CN103226725A - Smart card capable of measuring welding spot tension and welding spot tension measuring method thereof - Google Patents
Smart card capable of measuring welding spot tension and welding spot tension measuring method thereof Download PDFInfo
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- CN103226725A CN103226725A CN2013101019119A CN201310101911A CN103226725A CN 103226725 A CN103226725 A CN 103226725A CN 2013101019119 A CN2013101019119 A CN 2013101019119A CN 201310101911 A CN201310101911 A CN 201310101911A CN 103226725 A CN103226725 A CN 103226725A
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- extension line
- smart card
- welding spot
- solder joint
- thrust
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Abstract
The invention discloses a smart card capable of measuring welding spot tension and a welding spot tension measuring method thereof. The smart card comprises a substrate and a chip, wherein the chip is welded in the substrate; a coil is arranged inside the substrate; a first outgoing wire and a second outgoing wire are arranged on the coil; the first outgoing wire is longer than the second outgoing wire; and the first outgoing wire and the second outgoing wire are welded with the chip respectively. Through the technical scheme, the smart card can precisely measure the welding spot tensions of the outgoing wires of the chip in the production process, so that the quality abnormality of a welding spot can be found as early as possible; the production process is effectively simplified, so that the production efficiency is improved; and the unqualified rate of products is reduced.
Description
Technical field
The present invention relates to the REID field, particularly relate to a kind of smart card and solder joint value of thrust measuring method thereof of energy measurement solder joint value of thrust.
Background technology
Smart card is more and more universal, also more and more be unable to do without various smart cards in people's life.And in the manufacturing process of smart card, the especially making of double-interface card, one of difficult point just is how to control the quality of the solder joint of extension line; The production double-interface smart card is control afterwards for the quality control of the solder joint of the extension line of chip at present, promptly make after the finished product card, detect by the reliability testing butt welding point, but card was produced and was finished this moment, if find because the reliability testing failure that the quality of welding spot problem causes, then entire block all can be scrapped, and causes enterprise to lose greatly, and influences friendship phase of client etc.The manufacturing process of smart card in the prior art finds that the existing problem of smart card of prior art is mainly: can't detect quality of welding spot in real time after chip and the extension line welding by analysis; Because two extension line length unanimities, in a single day have single line to be broken when doing the pulling force detection, then tensile test just stops and writes down current tensile test value, makes the value of thrust that can not measure two solder joints when detecting accurately, can only do a pulling force and detect, obtain a mean value.
Summary of the invention
At above-mentioned deficiency of the prior art, fundamental purpose of the present invention provides a kind of smart card and solder joint value of thrust measuring method thereof of energy measurement solder joint value of thrust.This smart card is the just accurate solder joint pulling force of the extension line of measured chip in process of production, thereby can find early that quality of welding spot is unusual, effective simplification production procedure enhance productivity, reduce the scrappage of product.
For achieving the above object, the technical solution used in the present invention is: a kind of smart card of energy measurement solder joint value of thrust, comprise substrate and chip, and described chips welding is in described substrate, be provided with coil in the described substrate, described coil is provided with first extension line and second extension line; Described first extension line is longer than described second extension line, described first extension line and second extension line respectively with described chips welding.
Preferably, described first extension line is arranged to swirl type, and described second extension line is arranged to linear pattern.
The present invention has also announced a kind of measuring method of measuring the solder joint value of thrust of above-mentioned smart card, comprise the steps: that step 1, use tension tester hold described chip and upwards draw, then described second extension line is tightened, and tension tester tests out the solder joint value of thrust of described second extension line; Step 2, use chuck are clamped first extension line and are pulled down, and then first extension line is tightened, and tension tester tests out the solder joint value of thrust of described first extension line.
Compared with prior art, the present invention is from setting about with the length of lead-out wire that chip welds mutually, adopt the extension line of different length, when welding, guarantee that the length of two extension lines is different, solve the existing in prior technology problem thereby when doing tensile test, respectively two extension lines are done tensile test.Like this in the smart card process of producing two interfaces, for the detection of quality of welding spot enforcement by the technology of the present invention, can accomplish completely to detect in real time and the monitoring quality of welding spot,, problem be investigated, handled as finding that quality of welding spot occurs unusually then can stopping immediately producing; Can not produce owing to detect and cause scrapping of property in batches afterwards, effective simplification production procedure enhance productivity, reduce the scrappage of product, thereby make the batch production of double-interface smart card accomplished.
The invention has the beneficial effects as follows: smart card of the present invention is the just accurate solder joint pulling force of the extension line of measured chip in process of production, thereby can find early that quality of welding spot is unusual, effective simplification production procedure enhance productivity, reduce the scrappage of product.
Description of drawings
Fig. 1 is the structural representation of smart card one preferred embodiment of energy measurement solder joint value of thrust of the present invention;
Fig. 2 is the synoptic diagram of step 1 during the solder joint value of thrust of smart card shown in Figure 1 is tested;
Fig. 3 is the synoptic diagram of step 2 during the solder joint value of thrust of smart card shown in Figure 1 is tested;
The mark of each parts is as follows in the accompanying drawing: 1-substrate, 2-chip, 3-coil, 4-the first extension line, 5-the second extension line, 6-tension tester, 7-chuck.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is described in detail, thereby protection scope of the present invention is made more explicit defining so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that.
See also Fig. 1, Fig. 2 and Fig. 3, the embodiment of the invention: a kind of smart card of energy measurement solder joint value of thrust, comprise substrate 1 and chip 2, chip 2 is welded in the substrate 1, is provided with coil 3 in the substrate 1, and coil 3 is provided with first extension line 4 and second extension line 5; Second extension line, 5, the first extension lines 4 are longer than by first extension line 4 and second extension line 5 welds with chip 2 respectively.
In the present embodiment, first extension line 4 is arranged to swirl type, and second extension line 5 is arranged to linear pattern.
The measuring method of the solder joint value of thrust of the described smart card of present embodiment comprises the steps: that step 1, use tension tester 6 hold chip 2 and upwards draw, and then second extension line 5 is tightened, and tension tester 6 tests out the solder joint value of thrust of second extension line 5; Step 2, use chuck 7 are clamped first extension line 4 and are pulled down, and then first extension line 4 is tightened, and tension tester 6 tests out the solder joint value of thrust of first extension line 4.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes instructions of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (3)
1. the smart card of an energy measurement solder joint value of thrust comprises substrate and chip, and described chips welding is characterized in that in described substrate, is provided with coil in the described substrate, and described coil is provided with first extension line and second extension line; Described first extension line is longer than described second extension line, described first extension line and second extension line respectively with described chips welding.
2. the smart card of energy measurement solder joint value of thrust according to claim 1 is characterized in that, described first extension line is arranged to swirl type, and described second extension line is arranged to linear pattern.
3. the measuring method of the solder joint value of thrust of the described smart card of claim 1, it is characterized in that, comprise the steps: that step 1, use tension tester hold described chip and upwards draw, then described second extension line is tightened, and tension tester tests out the solder joint value of thrust of described second extension line; Step 2, use chuck are clamped first extension line and are pulled down, and then first extension line is tightened, and tension tester tests out the solder joint value of thrust of described first extension line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310101911.9A CN103226725B (en) | 2013-03-27 | 2013-03-27 | A kind of smart card that can measure solder joint value of thrust and solder joint value of thrust measuring method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310101911.9A CN103226725B (en) | 2013-03-27 | 2013-03-27 | A kind of smart card that can measure solder joint value of thrust and solder joint value of thrust measuring method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103226725A true CN103226725A (en) | 2013-07-31 |
| CN103226725B CN103226725B (en) | 2016-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310101911.9A Active CN103226725B (en) | 2013-03-27 | 2013-03-27 | A kind of smart card that can measure solder joint value of thrust and solder joint value of thrust measuring method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1489106A (en) * | 2002-06-07 | 2004-04-14 | 索尼公司 | IC module and manufacturing method thereof, and wireless information storage medium comprising said IC module |
| US20080258278A1 (en) * | 2002-04-29 | 2008-10-23 | Mary Jean Ramos | Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
| CN201569518U (en) * | 2009-11-20 | 2010-09-01 | 富港电子（东莞）有限公司 | Tension testing device |
| CN202748271U (en) * | 2012-09-06 | 2013-02-20 | 浙江海洋学院 | Precise detection device for tensile strength of bonding site |
-
2013
- 2013-03-27 CN CN201310101911.9A patent/CN103226725B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080258278A1 (en) * | 2002-04-29 | 2008-10-23 | Mary Jean Ramos | Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
| CN1489106A (en) * | 2002-06-07 | 2004-04-14 | 索尼公司 | IC module and manufacturing method thereof, and wireless information storage medium comprising said IC module |
| CN201569518U (en) * | 2009-11-20 | 2010-09-01 | 富港电子（东莞）有限公司 | Tension testing device |
| CN202748271U (en) * | 2012-09-06 | 2013-02-20 | 浙江海洋学院 | Precise detection device for tensile strength of bonding site |
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| Publication number | Publication date |
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| CN103226725B (en) | 2016-06-22 |
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Address after: 201707 No. 98, Gaoxin Road, industrial park, Qingpu District, Shanghai Patentee after: Shanghai Dongfang magnetic card information Co., Ltd Address before: 201700 No. 98, Gaoxin Road, Qingpu Industrial Park, Shanghai Patentee before: Shanghai Dongfang magnetic card Engineering Co., Ltd |