memory module in the embodiment of the invention one.As shown in Figure 5, the concrete treatment scheme of access mode 2 comprises the steps: in the present embodiment
Whether step 502, interface conversion controller judge the access instruction that receives from SDRAM bus external interface, if then execution in step 503, otherwise, execution in step 504.
Whether step 504, interface conversion controller judge the access instruction that receives from NAND Flash bus external interface, if then execution in step 505, otherwise, execution in step 508.
In this step, the authentication reciprocal process of intelligent card chip and external host can adopt existing any one authentication mode to realize, does not repeat them here.
Whether step 508, interface conversion controller judge the access instruction that receives from intelligent card chip bus external interface, if then execution in step 509, otherwise, return step 501 and continue to receive access instruction or the process ends that external host sends.
In the above-mentioned flow process, judgement for external interface is first SDRAM bus external interface, back NAND Flash bus external interface in proper order, in the practical application, also can adjust above-mentioned judgement order as required arbitrarily, but external host needs still by authentication to the visit of NAND Flash.
Embodiment two
Fig. 6 is the structural representation of MCP memory module in the embodiment of the invention two.As shown in Figure 6, still the storer with two types of SDRAM and NAND Flash is an example, in Fig. 6 (" die " expression tube core among Fig. 6), SDRAM in the MCP memory module and NAND Flash are connected to the interface conversion controller by SDRAM bus and NAND Flash bus respectively, and intelligent card chip then is connected to the interface conversion controller by the intelligent card chip bus.
MCP memory module as shown in Figure 6 only has 1 external interface, and certainly, the MCP memory module also can have more than 1 external interface but be not corresponding one by one with SDRAM, NAND Flash and intelligent card chip.Preferably, because the SDRAM bus transfer rate is very fast, therefore, in order to improve the access efficiency of external host to the MCP memory module, 1 external interface in the present embodiment adopts SDRAM bus external interface.
Like this, the interface conversion controller links to each other with SDRAM bus external interface by the SDRAM bus, be used for main frame externally by external interface visit corresponding types storer or during intelligent card chip, set up external host and the storer of corresponding types or communicating by letter of intelligent card chip, and this communication is carried out the conversion of interface specification.
In the present embodiment, can carry the access object sign in the access instruction that main frame sends, for example " 1 " expression SDRAM, " 2 " expression NAND Flash, " 3 " expression intelligent card chip.In the practical application, the access object sign can be sent by the upper level applications of external host, also can represent to also have other multiple modes certainly by external host by the high-low level signal that the control signal wire at corresponding external interface sends, give unnecessary details no longer one by one at this.
Like this, the interface conversion controller can be according to the sign of the access object in the access instruction of external host transmission, and what judge host access is the storer or the intelligent card chip of any type.The interface conversion controller can directly be judged after receiving access instruction, sets up external host and the storer of its visit or communicating by letter of intelligent card chip then, and this mode is referred to as access mode 1; The interface conversion controller also can be after receiving access instruction, authenticate alternately to judge whether the main frame that sends this access instruction has the NAND Flash in the authority visit MCP memory module with intelligent card chip earlier, and the authentication by after judge again, set up external host and the storer of its visit or communicating by letter of intelligent card chip then, this mode is referred to as access mode 2.
Certainly, can also distribute different addresses with intelligent card chip for SDRAM, NAND Flash in the present embodiment, what like this, the reference address of the interface conversion controller access instruction that can send according to external host was judged host access is the storer or the intelligent card chip of any type.
Fig. 7 is the schematic flow sheet of the access mode 1 of MCP memory module in the embodiment of the invention two.As shown in Figure 7, identifying storer or the intelligent card chip of judging any type of host access with the foundation access object is example, and the concrete treatment scheme of access mode 1 comprises the steps: in the present embodiment
In the above-mentioned flow process, be SDRAM bus external interface, NANDFlash bus external interface, intelligent card chip bus external interface in proper order, in the practical application, also can adjust above-mentioned judgement order as required arbitrarily for the judgement of external interface.
Fig. 8 is the schematic flow sheet of the access mode 2 of MCP memory module in the embodiment of the invention two.As shown in Figure 8, identifying storer or the intelligent card chip of judging any type of host access with the foundation access object is example, and the concrete treatment scheme of access mode 2 comprises the steps: in the present embodiment
In this step, the authentication reciprocal process of intelligent card chip and external host can adopt existing any one authentication mode to realize, does not repeat them here.
In the above-mentioned flow process, judgement for external interface is first SDRAM bus external interface, back NAND Flash bus external interface in proper order, in the practical application, also can adjust above-mentioned judgement order as required arbitrarily, but external host needs still by authentication to the visit of NAND Flash.
Embodiment three
Fig. 9 is the structural representation of MCP memory module in the embodiment of the invention three.As shown in Figure 9, still the storer with two types of SDRAM and NAND Flash is an example, in Fig. 9 (" die " expression tube core among Fig. 3), SDRAM in the MCP memory module and NAND Flash are connected to the interface conversion controller by SDRAM bus and NAND Flash bus respectively, and intelligent card chip then is connected to the interface conversion controller by the intelligent card chip bus.
MCP memory module as shown in Figure 9 has 2 external interfaces, i.e. SDRAM bus interface and NAND Flash bus interface.The interface conversion controller links to each other with SDRAM bus external interface by the SDRAM bus, be used for main frame externally by external interface visit corresponding types storer or during intelligent card chip, set up external host and the storer of corresponding types or communicating by letter of intelligent card chip, and this communication is carried out the conversion of interface specification.
Because also be packaged with intelligent card chip in the MCP memory module as shown in Figure 9, therefore, 2 external interfaces can't be corresponding one by one with SDRAM, NAND Flash and intelligent card chip.
In the present embodiment, can carry the access object sign in the access instruction that main frame sends, for example " 1 " expression SDRAM, " 2 " expression NAND Flash, " 3 " expression intelligent card chip.In the practical application, the access object sign can be sent by the upper level applications of external host, also can represent to also have other multiple modes certainly by external host by the high-low level signal that the control signal wire at corresponding external interface sends, give unnecessary details no longer one by one at this.
Like this, though 2 external interfaces can't be corresponding one by one with SDRAM, NAND Flash and intelligent card chip, but the interface conversion controller can be according to the sign of the access object in the access instruction of external host transmission, and what judge host access is the storer or the intelligent card chip of any type.The interface conversion controller can directly be judged after receiving access instruction, connects then and sets up external host and the storer of its visit or communicating by letter of intelligent card chip, and this mode is referred to as access mode 1; The interface conversion controller also can be after receiving access instruction, authenticate alternately to judge whether the main frame that sends this access instruction has the NAND Flash in the authority visit MCP memory module with intelligent card chip earlier, and the authentication by after judge again, set up external host and the storer of its visit or communicating by letter of intelligent card chip then, this mode is referred to as access mode 2.
Certainly, can also distribute different addresses with intelligent card chip for SDRAM, NAND Flash in the present embodiment, what like this, the reference address of the interface conversion controller access instruction that can send according to external host was judged host access is the storer or the intelligent card chip of any type.
Figure 10 is the schematic flow sheet of the access mode 1 of MCP memory module in the embodiment of the invention three.As shown in Figure 7 flow processing process is identical among flow process as shown in figure 10 and the embodiment two, does not repeat them here.
Figure 11 is the schematic flow sheet of the access mode 2 of MCP memory module in the embodiment of the invention three.As shown in Figure 8 flow processing process is identical among flow process as shown in figure 11 and the embodiment two, does not repeat them here.
Only be that storer with two types of SDRAM and NAND Flash is an example among above-mentioned three embodiment, in the practical application, the storer that is packaged in the MCP memory module can comprise one of the following or combination in any at least: random access memory (RAM), SRAM, dynamic RAM (DRAM) SDRAM, ROM (read-only memory) (ROM), non-volatile ROM (read-only memory) (E
2PROM), NORFLASH, NAND FLASH.
Embodiment four
Figure 12 is the structural representation of MCP memory module in the embodiment of the invention four.As shown in figure 12, storer with two types of SRAM and NOR Flash is an example, in Figure 12, SRAM in the MCP memory module and NOR Flash are connected to the interface conversion controller by SRAM bus and NOR Flash bus respectively, and intelligent card chip then is connected to the interface conversion controller by the intelligent card chip bus.
MCP memory module as shown in figure 12 only has 1 external interface, and certainly, the MCP memory module also can have more than 1 external interface but be not corresponding one by one with SRAM, NOR Flash and intelligent card chip.Preferably, because the SRAM bus transfer rate is very fast, therefore, in order to improve the access efficiency of external host to the MCP memory module, 1 external interface in the present embodiment adopts SRAM bus external interface.
Like this, the interface conversion controller links to each other with SRAM bus external interface by the SRAM bus, be used for main frame externally by external interface visit corresponding types storer or during intelligent card chip, set up external host and the storer of corresponding types or communicating by letter of intelligent card chip, and this communication is carried out the conversion of interface specification.
In the present embodiment, can carry the access object sign in the access instruction that main frame sends, for example " 4 " expression SRAM, " 5 " expression NOR Flash, " 3 " expression intelligent card chip.In the practical application, the access object sign can be sent by the upper level applications of external host, also can represent to also have other multiple modes certainly by external host by the high-low level signal that the control signal wire at corresponding external interface sends, give unnecessary details no longer one by one at this.
Like this, the interface conversion controller can be according to the sign of the access object in the access instruction of external host transmission, and what judge host access is the storer or the intelligent card chip of any type.The interface conversion controller can directly be judged after receiving access instruction, connects then and sets up external host and the storer of its visit or communicating by letter of intelligent card chip, and this mode is referred to as access mode 1; The interface conversion controller also can be after receiving access instruction, authenticate alternately to judge whether the main frame that sends this access instruction has the NOR Flash in the authority visit MCP memory module with intelligent card chip earlier, and the authentication by after judge again, set up external host and the storer of its visit or communicating by letter of intelligent card chip then, this mode is referred to as access mode 2.
Certainly, can also distribute different addresses with intelligent card chip for SRAM, NOR Flash in the present embodiment, what like this, the reference address of the interface conversion controller access instruction that can send according to external host was judged host access is the storer or the intelligent card chip of any type.
Figure 13 is the schematic flow sheet of the access mode 1 of MCP memory module in the embodiment of the invention four.As shown in figure 13, identifying storer or the intelligent card chip of judging any type of host access with the foundation access object is example, and the concrete treatment scheme of access mode 1 comprises the steps: in the present embodiment
In the above-mentioned flow process, be SRAM bus external interface, NORFlash bus external interface, intelligent card chip bus external interface in proper order, in the practical application, also can adjust above-mentioned judgement order as required arbitrarily for the judgement of external interface.
Figure 14 is the schematic flow sheet of the access mode 2 of MCP memory module in the embodiment of the invention four.As shown in figure 14, identifying storer or the intelligent card chip of judging any type of host access with the foundation access object is example, and the concrete treatment scheme of access mode 2 comprises the steps: in the present embodiment
In this step, the authentication reciprocal process of intelligent card chip and external host can adopt existing any one authentication mode to realize, does not repeat them here.
In the above-mentioned flow process, judgement for external interface is first SRAM bus external interface, back NOR Flash bus external interface in proper order, in the practical application, also can adjust above-mentioned judgement order as required arbitrarily, but external host needs still by authentication to the visit of NOR Flash.
The above is preferred embodiment of the present invention only, is not to be used to limit protection scope of the present invention.Within the spirit and principles in the present invention all, any modification of being done, be equal to and replace and improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1, a kind of multicore sheet encapsulation MCP memory module is packaged with the storer of some types and has the external interface that is used for the external host visit,
It is characterized in that,
Also be packaged with interface conversion controller and intelligent card chip in the described MCP memory module, wherein,
The storer of some types is connected to the interface conversion controller by each self-corresponding bus respectively;
Intelligent card chip is connected to the interface conversion controller by the intelligent card chip bus;
The interface conversion controller then links to each other with external interface by the pairing bus of external interface, be used for main frame externally by external interface visit corresponding types storer or during intelligent card chip, set up external host and the storer of corresponding types or communicating by letter of intelligent card chip.
2, MCP memory module as claimed in claim 1 is characterized in that,
The quantity of described external interface is smaller or equal to the storer sum and intelligent card chip quantity sum of some types.
3, MCP memory module as claimed in claim 2 is characterized in that,
Described MCP memory module only has an external interface.
4, MCP memory module as claimed in claim 3 is characterized in that,
A described external interface is static RAM SRAM bus interface or dynamic RAM DRAM, synchronous DRAM SDRAM bus interface, inclusive NAND flash memory NANDFlash bus interface.
5, MCP memory module as claimed in claim 2 is characterized in that, described a plurality of external interfaces storer and intelligent card chip with some types respectively are corresponding one by one.
6, as any described MCP memory module in the claim 1 to 5, it is characterized in that,
The storer of described some types comprises: random access memory ram, SRAM, DRAM, SDRAM, read only memory ROM, non-volatile ROM (read-only memory) E
2PROM or non-flash memory NORFLASH, with non-flash memory NAND FLASH.
7, as any described MCP memory module in the claim 1 to 5, it is characterized in that,
The interface conversion controller was further set up external host and communicated by letter with intelligent card chip before the communicating by letter of the storer of setting up external host and corresponding types, and is mutual with the authentication that realizes external host and intelligent card chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101160093A CN101303885A (en) | 2008-07-01 | 2008-07-01 | Multi-chip encapsulation storage module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008101160093A CN101303885A (en) | 2008-07-01 | 2008-07-01 | Multi-chip encapsulation storage module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101303885A true CN101303885A (en) | 2008-11-12 |
Family
ID=40113752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008101160093A Pending CN101303885A (en) | 2008-07-01 | 2008-07-01 | Multi-chip encapsulation storage module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101303885A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105493061A (en) * | 2013-09-03 | 2016-04-13 | 高通股份有限公司 | Unified memory controller for heterogeneous memory on a multi-chip package |
| CN111221583A (en) * | 2020-01-03 | 2020-06-02 | 广东岭南通股份有限公司 | Multi-smart-card starting management device and system |
| CN111737769A (en) * | 2019-03-25 | 2020-10-02 | 美光科技公司 | Multi-chip package and method for secure communication between connected dies |
| CN112383490A (en) * | 2016-03-18 | 2021-02-19 | 华为技术有限公司 | Chip and transmission scheduling method |
-
2008
- 2008-07-01 CN CNA2008101160093A patent/CN101303885A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105493061A (en) * | 2013-09-03 | 2016-04-13 | 高通股份有限公司 | Unified memory controller for heterogeneous memory on a multi-chip package |
| US10185515B2 (en) | 2013-09-03 | 2019-01-22 | Qualcomm Incorporated | Unified memory controller for heterogeneous memory on a multi-chip package |
| CN105493061B (en) * | 2013-09-03 | 2020-11-03 | 高通股份有限公司 | Unified memory controller for heterogeneous memory on multi-chip package |
| CN112383490A (en) * | 2016-03-18 | 2021-02-19 | 华为技术有限公司 | Chip and transmission scheduling method |
| CN111737769A (en) * | 2019-03-25 | 2020-10-02 | 美光科技公司 | Multi-chip package and method for secure communication between connected dies |
| US11899804B2 (en) | 2019-03-25 | 2024-02-13 | Micron Technology, Inc. | Secure communications amongst connected dice |
| CN111737769B (en) * | 2019-03-25 | 2024-05-28 | 美光科技公司 | Multi-chip package and method for secure communication between connected die |
| CN111221583A (en) * | 2020-01-03 | 2020-06-02 | 广东岭南通股份有限公司 | Multi-smart-card starting management device and system |
| CN111221583B (en) * | 2020-01-03 | 2022-02-25 | 广东岭南通股份有限公司 | Multi-smart-card starting management device and system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101770439B (en) | Electronic system and its method of operating | |
| CN101410814B (en) | Daisy chain arrangement of non-volatile memories | |
| US12046577B2 (en) | Stacked memory with interface providing offset interconnects | |
| CN100550000C (en) | Communicator and method with shared local storage | |
| CN1322441C (en) | Multi-chip package type memory system | |
| CN103988140A (en) | Interconnection of a packaged chip to a die in a package utilizing on-package input/output interfaces | |
| CN103236428B (en) | A kind of enhancement mode Flash chip and method for packing thereof containing RPMC | |
| US9728520B2 (en) | Enhanced flash chip and method for packaging chip | |
| EP2618544B1 (en) | Ethernet communication system and method based on mmc/sd interface | |
| CN101303885A (en) | Multi-chip encapsulation storage module | |
| CN103258820B (en) | The enhancement mode Flash chip of SPI interface and chip packaging method | |
| CN102169463B (en) | Inter-integrated circuit (IIC) bus-based manufacturing information acquisition method and equipment | |
| US20220382920A1 (en) | Terminal and communication method | |
| CN106354474A (en) | Random number generation circuit and semiconductor system including the same | |
| CN112765057B (en) | Data transmission method, PCIE system, equipment and storage medium | |
| CN103219333B (en) | Enhancement mode Flash chip, method for packing and instruction executing method | |
| KR101845368B1 (en) | Mapping memory controller connectors to memory connectors | |
| CN103219334B (en) | A kind of flash memory packaged chip | |
| CN103280444B (en) | The packaged chip of the multi-chip of enhancement mode Flash, synchronous method and method for packing | |
| CN103229240A (en) | Method and apparatus for sharing internal power supplies in integrated circuit devices | |
| JP2008152525A (en) | Device equipped with function to output monitoring state and computer equipment | |
| US20150318044A1 (en) | Enhanced flash chip and method for packaging chip | |
| CN103258821B (en) | Enhancement type Flash chip with hard reset function and chip encapsulating method | |
| CN113448895A (en) | Storage integrated chip and communication method, packaging structure and packaging method thereof | |
| KR960012497A (en) | Semiconductor integrated circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20081112 |