CN103208446B - Wafer temporary storage cassette - Google Patents

Wafer temporary storage cassette Download PDF

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Publication number
CN103208446B
CN103208446B CN201210194714.1A CN201210194714A CN103208446B CN 103208446 B CN103208446 B CN 103208446B CN 201210194714 A CN201210194714 A CN 201210194714A CN 103208446 B CN103208446 B CN 103208446B
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China
Prior art keywords
wafer
block
described multiple
groove
temporary storage
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CN201210194714.1A
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Chinese (zh)
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CN103208446A (en
Inventor
唐英泰
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Chipmos Technologies Inc
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Chipmos Technologies Inc
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Abstract

A wafer temporary storage cassette comprises a top plate, a bottom plate, a plurality of side plates and a rotatable stop piece. The top plate is provided with a clamping part. The bottom plate and the top plate are arranged in parallel and are provided with a plurality of supporting blocks, wherein at least one of the supporting blocks is provided with a clamping groove. The top plate, the bottom plate and the side plate form an accommodating space and define a taking and placing opening. The side plate has a plurality of first fixing grooves on its surface facing the accommodating space for inserting a plurality of wafers in a layered manner. The rotatable stop piece is provided with a rod part and a clamping hook, and the clamping hook is fixed on the bottom end of the rod part. When the top end of the rod part is buckled to the clamping part, the clamping hook is not positioned in the clamping groove, and the rod part limits the horizontal displacement of the wafer. When the top end of the rod part is not buckled with the clamping part, the clamping hook is simultaneously actuated to be positioned in the clamping groove, so that the wafer is suitable for being taken out from the taking and placing opening.

Description

Wafer clamping box for temporary storage
Technical field
The invention relates to a kind of clamping box for temporary storage, and relate to a kind of wafer clamping box for temporary storage especially.
Background technology
Semiconductor crystal wafer, owing to need need coordinate process equipment through the process of various different flow process, therefore can be moved to different work stations.Conveniently the carrying and avoiding of wafer is subject to external force collision, multiple wafer can be accommodated in wafer clamping box for temporary storage.
In general, being provided with multiple slots of successively arranging in wafer clamping box for temporary storage can the accommodating multiple wafer of level, and one side there is an opening can setting out and being loaded into for wafer.Moreover, the stop dog component that can prevent wafer from skidding off in time carrying also is provided with in opening part.But; when the wafer clamping box for temporary storage of storing wafer is carried to subsequent work station; operating personnel often can forget and removes spacing to wafer of stop dog component, and causes mechanical arm to be taken out by wafer from opening by force, causes wafer clash into stop dog component and break and damage.In addition, the slot spacing of wafer clamping box for temporary storage is greater than wafer thickness, and the accommodation space of wafer clamping box for temporary storage can be greater than wafer area, and therefore wafer still can rock in handling process in wafer clamping box for temporary storage, and mutually collide with wafer clamping box for temporary storage, this also can cause breaking and damaging of wafer.Therefore, the chance of operating personnel's misoperation how is effectively reduced and to reduce the probability of mutually colliding between wafer clamping box for temporary storage and wafer in handling process be one of industry problem of desiring most ardently solution.
Summary of the invention
The invention provides a kind of wafer clamping box for temporary storage, it effectively can reduce the chance of operating personnel's misoperation.
The present invention proposes a kind of wafer clamping box for temporary storage, and it comprises a top board, a base plate, multiple side plate and a rotatable stop part.Top board has a holding section.Base plate and top board are parallel to each other and configure, and have multiple back-up block, and wherein at least wherein one of back-up block has a draw-in groove.Side plate connects top board and base plate.Top board, base plate and side plate form an accommodation space and define one and pick and place mouth.Side plate has corresponding multiple first holddown grooves respectively on the surface of accommodation space, plants for multiple layered wafer.Rotatable stop part has a bar portion and a snap fit, and its king-rod portion has a top respect to one another and a bottom, and snap fit is fixed on the bottom in bar portion.When the top in bar portion is clipped to the holding section of top board, the back-up block that snap fit is not positioned at base plate at least wherein one draw-in groove, the horizontal displacement of bar portion restriction wafer.When the holding section of the top not buckle top board in bar portion, snap fit start simultaneously and back-up block at least one of them the draw-in groove that is positioned at base plate, be suitable for make wafer being removed from picking and placeing mouth.
Based on above-mentioned, because wafer clamping box for temporary storage of the present invention has rotatable stop part, so whether wafer clamping box for temporary storage can limit or remove the horizontal displacement to wafer by the interference of the draw-in groove of the back-up block of the snap fit of rotatable stop part and base plate.Therefore, wafer clamping box for temporary storage of the present invention effectively can reduce the chance of operating personnel's misoperation.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of a kind of wafer clamping box for temporary storage of one embodiment of the invention.
The snap fit that Fig. 2 A illustrates the rotatable stop part of Fig. 1 is not positioned at the schematic perspective view of the draw-in groove of the second back-up block.
The bar portion that Fig. 2 B illustrates the rotatable stop part of Fig. 1 is not snapped in the three-dimensional partial schematic diagram of the holding section of top board.
The snap fit that Fig. 2 C illustrates the rotatable stop part of Fig. 1 is positioned at the schematic perspective view of the draw-in groove of the second back-up block.
Fig. 2 D to Fig. 2 E illustrates solid and the generalized section of the back-up block of multiple different kenel.
Fig. 3 illustrates the schematic perspective view of the wafer clamping box for temporary storage of Fig. 1 and the relative position relation of a detection equipment.
Fig. 4 is the schematic perspective view of a kind of wafer clamping box for temporary storage of another embodiment of the present invention.
Fig. 5 illustrates the schematic perspective view of the over cap assembly into Fig. 4.
Fig. 6 illustrates the elevational schematic view of the over cap assembly into Fig. 4.
Main element symbol description:
100a, 100b: wafer clamping box for temporary storage
110: top board
112: holding section
120: base plate
122: back-up block
123,125,126a, 126b, 126c: the first back-up block
123a, 123b, 125a, 125b: the first support portion
127: the second back-up blocks
127a: draw-in groove
127b: the second support portion
130a, 130b, 130c: side plate
131,133: surface
132: the first holddown grooves
140: rotatable stop part
142: bar portion
142a: top
142b: bottom
144: snap fit
150: handle
160: locking part
180: over cap assembly
181: inner surface
182: protection lid
182a: cover plate
182b: the first side wall
182c: the second sidewall
183: outer surface
184: handle
185b: the first Ka Gou
185c: the second Ka Gou
186: support board
187: surface
188: the second holddown grooves
189: locking part
200: wafer
210: detection equipment
212: substrate
212a: detecting point
214: display
S: accommodation space
P: pick and place mouth
T: hold the tip
Embodiment
Fig. 1 is the schematic perspective view of a kind of wafer clamping box for temporary storage of one embodiment of the invention.The snap fit that Fig. 2 A illustrates the rotatable stop part of Fig. 1 is not positioned at the schematic perspective view of the draw-in groove of the second back-up block.The bar portion that Fig. 2 B illustrates the rotatable stop part of Fig. 1 is not snapped in the three-dimensional partial schematic diagram of the holding section of top board.The snap fit that Fig. 2 C illustrates the rotatable stop part of Fig. 1 is positioned at the schematic perspective view of the draw-in groove of the second back-up block.For convenience of description, Fig. 1 omits and illustrates partial component.Please refer to Fig. 1, in the present embodiment, wafer clamping box for temporary storage 100a comprises top board 110, base plate 120, multiple side plate 130a, 130b, 130c and a rotatable stop part 140.
Specifically, please also refer to Fig. 2 A and Fig. 2 B, top board 110 has a holding section 112.Base plate 120 and top board 110 are parallel to each other and configure, and have multiple back-up block 122.Back-up block 122 comprises two the first back-up block 123,125 and 1 second back-up blocks 127.First back-up block 123 has two first support portions 123a, 123b, and the first back-up block 125 has two first support portions 125a, 125b, and the second back-up block 127 has a draw-in groove 127a and one second support portion 127b.
Refer again to Fig. 1 and Fig. 2 A, side plate 130a, 130b, 130c connect top board 110 with base plate 120 and toward each other, and top board 110, base plate 120 and side plate 130a, 130b, 130c form an accommodation space S and define one and pick and place a mouthful P.Side plate 130a, 130b, 130c have corresponding multiple first holddown grooves 132 respectively on the surface 131 of accommodation space S, plant for multiple wafer 200 layering.In the present embodiment, wafer 200 is such as 12 inch wafers.
Please also refer to Fig. 1, Fig. 2 A and Fig. 2 B, the rotatable stop part 140 of the present embodiment has bar portion 142 and a snap fit 144, its king-rod portion 142 has an a top 142a respect to one another and bottom 142b, and snap fit 144 is fixed on the bottom 142b in bar portion 142.In the present embodiment, one stiff end of one waling stripe (not illustrating) is connected to top board 110, and the top 142a in connecting rod portion, opposite end 142, and a stiff end of another waling stripe (not illustrating) is connected to base plate 120, and the bottom 142b in connecting rod portion, opposite end 142, and rotatable stop member 140 with the stiff end of waling stripe for axle center rotates, make the top 142a in bar portion 142 can buckle or be not snapped in the holding section 112 of top board 110.In addition, the shape of snap fit 144 is such as C shape, but not as limit.
Particularly, please also refer to Fig. 1 and Fig. 2 A, when the top 142a in the bar portion 142 of rotatable stop part 140 is clipped to the holding section 112 of top board 110, snap fit 144 is not positioned at the draw-in groove 127a of the second back-up block 127 of base plate 120, and bar portion 142 limits the horizontal displacement of wafer 200, wafer 200 can not be shifted out from accommodating space S.Please refer to Fig. 1, Fig. 2 B and Fig. 2 C, when rotating the holding section 112 of top 142a that rotatable stop part 140 makes its bar portion 142 not buckle top board 110, snap fit 144 start simultaneously proceeds in the draw-in groove 127a of the second back-up block 127 of base plate 120, snap fit 144 is made to be positioned at draw-in groove 127a, now, wafer 200 is suitable for being removed from picking and placeing a mouthful P.
Moreover please join Fig. 1 and Fig. 2 A again, wafer clamping box for temporary storage 100a more comprises multiple handle 150, wherein handle 150 is configured at side plate 130a, 130b away from the surface 133 of accommodation space S, carries wafer clamping box for temporary storage 100a with convenient working personnel.In addition, wafer clamping box for temporary storage 100a also comprises multiple locking part 160, and its latus inframedium 130a, 130b, 130c are locked in top board 110 with on base plate 120 through locking part 160.
Fig. 3 illustrates the schematic perspective view of the wafer clamping box for temporary storage of Fig. 1 and the relative position relation of a detection equipment.Please also refer to Fig. 2 A and Fig. 3, the wafer clamping box for temporary storage 100a of the present embodiment is suitable for being positioned on a detection equipment 210, whether completely wherein detection equipment 210 has the detecting point 212a that multiple corresponding back-up block 122 is arranged, in order to detect back-up block 122 pressing detecting point 212a.In addition, detection equipment 210 also comprises a display 214, the prompting whether be pressed completely in order to display detecting point 212a.More particularly, the detecting point 212a of detection equipment 210 is arranged on a substrate 212, and detecting is put, and 212a is corresponding with first support portion 123a, 123b, 125a, 125b and draw-in groove 127a to be arranged.
Particularly, please also refer to Fig. 1, Fig. 2 A and Fig. 3, when the top 142a in the bar portion 142 of rotatable stop part 140 is clipped to the holding section 112 of top board 110, first support portion 123a, 123b of the back-up block 122 of base plate 120 at least one of them and first support portion 125a, 125b at least one of them directly press corresponding to detecting point 212a, and snap fit 144 is not positioned at the draw-in groove 127a of the second back-up block 127 of base plate 120, therefore the detecting point 212a of corresponding draw-in groove 127a is not pressed, now display 214 shows a card casket and there is not prompting.According to the display of display 214, operating personnel can learn that rotatable stop part 140 does not discharge its backstop mechanism, therefore the bar portion 142 of rotatable stop part 140 still limits the horizontal displacement of wafer 200.
Please also refer to Fig. 2 B, Fig. 2 C and Fig. 3, when the holding section 112 of the top 142a not buckle top board 110 in the bar portion 142 of rotatable stop part 140, snap fit 144 can be positioned at the draw-in groove 127a of the second back-up block 127 of base plate 120, now the back-up block 122 of base plate 120 is except the first support portion 123a, 123b at least one of them and the first support portion 125a, 125b at least one of them directly press corresponding to detecting point 212a, the detecting point 212a of corresponding draw-in groove 127a is also directly pressed by snap fit 144, meaning and all detecting point 212a are all depressed state, now display 214 shows a card casket existence prompting.According to the display of display 214, operating personnel can learn that rotatable stop part 140 has discharged its backstop mechanism, meaning can the horizontal displacement of the unrestricted wafer 200 in bar portion 142 of rotation stop 140, and therefore operating personnel can start mechanical arm (not illustrating) wafer 200 be please refer to Fig. 1 from picking and placeing a mouthful P() be taken out to subsequent work station.Thus, through the mechanism design collocation detection equipment 210 of rotatable stop part 140, effectively can reduce the chance of operating personnel's misoperation, when to avoid in the bar portion 142 of rotatable stop part 140 still in backstop state, namely wafer 200 is removed from picking and placeing a mouthful P, and causes wafer 200 to strike bar portion 142 and damage rupture.
In brief, because the wafer clamping box for temporary storage 100a of the present embodiment has rotatable stop part 140, so whether wafer clamping box for temporary storage 100a can limit or remove the horizontal displacement to wafer 200 by the interference of the snap fit 144 of rotatable stop part 140 and the draw-in groove 127a of the second back-up block 127 of base plate 120.Meanwhile, collocation detection equipment 210 learns whether rotatable stop part 140 discharges its backstop mechanism, not yet removes the chance that namely backstop state makes the misoperation of taking out wafer 200 effectively to reduce operating personnel in stop part 140.
It is worth mentioning that, the present invention does not limit the structure kenel of back-up block 122.The used time that the fixing or frame be positioned on other equipment platforms (not illustrating) as wafer clamping box for temporary storage 100a when back-up block 122 is high; usual meeting corresponding back-up block 122 part on equipment platform is provided with and holds the tip (not illustrating), firmly can hold and unlikely displacement to make the holding tip with back-up block 122.For example, generally back-up block 122 can be designed to there is a V-shaped section groove, and hold the tip and be suitable for firmly being fastened in groove, and then make wafer clamping box for temporary storage 100a steadily be placed on equipment platform.Please refer to Fig. 2 A, the structure kenel of first back-up block 123,125 and second back-up block 127 of the present embodiment forms the simpler kenel of a V-shaped section groove, therefore the first back-up block 123 and 125 respectively has 2 first support portion 123a, 123b and 125a, 125b respectively, and the second back-up block 127 also has 2 second support portions, and one of them of the second support portion is partially removed and forms a draw-in groove 127b.But in other embodiments, please refer to Fig. 2 D, the profile of back-up block 126a also can be a triangle, and has the groove of a pyrometric cone kenel, holding tip T and firmly can hold and unlikely displacement with back-up block 126a wherein on equipment platform; Also or, please refer to Fig. 2 E, the profile of back-up block 126b also can be a rectangle, and has the groove of a quadrangular pyramid kenel, holding tip T and firmly can hold and unlikely displacement with back-up block 126b wherein on equipment platform.The groove of the two profiles state of above-mentioned Fig. 2 D and Fig. 2 E all has V-shaped section, but back-up block 126a has three support portions, and back-up block 126b has four support portions.In addition, in the embodiment do not illustrated, the second back-up block in back-up block 126a, 126b also can have identical structure kenel with the first back-up block, and difference part is only that the second back-up block has a draw-in groove.Above-mentioned design still belongs to the adoptable technical scheme of the present invention, do not depart from the present invention for protection scope.
Fig. 4 is the schematic perspective view of a kind of wafer clamping box for temporary storage of another embodiment of the present invention.Fig. 5 illustrates the schematic perspective view of the over cap assembly into Fig. 4.Fig. 6 illustrates the elevational schematic view of the over cap assembly into Fig. 4.The present embodiment continues to use element numbers and the partial content of previous embodiment, wherein adopts identical label to represent identical or approximate element, and eliminates the explanation of constructed content.Explanation about clipped can refer to previous embodiment, and it is no longer repeated for the present embodiment.
Please refer to Fig. 4; the main difference of the semiconductor package 100b of the present embodiment and the semiconductor package 100a of previous embodiment is: the wafer clamping box for temporary storage 100b of the present embodiment more comprises an over cap assembly 180; wherein over cap assembly 180 is arranged at and picks and places a mouthful P; and be snapped in top board 110 with on base plate 120, wherein the lateral margin of wafer 200 is plugged on over cap assembly 180.
Specifically; please also refer to Fig. 4, Fig. 5 and Fig. 6; the over cap assembly 180 of the present embodiment comprises a protection lid 182, leader 184 and a support board 186; wherein protect lid 182 to comprise a cover plate 182a and connect a first side wall 182b and the one second sidewall 182c of the relative both sides of cover plate 182a; its cover plate 182a has inner surface 181 and an outer surface 183 respect to one another; the first side wall 182b has one first card ditch 185b of depression, and the second sidewall 182c has one second card ditch 185c of depression.In the present embodiment; the protection the first side wall 182b of the lid 182 and first card ditch 185b of the second sidewall 182c and the second card ditch 185c is bearing on top board 110 respectively with on base plate 120; with by top board 110 and base plate 120 pinching between the first side wall 182b and the second sidewall 182c, and make over cap assembly 180 be fixed on top board 110 with on base plate 120.Handle 184 is configured on the outer surface 183 of the cover plate 182a of protection lid 182.Support board 186 is configured on the inner surface 181 of the cover plate 182a of protection lid 182, and wherein support board 186 has multiple second holddown groove 188 on the surface 187 picking and placeing mouthful P, and the lateral margin layering for wafer 200 is planted.In this, each second holddown groove 188 is such as a resilient clamp groove, and when wafer 200 is inserted in resilient clamp groove respectively, resilient clamp groove can held tight wafer 200.In addition, over cap assembly 180 more can comprise multiple locking part 189, and support board 186 is locked in through locking part 189 on the inner surface 181 of the cover plate 182a of protection lid 182.Certainly, in the embodiment that other do not illustrate, the structure that over cap assembly 180 also can be one of the forming.
Because the wafer clamping box for temporary storage 100b of the present embodiment has more over cap assembly 180; therefore in the process of carrying; except first holddown groove 132 of script side plate 130a, 130b, 130c can layering be fixed in except the lateral margin of the wafer 200 in accommodation space S, the second holddown groove 188 layering that the contiguous lateral margin picking and placeing the wafer 200 of mouthful P also can pass through the support board 186 of over cap assembly 180 is seized on both sides by the arms fixing.The first holddown groove 132 spacing that accommodation space compared to known wafer clamping box for temporary storage is greater than wafer 200 area and side plate 130a, 130b, 130c is greater than wafer 200 thickness, the design of the wafer clamping box for temporary storage 100b of the present embodiment effectively can seize fixing wafer 200 on both sides by the arms, the chance that when can avoid carrying, wafer 200 collides with wafer clamping box for temporary storage 100b mutually because rocking, effectively can reduce the probability of breaking and damaging of wafer 200.
In sum, because wafer clamping box for temporary storage of the present invention has rotatable stop part, so whether wafer clamping box for temporary storage can limit or remove the horizontal displacement to wafer by the interference of the draw-in groove of the back-up block of the snap fit of rotatable stop part and base plate, and detection equipment of arranging in pairs or groups, to learn whether rotatable stop part discharges its backstop mechanism, not yet removes in stop part the chance that namely backstop state makes the misoperation of taking out wafer effectively to reduce operating personnel.Moreover wafer clamping box for temporary storage of the present invention can have more over cap assembly, therefore in the process of carrying, the chance that wafer collides with clamping box for temporary storage mutually because rocking can being avoided, effectively can reduce the probability of breaking and damaging of wafer.
Although the present invention discloses as above with embodiment; so itself and be not used to limit the present invention; have in any art and usually know the knowledgeable; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion depending on the accompanying claim person of defining.

Claims (7)

1. a wafer clamping box for temporary storage, comprising:
One top board, has a holding section;
One base plate, is parallel to each other with this top board and configures, and have multiple back-up block, wherein said multiple back-up block at least one of them has a draw-in groove;
Multiple side plate, connect this top board and this base plate, this top board, this base plate and described multiple side plate form an accommodation space and define one and pick and place mouth, wherein said multiple side plate has corresponding multiple first holddown grooves respectively on the surface of this accommodation space, plants for multiple layered wafer; And
One rotatable stop part, there is a bar portion and a snap fit, wherein this bar portion has a top respect to one another and a bottom, and this snap fit is fixed on this bottom in this bar portion, wherein when this top in this bar portion is clipped to this holding section of this top board, described multiple back-up block that this snap fit is not positioned at this base plate at least one of them this draw-in groove, the horizontal displacement of the described multiple wafer of this bar portion restriction, and when this holding section of this top not this top board of buckle in this bar portion, the start simultaneously of this snap fit and described multiple back-up block at least one of them this draw-in groove of being positioned at this base plate, be suitable for make described multiple wafer picking and placeing mouth be removed from this,
Wherein this wafer clamping box for temporary storage is suitable for being positioned on a detection equipment, and this detection equipment has the detecting point that the described multiple back-up block of multiple correspondence is arranged, and whether presses described multiple detecting point completely in order to detect described multiple back-up block.
2. wafer clamping box for temporary storage as claimed in claim 1, it is characterized in that, described multiple back-up block comprises two the first back-up blocks and one second back-up block, and respectively this first back-up block has two the first support portions, this second back-up block has this draw-in groove and one second support portion, and this draw-in groove of described multiple detecting point of this detection equipment and described multiple first support portions of each this first back-up block at least one of them and this second back-up block is corresponding to be arranged.
3. wafer clamping box for temporary storage as claimed in claim 2, it is characterized in that, this detection equipment more comprises a display, when this top in this bar portion is clipped to this holding section of this top board, respectively described multiple first support portions of this first back-up block at least one of them directly press corresponding to this detecting point, and to should this detecting point of draw-in groove not be pressed, this display shows a card casket and there is not prompting, when this holding section of this top not this top board of buckle in this bar portion, respectively described multiple first support portions of this first back-up block at least one of them directly press corresponding to described multiple detecting points, to should this detecting point of draw-in groove directly be pressed by this snap fit, this display shows a card casket and there is prompting.
4. wafer clamping box for temporary storage as claimed in claim 1, it is characterized in that, more comprise an over cap assembly, be arranged at this and pick and place mouth, and clamp this top board and this base plate, the lateral margin of wherein said multiple wafer is plugged on this over cap assembly.
5. wafer clamping box for temporary storage as claimed in claim 4, it is characterized in that, this over cap assembly, comprising:
One protection lid, comprise a cover plate and connect a first side wall and one second sidewall of the relative both sides of this cover plate, wherein this cover plate has an inner surface respect to one another and an outer surface, this the first side wall has one first Ka Gou, and this second sidewall has one second Ka Gou, and this first Ka Gou and this second Ka Gou is bearing on this top board and this base plate respectively, with by this top board and this base plate pinching between this first side wall and this second sidewall; And
One support board, is configured on this inner surface of this cover plate of this protection lid, and wherein this support board has multiple second holddown groove on the surface that this picks and places mouth, plants fixing for described multiple layered wafer.
6. wafer clamping box for temporary storage as claimed in claim 5, it is characterized in that, respectively this second holddown groove is a resilient clamp groove, when described multiple wafer is inserted in described multiple resilient clamp groove respectively, multiple wafer described in described multiple resilient clamp groove held tight.
7. wafer clamping box for temporary storage as claimed in claim 1, it is characterized in that, the shape of this snap fit comprises C shape.
CN201210194714.1A 2012-01-17 2012-06-13 Wafer temporary storage cassette Active CN103208446B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101101785 2012-01-17
TW101101785A TWI433257B (en) 2012-01-17 2012-01-17 Wafer cassette

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CN103208446A CN103208446A (en) 2013-07-17
CN103208446B true CN103208446B (en) 2015-12-16

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105990199B (en) * 2015-02-15 2020-03-27 盛美半导体设备(上海)股份有限公司 Substrate transfer module in semiconductor device
CN110211907A (en) * 2019-05-24 2019-09-06 上海提牛机电设备有限公司 A kind of chip cassette and wafer cleaning equipment
CN110534665B (en) * 2019-07-16 2022-04-05 福建华佳彩有限公司 Substrate arrangement caching device
CN112599447A (en) * 2020-12-14 2021-04-02 湖南凯通电子有限公司 Loading device for realizing product production automation by chip packaging process
CN113314450B (en) * 2021-07-27 2021-11-16 北京北方华创微电子装备有限公司 Wafer overturning device and wafer transmission system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101633441A (en) * 2009-08-19 2010-01-27 友达光电股份有限公司 Substrate processing system and substrate carrying device thereof
CN201673895U (en) * 2010-04-13 2010-12-15 中勤实业股份有限公司 Improved cartridge structure
CN201729419U (en) * 2010-08-13 2011-02-02 中勤实业股份有限公司 Improved structure of base plate cassette

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101633441A (en) * 2009-08-19 2010-01-27 友达光电股份有限公司 Substrate processing system and substrate carrying device thereof
CN201673895U (en) * 2010-04-13 2010-12-15 中勤实业股份有限公司 Improved cartridge structure
CN201729419U (en) * 2010-08-13 2011-02-02 中勤实业股份有限公司 Improved structure of base plate cassette

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TW201332049A (en) 2013-08-01
TWI433257B (en) 2014-04-01

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