CN103228110A - Line resistance welding process for printed circuit board - Google Patents
Line resistance welding process for printed circuit board Download PDFInfo
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- CN103228110A CN103228110A CN2013100664807A CN201310066480A CN103228110A CN 103228110 A CN103228110 A CN 103228110A CN 2013100664807 A CN2013100664807 A CN 2013100664807A CN 201310066480 A CN201310066480 A CN 201310066480A CN 103228110 A CN103228110 A CN 103228110A
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Abstract
The invention discloses a line resistance welding process for a printed circuit board, which sequentially comprises the following steps of: (1) printing nano gold-tin-copper alloy conductive ink on the board surface of the printed circuit board, wherein the nano gold-tin-copper alloy conductive ink comprises the following components in percentage by mass: 10 percent to 50 percent of nano gold-tin-copper alloy powder, 20 percent to 70 percent of solvent and 5 percent to 10 percent of auxiliary, and the particle size range of the nano gold-tin-copper alloy powder is in the range of 20nm to 100nm; (2) ablating and curing the nano gold-tin-copper alloy conductive ink so as to form a conductive graph on the printed circuit board; (3) carrying out silk screen of resistance welding ink on the printed circuit board and drying to form a first resistance welding layer; and (4) carrying out silk screen of the resistance welding ink on the first resistance welding layer and drying to form a second resistance welding layer.
Description
Technical field:
The present invention relates to print manufacturing technology, specifically is a kind of circuit welding resistance technology of printed circuit board (PCB).
Background technology:
The welding resistance printing ink of printed circuit board (PCB) is insulating material, and it forms solder mask by being printed on circuit board plate material, and plays the effect of insulation, prevention welding in printed circuit board (PCB).This solder mask is to be formed by permanent polymer welding resistance coating material, and solder mask covers on the most printed wire, only exposes the pad for part welding, electric performance test and circuit board grafting usefulness.And when the line thicknesses on the printed circuit board (PCB) during, will form step on the substrate for printed circuit board of circuit surface and spacing greater than 100 microns, and at the solder mask thickness of the corner of step because the existence at turning and generally all than the solder mask thin thickness at other positions.Therefore, this will cause the phenomenon that the solder mask perk occurs, bubble or come off, thereby influence the quality of final products.
Simultaneously, generally to be divided into gold be that electrically conductive ink, silver are that electrically conductive ink and copper are electrically conductive ink to the electrically conductive ink that constitutes printed circuit board circuitry in the prior art.Copper is that conductive phase is the low price of electrically conductive ink than silver, but because the easy oxidation of copper, so cause the electric conductivity instability of copper system conduction.Though silver is that the electrically conductive ink electric conductivity is better, formed conducting wire is all softer but silver is electrically conductive ink oven dry back, and silver is that the circuit that forms of printing ink is in the operational environment of D.C. high-current, owing to be easy to generate the silver migration, so the electric property of circuit can not satisfy the operational environment demand of D.C. high-current fully.With silver is that printing ink and copper are that printing ink is compared, and gold is that the antioxygenic property of electrically conductive ink is best, and intensity is moderate.
But because that gold is the cost of printing ink is higher, if the electrically conductive particles of printing ink all adopts gold to make, its cost inferior position can not be ignored.Therefore, be necessary to study and a kind ofly can be adapted at steady operation under the D.C. high-current, the electrically conductive ink that can reduce cost as far as possible again, make the conducting wire of printed circuit board (PCB) by adopting this electrically conductive ink, and combine, thereby promote the performance and the useful life of printed circuit board (PCB) with circuit welding resistance technology.
Summary of the invention:
For this reason, the invention provides a kind of circuit welding resistance technology of printed circuit board (PCB), it adopts nm of gold-tin-copper alloy electrically conductive ink to constitute printed circuit board circuitry, and adopt circuit welding resistance technology of the present invention, thereby not only reduce printed substrate line material cost, and the problem that can also solve the existing easy perk of printed circuit board (PCB) solder mask, bubble and come off.
For realizing above-mentioned purpose of the present invention, the present invention by the following technical solutions:
A kind of circuit welding resistance technology of printed circuit board (PCB), it may further comprise the steps sequentially:
(1), at the plate face of printed circuit board (PCB) printing nm of gold-tin-copper alloy electrically conductive ink, wherein said nm of gold-Xi-copper electrically conductive ink comprises following component by mass percentage:
Nm of gold-tin-copper alloy powder: solvent 10%～50%: auxiliary agent 20%～70%: 5%～10%; The particle size range of this nm of gold-tin-copper alloy powder is: 20nm～100nm; And the content of gold, tin and copper is respectively: 3%, 7%, 90% by mass percentage in described nm of gold-tin-copper alloy particulate;
(2) above-mentioned Jin-Xi-copper electrically conductive ink ablation is solidified, on printed circuit board (PCB), to form conductive pattern;
(3) silk-screen welding resistance printing ink on printed circuit board (PCB), the oven dry back is to form first solder mask;
(4) silk-screen welding resistance printing ink on described first solder mask, the oven dry back is to form second solder mask.
Wherein, the process conditions that step (3) oven dry forms first solder mask are: printed circuit board (PCB) is placed in the baking box, and keeping oven temperature is 80 degrees centigrade, and stoving time is 1 hour;
Wherein, the process conditions that step (4) oven dry forms second solder mask are: printed circuit board (PCB) is placed in the baking box, and keeping oven temperature is 70 degrees centigrade, and stoving time is 2 hours, and first solder mask, second layer solder mask are hardened fully.
Wherein, the technology of printing first solder mask is:
On printed circuit board (PCB), print ground floor welding resistance printing ink by silk screen printing process; Adopt ultraviolet exposure machine to above-mentioned printed circuit board to explosure and development, to form first solder mask; By sodium carbonate liquor first solder mask development of unexposed area is removed afterwards.
Wherein, the technology of printing second solder mask is:
On the printed circuit board (PCB) that has printed first solder mask, on printed circuit board (PCB), print second layer welding resistance printing ink by silk screen printing process; Adopt ultraviolet exposure machine to above-mentioned printed circuit board to explosure and development, to form second solder mask; By sodium carbonate liquor second solder mask development of unexposed area is removed afterwards.
The present invention makes printed circuit board circuitry by adopting Jin-Xi-copper electrically conductive ink, thereby not only economy but also guarantee to obtain qualified line pattern under the prerequisite of circuit intensity, and print welding resistance printing ink to form two-layer solder mask by twice, thereby increase solder mask thickness, and then the solder mask thickness at circuit turning, the problem of avoiding the welding resistance perk, bubble or coming off have been thickeied.
Embodiment:
Below by embodiment printed circuit board circuitry welding resistance technology of the present invention is elaborated.
Execution mode 1:
The circuit welding resistance technology of the printed circuit board (PCB) that the present invention proposes, it may further comprise the steps sequentially: (1), at the plate face of printed circuit board (PCB) printing nm of gold-tin-copper alloy electrically conductive ink, wherein said nm of gold-Xi-copper electrically conductive ink comprises following component by mass percentage:
Nm of gold-tin-copper alloy powder: solvent 10%～50%: auxiliary agent 20%～70%: 5%～10%; The particle size range of this nm of gold-tin-copper alloy powder is: 20nm～100nm; And the content of gold, tin and copper is respectively: 3%, 7%, 90% by mass percentage in described nm of gold-tin-copper alloy particulate;
Solvent comprises: one or more of water, alcohols, ethers and ester class; Wherein alcohols comprises: one or more in the group of being made up of ethanol, isopropyl alcohol, butanols, ethylene glycol, phenmethylol.Ethers comprises: one or more in the group that butyl glycol ether, diethylene glycol butyl ether, diethylene glycol dimethyl ether, diethylene glycol ether are formed.The ester class comprises: butyl acetate or ethyl acetate.
Auxiliary agent comprises one or more in surfactant, dispersant, the reducing agent; Wherein surfactant comprises: one or more in the group of being made up of stearic acid, oleic acid, laurate, triethanolamine, sldium lauryl sulfate, pectic acid sodium, hydroxymethyl starch etc.; Dispersant comprises: one or more in the group of being made up of alkyl hydrosulfide, alkyl acid, alkylamine, alkyl phosphoric acid; Reducing agent comprises: one or more in the group of being made up of ascorbic acid, hydrazine hydrate, formic acid and formaldehyde;
(2) above-mentioned Jin-Xi-copper electrically conductive ink ablation is solidified, on printed circuit board (PCB), to form conductive pattern.The ablation of Jin-Xi-copper electrically conductive ink is solidified under the environment that can place 80～180 degrees centigrade by the printed circuit board (PCB) that will print this Jin-Xi-copper electrically conductive ink, ablated 20～50 minutes, solidify this electrically conductive ink behind the solvent in the oven dry electrically conductive ink, to form the conducting wire;
(3) silk-screen ground floor welding resistance printing ink on printed circuit board (PCB), the oven dry back is to form first solder mask.The processing step of silk-screen ground floor welding resistance printing ink is: printing ground floor welding resistance printing ink on printed circuit board (PCB); Adopt ultraviolet exposure machine to above-mentioned printed circuit board to explosure and development, to form first solder mask; By sodium carbonate liquor first solder mask development of unexposed area is removed afterwards.After this, oven dry forms first solder mask, and its process conditions are: printed circuit board (PCB) is placed in the baking box, and keeping oven temperature is 80 degrees centigrade, and stoving time is 1 hour;
(4) silk-screen second layer welding resistance printing ink on described first solder mask, the oven dry back is to form second solder mask.The processing step of silk-screen second layer welding resistance printing ink is: printing second layer welding resistance printing ink on first solder mask; Adopt ultraviolet exposure machine to above-mentioned printed circuit board to explosure and development, to form second solder mask; By sodium carbonate liquor second solder mask development of unexposed area is removed afterwards; After this, oven dry forms second solder mask, and its process conditions are: printed circuit board (PCB) is placed in the baking box, and keeping oven temperature is 70 degrees centigrade, and stoving time is 2 hours, and first solder mask, second layer solder mask are hardened fully.
Execution mode 2:
The circuit welding resistance technology of the printed circuit board (PCB) that the present invention proposes, it may further comprise the steps sequentially: (1), at the plate face of printed circuit board (PCB) printing nm of gold-tin-copper alloy electrically conductive ink, wherein said nm of gold-Xi-copper electrically conductive ink comprises following component by mass percentage:
Nm of gold-tin-copper alloy powder 40%, solvent: auxiliary agent 52%: 8%; The particle size range of this nm of gold-tin-copper alloy powder is: 30nm; And the content of gold, tin and copper is respectively: 3%, 7%, 90% by mass percentage in described nm of gold-tin-copper alloy particulate;
Solvent comprises: one or more of water, alcohols, ethers and ester class; Wherein alcohols comprises: by ethanol, isopropyl alcohol, butanols, ethylene glycol, phenmethylol.Ethers comprises: one or more in the group that butyl glycol ether, diethylene glycol butyl ether, diethylene glycol dimethyl ether, diethylene glycol ether are formed.The ester class comprises: butyl acetate or ethyl acetate.
Auxiliary agent comprises one or more in surfactant, dispersant, the reducing agent; Wherein surfactant comprises: one or more in the group of being made up of stearic acid, oleic acid, laurate, triethanolamine, sldium lauryl sulfate, pectic acid sodium, hydroxymethyl starch etc.; Dispersant comprises: one or more in the group of being made up of alkyl hydrosulfide, alkyl acid, alkylamine, alkyl phosphoric acid; Reducing agent comprises: one or more in the group of being made up of ascorbic acid, hydrazine hydrate, formic acid and formaldehyde;
(2) above-mentioned Jin-Xi-copper electrically conductive ink ablation is solidified, on printed circuit board (PCB), to form conductive pattern.Ablation to Jin-Xi-copper electrically conductive ink is solidified under the environment that can place 150 degrees centigrade by the printed circuit board (PCB) that will print this Jin-Xi-copper electrically conductive ink, ablates 30 minutes, solidifies this electrically conductive ink behind the solvent in the oven dry electrically conductive ink, to form the conducting wire;
(3) silk-screen ground floor welding resistance printing ink on printed circuit board (PCB), the oven dry back is to form first solder mask.The processing step of silk-screen ground floor welding resistance printing ink is: printing ground floor welding resistance printing ink on printed circuit board (PCB); Adopt ultraviolet exposure machine to above-mentioned printed circuit board to explosure and development, to form first solder mask; By sodium carbonate liquor first solder mask development of unexposed area is removed afterwards.After this, oven dry forms first solder mask, and its process conditions are: printed circuit board (PCB) is placed in the baking box, and keeping oven temperature is 80 degrees centigrade, and stoving time is 1 hour;
(4) silk-screen second layer welding resistance printing ink on described first solder mask, the oven dry back is to form second solder mask.The processing step of silk-screen second layer welding resistance printing ink is: printing second layer welding resistance printing ink on first solder mask; Adopt ultraviolet exposure machine to above-mentioned printed circuit board to explosure and development, to form second solder mask; By sodium carbonate liquor second solder mask development of unexposed area is removed afterwards; After this, oven dry forms second solder mask, and its process conditions are: printed circuit board (PCB) is placed in the baking box, and keeping oven temperature is 70 degrees centigrade, and stoving time is 2 hours, and first solder mask, second layer solder mask are hardened fully.
Above execution mode is described in detail the present invention, but above-mentioned execution mode is not in order to limit scope of the present invention, and protection scope of the present invention is defined by the appended claims.
Claims (4)
1. the circuit welding resistance technology of a printed circuit board (PCB), it may further comprise the steps sequentially:
(1), the plate face at printed circuit board (PCB) prints nm of gold-tin-copper alloy electrically conductive ink;
(2) above-mentioned Jin-Xi-copper electrically conductive ink ablation is solidified, on printed circuit board (PCB), to form conductive pattern;
(3) silk-screen welding resistance printing ink on printed circuit board (PCB), the oven dry back is to form first solder mask;
(4) silk-screen welding resistance printing ink on described first solder mask, the oven dry back is to form second solder mask.
2. the circuit welding resistance technology of printed circuit board (PCB) as claimed in claim 1 is characterized in that:
Wherein, described nm of gold-Xi-copper electrically conductive ink comprises following component by mass percentage: nm of gold-tin-copper alloy powder: 10%～50%, and solvent: 20%～70%, auxiliary agent: 5%～10%; Wherein,
The particle size range of this nm of gold-tin-copper alloy powder is: 20nm～100nm; And the content of gold, tin and copper is respectively: 3%, 7%, 90% by mass percentage in described nm of gold-tin-copper alloy particulate.
3. the circuit welding resistance technology of printed circuit board (PCB) as claimed in claim 1 or 2 is characterized in that:
Wherein, the process conditions that step (3) oven dry forms first solder mask are: printed circuit board (PCB) is placed in the baking box, and keeping oven temperature is 80 degrees centigrade, and stoving time is 1 hour.
4. as the circuit welding resistance technology of one of any described printed circuit board (PCB) of claim 1-3, it is characterized in that:
Wherein, the process conditions that step (4) oven dry forms second solder mask are: printed circuit board (PCB) is placed in the baking box, and keeping oven temperature is 70 degrees centigrade, and stoving time is 2 hours, and first solder mask, second layer solder mask are hardened fully.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310066480.7A CN103228110B (en) | 2013-03-01 | 2013-03-01 | The circuit welding resistance technique of printed circuit board (PCB) |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310066480.7A CN103228110B (en) | 2013-03-01 | 2013-03-01 | The circuit welding resistance technique of printed circuit board (PCB) |
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| Publication Number | Publication Date |
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| CN103228110A true CN103228110A (en) | 2013-07-31 |
| CN103228110B CN103228110B (en) | 2016-01-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115124351A (en) * | 2022-07-18 | 2022-09-30 | 合肥圣达电子科技实业有限公司 | High-temperature solder resist slurry for aluminum nitride multilayer and preparation method thereof |
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| CN1571855A (en) * | 2001-10-18 | 2005-01-26 | 加拿大电子粉末公司 | Powder for laminated ceramic capacitor internal electrode |
| CN101560349A (en) * | 2009-04-22 | 2009-10-21 | 北京印刷学院 | Jet conductive ink |
| WO2010109465A1 (en) * | 2009-03-24 | 2010-09-30 | Yissum Research Development Company Of The Hebrew University Of Jerusalem, Ltd. | Process for sintering nanoparticles at low temperatures |
| CN102675960A (en) * | 2011-03-08 | 2012-09-19 | 深圳市尊业纳米材料有限公司 | Nano copper-tin alloy conductive ink and preparation method and usage of nano copper-tin alloy conductive ink |
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2013
- 2013-03-01 CN CN201310066480.7A patent/CN103228110B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1571855A (en) * | 2001-10-18 | 2005-01-26 | 加拿大电子粉末公司 | Powder for laminated ceramic capacitor internal electrode |
| WO2010109465A1 (en) * | 2009-03-24 | 2010-09-30 | Yissum Research Development Company Of The Hebrew University Of Jerusalem, Ltd. | Process for sintering nanoparticles at low temperatures |
| CN101560349A (en) * | 2009-04-22 | 2009-10-21 | 北京印刷学院 | Jet conductive ink |
| CN102675960A (en) * | 2011-03-08 | 2012-09-19 | 深圳市尊业纳米材料有限公司 | Nano copper-tin alloy conductive ink and preparation method and usage of nano copper-tin alloy conductive ink |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115124351A (en) * | 2022-07-18 | 2022-09-30 | 合肥圣达电子科技实业有限公司 | High-temperature solder resist slurry for aluminum nitride multilayer and preparation method thereof |
| CN115124351B (en) * | 2022-07-18 | 2023-10-20 | 合肥圣达电子科技实业有限公司 | High-temperature solder resist slurry for aluminum nitride multilayer and preparation method thereof |
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| CN103228110B (en) | 2016-01-06 |
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