CN103214947B - Low-radiation paint composition as well as preparation method and low-radiation material thereof - Google Patents

Abstract

The invention provides a low-radiation paint composition as well as a method for preparing the low-radiation paint composition and a low-radiation material including the low-radiation paint composition. The low-radiation paint composition comprises the following components in percentage by weight: 1wt%-15wt% of semiconductor nanometer particles, 1wt%-10wt% of water-soluble conductive high polymer materials and 10wt%-60wt% of organic silicon resin, wherein the semiconductor nanometer particles have a mean particle diameter of 1nm-100nm. The low-radiation paint composition provided by the invention can be used for improving the conductivity of the coating, improving the radiance, lowering a heat transfer coefficient, and achieving good thermal-insulation heat insulation performance. Moreover, the low-radiation composition is environment-friendly.

Description

Low-E coating composition, its preparation method and low-E material

technical field

The invention belongs to the technical field of functional nanomaterials, and in particular relates to a low-emissivity coating composition comprising semiconductor nanoparticles, water-soluble conductive polymer materials and silicone resins, a method for preparing the low-emission coating composition, and the low-emission coating composition comprising the low-emission coating composition Low-E materials for coatings formed from radiant coating compositions.

Background technique

With the proposal of my country's sustainable development strategy and the concept of building a resource-saving society, building energy conservation has become one of the hot issues that need to be resolved urgently. At present, building energy consumption accounts for about 40% of the total energy consumption of the society, and the energy lost through glass doors and windows accounts for 40% of building energy consumption. Door and window glass has become the biggest energy loophole in buildings.

In recent years, as an energy-saving coating that has a good barrier to near-infrared light and can maintain a high visible light transmittance, nano-coatings have attracted much attention due to their environmental friendliness, good heat insulation effect, and simple preparation process. extensive attention. U.S. Patent US5518810 adopts tin-doped indium oxide powder dispersed in inorganic or organic polymers to form coatings and films, which are transparent in the visible light region and can block all near-infrared light with a wavelength above 1000nm, so as to achieve the purpose of heat insulation , the barrier of the obtained coating to infrared rays reaches more than 90%. European patent EP1040913 has reported a kind of transparent infrared barrier thermal coating of the multilayer structure that is made of base film layer, infrared barrier layer, protective layer, adhesive layer, separation layer, and it adopts the indium tin oxide ( ITO) particles are used as infrared blocking fillers, and non-ionic surfactants are used as dispersants for ITO. The coating can block the energy of near-infrared light with a wavelength of 1000-2500nm. US Patent 6107360 discloses a resin composite sunshade coating containing a sun absorber (zinc dehydrodysprospronate) that needs to be cured by ultraviolet light. The sun absorber is dispersed in toluene and needs to be cured by ultraviolet light. Chinese invention patent CN1903958 discloses a synthetic polyurethane glass thermal insulation coating and its preparation method. The coating includes synthetic polyurethane resin, 50-100nm nano antimony tin oxide (ATO) slurry and thinner. Glass has a high visible light transmittance, and at the same time has a high reflectivity to infrared (thermal radiation), which has the effect of blocking the direct transmission of thermal radiation. Chinese invention patent CN1609030A uses tin inorganic compounds as raw materials to synthesize a precursor required for low-emissivity glass coating, and sprays the precursor solution on the hot voltaic glass surface to form doped tin oxide low-emissivity coatings with different thicknesses and properties. layer. Chinese invention patent CN1800068, disperse nanoparticles such as ATO or ITO in polymer resin, apply the paint on the glass surface by spraying and brushing, and after drying and curing, the glass with heat insulation function is obtained. Chinese invention patent CN101239788A discloses a glass with transparent conductive and thermal insulation properties of zinc gallium oxide (GZO) nanomaterials. Chinese invention patent CN101993657A reports a smart and transparent thermal insulation glass coating, which is mixed with nano-ITO or ATO, nano-vanadium dioxide, etc. and organic silicon resin, and has the function of adjusting the infrared transmittance at high and low temperatures . Based on the above-mentioned patents, the thermal insulation effect is a thermal insulation transparent coating made by mixing tin antimony oxide, indium tin oxide or zinc gallium oxide nanoparticles with organic resins, but the organic resin contained in these glass coatings reduces the coating The resistance of the coating increases, which increases the heat transfer coefficient of the surface and reduces the heat insulation performance of the coating.

Contents of the invention

Therefore, the present invention is proposed in view of the above problems. The purpose of the present invention is to provide a green and environmentally friendly water-based low-emissivity coating composition, which can effectively block ultraviolet rays, transmit visible light and reflect infrared rays, thereby providing good thermal insulation effect.

According to one aspect of the present invention, the present invention provides a low-emissivity coating composition, comprising: 1-15wt% of semiconductor nanoparticles; 1-10wt% of water-soluble conductive polymer material; 10-60wt% of organic silicon resin ; wherein the semiconductor nanoparticles have an average particle diameter of 1 to 100 nm.

The semiconductor nanoparticles are one or more selected from particles of silver, gold, indium tin oxide, tin antimony oxide, zinc aluminum oxide, and zinc gallium oxide.

The water-soluble conductive polymer material is composed of one or more conductive polymer monomers selected from aniline, aniline derivatives, pyrrole, pyrrole derivatives, C1-18 alkyl-substituted thiophene and diethoxythiophene and Formed by polymerization of polystyrene sulfonate.

The silicone resin is selected from methyltriacetoxysilane, methyltrimethoxysilane, divinyltriaminopropyltrimethoxysilane, divinyltriaminopropylmethyldiethoxysilane, Vinyltrimethoxysilane, α-(methacryloxy)propyltrimethoxysilane, N-(α-aminoethyl)-γ-aminopropylmethyldimethoxysilane, γ-shrink One or more organosilicon monomers from glyceryl etheroxypropoxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane aggregate formation.

According to another aspect of the present invention, the present invention provides a method for preparing a low-radiation coating composition, comprising: dispersing semiconductor nanoparticles with an average particle diameter of 1 to 100 nm in water to obtain a semiconductor nanoparticle dispersion, wherein the semiconductor The content of nanoparticles is 20% to 50% of the total weight of the semiconductor nanoparticle dispersion; the conductive polymer monomer and polystyrene sulfonate are mixed in a solvent including water at a molar ratio of 1:1 to 2:1 Polymerize to form a 5-20% water-soluble conductive polymer material solution; polymerize the organosilicon monomer in a solvent including water to form a 50-90% organosilicon resin solution; use 1:10-15:1 of the semiconductor The weight ratio of nanoparticles to the water-soluble conductive polymer material is to mix the semiconductor nanoparticle dispersion with the water-soluble conductive polymer material solution to obtain a composite slurry; mix the composite slurry with the silicone resin The solution is mixed at a weight ratio of 20-50%:50-80% to obtain a low-radiation coating composition.

According to another aspect of the present invention, the present invention provides a low-E material, comprising a substrate and a coating formed from the above-mentioned low-E coating composition.

The substrate is glass or transparent plastic.

In the low-emissivity coating composition provided by the present invention, a harmless solvent including water is used, and a water-soluble conductive polymer material is added, which can improve the conductivity of the coating, improve the emissivity, reduce the heat transfer coefficient, and provide thermal insulation. Good performance and friendly to the environment at the same time. In addition, the low-radiation coating composition provided by the invention also has the functions of waterproof and mildew resistance, and the service life can be as long as more than ten years.

Description of drawings

Fig. 1 is the transmission electron microscope picture of the nanometer ATO aqueous dispersion liquid prepared in embodiment 1;

Fig. 2 is the particle size distribution figure of the nanometer ATO aqueous dispersion liquid prepared in embodiment 1;

Fig. 3 is the optical picture of the glass that is coated with the low radiation coating composition prepared in embodiment 1;

FIG. 4 is an ultraviolet-visible spectrogram of glass coated with the low-emissivity coating composition prepared in Example 1. FIG.

Detailed ways

The invention provides a high-efficiency and environment-friendly low-radiation coating composition, which comprises 1-15wt% of semiconductor nanoparticles; 1-10wt% of water-soluble conductive polymer materials; 10-60wt% of organic silicon resin; wherein the nanoparticles have 1-100nm average particle size.

The aforementioned semiconductor nanoparticles may be particles selected from silver, gold, indium tin oxide, tin antimony oxide, zinc aluminum oxide, zinc gallium oxide, or combinations thereof.

The above-mentioned water-soluble conductive polymer material is selected from aniline, aniline derivatives (such as o-toluidine, m-toluidine, m-nitroaniline, p-nitroaniline, o-chloroaniline, p-chloroaniline, m-chloroaniline, etc.), Pyrrole, pyrrole derivatives (such as 2,5-dithienylpyrrole, 3-pentanoylpyrrole, etc.), C1-18 (preferably C1-10, more preferably C1-6) alkyl-substituted thiophene and diethoxythiophene One or more conductive macromolecular monomers are polymerized with polystyrene sulfonate.

The above silicone resin is selected from methyltriacetoxysilane, methyltrimethoxysilane, divinyltriaminopropyltrimethoxysilane, divinyltriaminopropylmethyldiethoxysilane, ethylene Trimethoxysilane, α-(methacryloyloxy)propyltrimethoxysilane, N-(α-aminoethyl)-γ-aminopropylmethyldimethoxysilane, γ-glycidol Polymerization of one or more organosilicon monomers from etheroxypropoxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane form.

The present invention provides a kind of preparation method of above-mentioned low radiation paint composition, specifically comprises the following steps:

1) Add 0.1-0.5% surfactant of the total weight of the semiconductor nanomaterial dispersion into the solvent, ultrasonically mix the above-mentioned semiconductor nanoparticles for 0.5-2.5 hours, preferably 1 hour, and then use a ball mill for 8-12 hours, preferably After 10 hours, a modified semiconductor nanometer material dispersion is obtained, wherein the content of the inorganic semiconductor nanoparticle is 20-50% of the total weight of the semiconductor nanoparticle dispersion.

The surfactant used can be one or more of sodium dodecylsulfonate, sodium lauryl sulfate, sodium dodecylbenzenesulfonate, oleic acid, stearic acid, polysorbate 80, polysorbate 60 kind.

The aforementioned solvent may include a mixed solvent of two or more of ethanol, n-propanol, isopropanol, n-butanol, isobutanol, ethylene glycol, propylene glycol, butylene glycol, pentylene glycol, and water.

2) Add the conductive polymer monomer and polystyrene sulfonate into water, mix them uniformly by ultrasonic to form a mixed emulsion, then add an oxidant, and oxidize and polymerize at a temperature of 20-70°C for 5-12 hours, among which, the conductive high The addition amount of molecular monomer is 100～1000 millimoles per liter of the above-mentioned mixed emulsion; the molar ratio of the addition amount of polystyrene sulfonate and monomer is 1:1～2:1; The molar ratio is 1:1～5:1. In the obtained conductive polymer material solution, the content of the conductive polymer material is 5-20%.

The above-mentioned oxidizing agent can be ferric trichloride, ferric p-toluenesulfonate, ammonium persulfate, horseradish peroxidase, four p-sulfonate-phenylporphyrin iron, or their mixtures.

The above-mentioned polystyrene sulfonate may be any dissociable water-soluble polystyrene sulfonate, such as sodium polystyrene sulfonate, potassium polystyrene sulfonate, and the like.

3) Take a certain amount of organosilicon monomer in a certain amount of water, then add catalyst, wherein the content of organosilicon monomer is 20-90wt%, the amount of catalyst is 0.1-5wt%, mechanically stir and heat to 30-60°C , polymerize for 1-4 hours, preferably 2 hours, to obtain a silicone resin solution with a silicone resin content of 50-90%.

The above-mentioned catalyst can be inorganic acid, inorganic base, organic acid, organic base in solid or liquid state, or one or more of the above-mentioned catalysts, such as hydrochloric acid, sulfuric acid, oxalic acid, acetic acid and the like.

4) uniformly mixing the semiconductor nanomaterial dispersion prepared in step 1 with the aqueous conductive polymer solution prepared in step 2 at a weight ratio of semiconductor nanoparticles to water-soluble conductive polymer material of 1:10 to 15:1 to obtain Composite slurry.

5) Mix the composite slurry prepared in step 4 with the silicone resin solution prepared in step 3 at a weight ratio of 20-50%:50-80% to prepare a low-emissivity coating composition.

The present invention provides a low-emissivity material comprising a coating formed from the above-mentioned low-emissivity coating composition, wherein the coating with high-efficiency low-emission transparent heat insulation is applied with a thickness of 0.1 to 500 μm by methods such as spraying, roller coating, brushing, etc. Clothed on a clean glass or transparent plastic substrate, it has the functions of blocking ultraviolet rays, passing through visible light and reflecting infrared rays, and has the function of heat preservation and heat insulation.

In the above-mentioned low-radiation coating composition of the present invention, the semiconductor nanomaterial has the following properties: for ultraviolet rays with a wavelength less than 400nm, the absorption rate reaches about 90%; for visible light with a wavelength of 400-800nm, the transmittance has no obvious influence; Near-infrared rays with a wavelength of 800-2500nm, because the frequency of incident light from the sun is higher than the vibration frequency of semiconductor nanomaterials, causes high reflection of its ions, thus reflecting the high-band solar energy. In addition, the addition of water-soluble conductive polymer materials can effectively improve the electrical conductivity of the coating, which is beneficial to reduce the emissivity and heat transfer coefficient, and improve the thermal insulation performance of the coating. The addition of the silicone resin acts as a binder to enhance the binding force between the semiconductor nanomaterials and between the semiconductor nanomaterials and the substrate. In addition, by adjusting the ratio of semiconductor nanomaterials, water-soluble conductive polymer materials, and silicone resins, the heat insulation performance of the coating can be adjusted to meet different technical requirements.

Thus, the low-emissivity coating composition provided by the present invention can provide a coating with an electrical conductivity of 10 to 1000 Ω/cm ² , and has the thermal conductivity (U value) can be 2.0-2.5 W/m ² ·K, the visible light transmittance is greater than 70%, the infrared reflectivity is greater than 70% and the ultraviolet blocking rate is greater than 95%. The low-radiation coating composition not only has the function of heat preservation and heat insulation, but also has the functions of waterproof and anti-mildew, and can have a service life of more than ten years.

Example

1. Preparation of low-emissivity coating composition

Example 1

0.1 g of sodium dodecylbenzenesulfonate was added to 100 mL of deionized water, and 40 g of ATO particles with an average particle diameter of 5 nm were added thereto. The resulting mixture was ultrasonically mixed for 1 hour, and then ball milled for 10 hours with a ball mill to obtain a modified 28.6% nano-ATO aqueous dispersion. The particle state observed by transmission electron microscope (Japan Electronics, JEM-100CXII) to this nanometer ATO aqueous dispersion is as shown in Figure 1, and it measures the particle size distribution figure with laser particle size analyzer (UK Malvern, zs90) as shown in picture 2.

12.8g (90mmol) of ethylenedioxythiophene was added as a conductive polymer monomer into 37g (180mmol) of sodium polystyrene sulfonate, and mixed by ultrasonic to form a mixed emulsion. Add 24.3g (90mmol) ferric trichloride as oxidizing agent to this mixed emulsion, and fully stir evenly. The resulting mixture was oxidatively polymerized at 25° C. for 5 hours to prepare a water-soluble conductive polymer material solution having a water-soluble conductive polymer material content of 5%.

Add 180g of methyltriacetoxysilane to 20g of deionized water, add 0.5g of 2M hydrochloric acid as a catalyst, heat to 40°C under mechanical stirring, and polymerize for 2 hours to obtain an organic silicone resin with a content of 89.8%. Silicone solution.

Add 20 g of the water-soluble conductive polymer material solution prepared above into 20 g of the above-mentioned nano-ATO aqueous dispersion, and mix evenly to obtain a composite slurry.

Add 60g of the above-prepared silicone resin solution into 40g of the above-mentioned composite slurry, and mix evenly to obtain Low-E coating composition-1.

Example 2

0.1 g of sodium dodecylsulfonate was added to 500 mL of deionized water, and 150 g of ATO particles having an average particle diameter of 100 nm were added thereto. The resulting mixture was ultrasonically mixed for 1 hour, and then ball milled for 10 hours with a ball mill to obtain a modified 23.1% nano-ATO aqueous dispersion.

12.8 g (90 mmol) of ethylenedioxythiophene was added as a conductive polymer monomer into 18.5 g (90 mmol) of sodium polystyrene sulfonate, and mixed by ultrasonic to form a mixed emulsion. Add 102.7g (450mmol) ammonium persulfate as an oxidizing agent to the mixed emulsion, and stir well. The resulting mixture was oxidatively polymerized at 25° C. for 5 hours to prepare a water-soluble conductive polymer material solution having a water-soluble conductive polymer material content of 7%.

Take 180g of methyltrimethoxysilane and add it to 20g of deionized water, add 3.4g of 2M hydrochloric acid as a catalyst, heat to 30°C under mechanical stirring, and carry out polymerization for 2 hours to obtain an organic silicone resin with a content of 88.5%. Silicone solution.

Add 15 g of the water-soluble conductive polymer material solution prepared above into 25 g of the above-mentioned nano-ATO aqueous dispersion, and mix evenly to prepare a composite slurry.

Add 60g of the above-prepared silicone resin solution to 40g of the above-mentioned composite slurry, and mix evenly to prepare Low-E coating composition-2.

Example 3

0.1 g of sodium lauryl sulfate was added to 300 mL of deionized water, and 200 g of ATO particles with an average particle diameter of 1 nm were added thereto. The resulting mixture was ultrasonically mixed for 1 hour, and then ball milled for 10 hours to obtain a modified 40% nano-ATO aqueous dispersion.

12.8g (90mmol) of ethylenedioxythiophene was added as a conductive polymer monomer into 37g (180mmol) of sodium polystyrene sulfonate, and a mixed emulsion was formed after ultrasonic mixing. Add 60.01g (90mmol) iron p-toluenesulfonate as an oxidizing agent to the mixed emulsion, and fully stir evenly. The resulting mixture was oxidatively polymerized at 25° C. for 5 hours to prepare a water-soluble conductive polymer material solution having a water-soluble conductive polymer material content of 8%.

Take 46.7g of γ-glycidyl etheroxypropoxypropyl trimethoxysilane and add it to 20g of deionized water, add 0.8g of 2M hydrochloric acid as a catalyst, heat to 55°C under mechanical stirring, and carry out polymerization for 2 hours to obtain A silicone resin solution with a silicone resin content of 69.2%.

Add 3 g of the water-soluble conductive polymer material solution prepared above into 7 g of the above-mentioned nano-ATO aqueous dispersion, and mix evenly to prepare a composite slurry.

Add 10 g of the above-prepared silicone resin solution to 10 g of the above-mentioned composite slurry, and mix evenly to obtain Low-E coating composition-3.

Example 4

0.1 g of oleic acid was added to 100 mL of deionized water, and 60 g of ATO particles with an average particle diameter of 10 nm were added thereto. The resulting mixture was ultrasonically mixed for 1 hour, and then ball milled with a ball mill for 10 hours to obtain a modified 37.5% nano-ATO aqueous dispersion.

Add 8.4g (90mmol) of aniline as a conductive polymer monomer into 37g (135mmol) of sodium polystyrene sulfonate, and form a mixed emulsion after ultrasonic mixing. Add 48.7g (180mmol) ferric trichloride to this mixed emulsion as an oxidizing agent, and fully stir evenly. The resulting mixture was oxidatively polymerized at 25° C. for 5 hours to prepare a water-soluble conductive polymer material solution having a water-soluble conductive polymer material content of 9%.

Take 46.7g of diethylenetriaminopropylmethyldiethoxysilane and add it to 20g of deionized water, add 0.8g of 2M hydrochloric acid as a catalyst, heat to 45°C under mechanical stirring, and carry out polymerization for 2 hours to obtain organic A silicone resin solution with a silicone content of 69.2%.

Add 25 g of the water-soluble conductive polymer material solution prepared above into 20 g of the above-mentioned nano-ATO aqueous dispersion, and mix evenly to prepare a composite slurry.

Add 55g of the above-prepared silicone resin solution into 45g of the above-mentioned composite slurry, and mix evenly to prepare Low-E coating composition-4.

Example 5

0.1 g of stearic acid was added to 100 mL of deionized water, and 70 g of ATO particles with an average particle diameter of 30 nm were added thereto. The resulting mixture was ultrasonically mixed for 1 hour, and then ball milled with a ball mill for 10 hours to obtain a modified 41.2% nano-ATO aqueous dispersion.

Add 12.8g (90mmol) of pyrrole as a conductive polymer monomer into 37g (180mmol) of sodium polystyrene sulfonate, and form a mixed emulsion after ultrasonic mixing. Add 60.01g (90mmol) iron p-toluenesulfonate as an oxidizing agent to this mixed emulsion, and fully stir evenly. The resulting mixture was oxidatively polymerized at 25° C. for 5 hours to prepare a water-soluble conductive polymer material solution having a water-soluble conductive polymer material content of 10%.

Take 60g of vinyltrimethoxysilane and add it to 20g of deionized water, add 0.8g of 2M hydrochloric acid as a catalyst, heat to 50°C under mechanical stirring, and carry out polymerization for 2 hours to obtain an organic silicone resin with a content of 74.3%. Silicone solution.

Add 3 g of the water-soluble conductive polymer material solution prepared above into 6 g of the above-mentioned nano-ATO aqueous dispersion, and mix evenly to prepare a composite slurry.

Add 11 g of the above-prepared silicone resin solution to 9 g of the above-mentioned composite slurry, and mix evenly to obtain Low-E coating composition-5.

Example 6

0.1 g of Tween 80 was added to 200 mL of deionized water, and 100 g of ATO particles with an average particle diameter of 70 nm were added thereto. The resulting mixture was ultrasonically mixed for 1 hour, and then ball milled with a ball mill for 10 hours to obtain a modified 33.3% nano-ATO aqueous dispersion.

12.8g (90mmol) of ethylenedioxythiophene was added as a conductive polymer monomer into 37g (180mmol) of sodium polystyrene sulfonate, and a mixed emulsion was formed after ultrasonic mixing. Add 60.01g (90mmol) iron p-toluenesulfonate as an oxidizing agent to this mixed emulsion, and fully stir evenly. The resulting mixture was subjected to oxidative polymerization at 25° C. for 5 hours to prepare a water-soluble conductive polymer material solution having a water-soluble conductive polymer material content of 20%.

Add 100g of divinyltriaminopropyltrimethoxysilane to 20g of water, add 0.8g of 2M hydrochloric acid as a catalyst, heat to 30°C under mechanical stirring, and polymerize for 2 hours to obtain a silicone resin with a content of 82.8%. of silicone resin solution.

Adding more than 10 g of the prepared water-soluble conductive polymer material solution to 20 g of the above-mentioned nano-ATO aqueous dispersion, and mixing evenly, to prepare a composite slurry.

Add 70g of the above-prepared silicone resin solution to 30g of the above-mentioned composite slurry, and mix evenly to prepare Low-E coating composition-6.

2. Performance Evaluation of Low-E Coating Compositions

Coat each of the low-emissivity coating compositions prepared in Examples 1 to 6 above onto a clean insulating glass, and the coating thickness after drying is about 100 μm. For the insulating glass (5+12A+6) sample with the above coating The following tests were carried out and the results are shown in Table 1.

(1) Conductivity (Ω/cm ² ) of the coating after drying: it was tested with a Keithley 4200 instrument using a four-probe method.

(2) Heat transfer coefficient U (W/m ² ·K) of insulating glass (5+12A+6) with coating: calculated by infrared reflection spectrum.

(3) Visible light transmittance, infrared reflectance and ultraviolet blocking rate of coated glass: tested with Shimadzu-UV-3600 instrument.

Specifically, the optical picture and the ultraviolet-visible spectrum picture coated with the low-emissivity coating composition prepared in Example 1 are shown in Fig. 3 and Fig. 4 respectively.

Table 1

3 and 4, it can be seen from Examples 1 to 6 and Table 1 that the insulating glass with the coating formed by the coating composition of the above embodiments has a transmittance greater than 70% for visible light, and has a transmittance of more than 70% for ultraviolet rays. It has a blocking rate of more than 95%, a reflectivity of more than 70% for infrared rays, and a reduced heat transfer coefficient, so it has good thermal insulation performance and is environmentally friendly.

Claims (4)

1. A low-emissivity coating composition, characterized in that, said low-emission coating composition comprises: 1-15wt% semiconductor nanoparticles; 1-10wt% water-soluble conductive polymer material; 10-60wt% silicone resin; Wherein, the semiconductor nanoparticles have an average particle diameter of 1 to 100 nm; and The semiconductor nanoparticles are one or more particles selected from silver, gold, indium tin oxide, tin antimony oxide, zinc aluminum oxide, and zinc gallium oxide; The water-soluble conductive polymer material is formed by polymerizing one or more conductive polymer monomers and polystyrene sulfonate, and the conductive polymer monomer is selected from aniline, aniline derivatives, pyrrole, pyrrole derivatives, C1-18 alkyl substituted thiophene and diethoxythiophene; Wherein, the aniline derivatives are selected from o-methylaniline, m-toluidine, m-nitroaniline, p-nitroaniline, o-chloroaniline, p-chloroaniline and m-chloroaniline, and the pyrrole derivatives are selected from 2,5 - Dithienylpyrrole and 3-pentanoylpyrrole; The silicone resin is formed by polymerization of one or more silicone monomers selected from the group consisting of methyltriacetoxysilane, methyltrimethoxysilane, divinyltriaminopropyltrimethoxy Divinyltriaminopropylmethyldiethoxysilane, vinyltrimethoxysilane, α-(methacryloyloxy)propyltrimethoxysilane, N-(α-aminoethyl )-γ-aminopropylmethyldimethoxysilane, γ-glycidyloxypropoxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-mercapto Propyltriethoxysilane. 2. A method for preparing low-emissivity coating composition, is characterized in that, described method comprises: Dispersing semiconductor nanoparticles with an average particle size of 1-100 nm in a solvent including water to obtain a semiconductor nanoparticle dispersion, wherein the content of the semiconductor nanoparticles is 20-50% of the total weight of the semiconductor nanoparticle dispersion; Polymerize the conductive polymer monomer and polystyrene sulfonate in a solvent including water at a molar ratio of 1:1 to 2:1 to form a 5% to 20% water-soluble conductive polymer material solution; Polymerizing the organosilicon monomer in a solvent including water to form a 50-90% organosilicon resin solution; Mixing the semiconductor nanoparticle dispersion and the water-soluble conductive polymer material solution at a weight ratio of the semiconductor nanoparticles to the water-soluble conductive polymer material of 1:10 to 15:1 to obtain a composite slurry; Mixing the composite slurry and the silicone resin solution in a weight ratio of 20-50:50-80 to obtain a low-emissivity coating composition; Wherein, the semiconductor nanoparticles are one or more particles selected from silver, gold, indium tin oxide, tin antimony oxide, zinc aluminum oxide, and zinc gallium oxide; The conductive polymer monomer is one or more selected from aniline, aniline derivatives, pyrrole, pyrrole derivatives, C1-18 alkyl substituted thiophene and diethoxythiophene; Wherein, the aniline derivatives are selected from o-methylaniline, m-toluidine, m-nitroaniline, p-nitroaniline, o-chloroaniline, p-chloroaniline and m-chloroaniline, and the pyrrole derivatives are selected from 2,5 - Dithienylpyrrole and 3-pentanoylpyrrole; The organosilicon monomer is selected from methyltriacetoxysilane, methyltrimethoxysilane, divinyltriaminopropyltrimethoxysilane, divinyltriaminopropylmethyldiethoxysilane , Vinyltrimethoxysilane, α-(methacryloyloxy)propyltrimethoxysilane, N-(α-aminoethyl)-γ-aminopropylmethyldimethoxysilane, γ- One or more of glycidyl etheroxypropoxypropyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane and γ-mercaptopropyltriethoxysilane. 3. A low-emissivity material, characterized in that the low-emissivity material comprises a substrate and a coating formed by the low-emissivity coating composition according to claim 1. 4. The low-emissivity material according to claim 3, the substrate is glass or transparent plastic.