CN103209539A - Circuit board - Google Patents

Circuit board Download PDF

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Publication number
CN103209539A
CN103209539A CN2012100099959A CN201210009995A CN103209539A CN 103209539 A CN103209539 A CN 103209539A CN 2012100099959 A CN2012100099959 A CN 2012100099959A CN 201210009995 A CN201210009995 A CN 201210009995A CN 103209539 A CN103209539 A CN 103209539A
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CN
China
Prior art keywords
sub
line
circuit board
conductive pole
ground plane
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Granted
Application number
CN2012100099959A
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Chinese (zh)
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CN103209539B (en
Inventor
白育彰
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Novatek Microelectronics Corp
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Novatek Microelectronics Corp
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Filing date
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Application filed by Novatek Microelectronics Corp filed Critical Novatek Microelectronics Corp
Priority to CN201210009995.9A priority Critical patent/CN103209539B/en
Publication of CN103209539A publication Critical patent/CN103209539A/en
Application granted granted Critical
Publication of CN103209539B publication Critical patent/CN103209539B/en
Expired - Fee Related legal-status Critical Current
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Abstract

A circuit board comprises a base material, two first signal lines, a first ground layer, two second signal lines, a second ground layer, two signal electric conduction columns and two ground electric conduction columns. The base material is provided with a first face and a second face which are opposite. The first signal lines are formed on the first face of the base material. The first ground layer is formed on the first face of the base material and is adjacent to the first signal lines. The second signal lines are formed on the second face of the base material. The second ground layer is formed on the second face of the base material and is adjacent to the second signal lines. The signal electric conduction columns extend from the first face to the second face and are connected with corresponding first signal lines and corresponding second signal lines. The ground electric conduction columns extend from the first face to the second face and are connected with the first ground layer and the second ground layer. The signal electric conduction columns and the ground electric conduction columns are arranged pairwise.

Description

Circuit board
Technical field
The invention relates to a kind of circuit board, and particularly relevant for a kind of circuit board.
Background technology
For fear of the distortion of signal transmission, the circuit of traditional circuit-board (for example being the double layer circuit plate) is to be formed at same one deck.Need be when another side form holding wire if having no alternative but, two line layers is also just simple relatively connects with via (via).
Yet, merely connect upper and lower two layers of line layer with via and be helpless to promote the quality of transmit high-speed signals, can make the resistance value of signal transmission path become inconsistent on the contrary, for example, the impedance contrast mutation of signal transmission path is big.
Summary of the invention
The invention relates to a kind of circuit board, the holding wire of circuit board can be kept the transmission quality of high speed signal in the process of transmit high-speed signals.
According to one embodiment of the invention, a kind of circuit board is proposed.Circuit board comprises a base material, 2 first holding wires, one first ground plane, two secondary signal lines, one second ground plane, binary signal conductive pole and two ground connection conductive poles.Base material has relative one first and one second.First holding wire is formed at first of base material.First ground plane is formed at first and contiguous first holding wire of base material.Linear second of being formed in base material of secondary signal.Second ground plane is formed at second and contiguous secondary signal line of base material.The signal conductive pole extends to second of base material from first face of base material, and each signal conductive pole connects corresponding first holding wire and secondary signal line.The ground connection conductive pole extends to second of base material from first face of base material, and each ground connection conductive pole connects first ground plane and second ground plane.Wherein, each signal conductive pole is paired configuration with corresponding ground connection conductive pole.
For there is better understanding above-mentioned and other aspect of the present invention, embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.
Description of drawings
Fig. 1 illustrates the fragmentary, perspective view according to the circuit board of one embodiment of the invention.
Fig. 2 illustrates first ground plane of circuit board of Fig. 1 and the vertical view of first holding wire.
The circuit board that Fig. 3 illustrates Fig. 1 carries out the analysis result figure of impedance analysis.
[main element label declaration]
100: circuit board 110: base material
110u: first 110b: second
121,1211: the first sub-lines of 122: the first holding wires
1213: the three sub-lines of 1212: the second sub-lines
131: the first sub-ground planes of 130: the first ground planes
Son connect 133: the first connecting portions in 132: the second
141,142: 1411: the four sub-lines of secondary signal line
1413: the six sub-lines of 1412: the five sub-lines
151: the three sub-ground planes of 150: the second ground planes
153: the second connecting portions of 152: the four sub-ground planes
161,162: signal conductive pole 171,172: the ground connection conductive pole
D1, D2: distance R: quadrangle
S1, S2: major axis bearing of trend Δ Z: impedance contrast
Embodiment
Please refer to Fig. 1 and Fig. 2, Fig. 1 illustrates the fragmentary, perspective view according to the circuit board of one embodiment of the invention, and Fig. 2 illustrates first ground plane of circuit board of Fig. 1 and the vertical view of first holding wire.
As shown in Figure 1, circuit board 100 for example is two laminates, and it comprises base material 110, at least two first holding wires 121 and 122, first ground plane 130, at least two secondary signal lines 141 and 142, second ground plane 150, binary signal conductive pole 161 and 162 and at least two ground connection conductive poles 171 and 172 at least.
Base material 110 has relative first 110u and second 110b. First holding wire 121 and 122 is formed at first 110u of base material 110, and secondary signal line 141 and 142 is formed at second 110b of base material 110.Among one embodiment, first holding wire 121 and 122 width for example are about 6 English silks (mil), and the width of secondary signal line 141 and 142 for example is 6 English silks.
First ground plane 130 is formed at first 110u of base material 110 and is adjacent to 2 first holding wires 121 and 122.
Second ground plane 150 is formed at second 110b of base material 110 and is adjacent to two secondary signal lines 141 and 142.
As shown in Figure 1, ground plane is around the holding wire with one deck.For example, first ground plane 130 is around first holding wire 121 and 122, and second ground plane 150 is around secondary signal line 141 and 142.Since ground plane around and the adjacent signal line, so the transmission quality of holding wire transmit high-speed signals is good, can keeps the transmission quality of high speed signal or not cause the transmission quality of high speed signal to descend too many.
First ground plane 130 and first holding wire 121 and 122 are to isolate.Among one embodiment, between first ground plane 130 and first holding wire 121 every for example being between about 4 to 6 English silks, between first ground plane 130 and first holding wire 122 every also for example being between about 4 to 6 English silks.In addition, second ground plane 150 is to isolate with secondary signal line 141 and 142, among one embodiment, between second ground plane 150 and the secondary signal line 141 every for example being between about 4 to 6 English silks, and between second ground plane 150 and the secondary signal line 142 every for example being between about 4 to 6 English silks.
As shown in Figure 1, holding wire and the ground plane with one deck is paired configuration.For example, first ground plane 130 comprises the first sub-ground plane 131 and the second sub-ground plane 132.121 configurations of first sub-ground plane 131 contiguous first holding wires, and just as disposing in pairs with first holding wire 121.122 configurations of second sub-ground plane 132 contiguous first holding wires, and just as disposing in pairs with first holding wire 122.Again for example, second ground plane 150 comprises the 3rd sub-ground plane 151 and the 4th sub-ground plane 152.The 3rd sub-ground plane 151 contiguous secondary signal line 141 configurations, and just as disposing in pairs with secondary signal line 141, the 4th sub-ground plane 152 contiguous secondary signal lines 142 dispose, and just as disposing in pairs with secondary signal line 142.Thus, the transmission quality of holding wire transmit high-speed signals is good, can keep the transmission quality of high speed signal or not cause the transmission quality of high speed signal to descend too many.
As shown in Figure 1, first ground plane 130 comprises that first connecting portion, 133, the first connecting portions 133 connect two ground connection conductive poles 171 and 172.Second ground plane 150 comprises that second connecting portion, 153, the second connecting portions 153 connect two ground connection conductive poles 171 and 172.
As shown in Figure 1, first connecting portion 133 is between the first sub-ground plane 131 and the second sub-ground plane 132 and be connected the first sub-ground plane 131 and the second sub-ground plane 132.Second connecting portion 153 is between the 3rd sub-ground plane 151 and the 4th sub-ground plane 152 and be connected the 3rd sub-ground plane 151 and the 4th sub-ground plane 152.
Binary signal conductive pole 161 and 162 first 110u from base material 110 extend to second 110b of base material 110.Each signal conductive pole 161 and 162 connects corresponding first holding wire and secondary signal line, for example, signal conductive pole 161 connects the first corresponding holding wire 121 and secondary signal line 141, and signal conductive pole 162 connects the first corresponding holding wire 122 and secondary signal line 142.Among one embodiment, signal conductive pole 161 and 162 diameter for example are 8 English silks.
Two ground connection conductive poles 171 and 172 first 110u from base material 110 extend to second 110b of base material 110.Each ground connection conductive pole connects first ground plane and second ground plane, and for example, ground connection conductive pole 171 and 172 connects first ground plane 130 and second ground plane 150.Among one embodiment, ground connection conductive pole 171 and 172 diameter for example are 8 English silks.
As shown in Figures 1 and 2, one of two ground connection conductive poles major axis bearing of trend passes between 2 first holding wires.For example, the major axis bearing of trend S1 of ground connection conductive pole 171 passes between 2 first holding wires 121 and 122.In addition, the major axis bearing of trend S2 of ground connection conductive pole 172 passes outside 2 first holding wires 121 and 122, and so this is non-in order to limit the embodiment of the invention.Among another embodiment, as long as change the position of ground connection conductive pole 171 and/or 172, the major axis S2 bearing of trend of ground connection conductive pole 172 also can pass between 2 first holding wires 121 and 122.
Another person's of two ground connection conductive poles major axis bearing of trend passes between the two secondary signal lines.For example, the major axis bearing of trend S2 of ground connection conductive pole 172 passes between two secondary signal lines 141 and 142.In addition, the major axis bearing of trend S1 of ground connection conductive pole 171 passes outside two secondary signal lines 141 and 142, and so this is non-in order to limit the embodiment of the invention.Among another embodiment, as long as change the position of ground connection conductive pole 171 and/or 172, the major axis bearing of trend S1 of ground connection conductive pole 171 also can pass between two secondary signal lines 141 and 142.
As shown in Figure 2, signal conductive pole and ground connection conductive pole are paired configurations.For example, arrange at four angles of binary signal conductive pole 161 and 162 and two ground connection conductive poles 171 and 172 corresponding quadrangle R, i.e. four angles of the corresponding quadrangle R in the position in those end faces of binary signal conductive pole 161 and 162 and two ground connection conductive poles 171 and 172 or those cross sections.Quadrangle R for example is rectangle, rhombus or trapezoidal.Thus, each signal conductive pole is paired configuration with corresponding ground connection conductive pole, high speed signal is transferred to another person's the process of first 110u and second 110b via signal conductive pole and ground connection conductive pole from one of first 110u of base material 110 and second 110b, can promote or keep the transmission quality of high speed signal, not cause the transmission quality of high speed signal to descend too many.
As shown in Figure 2, binary signal conductive pole 161 and 162 any one be adjacent to any one of two ground connection conductive poles 171 and 172.In the present embodiment, binary signal conductive pole 161 and 162 is relative configurations, and two ground connection conductive poles 171 and 172 are relative configurations.For example, the configuration of the diagonal angle of binary signal conductive pole 161 and 162 corresponding quadrangle R, another diagonal angle configuration of two ground connection conductive poles 171 and 172 corresponding quadrangle R.
As shown in Figure 2, binary signal conductive pole 161 and 162 distance B 1 can equate in fact with the distance B 2 of two ground connection conductive poles 171 and 172, so also can be unequal.
As shown in Figure 2, each first holding wire has a plurality of turning points.Be example with first holding wire 121, first holding wire 121 comprises the first sub-line 1211, the second sub-line 1212 and the 3rd sub-line 1213.The second sub-line 1212 is parallel to the first sub-line 1211 in fact.The 3rd sub-line 1213 connects the first sub-line 1211 and the second sub-line 1212.Another first holding wire 122 has similar in appearance to the structure of first holding wire 121, therefore no longer repeats to give unnecessary details.Be example with secondary signal line 141, secondary signal line 141 (Fig. 1) comprises the 4th sub-line 1411 (Fig. 1), the 5th sub-line 1412 (Fig. 1) and the 6th sub-line 1413 (Fig. 1).The 5th sub-line 1412 is parallel to the 4th sub-line 1411 in fact.The 6th sub-line 1413 connects the 4th sub-line 1411 and the 5th sub-line 1412.Another secondary signal line 142 has similar in appearance to the structure of secondary signal line 141, therefore no longer repeats to give unnecessary details.
Please refer to Fig. 3, its circuit board that illustrates Fig. 1 carries out the analysis result figure of impedance analysis.In the embodiment of the invention, because holding wire and ground structure are paired configurations, so when signal was transmitted in path between first holding wire (for example being first holding wire 121 and/or 122) and the secondary signal (for example being secondary signal line 141 and/or 142) via signal conductive pole 161 and 162, Z was very low for its impedance contrast Δ.Thus, the impedance of the transmission path of signal very approaches or is consistent, and this is conducive to keep the transmission quality of high speed signal.Among one embodiment, the impedance contrast Δ Z of circuit board 100 can be lower than 3.5 ohm (ohm).
In sum, though the present invention discloses as above with embodiment, so it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when looking appended the claim scope person of defining.

Claims (15)

1. circuit board comprises:
One base material has relative one first and one second;
2 first holding wires are formed at this first of this base material;
One first ground plane is formed at this first of this base material and is close to this 2 first holding wire;
Two secondary signal lines are formed at this second of this base material;
One second ground plane is formed at this second of this base material and is close to this two secondary signals line;
The binary signal conductive pole extends to this second of this base material from this first face of this base material, and respectively this binary signal conductive pole connects corresponding this first holding wire and this secondary signal line; And
Two ground connection conductive poles extend to this second of this base material from this first face of this base material, and respectively this two ground connection conductive pole connects this first ground plane and this second ground plane;
Wherein, respectively this binary signal conductive pole is paired configuration with corresponding this ground connection conductive pole.
2. circuit board according to claim 1, wherein this binary signal conductive pole is relative configuration, and this two ground connection conductive pole is relative configuration.
3. circuit board according to claim 1, wherein the distance of this binary signal conductive pole equates in fact with the distance of this two ground connection conductive pole.
4. circuit board according to claim 1, wherein this first ground plane is around this 2 first holding wire.
5. circuit board according to claim 1, wherein this second ground plane is around this two secondary signals line.
6. circuit board according to claim 1, wherein respectively this 2 first holding wire comprises:
One first sub-line;
One second sub-line is parallel to this first sub-line in fact; And
One the 3rd sub-line connects this first sub-line and this second sub-line.
7. circuit board according to claim 1, wherein respectively this two secondary signals line comprises:
One the 4th sub-line;
One the 5th sub-line is parallel to the 4th sub-line in fact; And
One the 6th sub-line connects the 4th sub-line and the 5th sub-line.
8. circuit board according to claim 1, wherein this first ground plane comprises one first connecting portion, this first connecting portion connects this two ground connection conductive pole.
9. circuit board according to claim 1, wherein this second ground plane comprises one second connecting portion, this second connecting portion connects this two ground connection conductive pole.
10. circuit board according to claim 1, wherein this first ground plane comprises:
One first sub-ground plane, configurations of contiguous this 2 first holding wire; And
One second sub-ground plane, another person's configuration of contiguous this 2 first holding wire.
11. circuit board according to claim 1, wherein this second ground plane comprises:
One the 3rd sub-ground plane, configurations of contiguous this two secondary signals line; And
One the 4th sub-ground plane, another person's configuration of contiguous this two secondary signals line.
12. circuit board according to claim 1, wherein one of this two ground connection conductive pole major axis bearing of trend passes between this 2 first holding wire.
13. circuit board according to claim 12, wherein another person's of this two ground connection conductive pole major axis bearing of trend passes outside this 2 first holding wire.
14. circuit board according to claim 12, another person's of this two ground connection conductive pole major axis bearing of trend pass between this two secondary signals line.
15. circuit board according to claim 14, this person's of this two ground connection conductive pole major axis bearing of trend pass outside this two secondary signals line.
CN201210009995.9A 2012-01-13 2012-01-13 Circuit board Expired - Fee Related CN103209539B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210009995.9A CN103209539B (en) 2012-01-13 2012-01-13 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210009995.9A CN103209539B (en) 2012-01-13 2012-01-13 Circuit board

Publications (2)

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CN103209539A true CN103209539A (en) 2013-07-17
CN103209539B CN103209539B (en) 2016-01-13

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104735907A (en) * 2013-12-20 2015-06-24 财团法人工业技术研究院 circuit board with transmission hole and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050247482A1 (en) * 2004-05-10 2005-11-10 Fujitsu Limited Wiring base board, method of producing thereof, and electronic device
CN1943286A (en) * 2004-02-13 2007-04-04 莫莱克斯公司 Preferential asymmetric through-hole positoning for printed circuit boards
CN1972558A (en) * 2005-10-31 2007-05-30 索尼株式会社 Flexible printed circuit board and module and device having same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1943286A (en) * 2004-02-13 2007-04-04 莫莱克斯公司 Preferential asymmetric through-hole positoning for printed circuit boards
US20050247482A1 (en) * 2004-05-10 2005-11-10 Fujitsu Limited Wiring base board, method of producing thereof, and electronic device
CN1972558A (en) * 2005-10-31 2007-05-30 索尼株式会社 Flexible printed circuit board and module and device having same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104735907A (en) * 2013-12-20 2015-06-24 财团法人工业技术研究院 circuit board with transmission hole and manufacturing method thereof
CN104735907B (en) * 2013-12-20 2017-12-22 财团法人工业技术研究院 Circuit board with transmission holes and manufacturing method thereof

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Granted publication date: 20160113

Termination date: 20210113