CN103209571A - Radiating base structure and manufacturing method thereof - Google Patents
Radiating base structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN103209571A CN103209571A CN2012100132726A CN201210013272A CN103209571A CN 103209571 A CN103209571 A CN 103209571A CN 2012100132726 A CN2012100132726 A CN 2012100132726A CN 201210013272 A CN201210013272 A CN 201210013272A CN 103209571 A CN103209571 A CN 103209571A
- Authority
- CN
- China
- Prior art keywords
- base structure
- cooling base
- heat pipe
- pedestal
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
Provided are a radiating base structure and a manufacturing method thereof. The radiating base structure comprises a base and at least one heat pipe. The base is made of high polymer materials, one side of the base is provided with at least one groove and is provided with one open side and one closed side, the heat pipe is fixedly arranged in the groove, and one side of the heat pipe is aligned with the open side. By means of the structure design, the weight and the cost of the radiating base structure can be greatly reduced due to the fact that the base is made of the high polymer materials.
Description
Technical field
The invention relates to a kind of cooling base structure and manufacture method thereof, refer to an a kind of pedestal that constitutes with macromolecular material especially, can significantly alleviate the weight of cooling base structure and cooling base structure and the manufacture method thereof of the cost that reduces cost.
Background technology
Development along with the electronic industry technology, the volume of all kinds of wafers (as central processing unit) dwindles gradually, relatively, can handle more data in order to make all kinds of wafers, wafer under the equal volume can hold more in the past than the element that had more more than the several times, when the number of elements in the wafer is more and more, the heat energy that produces during element work is also increasing, be example with common central processing unit, be enough to make that central processing unit is whole burns, therefore, the heat abstractor that improves all kinds of wafers has become important problem.
See also shown in Figure 1ly, be known cooling base 1; It comprises that a pedestal 10 has a heat pipe 11 can be combined with it, because described pedestal 10 mostly is the metal material manufacturing greatly, the module overall weight that causes dispelling the heat is heavier, and the general material of metal material to compare its cost higher, thus, can cause the heat radiation module to increase extra cost cost.
The above, known technology has following shortcoming:
1. weight is heavier;
2. cost is higher.
Be with, how to solve the above-mentioned problem of commonly using and disappearance, the inventor who is this case desires most ardently the direction place that research improves with the relevant manufacturer that is engaged in the industry.
Summary of the invention
Therefore, for effectively solving the above problems, main purpose of the present invention is to provide the cooling base structure of an a kind of pedestal that constitutes with macromolecular material with weight reduction.
Secondary objective of the present invention is to provide the manufacture method of an a kind of pedestal that constitutes with macromolecular material with the cooling base structure of weight reduction.
For reaching above-mentioned purpose, the invention provides a kind of cooling base structure, comprise: a pedestal and at least one heat pipe, described pedestal is that macromolecular material constitutes, and a side of this pedestal is provided with at least one groove, and this groove has an open sides and a closed side, and described heat pipe is fixedly arranged in this groove, and a side of this heat pipe and described open sides trim.
For reaching above-mentioned purpose, the invention provides a kind of manufacture method of cooling base structure, comprise the following steps:
One pedestal and at least one heat pipe that is provided with at least one groove is provided, and described pedestal is macromolecular material;
Described heat pipe correspondence is arranged at described groove, and presses and make this heat pipe and this pedestal one side plane trim.
By cooling base structure of the present invention and manufacture method thereof, because being macromolecular material, described pedestal constitutes, not only significantly alleviated the weight of cooling base structure, the also cost that can reduce cost.
Particularly, the invention discloses a kind of cooling base structure, comprising:
One pedestal, it is that macromolecular material constitutes, and a side of this pedestal is provided with at least one groove, described groove has an open sides and a closed side; And
At least one heat pipe, it is fixedly arranged in the described groove, and a side of this heat pipe and described open sides trim.
Further, described cooling base structure, wherein this macromolecular material can be plastic cement or rubber is wherein arbitrary.
Further, described cooling base structure, wherein this heat pipe utilizes the machining close-fitting to be combined with described pedestal.
Further, described cooling base structure, wherein this heat pipe also has one first side and one second side, and this first side is smooth to trim described open sides, and this second side utilizes the bonding mode to be combined with described closed side.
Further, described cooling base structure, wherein the material of this bonding is solid.
Further, described cooling base structure, wherein this machining is punch process.
The present invention also provides a kind of cooling base structure making process, comprises the following steps:
One pedestal and at least one heat pipe that is provided with at least one groove is provided, and described pedestal is macromolecular material;
Described heat pipe correspondence is arranged at described groove, and presses and make this heat pipe and this pedestal one side plane trim.
Further, described cooling base structure making process, wherein this macromolecular material can be plastic cement or rubber is wherein arbitrary.
Further, described cooling base structure making process, wherein this heat pipe utilizes the machining close-fitting to be combined with described pedestal.
Further, described cooling base structure making process, wherein this machining is punch process.
Further, described cooling base structure making process, wherein this groove has an open sides and a closed side, and described heat pipe also has one first side and one second side, this first side trims described open sides, and this second side utilizes the bonding mode to be combined with described closed side.
Further, described cooling base structure making process, wherein the material of this bonding is solid.
Description of drawings
Fig. 1 is the structure chart of known cooling base structure;
Fig. 2 A is the three-dimensional exploded view of cooling base structure first embodiment of the present invention;
Fig. 2 B is the three-dimensional combination figure of cooling base structure first embodiment of the present invention;
Fig. 3 A is the three-dimensional exploded view of cooling base structure second embodiment of the present invention;
Fig. 3 B is the three-dimensional combination figure of cooling base structure second embodiment of the present invention;
Fig. 4 is the manufacture method flow chart of cooling base structure first embodiment of the present invention.
[main element symbol description]
Closed side 2012
Embodiment
Characteristic on above-mentioned purpose of the present invention and structure thereof and the function will be illustrated according to appended graphic preferred embodiment.
See also Fig. 2 A, Fig. 2 B, three-dimensional exploded view and three-dimensional combination figure for cooling base structure first embodiment of the present invention, as shown in the figure, a kind of cooling base structure 2, comprise: a pedestal 20 and at least one heat pipe 21, described pedestal 20 is that macromolecular material constitutes, and that this macromolecular material can be plastic cement or rubber or plastic compound is wherein arbitrary.
Described heat pipe 21 utilizes the machining close-fitting to be combined with this pedestal 20, and trims mutually with described first open sides 2011, and this machining is carried out the close-fitting combination in the punch process mode.
Combine with described heat pipe 21 by the described pedestal 20 that is constituted by macromolecular material, make that the weight of cooling base structure 2 is significantly alleviated outside, also can reduce known cooling base and be the cost of the cost that metal material constitutes.
See also Fig. 3 A, Fig. 3 B, three-dimensional exploded view and three-dimensional combination figure for cooling base structure second embodiment of the present invention, described cooling base structure portion of element and interelement corresponding pass are identical with aforesaid cooling base structure, so do not repeat them here, only this cooling base structure and the topmost difference of previous embodiment are that described heat pipe 21 also has one first side 211 and one second side 212; When described heat pipe 21 and aforesaid pedestal 20 in conjunction with the time, first side 211 of this heat pipe 21 is smooth to trim described open sides 2011, and second side 212 of this heat pipe 21 utilizes the bonding mode to be incorporated on this pedestal 20 with described closed side 2012, and wherein the material of this bonding is solid.
Utilize solid that aforesaid heat pipe 21 and the pedestal 20 that is made of macromolecular material are binded mutually, can make that the weight of cooling base structure 2 is significantly alleviated outside, what also can reduce cost expends.
See also Fig. 4 and consult Fig. 2 A in the lump, be the manufacture method flow chart of manufacture method first embodiment of cooling base structure of the present invention, as shown in the figure, the manufacture method of described cooling base structure comprises the following steps:
S1: pedestal and an at least one heat pipe that is provided with at least one groove is provided, and described pedestal is macromolecular material;
One pedestal 20 and at least one heat pipe 21 that is provided with at least one groove 201 is provided, and described pedestal 20 is made of macromolecular material, and macromolecular material can be plastic cement or rubber is wherein arbitrary.
S2: described heat pipe correspondence is arranged at described groove, and presses and make this heat pipe and this pedestal one side plane trim.
Described heat pipe 21 correspondences are arranged at described groove 201, and exert pressure and make described heat pipe 21 and pedestal 20 1 side planes trim, wherein this heat pipe 21 utilizes the processing method for stamping close-fitting of machining to be combined with this pedestal 20.
Manufacture method by aforesaid cooling base structure, the described pedestal 20 that utilizes macromolecular material to constitute is combined with described heat pipe 21 phase close-fittings, outside making that the weight of cooling base structure 2 is significantly alleviated, also can reduce known cooling base 20 and be the cost of the cost that metal material constitutes.
Please continue and consult Fig. 4 and consult Fig. 3 A in the lump, described groove 201 also has an open sides 2011 and a closed side 2012, and described heat pipe 21 also has one first side 211 and one second side 212, this first side 211 trims described open sides 2011, and this second side 212 utilizes the bonding mode to be combined with described closed side 2012, and wherein the material of Nian Heing is solid; Utilize solid to be bonding on the described pedestal 20 by described heat pipe 21, cooling base structure 2 weight are significantly alleviated, and improve and reduce the cost cost that known cooling base is the metal material formation.
The above, the present invention has following advantage compared to known technology:
1. weight is lighter;
2. cost is lower.
Below the present invention is described in detail, the above only is a preferred embodiment of the present invention, when not limiting scope of the invention process.Be that all equalizations of doing according to claim of the present invention change and modify etc., all should still belong to patent protection covering scope of the present invention.
Claims (12)
1. a cooling base structure is characterized in that, comprising:
One pedestal, it is that macromolecular material constitutes, and a side of this pedestal is provided with at least one groove, described groove has an open sides and a closed side; And
At least one heat pipe, it is fixedly arranged in the described groove, and a side of this heat pipe and described open sides trim.
2. cooling base structure as claimed in claim 1 is characterized in that, wherein this macromolecular material can be plastic cement or rubber is wherein arbitrary.
3. cooling base structure as claimed in claim 1 is characterized in that, wherein this heat pipe utilizes the machining close-fitting to be combined with described pedestal.
4. cooling base structure as claimed in claim 1 is characterized in that, wherein this heat pipe also has one first side and one second side, and this first side is smooth to trim described open sides, and this second side utilizes the bonding mode to be combined with described closed side.
5. cooling base structure as claimed in claim 4 is characterized in that, wherein the material of this bonding is solid.
6. cooling base structure as claimed in claim 3 is characterized in that, wherein this machining is punch process.
7. a cooling base structure making process is characterized in that, comprises the following steps:
One pedestal and at least one heat pipe that is provided with at least one groove is provided, and described pedestal is macromolecular material;
Described heat pipe correspondence is arranged at described groove, and presses and make this heat pipe and this pedestal one side plane trim.
8. cooling base structure making process as claimed in claim 7 is characterized in that, wherein this macromolecular material can be plastic cement or rubber is wherein arbitrary.
9. cooling base structure making process as claimed in claim 7 is characterized in that, wherein this heat pipe utilizes the machining close-fitting to be combined with described pedestal.
10. cooling base structure making process as claimed in claim 9 is characterized in that, wherein this machining is punch process.
11. cooling base structure making process as claimed in claim 7, it is characterized in that wherein this groove has an open sides and a closed side, described heat pipe also has one first side and one second side, this first side trims described open sides, and this second side utilizes the bonding mode to be combined with described closed side.
12. cooling base structure making process as claimed in claim 7 is characterized in that, wherein the material of this bonding is solid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100132726A CN103209571A (en) | 2012-01-16 | 2012-01-16 | Radiating base structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100132726A CN103209571A (en) | 2012-01-16 | 2012-01-16 | Radiating base structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103209571A true CN103209571A (en) | 2013-07-17 |
Family
ID=48756607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100132726A Pending CN103209571A (en) | 2012-01-16 | 2012-01-16 | Radiating base structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103209571A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2909804Y (en) * | 2006-05-24 | 2007-06-06 | 林正兴 | Radiation module base |
| EP2112450A1 (en) * | 2008-04-25 | 2009-10-28 | Golden Sun News Techniques Co., Ltd. | Method of flatting evaporating section of heat pipe embedded in heat dissipation device and heat dissipation device with heat pipe |
| US20100122799A1 (en) * | 2008-10-23 | 2010-05-20 | Kuo-Len Lin | Method for combining heat pipes with a fixing base and structure of the same |
| CN101925285A (en) * | 2009-06-17 | 2010-12-22 | 奇鋐科技股份有限公司 | Cooling plate structure and manufacturing method thereof |
| CN202058722U (en) * | 2011-03-23 | 2011-11-30 | 奇鋐科技股份有限公司 | Structure of heat radiation module |
| CN202585387U (en) * | 2012-01-16 | 2012-12-05 | 奇鋐科技股份有限公司 | Structure of a heat dissipating pedestal |
-
2012
- 2012-01-16 CN CN2012100132726A patent/CN103209571A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2909804Y (en) * | 2006-05-24 | 2007-06-06 | 林正兴 | Radiation module base |
| EP2112450A1 (en) * | 2008-04-25 | 2009-10-28 | Golden Sun News Techniques Co., Ltd. | Method of flatting evaporating section of heat pipe embedded in heat dissipation device and heat dissipation device with heat pipe |
| US20100122799A1 (en) * | 2008-10-23 | 2010-05-20 | Kuo-Len Lin | Method for combining heat pipes with a fixing base and structure of the same |
| CN101925285A (en) * | 2009-06-17 | 2010-12-22 | 奇鋐科技股份有限公司 | Cooling plate structure and manufacturing method thereof |
| CN202058722U (en) * | 2011-03-23 | 2011-11-30 | 奇鋐科技股份有限公司 | Structure of heat radiation module |
| CN202585387U (en) * | 2012-01-16 | 2012-12-05 | 奇鋐科技股份有限公司 | Structure of a heat dissipating pedestal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2007011580A3 (en) | Photovoltaic modules having improved back sheet | |
| EP2485106A3 (en) | System and method for an integrated additive manufacturing cell for complex components | |
| WO2004086462A3 (en) | Photovoltaic cell with mesh electrode | |
| WO2013074530A3 (en) | High efficiency multijunction solar cells | |
| EP3629396A4 (en) | Battery module having initial pressing force strengthening structure for cell assembly, and method for manufacturing same | |
| HK1110837A1 (en) | Method and apparatus for forming structural members | |
| CN102523685A (en) | Manufacturing method for printed circuit board (PCB) with stepped grooves | |
| TW200715548A (en) | Integrated inductor | |
| CN108701667A (en) | Semiconductor equipment sub-component | |
| EP3961777A4 (en) | Cell, cell stack device, module, and module housing device | |
| EP1717897A4 (en) | Laminated film for dye-sensitized solar cell, electrode for dye-sensitized solar cell and process for producing the same | |
| WO2012006130A3 (en) | High performance multi-layer back contact stack for silicon solar cells | |
| CN202585387U (en) | Structure of a heat dissipating pedestal | |
| CN103209571A (en) | Radiating base structure and manufacturing method thereof | |
| US20130140967A1 (en) | Housing of electronic device and method for manufacturing same | |
| CN208117269U (en) | A kind of mobile phone frame clamp for machining | |
| CN203859940U (en) | Universal tool for processing flexible circuit board | |
| CN203256141U (en) | Glass film plating jig | |
| CN201856186U (en) | Assembly fixture | |
| CN104470217A (en) | False sticking equipment | |
| CN204300065U (en) | A kind of tool pasting magnet for electronic product tabular housing | |
| EP2595462A3 (en) | Layered composite circuit with integrated components which are accessible from outside | |
| CN201863008U (en) | Eccentric circle processing clamp | |
| CN203193107U (en) | Novel terminal assembling device for electronic plastic part | |
| CN207509059U (en) | A kind of multifunctional built-up fixture |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130717 |