CN103208904B - A kind of liquid metal electromagnetic pump - Google Patents
A kind of liquid metal electromagnetic pump Download PDFInfo
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- CN103208904B CN103208904B CN201310153919.XA CN201310153919A CN103208904B CN 103208904 B CN103208904 B CN 103208904B CN 201310153919 A CN201310153919 A CN 201310153919A CN 103208904 B CN103208904 B CN 103208904B
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- liquid metal
- metal pipeline
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- pipeline
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Abstract
The invention discloses a kind of liquid metal electromagnetic pump, including housing and it is arranged on the liquid metal pipeline of rectangular cross-section, conductive and heat-conductive body, at least one semiconductor thermoelectric power generation component, magnet assembly and a pair of insulation and thermal insulations layers of enclosure interior；Insulation and thermal insulation layer is respectively arranged on the relative lateral wall of liquid metal pipeline；Semiconductor thermoelectric power generation component is on the upper madial wall and/or lower madial wall of liquid metal pipeline, and Ohmic contact；Conductive and heat-conductive body is placed on outside liquid metal pipeline, is fitted with the upper lateral wall of liquid metal pipeline；Magnet assembly produces the magnetic field for making the liquid metal in liquid metal pipeline be flowed along the bearing of trend of liquid metal pipeline.The liquid metal electromagnetic pump that the present invention is provided is applied to liquid metal heat-transfer field, low-voltage, the high-current supply produced by the use of pump body thermo-electric generation component are used as power, improve the propulsive efficiency of electromagnetic pump, liquid metal flows speed is accelerated, so as to enhance the heat transfer efficiency of liquid metal heat-transfer system.
Description
Technical field
The present invention relates to radiator field, more particularly to a kind of liquid metal electromagnetic pump.
Background technology
In industrial processes, liquid metal heat radiation technology is applied to liquid metal heat-transfer field, liquid metal heat radiation
During technology application, the liquid metal flowed in pipeline, by the driving effect of electromagnetic pump, heat is absorbed when flowing through heater element,
Heat is released again when flowing through the relatively low radiator of temperature, heater element is passed through afterwards, circulate successively, by heat from heater element
Take the technology that radiator is radiated to.
In existing electromagnetic pump product, it is possible to use semi-conductor thermo-electric generation module is powered for electromagnetic pump, semiconductor temperature difference hair
Electric module can sense the temperature difference, meanwhile, produce electric energy, semi-conductor thermo-electric generation module using the temperature difference（It is up to a hundred to semiconductor temperature difference
Electrification component is cascaded）Fit on a heat sink, as power supply（Voltage ＞ 1V, electric current ＜ 5A）Connected by long range wire
Circuit is connect, is that electromagnetic pump is powered, drive the liquid metal flows in pipeline.But it is existing due to existing semi-conductor thermo-electric generation module
The electric current of generation, by after remote wire transmission, because wire is transmitted over long distances, electric energy loss is larger, while conductor resistance
Too big, electric current becomes very little, so the Lorentz force that electromagnetic pump interior liquid metal is subject to（That is the driving force of fluid）It is limited, liquid
State metal flow speed is very low, can also be reduced so as to further result in liquid metal heat-transfer efficiency, and then influences liquid metal electricity
The performance of magnetic pumping.
The content of the invention
It is an object of the invention to provide a kind of liquid metal electromagnetic pump, to solve the above problems.
In order to achieve the above object, the technical proposal of the invention is realized in this way：
A kind of liquid metal electromagnetic pump, including housing and be arranged on enclosure interior rectangular cross-section liquid metal pipe
Road, conductive and heat-conductive body, at least one semiconductor thermoelectric power generation component, magnet assembly and a pair of insulation and thermal insulation layers；
The insulation and thermal insulation layer is respectively arranged on the relative lateral wall of the liquid metal pipeline；The semiconductor temperature difference
Electrification component is on the upper madial wall and/or lower madial wall of the liquid metal pipeline, and Ohmic contact；The conductive and heat-conductive
Body is placed on outside the liquid metal pipeline, and is fitted with the upper lateral wall of the liquid metal pipeline；The magnet assembly is used for
Generation makes the magnetic field that the liquid metal in the liquid metal pipeline flows along the bearing of trend of the liquid metal pipeline.
Compared with prior art, this have the advantage that：
A kind of liquid metal electromagnetic pump that the present invention is provided, wherein, liquid metal pipeline is used to contain liquid metal.Make
The bottom surface of used time conductive and heat-conductive body fit with heating face, and the heat transfer in the face that generates heat that can be absorbed is to outside thermo-electric generation component
Surface.Semiconductor thermoelectric power generation component（It is made up of whole piece semi-conductor thermoelectric material or thermoelectric film）Temperature can be sensed
Difference, produces induced electromotive force, forms the current loop of semiconductor → liquid metal → conductive and heat-conductive body → semiconductor, wherein liquid
Electric current in metal is up or down；For example：Semiconductor thermoelectric power generation component is set in liquid metal pipeline, and and liquid
Madial wall and/or lower madial wall are fitted on metallic conduit, are electrically connected with liquid metal pipeline, can be in liquid metal pipeline
Liquid metal provides electric current；Magnet assembly applies Lorentz force effect to the liquid metal of load current in liquid metal pipeline,
So as to drive liquid metal to be flowed in liquid metal pipeline.Simultaneously in said structure, conductive and heat-conductive body is wrapped in liquid gold
On metal conduit, it is additionally operable to be formed the circulation canal of transmission electric current, constitutes power supply（That is the semiconductor temperature differential generating of liquid metal internal
Component）External circuit.In addition, insulation and thermal insulation layer is separately positioned on left-external side wall, the right side of the liquid metal pipeline of enclosure interior
On lateral wall, it thus is avoided that short circuit phenomenon is caused in internal electric source and external circuit, while it is left to substantially reduce liquid metal pipeline
The heat transfer of right both sides, makes the upper and lower surface temperature of semiconductor electrification component uniform, it is ensured that the electric current by liquid metal is
It is parallel up or down.
Due to using conductive and heat-conductive body, directly substitute wire and use, conductive and heat-conductive body can select such as copper casting or aluminium
Part, liquid metal electromagnetic pump is integrally molded so as with other components, and conductive and heat-conductive body saves the electricity that long-distance transmissions are brought
Can be lost, while conductive and heat-conductive body（Such as copper casting etc.）Resistance be far smaller than wire resistance, cause circuital current bigger,
So and then ensure high current because Lorentz force F=BIL, therefore because the change of electric current I is big, Lorentz force F also mutually strain it is big,
And then improve utilization ratio and liquid metal flows speed of the electromagnetic pump to electric energy, using liquid metal heat-transfer speed also with
Improve.
Brief description of the drawings
Fig. 1 is the cross-sectional structure schematic diagram of the liquid metal electromagnetic pump that the embodiment of the present invention one is provided；
Fig. 2 is the part-structure schematic perspective view of the liquid metal electromagnetic pump that the embodiment of the present invention one is provided；
Fig. 3 is the cross-sectional structure schematic diagram of the liquid metal electromagnetic pump that the embodiment of the present invention two is provided；
Fig. 4 is another cross-sectional structure schematic diagram of the liquid metal electromagnetic pump that the embodiment of the present invention two is provided；
Fig. 5 is the operating diagram in heat circulating system of the liquid metal electromagnetic pump that the embodiment of the present invention two is provided；
Fig. 6 is a kind of cross-sectional structure schematic diagram of the liquid metal electromagnetic pump that the embodiment of the present invention three is provided；
Fig. 7 is another cross-sectional structure schematic diagram of the liquid metal electromagnetic pump that the embodiment of the present invention three is provided；
Fig. 8 is another cross-sectional structure schematic diagram of the liquid metal electromagnetic pump that the embodiment of the present invention three is provided.
Specific embodiment
The present invention is described in further detail below by specific embodiment and with reference to accompanying drawing.
Embodiment one
Referring to a kind of liquid metal electromagnetic pump 1 that Fig. 1 and Fig. 2, the embodiment of the present invention one are provided, heating element 2 is arranged on
On heating face 20, including housing 10 and be arranged on enclosure interior rectangular cross-section liquid metal pipeline 12, conductive and heat-conductive body
14th, at least one semiconductor thermoelectric power generation component 13, magnet assembly 11 and a pair of insulation and thermal insulation layers 16；
Insulation and thermal insulation layer 16 is respectively arranged on the relative lateral wall of liquid metal pipeline；
Semiconductor thermoelectric power generation component 13 is on the upper madial wall and/or lower madial wall of liquid metal pipeline, and ohm
Contact；Wherein：Semiconductor thermoelectric power generation component 13 is made up of whole piece semi-conductor thermoelectric material or thermoelectric film.
Conductive and heat-conductive body 14 is placed on outside liquid metal pipeline, and is fitted with the upper lateral wall of liquid metal pipeline；
Magnet assembly 11 is used to produce makes the liquid metal in liquid metal pipeline along the bearing of trend of liquid metal pipeline
The magnetic field of flowing.
It should be noted that wherein, liquid metal pipeline is used to contain liquid metal.The bottom surface of conductive and heat-conductive body and heating
Face is fitted, and the heat transfer in the heating face that can be absorbed is to thermo-electric generation module outer surface.Semiconductor thermoelectric power generation component can
To sense the temperature difference, induced electromotive force is produced, and electric current is provided to the liquid metal in liquid metal pipeline；For example：Semiconductor temperature
Difference electrification component is set in liquid metal pipeline, and is fitted with madial wall on liquid metal pipeline and/or lower madial wall, and and liquid
State metallic conduit and liquid metal are electrically connected, and can provide electric current to the liquid metal in liquid metal pipeline；Magnet assembly pair
The liquid metal of load current applies Lorentz force effect in liquid metal pipeline, so as to drive liquid metal in liquid metal pipe
Flowed in road.Simultaneously in said structure, conductive and heat-conductive body is wrapped on liquid metal pipeline, is additionally operable to form transmission electric current
Circulation canal, constitutes power supply（That is the semiconductor thermoelectric power generation component of liquid metal internal）External circuit.In addition, insulation and thermal insulation
Layer is separately positioned on the left-external side wall of the liquid metal pipeline of enclosure interior, right outside sidewall, thus is avoided that internal electric source and outer
Cause short circuit phenomenon in loop in portion.
Due to using conductive and heat-conductive body, directly substitute wire and use, conductive and heat-conductive body can select such as copper casting or aluminium
Part, liquid metal electromagnetic pump is integrally molded so as with other components, and conductive and heat-conductive body saves the electricity that long-distance transmissions are brought
Can be lost, while conductive and heat-conductive body（Such as copper casting etc.）Resistance be far smaller than wire resistance, cause circuital current bigger,
So and then ensure high current because Lorentz force F=BIL, therefore because the change of electric current I is big, Lorentz force F also mutually strain it is big,
And then improve utilization ratio and liquid metal flows speed of the electromagnetic pump to electric energy, using liquid metal heat-transfer speed also with
Improve.
In embodiment one, due to using conductive and heat-conductive body, directly substitute wire and use, conductive and heat-conductive body can be with selection example
Such as copper casting or aluminum component, conductive and heat-conductive body saves the electric energy loss that long-distance transmissions are brought, while copper casting resistance is much
Less than the resistance of wire, cause circuital current bigger, so and then ensure high current, small voltage, and then improve electromagnetic pump pair
The utilization ratio and liquid metal flows speed of electric energy, are also improved therewith using the speed of liquid metal heat-transfer.
Meanwhile, the liquid metal pipeline of conductive and heat-conductive body and whole enclosure interior, the component such as magnet assembly is integrally formed,
Design structure is simple, saves many use spaces.
It will be understood by those skilled in the art that being directly driven using the electric energy that semiconductor thermoelectric power generation component is produced
Liquid metal in pipeline quickly flows to carry out the device of flash heat transfer.The power of liquid metal flows comes from electromagnetic pump, by
In high current effect, electromagnetic pump propulsive efficiency will be lifted.
Analysis said structure understands that the bottom surface of conductive and heat-conductive body is fitted with heating face, the heat in the heating face for that will absorb
Amount is delivered to thermo-electric generation module outer surface.Semiconductor thermoelectric power generation component two sides can produce the temperature difference during work, meanwhile, semiconductor
Thermo-electric generation component can produce thermoelectromotive force, form liquid metal → semiconductor thermoelectric power generation component → liquid metal pipeline
Metal outer wall →（Galvanic circle is formed by conductive and heat-conductive body）Liquid metal current loop, is led this avoid using substantial amounts of
Line, while the resistance of circuit becomes smaller, electric current is bigger, and then produces low-voltage using heat energy（Several millivolts）, high current（Can
Up to 100A）Power supply, expeditiously drive electromagnetism pump work, liquid metal is quickly flowed, it is possible to achieve heat transfer very high
Speed.Referring to Fig. 3, the electric current that semiconductor thermoelectric power generation component is produced lays plane perpendicular to semiconductor thermoelectric power generation component,（Figure
The direction of arrow in 3 up or down）
Due to being used as galvanic circle using conductive and heat-conductive body, during conduction, the resistance of copper is far smaller than to lead
The resistance of line, causes circuital current bigger, so and then ensures high current, small voltage, and then improve electromagnetic pump to electric energy
Utilization ratio and liquid metal flows speed, are also improved therewith using the speed of liquid metal heat-transfer.
In embodiments of the present invention, electromagnetic pump and two independent device integrations of semiconductor thermoelectric power generation component into one
Simple compact device, and current loop is formed by conductive and heat-conductive body, structure is simplified, reliability is improve, save sky
Between.
Embodiment two
Embodiment two is identical with the part-structure on liquid metal electromagnetic pump in embodiment one, but concrete structure is different,
Annexation and structure something in common between other parts and each device, parts are repeated no more.
A kind of liquid metal electromagnetic pump 1 that the embodiment of the present invention two is provided, referring to Fig. 3, is arranged on the heating face of heating element 2
On 20, including housing 10 and it is arranged on the liquid metal pipeline 12 of rectangular cross-section of enclosure interior, conductive and heat-conductive body 14, at least
One semiconductor thermoelectric power generation component 13, magnet assembly 11 and a pair of insulation and thermal insulation layers 16；
Insulation and thermal insulation layer 16 is respectively arranged on the relative lateral wall of liquid metal pipeline 12；
Semiconductor thermoelectric power generation component 13 is arranged on the upper madial wall of liquid metal pipeline and/or lower madial wall；
Conductive and heat-conductive body 14 is placed on outside liquid metal pipeline, and is fitted with the upper lateral wall of liquid metal pipeline；
Magnet assembly 11 is used to produce makes the liquid metal in liquid metal pipeline along the bearing of trend of liquid metal pipeline
The magnetic field of flowing.
It is preferred that referring to Fig. 3 and Fig. 4, magnet assembly 11 includes the first permanent magnet；
First permanent magnet is arranged on the top of housing 10；
And, liquid metal pipeline 12 is arranged on the vertical lower section of the first permanent magnet.
Further, liquid metal electromagnetic pump 1 also includes two magnetic conduction sheets 15；
Two magnetic conduction sheets 15 are separately fixed at the two ends of the first permanent magnet；
Liquid metal pipeline is located between magnetic conduction sheet.
It is preferred that the liquid metal pipeline in housing is cuboid pipeline.It is preferably selected the cuboid pipeline of relative flat.
It is preferred that liquid metal pipeline is connected by flange or screw thread with housing.
Further, liquid metal electromagnetic pump 1 also includes magnetic guiding loop；
Magnetic guiding loop wraps up the outer surface of housing, and the magnetic action for ensureing magnet assembly is not lost, wherein, the present invention is implemented
Example is not limited for the concrete shape of magnetic guiding loop, and the outer surface of magnetic guiding loop parcel housing is that one of which preferably can be real
Apply scheme.
It is preferred that conductive and heat-conductive body is copper casting.
It is preferred that liquid metal electromagnetic pump 1 also includes conductive protecting layer 17；
Conductive protecting layer is arranged on semiconductor thermoelectric power generation component towards on the outer surface of liquid metal pipeline center.（I.e.
Conductive protecting layer is located between liquid metal and semiconductor thermoelectric power generation component.）
It is preferred that the conductive protecting layer is copper facing or silver coating.
It is preferred that semiconductor thermoelectric power generation component thickness is 5-50 μm.
It should be noted that housing（Outer cover metal）Material can be copper, or aluminum or aluminum alloy, or other heat conduction
Conducting metal.Semiconductor temperature differential generating material is very thin, and at 10 μm or so, semiconductor must with the contact of solid metal or liquid metal
It must be Ohmic contact；When not being Ohmic contact, semiconductor should do Ohmic contact treatment with metal-contacting surface.Work as liquid metal
During possible corrosion resistant semiconductor, semiconductor material surface adds (plating, sputtering, deposition) metal film to protect.
In addition, when using one block of thermo-electric generation material, thermoelectromotive force alloy material high can be used（Such as constantan）Generation
For semi-conducting material, process is simple, the efficiency of pump is low compared with semi-conducting material.
Referring to Fig. 3, in embodiment two, due to using copper casting as conductive and heat-conductive body, copper is caused directly as conduction
Body is used, and during conduction, the resistance of copper is far smaller than the resistance of wire, causes circuital current bigger, so so that protect
Barrier high current, small voltage, and then utilization ratio and liquid metal flows speed of the electromagnetic pump to electric energy are improved, using liquid gold
The speed for belonging to heat transfer is also improved therewith.
Further, permanent magnet is arranged on the top of housing, and fully occupies the space of enclosure interior, so can be with
Ensure that permanent magnet is sufficiently large, while liquid metal pipeline is arranged between magnetic conduction sheet, ensure that magnetic field is stronger, because magnetic field is made
With more strong, promote the suffered Lorentz force of liquid metal bigger, accelerate liquid metal flows, further increase liquid
The performance of metal electromagnetic pump.
Fig. 3 is the cross-sectional structure figure of liquid metal electromagnetic pump, and the section is perpendicular to the flow direction of liquid metal.The liquid
State metal electromagnetic pump is by magnet assembly, insulation and thermal insulation layer, the copper piece with cuboid pipeline（Or aluminum component）, liquid metals, semiconductor
Thermo-electric generation component etc. is constituted, and semiconductor thermoelectric power generation component is whole piece alloy or semiconductor thermoelectric power generation component, parallel to
The radiating plane of heater, with semiconductor thermoelectric power generation component as excellent；Liquid metal pipeline is a flat cuboid pipeline, place
In parallel magnetic field between permanent magnet, the flat plane of pipeline is parallel to semiconductor thermoelectric power generation component plane；Liquid metal
Contacted with semiconductor thermoelectric power generation component, when semiconductor thermoelectric power generation component two sides produces thermoelectromotive force.Due to liquid gold
Semiconductor thermoelectric power generation component is very thin one layer in category electromagnetic pump（Tens microns）, to prevent during liquid metal flow pair
Its abrasion is corroded, and can install conductive protecting layer, such as copper facing, silver, aluminium etc. additional on itself and the surface of liquid metal contacts.
Liquid metal electromagnetic pump its operation principle that the present invention is provided is：When electronic device heating face（That is heating element 2）Cause
Work and adstante febre, semiconductor thermoelectric power generation component two sides can produce the temperature difference, meanwhile, semiconductor thermoelectric power generation component can produce temperature
Difference electromotive force, formed liquid metal → semiconductor thermoelectric power generation component → liquid metal pipeline metal outer wall → liquid metal or
Rightabout current loop is flat perpendicular to semiconductor thermoelectric power generation component so as to be produced in the liquid metal of cuboid pipeline
Face（The direction of arrow in Fig. 3 up or down）Electric current.The heat that the indirect absorption heater of semiconductor thermoelectric power generation component is distributed
Amount, because electric current is perpendicular to magnetic direction, the electric current perpendicular to magnetic direction can be subject to Lorentz force, so as to drive rectangular
Liquid metal in body pipeline flows along the pipeline perpendicular to paper direction.The liquid metal of cuboid pipeline is again by external
Sealing pipeline, flow through radiator 3, radiator 3 cooling after flow back to the system again in heating element absorbed heat, and so on follow
Ring, constantly can be sent to heat radiator 3 and be radiated by heating face, so as to constitute the circulatory system illustrated such as Fig. 5.
Wherein, semiconductor thermoelectric power generation component can also set two panels, for example, see being illustrated with two panels in Fig. 4, Fig. 4
The structure of the liquid metal electromagnetic pump of semiconductor thermoelectric power generation component.
Embodiment three
Embodiment three is identical with the part-structure on liquid metal electromagnetic pump in embodiment two, but housing concrete structure
Position relationship between layout and each device is different, annexation and knot between other parts and each device, parts
Structure something in common is repeated no more.
Referring to Fig. 6, Fig. 7 and Fig. 8, the liquid metal electromagnetic pump 1 in the embodiment of the present invention three, identical structure is repeated no more,
Different structures is as follows:
Magnet assembly 11 includes the second permanent magnet and three permanent magnet；
Second permanent magnet, three permanent magnet are arranged on the inside of housing 10, and the second permanent magnet and three permanent magnet N poles
It is oppositely arranged with S poles；
Liquid metal pipeline is arranged between the second permanent magnet and three permanent magnet.
Wherein, repeated no more with identical structure in the embodiment of the present invention two.
Specifically, referring to Fig. 6, Fig. 7 and Fig. 8, magnet assembly is two permanent magnets and constitutes, and then constitutes liquid metal shell
The structure of body.It should be noted that permanent magnet can also be arranged on cuboid pipeline the inside or on the outside of cuboid passage；Cause
This, the electromagnetism pump configuration that the temperature difference drives also just has a diversified forms, and the present invention is not specifically limited to this, but every meets above-mentioned
Liquid metal shell structure, the present invention should give protection.
The preferred embodiments of the present invention are the foregoing is only, is not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.It is all within the spirit and principles in the present invention, made any repair
Change, equivalent, improvement etc., should be included within the scope of the present invention.
Claims (6)
1. a kind of liquid metal electromagnetic pump, it is characterised in that
Liquid metal pipeline, conductive and heat-conductive body, at least one half including housing He the rectangular cross-section for being arranged on enclosure interior
Conductor thermo-electric generation component, magnet assembly and a pair of insulation and thermal insulation layers；
The insulation and thermal insulation layer is respectively arranged on the relative lateral wall of the liquid metal pipeline；
The semiconductor thermoelectric power generation component is on the upper madial wall and/or lower madial wall of the liquid metal pipeline, and Europe
Nurse is contacted；
The conductive and heat-conductive body is placed on outside the liquid metal pipeline, and is fitted with the upper lateral wall of the liquid metal pipeline；
The magnet assembly is used to produce liquid metal the prolonging along the liquid metal pipeline made in the liquid metal pipeline
Stretch the magnetic field of direction flowing；
The magnet assembly includes the first permanent magnet；
First permanent magnet is arranged on the top of the housing；
Also include two magnetic conduction sheets；
Two magnetic conduction sheets are separately fixed at the two ends of first permanent magnet；
The liquid metal pipeline is located between magnetic conduction sheet；
Also include conductive protecting layer；
The conductive protecting layer is arranged on the semiconductor thermoelectric power generation component towards the appearance of the liquid metal pipeline center
On face.
2. liquid metal electromagnetic pump as claimed in claim 1, it is characterised in that
The liquid metal pipeline is connected by flange or screw thread with the housing.
3. liquid metal electromagnetic pump as claimed in claim 1, it is characterised in that
The conductive and heat-conductive body is copper casting.
4. liquid metal electromagnetic pump as claimed in claim 1, it is characterised in that
The conductive protecting layer is copper facing or silver coating.
5. liquid metal electromagnetic pump as claimed in claim 1, it is characterised in that
The semiconductor thermoelectric power generation component thickness is 5-50 μm.
6. a kind of liquid metal electromagnetic pump, it is characterised in that
Liquid metal pipeline, conductive and heat-conductive body, at least one half including housing He the rectangular cross-section for being arranged on enclosure interior
Conductor thermo-electric generation component, magnet assembly and a pair of insulation and thermal insulation layers；
The insulation and thermal insulation layer is respectively arranged on the relative lateral wall of the liquid metal pipeline；
The semiconductor thermoelectric power generation component is on the upper madial wall and/or lower madial wall of the liquid metal pipeline, and Europe
Nurse is contacted；
The conductive and heat-conductive body is placed on outside the liquid metal pipeline, and is fitted with the upper lateral wall of the liquid metal pipeline；
The magnet assembly is used to produce liquid metal the prolonging along the liquid metal pipeline made in the liquid metal pipeline
Stretch the magnetic field of direction flowing；
The magnet assembly includes the second permanent magnet and three permanent magnet；
Second permanent magnet, the three permanent magnet are arranged on the inside of housing, and second permanent magnet and the described 3rd
The N poles of permanent magnet are oppositely arranged with S poles；
The liquid metal pipeline is arranged between second permanent magnet and the three permanent magnet；
Also include magnetic guiding loop；
The magnetic guiding loop wraps up the outer surface of the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310153919.XA CN103208904B (en) | 2013-04-27 | 2013-04-27 | A kind of liquid metal electromagnetic pump |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310153919.XA CN103208904B (en) | 2013-04-27 | 2013-04-27 | A kind of liquid metal electromagnetic pump |
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| Publication Number | Publication Date |
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| CN103208904A CN103208904A (en) | 2013-07-17 |
| CN103208904B true CN103208904B (en) | 2017-07-04 |
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| CN201310153919.XA Expired - Fee Related CN103208904B (en) | 2013-04-27 | 2013-04-27 | A kind of liquid metal electromagnetic pump |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107490311B (en) * | 2017-07-25 | 2019-06-21 | 中国船舶重工集团公司第七一九研究所 | Self-driving type magnetic fluid heat exchanger |
| CN111953174A (en) * | 2020-07-01 | 2020-11-17 | 蚌埠正峰电子科技有限公司 | Liquid metal electromagnetic pump |
| CN112737274B (en) * | 2020-12-29 | 2022-07-19 | 广西民族师范学院 | Auxiliary device of broadband miniature electromagnetic vibration energy collector |
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| US20050160752A1 (en) * | 2004-01-23 | 2005-07-28 | Nanocoolers, Inc. | Apparatus and methodology for cooling of high power density devices by electrically conducting fluids |
| KR100763934B1 (en) * | 2006-11-20 | 2007-10-05 | 삼성전자주식회사 | Electrohydrodynamic micropump and method of operating the same |
| CN203225646U (en) * | 2013-04-27 | 2013-10-02 | 颉未凤 | Liquid metal electromagnetic pump |
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