CN103217754A - Thermally-sensitive optocoupler - Google Patents
Thermally-sensitive optocoupler Download PDFInfo
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- CN103217754A CN103217754A CN 201310020417 CN201310020417A CN103217754A CN 103217754 A CN103217754 A CN 103217754A CN 201310020417 CN201310020417 CN 201310020417 CN 201310020417 A CN201310020417 A CN 201310020417A CN 103217754 A CN103217754 A CN 103217754A
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Abstract
Various embodiments of methods and devices are provided for a thermally-sensitive optocoupler package. A layer in the optocoupler package has an upper surface and a lower surface, and comprises a thermally-sensitive material. In the package, an LED emits infrared or near-infrared light and a photodetector receives at least a portion of such emitted light and in response provides isolated output signals therefrom. The LED is located above the upper surface, and the photodetector is located beneath the lower surface. The thermally-sensitive material is configured such that an amount of light emitted by the LED, incident on the material and the layer, and transmitted through the material and the layer, changes in accordance with changes in ambient temperature or local thermal conditions.
Description
Related application
Present application for patent be give Wang Zhimin people such as (Chee Mang Wong) in the 13/342nd of being entitled as of on January 3rd, 2012 application " photo-coupler (Optocoupler withMultiple Photodetectors and Improved Feedback Control of LED) that has a plurality of photoelectric detectors and the FEEDBACK CONTROL of LED has been improved ", the part of No. 227 U.S. patent application case (hereinafter being " ' 227 the patent application case ") application case that continues, and advocate right of priority and other interests of described U.S. patent application case from the date of application.
Technical field
The of the present invention various embodiment of Miao Shuing relate to the field of photo-coupler and optoisolator herein.
Background technology
In electronics, photo-coupler is also referred to as optoisolator photoelectrical coupler or optical isolator, is to use light wave to transmit electric signal with at the electronic installation that the coupling with electricity isolation is provided between the input of photo-coupler and the output.The fundamental purpose of photo-coupler is to prevent that high voltage on the side of photo-coupler or the voltage that changes fast from damaging assembly or making emission distortion on the opposite side of photo-coupler.For instance, some commercially available photo-couplers are designed to tolerate and are input to output voltage and the speed voltage transient up to 10kV/usec up to 10kV.
In photo-coupler, the input and output side of device is connected with a light beam (dropping on usually in infrared or the near infrared spectrum), and described light beam is by modulating with the proportional input current of the electric signal that is input to device.Photo-coupler is transformed into light with input electrical signal, with the light signal transmission process dielectric passageway of correspondence, captures the light signal of being launched on the outgoing side of photo-coupler, and the light signal of being launched is transformed back into the output electric signal.Some photo-couplers adopt infrared or near-infrared luminous diode (LED) to launch light signal, and adopt photoelectric detector to come sensed light signal and convert thereof into the output electric signal.
Some photo-couplers comprise side by side the closely photoelectric detector of coupling, and one of them photoelectric detector is used for monitoring and the light output of stable LED non-linear, drift and the aging influence to reduce LED, and another photoelectric detector is used for producing output signal.Referring to the Avago Technologies that proposes (for example) on Dec 10th, 2011
TM" the high linear analogue photo-coupler of HCNR200 and HCNR201 (HCNR200 and HCNR201 High-Linearity AnalogOptocouplers) ", its tables of data and its are proposing in appended information disclosure statement on the same day, and described file is incorporated herein with way of reference in full hereby.
A problem of some commercially available photo-couplers is that the output that provides thus can change according to the change of environment temperature or localized heat environment, and this may be incorporated into another undesired variable in the output signal.
Many commercially available photo-couplers are to provide with the 8 pin dual-in-lines (DIP) of standard or the encapsulation of other standard format.Though in these a little encapsulation based on the change of environment temperature, the detected light signal of localized heat conditioned disjunction to being placed in wherein LED and carrying out FEEDBACK CONTROL and modulation being normally desired, do like this may need than desired greatly and have a more encapsulation of complicated circuit.
Especially need a kind of photo-coupler encapsulation, it has the stability of improvement under temperature that changes or heat condition.
Summary of the invention
In one embodiment, provide a kind of temperature-sensitive photo-coupler encapsulation, it comprises: comprise the layer of thermo-sensitive material, described layer has upper surface and lower surface; At least one light emitting diode (LED), it is configured to send and the proportional infrared or near infrared light of at least one predetermined properties of described input signal; And at least one photoelectric detector, it is configured to provide thus the output signal through isolating, wherein said LED is positioned at the upper surface top of described layer, described photoelectric detector is positioned under the lower surface of described layer, described thermo-sensitive material be configured to make send by described LED, be incident on the described material, and the amount that the light of described material and described layer is crossed in transmission changes according to the change of environment temperature or localized heat condition, and being incident on the described photoelectric detector so that described output signal through isolating to be provided thus to small part of light of described layer crossed in transmission.
In another embodiment, provide a kind of method of operating the encapsulation of temperature-sensitive photo-coupler, it comprises: provide input signal on first and second input signal terminals of the LED that is comprised in described photo-coupler encapsulation; Produce and send infrared or near infrared light from described LED based on described input signal; And make by described LED send and be incident in a part of transmission of light on the upper surface of the layer that comprises thermo-sensitive material cross described layer with and lower surface with the whereabouts photoelectric detector, wherein said LED is positioned at the upper surface top of described layer, described photoelectric detector is positioned under the lower surface of described layer, described thermo-sensitive material is configured to make and is sent by described LED, be incident on the described material, and the amount that the light of described material and described layer is crossed in transmission changes according to the change of environment temperature or localized heat condition, and being incident on the described photoelectric detector so that the output signal through isolating to be provided thus to small part of described light of described layer crossed in transmission.
Disclosed additional embodiments in this article, or the those skilled in the art read and understood instructions of the present invention and graphic after can understand additional embodiments.
Description of drawings
From following instructions, graphic and claims, can obviously find out the different aspect of various embodiment, wherein:
Fig. 1 and 2 explanation is according to two different embodiment of the schematic circuit diagram of the adoptable photo-coupler 8 pin DIP encapsulation of the technology of this paper statement;
Fig. 3 shows 8 pin DIP package arrangements corresponding to the embodiment of circuit shown in Fig. 1;
Fig. 4 shows the loop according to the 4-20mA electric current of the loop service of an embodiment of photo-coupler encapsulation 10 disclosed herein;
Fig. 5 shows the low-cost simulation of the high speed isolator according to an embodiment of photo-coupler encapsulation 10 disclosed herein, and
Fig. 6 and 7 shows the cross-sectional view at an embodiment of photo-coupler encapsulation 10 under the different ambient temperature and under the different accordingly light transmission conditions with respect to layer 24.
Graphic may not be in proportion.Similar numeral refers to similar part or step all the time in graphic.
Embodiment
Fig. 1 and 2 explanation is according to two different embodiment of the schematic circuit diagram of the adoptable photo-coupler 8 pin DIP encapsulation of the technology of this paper statement.
In Fig. 1, the embodiment of photo-coupler encapsulation 10 shown here comprises first and second input signal terminals 12 and 14 (being respectively pin 1 and 2), first and second lead-out terminals 16 and 18 (being respectively pin 3 and 4), third and fourth lead-out terminal 20 and 22 (being respectively pin 5 and 6), and the layer 24 that comprises heat or temperature-sensitive material, wherein said layer comprises upper surface 26 and lower surface 28.Light emitting diode (LED) 30 is operably connected to first and second input signal terminals 12 and 14, and the proportional infrared or near infrared light of at least one predetermined properties of the input signal that is configured to send and receives on first and second input signal terminals 12 and 14.
First photoelectric detector 34 is operably connected to first and second lead- out terminals 16 and 18, and according to an embodiment, being configured to provides LED feedback control signal thereon.Second photoelectric detector 36 is operably connected to third and fourth lead-out terminal 20 and 22, and according to an embodiment, is configured to provide the output signal through isolating thereon.Please note, in other embodiment of photo-coupler encapsulation 10, only photoelectric detector provides the output signal through isolating thereon, because the feedback function that first photoelectric detector 34 in the encapsulation of the photo-coupler shown in Fig. 1 10 is provided by the temperature or thermo-responsive functional the substituting of layer 24, will be discussed about this more details at least in part hereinafter.
Continuation is with reference to figure 1, and LED 30 is positioned at upper surface 26 tops of layer 24, and first detecting device also can be positioned at upper surface 26 tops, or is positioned at lower surface 28 belows.Second photoelectric detector 36 is positioned under the lower surface 28 of layer 24.
Still with reference to figure 1, layer 24 comprises heat or temperature-sensitive material, that described material is configured to make is 30 that send by LED, be incident in layer 24 and settle thereon or wherein on the thermo-sensitive material of (or otherwise forming its part or assembly), and the amount that described material and layer 24 light are crossed in transmission changes according to the change of environment temperature or localized heat condition, and being incident on second photoelectric detector 36 so that the output signal through isolating to be provided thus to small part in the light of layer 24 crossed in transmission.In other words, layer 24 light transmission, and more particularly be incorporated in the layer 24 or on the heat or the light transmission of temperature-sensitive material come to change with respect to the heat of sending and be incident in layer 24 by LED 30 or the light wavelength on the temperature-sensitive material and frequency according to the change of environment temperature or localized heat condition.
According to layer 24 with and an embodiment of thermo-sensitive material, the amount that the light of layer 24 is crossed in transmission increases and increases along with environment temperature.According to layer 24 with and an embodiment of thermo-sensitive material, the amount that the light of layer 24 is crossed in transmission increases along with environment temperature and reduces.In arbitrary this kind embodiment, can be used to regulate and control the output of LED 30 through the FEEDBACK CONTROL output signal of temperature modulation by what photo-coupler encapsulation produced.
Thermo-sensitive material can be partially polymerized at least and/or comprises at least one film.If thermo-sensitive material is partially polymerized at least film, it also can comprise multi-layer optical film so, and according to some embodiment, described blooming can be selective wavelength mirror multi-layer optical film.Described film can be included in the layer between about 100 and about 1,000, and only for instance, the thickness of each in the described layer can be between about 10 nanometers and about 200 nanometers.Can be 3M with a example through upgrading as the material of the thermo-sensitive material of layer in 24
TMCool Mirror Film 330
TMYet, precondition be the composition of this kind film through upgrading to comprise suitable thermo-sensitive material.
According to some embodiment, that thermo-sensitive material can be part thermochromism at least and be configured to change its transmittance according to the change of environment temperature.For instance, the thermo-sensitive material of this kind thermochromism can comprise vanadium dioxide and/or be doped with the vanadium dioxide of titanium.The thermo-sensitive material of thermochromism also can be contained in and be placed in the coating of layer on 24, coating or otherwise be mounted with the dielectric substance of the thermo-sensitive material of described thermochromism above its middle level 24 comprises.In another embodiment, thermo-sensitive material is athermanous to small part, temperature activates, or electrochromic film or material, and it is configured to change its transmittance according to the change of environment temperature or localized heat condition.
Some examples based on the thermochromism film of vanadium dioxide are set forth in Batista people such as (Batista) at research in nanotechnology wall bulletin (Nanoscale Research Letters) 2011, the article of delivering on the 6:301 " be used for Energy Saving Windows based on VO
2The thermochromism film synthetic with characterize (Synthesis and characterization of VO
2-based thermochromic thinfilms for energy-efficient windows) " in, the full text of described article is incorporated herein with way of reference hereby.Some examples of the blooming that temperature activates are disclosed in gave the 7th of being entitled as of Xue Jiuzhi (Jiuzhi Xue) " blooming (Temperature Activated Optical Films) that temperature activates " on July 5th, 2011,973, give in No. 998 United States Patent (USP)s and on January 5th, 2012 in No. 2012/0002264 U.S. Patent Publication case that is entitled as " blooming (Temperature ActivatedOptical Films) that temperature activates " of Xue Jiuzhi (Jiuzhi Xue), the corresponding full text of described each case is incorporated herein with way of reference hereby.Some examples of thermochromism optical filter are disclosed in No. 2010/0045924 U.S. Patent Publication case that is entitled as " method (Methods for FabricatingThermochromic Filters) that is used for making the thermochromism optical filter " of giving this people such as (Powers) of Bauer on February 25th, 2010.Also carry the European patent EP 1985663A1 that is entitled as " molded articles (Moulded Articlewith Temperature Dependent Transparency) " of (DeArmitt) and give the open day unknown open case " ThermoShift that De Ami carries (DeArmitt) with the interdependent transparency of temperature referring to giving De Ami on October 29th, 2008
TM: new athermanous thermoplastics (ThermoShift
TM: New Thermo-opaque Thermoplastics) ", described each case has disclosed the adiathermance material of optical clarity along with temperature change, and the corresponding full text of described each case is incorporated herein with way of reference hereby.To recognize now that as the those skilled in the art some in thermo-sensitive material, optical filter and the film of describing and disclosing can be used in layer 24 disclosed herein and the photo-coupler encapsulation 10 through adjusting and be configured in aforementioned open case and references.
To see now, layer 24 and wherein or on it contained thermo-sensitive material can be configured so that its light transmission according to the increase of temperature or temperature reduce change.These a little speed that change take place with temperature and also can dispose according to application-specific at hand and desired result in light transmission.According to an embodiment, layer 24 and thermo-sensitive material are configured, so that the amount of the light that is received by photoelectric detector 36 keeps constant in the preset range of temperature around.For instance, if LED 30 sends less light when temperature increases around, layer 24 and thermo-sensitive material can be configured to make that the light transmission of layer 24 increases along with temperature so, thereby the output signal that photo-coupler encapsulation 10 is produced through isolating, the amplitude of described signal can not change because of the effect that is caused by temperature in the given range of temperature around, or amplitude at least can marked change.In another example, if LED 30 sends more light when temperature increases around, layer 24 and thermo-sensitive material can be configured to make that the light transmission of layer 24 reduces along with temperature so, thereby the output signal that photo-coupler encapsulation 10 is produced through isolating, the amplitude of described signal can not change because of the effect that is caused by temperature in the given range of temperature around, or amplitude at least can marked change.
According to some embodiment, layer 24 is general configuration as revealed.
With reference now to Fig. 2,, and contrast Fig. 1, comprised the 3rd extra photoelectric detector 37 in photo-coupler encapsulation 10, described the 3rd photoelectric detector is configured to provide output signal through isolating as photoelectric detector 36 on its lead-out terminal ( terminal 21 and 23 or pin 7 and 8).
Fig. 3 shows 8 pin DIP package arrangements corresponding to the embodiment of circuit shown in Fig. 1.
Fig. 4 shows the loop according to the 4-20mA electric current of the loop service of an embodiment of photo-coupler encapsulation 10 disclosed herein.
Fig. 5 shows the low-cost simulation of the high speed isolator according to an embodiment of photo-coupler encapsulation 10 disclosed herein.
Fig. 6 and 7 shows the cross-sectional view according to an embodiment of photo-coupler encapsulation 10, described photo-coupler encapsulation comprises the first input lead frame 38, the second output lead frame 42, be installed in the LED 30 on first lead frame 38, be installed in first photoelectric detector 34 on first lead frame 38, be installed in second photoelectric detector 36 on second lead frame 42, and be placed in layer 24 between the interior section of first and second lead frames 38 and 42, its middle level 24 comprises the thermo-sensitive material that light transmission changes according to the change of environment temperature, and its middle level 24 comprises upper surface 26 and lower surface 28.Light emitting diode (LED) 30 is operably connected to first and second input signal terminals (not being showed among Fig. 6) that are placed on first lead frame 38, and the proportional infrared or near infrared light of at least one predetermined properties of the input signal that is configured to send and receives on first and second input signal terminals.First photoelectric detector 34 is installed on first lead frame 38 that is operably connected to first and second lead-out terminals (not being showed among Fig. 6), and is configured to LED is provided feedback control signal thereon.Second photoelectric detector 36 is installed on second lead frame 42 and is operably connected to third and fourth lead-out terminal (not being showed among Fig. 6) and is configured to provide output signal through isolating thereon.
Continuation is with reference to figure 6, and the LED 30 and first photoelectric detector 34 all are positioned at upper surface 26 tops of layer 24.Second photoelectric detector 36 is positioned under the lower surface 28 of layer 24.As indicated above, layer 24 comprises thermo-sensitive material, that described material is configured to make is 30 that send by LED, be incident in layer 24 and settle thereon or wherein on the thermo-sensitive material of (or otherwise forming its part or assembly), and the amount that described material and layer 24 light are crossed in transmission changes according to the change of environment temperature, and being incident on second photoelectric detector 36 so that the output signal through isolating to be provided thus to small part in the light of layer 24 crossed in transmission.In other words, layer 24 light transmission, and more particularly be incorporated in the layer 24 or on the light transmission of thermo-sensitive material come to change with respect to light wavelength on the thermo-sensitive material that sends and be incident in layer 24 by LED 30 and frequency according to the change of environment temperature.This situation shows by comparison diagram 6 and 7.In Fig. 6, by LED30 send be incident on the upper surface 26 wide part or substantially all transmission cross the thermo-sensitive material that comprised in the layer 24 to incide on the photoelectric detector 36.In Fig. 7, and because the change of environment temperature, the amount transmission that reduces in the light on the upper surface 26 that is incident in of being sent by LED 30 is crossed the thermo-sensitive material that comprised in the layer 24 to incide on the photoelectric detector 36.
Please note, the various embodiment of the layer 24 in the photo-coupler encapsulation 10 can further comprise the dielectric semi-reflective material, described material is configured to and will be produced and be incident in first's light reflection on the upper surface 26 of layer 24 by LED 30 to first photoelectric detector 34, thereby the LED feedback control signal is provided thus, quote as mentioned and incorporate into ' in 227 patent application cases disclose and teaching.This kind dielectric semi-reflective material of layer in 24 can be through further configuration so that the upper surface 26 and the lower surface 28 of layer 24 are crossed in the second portion transmittance that is produced by LED 30, so that detected so that the output signal through isolating to be provided thus by second photoelectric detector 36.
In the various embodiment of photo-coupler encapsulation 10, first, second or the 3rd photoelectric detector can be photodiode, bipolar detector transistor, or the Darlington detector transistor.LED 30 can be AlGaAs LED, ACEAlGaAs LED, DPUP AlGaAs LED, or GaAsP LED.
As shown in Fig. 6 and 7, photo-coupler encapsulation 10 also can comprise moulding compound 46, and described moulding compound impales or encase a plurality of terminals 12,14,16,18,20,22,21 or 23 and the part of the layer 24 of the material of half reflection of dielectric optics and transmission at least in part.For instance, moulding compound 46 can comprise plastics or any other suitable material.In one embodiment, photo-coupler encapsulation 10 is 8 pin DIP encapsulation, but also can contain other package arrangements certainly.
As indicated above, the LED feedback control signal that is provided by first photoelectric detector 34 can be used to regulate and control the output of LED 30.At least one predetermined properties that is used for modulating the input signal of the light that is sent by LED 30 can comprise one or more in input signal amplitude, phase place and the frequency.
With reference now to Fig. 1 to 7,, according to some embodiment, also provide the corresponding method of operational light coupling mechanism encapsulation 10, described method can comprise: provide input signal on first and second input signal terminals 12 and 14 of LED 30; Produce and send infrared signal based on described input signal with LED 30; A certain amount of transmittance that is produced by LED 30 is crossed comprise the upper surface 26 and the opposing lower surface 28 of the layer 24 of thermo-sensitive material, thereby produce and provide output signal thus through isolating to go to second photoelectric detector 36; And change the amount of this light according to the change of environment temperature, wherein second photoelectric detector 36 is positioned under the lower surface 28.These a little methods can further comprise one or more in the following steps: use by what photo-coupler encapsulation 10 produced and regulate and control the output of LED 30 through the FEEDBACK CONTROL output signal of temperature modulation; The amount that makes transmission cross the light of layer 24 increases and increases along with environment temperature; The amount that makes transmission cross the light of layer 24 increases along with environment temperature and reduces; Be provided for the partially polymerized at least material of thermo-sensitive material; Film as thermo-sensitive material is provided; And provide thermochromic material as thermo-sensitive material.
According to above-mentioned teaching, various photo-couplers and photo-coupler encapsulation known in this technology can be fit to use.The example of these a little photo-couplers and photo-coupler encapsulation is including (but not limited to) (a) AvagoTechnologies that proposed January 29 in 2010
TM" 6N135/6, HCNW135/6, HCPL-2502/0500/0501 single channel, high-speed light coupling device (6N135/6, HCNW135/6, HCPL-2502/0500/0501Single Channel, High SpeedOptocouplers) "; (b) the Avago Technologies that proposed on January 4th, 2008
TM" HCPL-7710/071040ns propagation delay CMOS photo-coupler (HCPL-7710/071040ns Propagation Delay CMOSOptocoupler) "; And the Avago Technologies that (c) proposed on March 29th, 2010
TM" 6N137; HCNW2601; HCNW2611; HCPL-0600; HCPL-0601; HCPL-0611, HCPL-0630, HCPL-0631, HCPL-0661, HCPL-2601, HCPL-2611, HCPL-2630, HCPL-2631, the high CMR of HCPL-4661, high speed TTL compatible photo-coupler (6N137, HCNW2601, HCNW2611, HCPL-0600, HCPL-0601, HCPL-0611, HCPL-0630, HCPL-0631, HCPL-0661, HCPL-2601, HCPL-2611, HCPL-2630, HCPL-2631, HCPL-4661High CMR, High Speed TTL Compatible Optocouplers) "; Above-mentioned each person's corresponding data table and its are proposing in appended information disclosure statement and above-mentioned each person is incorporated herein with way of reference hereby with its corresponding full text separately on the same day.
The foregoing description should be regarded as example of the present invention, but not limits the scope of the invention, and except previous embodiment of the present invention, checks embodiment and accompanying drawing and also will show the present invention and exist other embodiment.Therefore, clearly many combinations, displacement, variation and the modification of the previous embodiment of the present invention of statement still do not belong in the scope of the present invention herein.
Claims (29)
1. temperature-sensitive photo-coupler encapsulation, it comprises:
The layer that comprises thermo-sensitive material, described layer has upper surface and lower surface;
At least one LED, it is configured to send and the proportional infrared or near infrared light of at least one predetermined properties of input signal, and
At least one photoelectric detector, it is configured to provide thus the output signal through isolating;
Wherein said LED is positioned at the described upper surface top of described layer, described photoelectric detector is positioned under the described lower surface of described layer, described thermo-sensitive material be configured to make send by described LED, be incident on the described material, and the amount that the light of described material and described layer is crossed in transmission changes according to the change of environment temperature or localized heat condition, and being incident on the described photoelectric detector so that described output signal through isolating to be provided thus to small part of described light of described layer crossed in transmission.
2. temperature-sensitive photo-coupler according to claim 1 encapsulation, wherein the transmission described amount of crossing the light of described layer increases and increases along with described environment temperature.
3. temperature-sensitive photo-coupler according to claim 2 encapsulation wherein is used for regulating and controlling the output of described LED by what described photo-coupler encapsulation produced through the FEEDBACK CONTROL output signal of temperature modulation.
4. temperature-sensitive photo-coupler according to claim 1 encapsulation, wherein the transmission described amount of crossing the light of described layer increases along with described environment temperature and reduces.
5. temperature-sensitive photo-coupler encapsulation according to claim 4, wherein the FEEDBACK CONTROL output signal through temperature modulation that is produced by described photo-coupler encapsulation is used for regulating and controlling the described output of described LED.
6. temperature-sensitive photo-coupler encapsulation according to claim 1, wherein said thermo-sensitive material is partially polymerized at least.
7. temperature-sensitive photo-coupler encapsulation according to claim 6, wherein said thermo-sensitive material further comprises at least one film.
8. temperature-sensitive photo-coupler encapsulation according to claim 7, wherein said partially polymerized at least film is a multi-layer optical film.
9. temperature-sensitive photo-coupler encapsulation according to claim 8, wherein said multi-layer optical film is a selective wavelength mirror multi-layer optical film.
10. temperature-sensitive photo-coupler encapsulation according to claim 9, wherein said film is included in the layer between about 100 and about 1,000.
11. temperature-sensitive photo-coupler encapsulation according to claim 10, the thickness of each in the wherein said layer is between about 10 nanometers and about 200 nanometers.
12. temperature-sensitive photo-coupler encapsulation according to claim 1, wherein said thermo-sensitive material are part thermochromisms at least.
13. temperature-sensitive photo-coupler encapsulation according to claim 12, wherein said material further comprises vanadium dioxide.
14. temperature-sensitive photo-coupler encapsulation according to claim 12, wherein said material further comprises titanium.
15. temperature-sensitive photo-coupler encapsulation according to claim 12, wherein said thermochromic material is contained in the coating that is placed on the described layer.
16. temperature-sensitive photo-coupler according to claim 15 encapsulates, and has been coated with the dielectric substance of described thermochromic material above wherein said layer further comprises.
17. temperature-sensitive photo-coupler encapsulation according to claim 1, wherein said thermo-sensitive material is electrochromic to small part.
18. temperature-sensitive photo-coupler encapsulation according to claim 1, wherein said at least one predetermined properties comprises at least one in input signal amplitude, phase place and the frequency.
19. temperature-sensitive photo-coupler encapsulation according to claim 1, wherein said photoelectric detector is one in photodiode, bipolar detector transistor and the Darlington detector transistor.
20. temperature-sensitive photo-coupler encapsulation according to claim 1, wherein said LED is one among AlGaAs LED, ACEAlGaAs LED, DPUP AlGaAs LED and the GaAsP LED.
21. temperature-sensitive photo-coupler encapsulation according to claim 1, wherein said photo-coupler further comprises the moulding compound that impales or encase described LED, described photoelectric detector and described layer to small part.
22. temperature-sensitive photo-coupler encapsulation according to claim 1, wherein said photo-coupler are 8 pin DIP encapsulation.
23. a method of operating the encapsulation of temperature-sensitive photo-coupler, it comprises:
Provide input signal on first and second input signal terminals of the LED that in described photo-coupler encapsulation, is comprised;
Produce and send infrared or near infrared light from described LED based on described input signal; And
Make by described LED send and be incident in a part of transmission of light on the upper surface of the layer that comprises thermo-sensitive material cross described layer with and lower surface with the whereabouts photodetector;
Wherein said LED is positioned at the described upper surface top of described layer, described photoelectric detector is positioned under the described lower surface of described layer, described thermo-sensitive material be configured to make send by described LED, be incident on the described material, and the amount that the light of described material and described layer is crossed in transmission changes according to the change of environment temperature or localized heat condition, and being incident on the described photoelectric detector so that the output signal through isolating to be provided thus to small part of described light of described layer crossed in transmission.
24. method according to claim 23, it comprises that further use regulates and control the output of described LED by what the encapsulation of described photo-coupler produced through the FEEDBACK CONTROL output signal of temperature modulation.
25. method according to claim 23, wherein the transmission described amount of crossing the light of described layer increases and increases along with described environment temperature.
26. method according to claim 23, wherein the transmission described amount of crossing the light of described layer increases along with described environment temperature and reduces.
27. method according to claim 23, wherein said thermo-sensitive material are partially polymerized at least.
28. method according to claim 23, wherein said thermo-sensitive material further comprises at least one film.
29. method according to claim 23, wherein said thermo-sensitive material further comprises thermochromic material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/353,303 | 2012-01-18 | ||
| US13/353,303 US20130168553A1 (en) | 2012-01-03 | 2012-01-18 | Thermally-Sensitive Optocoupler |
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| Publication Number | Publication Date |
|---|---|
| CN103217754A true CN103217754A (en) | 2013-07-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201310020417 Pending CN103217754A (en) | 2012-01-18 | 2013-01-18 | Thermally-sensitive optocoupler |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113219602A (en) * | 2021-05-20 | 2021-08-06 | 通号(北京)轨道工业集团有限公司轨道交通技术研究院 | Optical coupler |
| CN113359249A (en) * | 2021-06-07 | 2021-09-07 | 通号(北京)轨道工业集团有限公司轨道交通技术研究院 | Optical coupling structure |
-
2013
- 2013-01-18 CN CN 201310020417 patent/CN103217754A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113219602A (en) * | 2021-05-20 | 2021-08-06 | 通号(北京)轨道工业集团有限公司轨道交通技术研究院 | Optical coupler |
| CN113359249A (en) * | 2021-06-07 | 2021-09-07 | 通号(北京)轨道工业集团有限公司轨道交通技术研究院 | Optical coupling structure |
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Application publication date: 20130724 |