CN103226725B - A kind of smart card that can measure solder joint value of thrust and solder joint value of thrust measuring method thereof - Google Patents
A kind of smart card that can measure solder joint value of thrust and solder joint value of thrust measuring method thereof Download PDFInfo
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- CN103226725B CN103226725B CN201310101911.9A CN201310101911A CN103226725B CN 103226725 B CN103226725 B CN 103226725B CN 201310101911 A CN201310101911 A CN 201310101911A CN 103226725 B CN103226725 B CN 103226725B
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- out wire
- solder joint
- thrust
- smart card
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Abstract
The invention discloses a kind of smart card that can measure solder joint value of thrust and solder joint value of thrust measuring method thereof。Described smart card includes substrate and chip, and described chip soldering is connected in described substrate, is provided with coil in described substrate, and described coil is provided with the first lead-out wire and the second lead-out wire；Described first lead-out wire is longer than described second lead-out wire, and described first lead-out wire and the second lead-out wire weld with described chip respectively。By the way, the present invention can make smart card just can accurately measure the solder joint pulling force of lead-out wire of chip in process of production, it is thus possible to find that quality of welding spot is abnormal early, effectively simplifies production procedure and improves production efficiency, reduces the scrappage of product。
Description
Technical field
The present invention relates to technical field of RFID, particularly relate to a kind of smart card that can measure solder joint value of thrust and solder joint value of thrust measuring method thereof。
Background technology
Smart card is more and more universal, also increasingly be unable to do without various smart cards in people's life。And in the manufacturing process of smart card, the especially making of double-interface card, one of difficult point is that the quality of the solder joint how controlling lead-out wire；Produce at present double-interface smart card the quality control of the solder joint of the lead-out wire of chip is to control afterwards, namely after making finished product card, detected by reliability testing butt welding point, but now card has produced, if it find that the reliability testing failure caused due to quality of welding spot problem, then entire block all can be scrapped, and causes enterprise to lose greatly, and affects the friendship phase etc. of client。The manufacturing process of smart card in prior art by analysis, it has been found that the problem existing for the smart card of prior art is mainly: chip cannot detect quality of welding spot after welding with lead-out wire in real time；Owing to two lead-out wire length are consistent, when doing pull force calculation once there be single line to be pulled off, then tensile test just terminates and records current tensile test value, makes can not measure accurately during detection the value of thrust of two solder joints, a pull force calculation can only be done, obtain a meansigma methods。
Summary of the invention
For above-mentioned deficiency of the prior art, present invention is primarily intended to provide a kind of smart card that can measure solder joint value of thrust and solder joint value of thrust measuring method thereof。This smart card just can accurately measure the solder joint pulling force of the lead-out wire of chip in process of production, it is thus possible to find that quality of welding spot is abnormal early, effectively simplifies production procedure and improves production efficiency, reduces the scrappage of product。
For achieving the above object, the technical solution used in the present invention is: a kind of smart card that can measure solder joint value of thrust, and including substrate and chip, described chip soldering is connected in described substrate, being provided with coil in described substrate, described coil is provided with the first lead-out wire and the second lead-out wire；Described first lead-out wire is longer than described second lead-out wire, and described first lead-out wire and the second lead-out wire weld with described chip respectively。
Preferably, described first lead-out wire is arranged to swirl type, and described second lead-out wire is arranged to linear type。
The present invention also disclosed the measuring method of a kind of solder joint value of thrust measuring above-mentioned smart card, comprise the steps: that step one, use tension tester hold described chip and pull up, then described second lead-out wire is tightened, and tension tester tests out the solder joint value of thrust of described second lead-out wire；Step 2, use chuck are clamped the first lead-out wire and are pulled down, then the first lead-out wire is tightened, and tension tester tests out the solder joint value of thrust of described first lead-out wire。
Compared with prior art, the present invention sets about from the length of lead-out wire welded mutually with chip, adopt the lead-out wire of different length, ensureing that the length of two lead-out wires is different when welding, two lead-out wires being done tensile test thus solving the problem existing for prior art respectively when doing tensile test。So in the smart card process producing double; two interface, for the detection of quality of welding spot by the enforcement of the technology of the present invention, can accomplishing detection in real time and monitoring quality of welding spot completely, as found, quality of welding spot occurs that abnormal then can stopping immediately producing, and problem is investigated, processes；Will not produce owing to detection causes bulk scrapping afterwards, effectively simplify production procedure and improve production efficiency, reduce the scrappage of product, so that the bulk production of double-interface smart card is accomplished。
The invention has the beneficial effects as follows: smart card of the present invention just can accurately measure the solder joint pulling force of the lead-out wire of chip in process of production, it is thus possible to find that quality of welding spot is abnormal early, effectively simplify production procedure and improve production efficiency, reduce the scrappage of product。
Accompanying drawing explanation
Fig. 1 is the structural representation that the present invention can measure smart card one preferred embodiment of solder joint value of thrust；
Fig. 2 be smart card shown in Fig. 1 the test of solder joint value of thrust in the schematic diagram of step one；
Fig. 3 be smart card shown in Fig. 1 the test of solder joint value of thrust in the schematic diagram of step 2；
In accompanying drawing, the labelling of each parts is as follows: 1 substrate, 2 chips, 3 coils, 4 first lead-out wires, 5 second lead-out wires, 6 tension testers, 7 chucks。
Detailed description of the invention
Below in conjunction with accompanying drawing, presently preferred embodiments of the present invention is described in detail, so that advantages and features of the invention can be easier to be readily appreciated by one skilled in the art, thus protection scope of the present invention being made apparent clear and definite defining。
Referring to Fig. 1, Fig. 2 and Fig. 3, the embodiment of the present invention: a kind of smart card that can measure solder joint value of thrust, including substrate 1 and chip 2, chip 2 is welded in substrate 1, is provided with coil 3 in substrate 1, and coil 3 is provided with the first lead-out wire 4 and the second lead-out wire 5；First lead-out wire 4 is longer than the second lead-out wire 5, and the first lead-out wire 4 welds with chip 2 respectively with the second lead-out wire 5。
In the present embodiment, the first lead-out wire 4 is arranged to swirl type, and the second lead-out wire 5 is arranged to linear type。
The measuring method of the solder joint value of thrust of the smart card described in the present embodiment, comprises the steps: that step one, use tension tester 6 hold chip 2 and pull up, then the second lead-out wire 5 is tightened, and tension tester 6 tests out the solder joint value of thrust of the second lead-out wire 5；Step 2, use chuck 7 are clamped the first lead-out wire 4 and are pulled down, then the first lead-out wire 4 is tightened, and tension tester 6 tests out the solder joint value of thrust of the first lead-out wire 4。
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the present invention and accompanying drawing content to make or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical fields, all in like manner include in the scope of patent protection of the present invention。
Claims (3)
1. measuring a smart card for solder joint value of thrust, including substrate and chip, described chip soldering is connected in described substrate, it is characterised in that be provided with coil in described substrate, and described coil is provided with the first lead-out wire and the second lead-out wire；Described first lead-out wire is longer than described second lead-out wire, and described first lead-out wire and the second lead-out wire weld with described chip respectively；When tensile test, described first lead-out wire and described second lead-out wire are carried out rightabout tensile test respectively。
2. the smart card that can measure solder joint value of thrust according to claim 1, it is characterised in that described first lead-out wire is arranged to swirl type, and described second lead-out wire is arranged to linear type。
3. the measuring method of the solder joint value of thrust of the smart card described in a claim 1, it is characterized in that, comprise the steps: that step one, use tension tester hold described chip and pull up, then described second lead-out wire is tightened, and tension tester tests out the solder joint value of thrust of described second lead-out wire；Step 2, use chuck are clamped the first lead-out wire and are pulled down, then the first lead-out wire is tightened, and tension tester tests out the solder joint value of thrust of described first lead-out wire。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310101911.9A CN103226725B (en) | 2013-03-27 | 2013-03-27 | A kind of smart card that can measure solder joint value of thrust and solder joint value of thrust measuring method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310101911.9A CN103226725B (en) | 2013-03-27 | 2013-03-27 | A kind of smart card that can measure solder joint value of thrust and solder joint value of thrust measuring method thereof |
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| Publication Number | Publication Date |
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| CN103226725A CN103226725A (en) | 2013-07-31 |
| CN103226725B true CN103226725B (en) | 2016-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310101911.9A Active CN103226725B (en) | 2013-03-27 | 2013-03-27 | A kind of smart card that can measure solder joint value of thrust and solder joint value of thrust measuring method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1489106A (en) * | 2002-06-07 | 2004-04-14 | 索尼公司 | IC module and manufacturing method thereof, and wireless information storage medium comprising said IC module |
| CN201569518U (en) * | 2009-11-20 | 2010-09-01 | 富港电子（东莞）有限公司 | Tension testing device |
| CN202748271U (en) * | 2012-09-06 | 2013-02-20 | 浙江海洋学院 | Precise detection device for tensile strength of bonding site |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101601133B (en) * | 2006-10-27 | 2011-08-10 | 宇芯（毛里求斯）控股有限公司 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
-
2013
- 2013-03-27 CN CN201310101911.9A patent/CN103226725B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1489106A (en) * | 2002-06-07 | 2004-04-14 | 索尼公司 | IC module and manufacturing method thereof, and wireless information storage medium comprising said IC module |
| CN201569518U (en) * | 2009-11-20 | 2010-09-01 | 富港电子（东莞）有限公司 | Tension testing device |
| CN202748271U (en) * | 2012-09-06 | 2013-02-20 | 浙江海洋学院 | Precise detection device for tensile strength of bonding site |
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| CN103226725A (en) | 2013-07-31 |
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Address after: 201707 No. 98, Gaoxin Road, industrial park, Qingpu District, Shanghai Patentee after: Shanghai Dongfang magnetic card information Co., Ltd Address before: 201700 No. 98, Gaoxin Road, Qingpu Industrial Park, Shanghai Patentee before: Shanghai Dongfang magnetic card Engineering Co., Ltd |
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