CN103208369A - Dye-sensitized solar cell - Google Patents
Dye-sensitized solar cell Download PDFInfo
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- CN103208369A CN103208369A CN201210014695XA CN201210014695A CN103208369A CN 103208369 A CN103208369 A CN 103208369A CN 201210014695X A CN201210014695X A CN 201210014695XA CN 201210014695 A CN201210014695 A CN 201210014695A CN 103208369 A CN103208369 A CN 103208369A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/542—Dye sensitized solar cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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Abstract
A dye-sensitized solar cell comprises a first conductive substrate, a first dye layer, a first conductive layer and a second conductive substrate. The dye layer is provided with at least one dye portion and arranged on the first conductive substrate. The first conductive layer is arranged on the first conductive substrate and located on the periphery of the dye portion to form at least one hexagon. The second conductive substrate and the first conductive substrate are oppositely arranged. Therefore, when the dye portion arranged in the hexagon area generates electrons, the electrons can be transferred to the first conductive layer by evenly passing through the conductive substrates in the shortest distance to further improve integral photoelectric conversion efficiency.
Description
Technical field
The present invention is about a kind of solar cell, especially in regard to a kind of DSSC.
Background technology
Solar energy itself there is no pollution problem and obtains easily, never exhausts, so solar energy becomes one of important alternative energy.The solar cell of normal applied solar energy is a kind of photoelectric conversion component, its via solar light irradiation after, transform light energy is become electric energy.
Solar cell of a great variety, such as silica-based (silicon-based) solar cell, semiconducting compound (compound semiconductor) solar cell, organic (organic) solar cell or DSSC (Dye Sensitized Solar Cell, DSSC).Wherein, the structure of DSSC comprises that two electrically-conductive backing plates encapsulate applying mutually, and one of them electrically-conductive backing plate is provided with titanium dioxide with absorbing dye, and another electrically-conductive backing plate is provided with the Catalytic Layer of platinum for example.Wherein, the area of dye coating is the very important factor that influences the opto-electronic conversion usefulness of solar cell.
Therefore, how to improve the structural design of DSSC to promote whole opto-electronic conversion usefulness, real is one of current important topic.
Summary of the invention
Purpose of the present invention is for providing a kind of DSSC that can promote whole opto-electronic conversion usefulness.
The present invention can realize by the following technical solutions.
A kind of DSSC of the present invention comprises one first electrically-conductive backing plate, a dye coating, one first conductive layer and one second electrically-conductive backing plate.Dye coating has at least one dyestuff portion, and is arranged on first electrically-conductive backing plate.First conductive layer be arranged on first electrically-conductive backing plate and be positioned at dyestuff portion around, and form at least one hexagon.Second electrically-conductive backing plate and first electrically-conductive backing plate are oppositely arranged.
In one embodiment, dyestuff portion forms a hexagon.
In one embodiment, first conductive layer has a plurality of hexagons.
In one embodiment, formed one of them the hexagon area of first conductive layer is more than or equal to the hexagonal area of dyestuff portion formation.
In one embodiment, a spacing of first conductive layer and dyestuff portion is between 0.1mm to 50mm.
In one embodiment, DSSC also comprises an insulating protective layer, and it is arranged on first conductive layer.The material of insulating protective layer can comprise glass cement, for example bismuth oxide.
In one embodiment, DSSC also comprises one second conductive layer, and it is arranged on second electrically-conductive backing plate.
In one embodiment, the live width of first conductive layer or second conductive layer is between 0.1mm to 30mm.
In one embodiment, first conductive layer setting of aliging with second conductive layer.
From the above, in DSSC of the present invention, first conductive layer be arranged at dyestuff portion around, and the formed zone of first conductive layer is hexagon, thereby can form solid matter row so that the dyestuff portion in the hexagonal region of being arranged at is when producing electronics, can be evenly and the shortest distance via electrically-conductive backing plate, and electronics is passed to first conductive layer, and then promote whole opto-electronic conversion usefulness.
Description of drawings
Fig. 1 and Fig. 3 are the schematic diagram of different aspects of a kind of DSSC of the preferred embodiment of the present invention;
Fig. 2 is for looking schematic diagram on the dye coating of the DSSC of the preferred embodiment of the present invention and first conductive layer;
Fig. 4 is for being connected to the schematic diagram of a circle in the regular hexagon;
Fig. 5 A and Fig. 5 B are the schematic diagram of titanium dioxide-coated on first electrically-conductive backing plate of dyestuff adsorption layer;
Fig. 6 A and Fig. 6 B are the schematic diagram of the electronics bang path of three kinds of difform dyestuff portions and first conductive layer;
Fig. 7 A is that first conductive layer of the DSSC of another embodiment of the present invention is hexagonal schematic diagram;
Fig. 7 B is that second conductive layer of the DSSC of another embodiment of the present invention is hexagonal schematic diagram;
The schematic diagram that Fig. 7 C stacks mutually for second conductive layer of first conductive layer of Fig. 7 A and Fig. 7 B;
Fig. 8 A is that first conductive layer of the DSSC of an embodiment more of the present invention is hexagonal schematic diagram;
Fig. 8 B is that second conductive layer of the DSSC of an embodiment more of the present invention is hexagonal schematic diagram;
The schematic diagram that Fig. 8 C stacks mutually for second conductive layer of first conductive layer of Fig. 8 A and Fig. 8 B;
Fig. 8 D is the schematic diagram in order to a circuit board that electrically connects with described first electrode unit of Fig. 8 C and second electrode unit;
Fig. 9 A is that first conductive layer of the DSSC of another embodiment of the present invention is hexagonal schematic diagram;
Fig. 9 B is that second conductive layer of the DSSC of another embodiment of the present invention is hexagonal schematic diagram;
The schematic diagram that Fig. 9 C stacks mutually for second conductive layer of first conductive layer of Fig. 9 A and Fig. 9 B; And
Fig. 9 D is the schematic diagram in order to a circuit board that electrically connects with described first electrode unit of Fig. 9 C and second electrode unit.
The main element symbol description:
2: DSSC
201: the first electrically-conductive backing plates
202: the second electrically-conductive backing plates
203: dye coating
204: Catalytic Layer
205,305,405,505: the first conductive layers
206,306,406,506: the second conductive layers
207: frame glue
208: electrolyte
209: the first leads
210: the second leads
211: the first conductive through holes
212: the second conductive through holes
213: link glue
B1, B2: circuit board
B11, B21: first electronic pads
B12, B22: second electronic pads
C1, C2: curren-collecting part
D: spacing
E1: first dead zone
E2: second dead zone
L1, L2: lead
P: dyestuff portion
S: insulating protective layer
Embodiment
Hereinafter with reference to relevant drawings, a kind of DSSC according to the preferred embodiment of the present invention is described, wherein components identical will be illustrated with the components identical symbol.
Fig. 1 is the schematic diagram of a kind of DSSC 2 of the preferred embodiment of the present invention, and DSSC 2 comprises one first electrically-conductive backing plate 201, a dye coating 203, one first conductive layer 205 and one second electrically-conductive backing plate 202.Fig. 2 is for looking schematic diagram on dye coating 203 and first conductive layer 205, and Fig. 1 is the generalized section along the AA line segment of Fig. 2.Please refer to Figure 1 and Figure 2 with explanation DSSC 2.
The present invention does not limit the material of first electrically-conductive backing plate 201 and second electrically-conductive backing plate 202 especially, and it can for example be silicon substrate, ceramic substrate, metal substrate, glass substrate or plastic base etc.In this, sunray is from 201 incidents of first electrically-conductive backing plate, so the substrate of first electrically-conductive backing plate 201 is light-permeable, the substrate of second electrically-conductive backing plate 202 then can be printing opacity or light tight.First electrically-conductive backing plate 201 and second electrically-conductive backing plate 202 have a conductive layer respectively, conductive layer can be light transmission conductive layer or opaque conductive layer, wherein the material of light transmission conductive layer for example can be light transmitting conductive oxide (TCO), for example tin indium oxide, tin oxide or zinc oxide; Or the tin ash of doped with fluorine (Sn:F), and this kind substrate claims can be the FTO substrate.
First conductive layer 205 be arranged on first electrically-conductive backing plate 201 and be positioned at the P of dyestuff portion around.The material of first conductive layer 205 is example with the elargol, and it can be the conducting resinl of other material, for example aluminium glue or copper glue.The mode that forms first conductive layer 205 can be printing, coating or some glue, by the setting of first conductive layer 205, can assist the transmission of the P of dyestuff portion electronics.In this, the electronics that the P of dyestuff portion produces can be passed to the conductive layer on first electrically-conductive backing plate 201 earlier, is passed to first conductive layer 205 by conductive layer again.
First conductive layer 205 be positioned at dye coating 203 around and form at least one hexagon, be example in this to form a plurality of hexagons, and be regular hexagon.In this, first conductive layer, 205 formed one of them hexagon area are more than or equal to the hexagonal area of the P of dyestuff portion formation.Can make first conductive layer 205 that optimized carrier transmission effect is provided by such wires design (layout design).So, it is cellular that first conductive layer 205 and dye coating 203 in it form, and can share side and form solid matter row, thereby significantly promote dyestuff area and whole opto-electronic conversion usefulness.In this, dye coating 203 also forms a plurality of hexagons (be example with the regular hexagon) and lays respectively in first conductive layer, 205 formed a plurality of hexagons.In this, a space D of first conductive layer 205 and dye coating 203 is preferably between 0.2mm to 1mm between 0.1mm to 50mm.According to checking, such feature makes the electricity generation efficiency of present embodiment obtain preferable effect; Certainly, along with different enforcement aspects, space D can be adjusted.
In addition, DSSC 2 also can comprise an insulating protective layer S, and it is arranged on first conductive layer 205.The material of insulating protective layer S for example comprises glass cement (glass paste), and it can be bismuth oxide, in order to reducing the oxidation of first conductive layer 205 of a part, and forms electrical insulation.
In addition, side in first conductive layer, 205 outermost, one curren-collecting part C1 (with strip be example in this) is arranged usually, in order to compile the electric current of DSSC 2, and as the negative or positive electrode of battery, with the electrical polyphone or in parallel of adjacent DSSC or outside control circuit.
In addition, first electrically-conductive backing plate 201 also is provided with one first conductive through hole 211, and one first lead 209 is via first conductive through hole 211 and first electrically-conductive backing plate, 201 electrically connects.First lead 209 can be a printed circuit cable or an entity lead, is example in this lead with entity, and fills out in first conductive through hole 211 and establish conductive solder, and respectively the welding make win conductive through hole 211 can with first lead, 209 electrically connects.In addition, first conductive through hole 211 electrically connects by first conductive layer 205 and first electrically-conductive backing plate 201.The part of first conductive layer 205 (curren-collecting part C1) directly is connected with first conductive through hole 211.
Second electrically-conductive backing plate 202 and first electrically-conductive backing plate 201 are oppositely arranged.One Catalytic Layer 204 is arranged on second electrically-conductive backing plate 202, and Catalytic Layer 204 is platinum (Pt) or carbon (C) for example, can promote the redox of electrolyte 208.
Please refer to shown in Figure 3ly, DSSC 2 also can comprise one second conductive layer 206, and it is arranged on second electrically-conductive backing plate 202.One second conductive through hole 212 electrically connects by second conductive layer 206 and second electrically-conductive backing plate 202.The part of second conductive layer 206 (curren-collecting part C2) directly links to each other with second conductive through hole 212, and its another part is respectively at forming frame portion around the Catalytic Layer 204.In this, frame portion is example with the hexagon, is example with the regular hexagon particularly, makes the setting of can aliging with first conductive layer 205 of second conductive layer 206.And the live width of first conductive layer 205 or second conductive layer 206 is preferably between 0.2mm to 1.5mm to be example between 0.1mm to 30mm, and wherein the live width of first conductive layer 205 and second conductive layer 206 can be identical or inequality.
Second conductive layer 206 can be assisted the transmission of electronics, and together forms electrical loop with first conductive layer 205.Wherein, side in second conductive layer, 206 outermost, it (is example with the strip in this that one curren-collecting part C2 is arranged usually, and it is parallel with the curren-collecting part C1 of first conductive layer 205 in fact), in order to compile the electric current of DSSC 2, and as the negative or positive electrode of DSSC 2, with the electrical polyphone or in parallel of adjacent DSSC or outside control circuit.In this, second conductive layer 206 is example with the elargol, and it can be the conducting resinl of other material, for example aluminium glue or copper glue.What need replenish is; constitute the part of frame portion at second conductive layer 206; one insulating protective layer can also be set thereon; its material can for example be glass cement; it for example is bismuth oxide; in order to the oxidation of the frame portion part that reduces by second conductive layer 206, and avoid with first electrically-conductive backing plate 201 on the 205 electrical short circuits of first conductive layer.
In addition, DSSC 2 can comprise that also one second lead, 210, the second leads 210 are via second conductive through hole 212 and second electrically-conductive backing plate, 202 electrically connects.Second lead 210 can be a printed circuit cable or an entity lead, is example in this lead with entity, and fills out in second conductive through hole 212 and establish conductive solder, and respectively the welding make second conductive through hole 212 can with second lead, 210 electrically connects.In addition, second conductive through hole 212 electrically connects by second conductive layer 206 and second electrically-conductive backing plate 202.The part of second conductive layer 206 (curren-collecting part C2) directly is connected with second conductive through hole 212.
In addition, DSSC 2 also can comprise a frame glue 207, and it links first electrically-conductive backing plate 201 and second electrically-conductive backing plate 202.First electrically-conductive backing plate 201, second electrically-conductive backing plate 202 and frame glue 207 form a confined space.Wherein, frame glue 207 can comprise have water proofing property, stable on heating resin material to be to prolong the useful life of product.
In addition, for increasing the strength of connection of first electrically-conductive backing plate 201 and second electrically-conductive backing plate 202, also be provided with one between first electrically-conductive backing plate 201 and second electrically-conductive backing plate 202 and link glue 213.In this, be arranged between first conductive layer 205 and second conductive layer 206 to link glue 213, to link first electrically-conductive backing plate 201 and second electrically-conductive backing plate 202.In addition, it is identical that frame glue 207 and the material that links glue 213 can be, and for example is PUR or UV glue or epoxy resin.
In addition, DSSC 2 also can comprise an electrolyte 208, and its filling is in confined space.Behind irradiation, dye molecule in the dye coating 203 forms excitation state, and inject electronics to first electrically-conductive backing plate 201 or first conductive layer 205 rapidly, self be converted into simultaneously the dyestuff oxidation state, the dye molecule that is in oxidation state is then obtained electronics and is got back to ground state by electrolyte 208 solution, and makes dye molecule regenerate.In addition, the electrolyte 208 in the electrolyte solution provides after the electronics, then is diffused into second electrically-conductive backing plate 202 or second conductive layer 206, obtains electronics again and reduces.Thereby, finish an Optical Electro-Chemistry reaction cycle.
In sum, in DSSC of the present invention, first conductive layer be arranged at dyestuff portion around, and the formed zone of first conductive layer and dyestuff portion is hexagon.And the formed hexagon of first conductive layer and dyestuff portion has following advantage:
1, save material and adaptation height:
Fig. 4 is for being connected to the schematic diagram of a circle in the regular hexagon.Be connected to bowlder in regular hexagon, radius of a circle just equals the length of side of regular hexagon, and the longest diagonal of regular hexagon just equals diameter of a circle, and therefore can adopt regular hexagon is the approximate figure of circle.They in the polygonal of same circumference, be maximum with the area of regular polygon, and the angle number is more many, area is also more big; The area of circle is also bigger than any regular polygon.But from the angle of storehouse, the adaptation of circle is bad, and circle can not be total to the limit, and storehouse only joins a little between circle and the circle, have many spaces and be wasted, so the regular hexagon structure meets saving material, volume big and storehouse and adaptation advantages of higher.
2, mean forced:
Orthohexagonal structure is subjected to resonance effects chemically also common, and the structure of phenyl ring is regular hexagon, and graphite also is the continuous layer structure of being lined up regular hexagon by carbon atom, and also having ice crystal also is hexagon.When freezing, hydrone is subjected to hydrogen bond and attracts, and also is regular hexagon, and this structure stress because of regular hexagon is average.Fig. 5 A and Fig. 5 B are the schematic diagram of titanium dioxide-coated on first electrically-conductive backing plate 201 of dyestuff adsorption layer.When titanium dioxide-coated during in first electrically-conductive backing plate 202, the surface of titanium dioxide layer is not smooth, and needs to make the surfacing of titanium dioxide layer by shakeouing process.When titanium dioxide shakeouts with gravity, because of hexagon sub-circular mean forced, thus can reduce the thickness difference of height opposite sex of titanium dioxide layer, and then can reduce variability and promote yield.
3, promote electrical conductivity efficient:
Fig. 6 A is the schematic diagram of the electronics bang path of the dyestuff portion of three kinds of difformities (hexagon, square, rectangle) and first conductive layer, and the electronics bang path can comprise shortest path, second shortest path and short path.In fact but when electronics transmits, may the short path failure phenomenon appear because of interior too high in resistance, shown in Fig. 6 B.Electronics is with the shortest path transmission, in case short path lost efficacy (for example printing causes interior too high in resistance), its bang path increases, and can increase internal resistance.But the every limit of hexagon is all equidistant, so path failure does not influence its bang path.
In addition, DSSC 2 of the present invention can have the aspect of multiple electrical serial or parallel connection, below illustrates.
Fig. 7 A is that first conductive layer 305 of the DSSC of another embodiment of the present invention is and looks schematic diagram on hexagonal, and a plurality of dyestuff portions (figure shows) lay respectively in first conductive layer, the 305 formed hexagons.Fig. 7 B is that second conductive layer 306 of the DSSC of one embodiment of the invention is hexagonal schematic diagram, and a plurality of Catalytic Layer (figure does not show) lay respectively in second conductive layer, the 306 formed hexagons.Fig. 7 C schematic diagram that to be first conductive layer 305 stack mutually with second conductive layer 306.
In this, first conductive layer 305 is example to have seven hexagons, and claims that this is one first electrode unit, and first electrode unit is negative polarity in this.In this, second conductive layer 306 is example to have seven hexagons, and claims that this is one second electrode unit, and second electrode unit is positive polarity in this.First electrode unit can be derived electricity with a lead L1, and second electrode unit can be derived electricity with a lead L2.And the width of the part of first conductive layer 305 that is connected with lead L1 can be big (as thick line part in graphic) than other parts, the width of the part of second conductive layer 306 that is connected with lead L2 can be big (as thick line part in graphic) than other parts, can avoid current crowding whereby and promotes electrical conductive performance.In addition, adjacent a plurality of first electrode units and a plurality of second electrode units can form by lead L1, L2 and connects (being that lead L1, L2 interconnect) or parallel connection (being that lead L1 interconnects and lead L2 interconnects), and described first electrode unit or described second electrode unit can be positioned at the homogencous dyes sensitization solar battery or lay respectively at a plurality of DSSC.
Fig. 8 A is that first conductive layer 405 of the DSSC of another embodiment of the present invention is hexagonal schematic diagram, and a plurality of dyestuff portions (figure does not show) lay respectively in first conductive layer, the 405 formed hexagons.Fig. 8 B is that second conductive layer 406 of the DSSC of another embodiment of the present invention is hexagonal schematic diagram, and a plurality of Catalytic Layer (figure does not show) lay respectively in second conductive layer, the 406 formed hexagons.Fig. 8 C schematic diagram that to be first conductive layer 405 stack mutually with second conductive layer 406.
In this, first conductive layer 405 is example to have seven hexagons, and each hexagon is called one first electrode unit, and first electrode unit in this for negative polarity and do not connect mutually, and each hexagon is intervally installed.In this, second conductive layer 406 is example to have seven hexagons, and each hexagon is called one second electrode unit, and second electrode unit in this for positive polarity and do not connect mutually, and each hexagon is intervally installed.Described first electrode unit and described second electrode unit are positioned at the homogencous dyes sensitization solar battery.Described first electrode unit and described second electrode unit be corresponding stacking respectively.In this, the area of second electrode unit is slightly less than the area of first electrode unit.
Fig. 8 D is the schematic diagram in order to a circuit board B1 who electrically connects with described first electrode unit and second electrode unit, circuit board can be arranged on as shown in Figure 3 second electrically-conductive backing plate 202 and electrically connect with described first electrode unit and second electrode unit, and described first electrode unit is formed with described second electrode unit connects, can be a plurality of stainless steel substrates in this second electrically-conductive backing plate (not showing among Fig. 8 C), corresponding each hexagon arranges respectively.Circuit board B1 has a plurality of first electronic pads B11 and a plurality of second electronic pads B12.When circuit board B1 was arranged on second electrically-conductive backing plate, the described first electronic pads B11 and described first electrode unit electrically connected, and the described second electronic pads B12 and described second electrode unit electrically connect.Be noted that the position that the position indication circuit plate B1 of the first electronic pads B11 shown in Fig. 8 C and the second electronic pads B12 corresponds to when stacking on second electrically-conductive backing plate.In addition, the first electronic pads B11 of circuit board B1 is connected by lead with the adjacent hexagonal second electronic pads B12, connects so described first electrode unit is formed with described second electrode unit.In addition, because circuit board B1 can be a two-sided circuit board, so first electrode unit and second electrode unit that electrically connect by circuit board B1, can utilize the contact design of circuit board B1, surface and first electrode unit and second electrode unit electrically connect, another surface then is provided with the electrical derivation contact with DSSC, in order to the electric connection of outside.
Fig. 9 A is that first conductive layer 505 of the DSSC of another embodiment of the present invention is hexagonal schematic diagram, and a plurality of dyestuff portions (figure does not show) lay respectively in first conductive layer, the 505 formed hexagons.Fig. 9 B is that second conductive layer 506 of the DSSC of another embodiment of the present invention is hexagonal schematic diagram, and a plurality of Catalytic Layer (figure does not show) lay respectively in second conductive layer, the 506 formed hexagons.Fig. 9 C schematic diagram that to be first conductive layer 505 stack mutually with second conductive layer 506.
In this, first conductive layer 505 is example to have six hexagons, and each hexagon is called one first electrode unit, and first electrode unit is negative polarity and does not connect mutually in this, and each hexagon is intervally installed, and described first electrode unit is located on one first dead zone E1, and the so-called first dead zone E1 refers to that described zone there is no first electrode unit.In this, second conductive layer 506 is example to have six hexagons, and each hexagon is called one second electrode unit, and second electrode unit is positive polarity and does not connect mutually in this, and each hexagon is intervally installed, and described second electrode unit is located on one second dead zone E2, and the so-called second dead zone E2 refers to that described zone there is no second electrode unit.Described first electrode unit and described second electrode unit are positioned at the homogencous dyes sensitization solar battery.Described first electrode unit and described second electrode unit be corresponding stacking respectively.In this, the area of second electrode unit is slightly less than the area of first electrode unit.
Fig. 9 D is the schematic diagram in order to a circuit board B2 who electrically connects with described first electrode unit and second electrode unit, circuit board can be arranged on as shown in Figure 3 second electrically-conductive backing plate 202 and electrically connect with described first electrode unit and second electrode unit, and described first electrode unit is connected with described second electrode unit formation.Circuit board B2 has at least one first electronic pads B21 and at least one second electronic pads B22.When circuit board B2 was arranged on second electrically-conductive backing plate, the described first electronic pads B21 and described first electrode unit electrically connected, and the described second electronic pads B22 and described second electrode unit electrically connect.Be noted that the position that the position indication circuit plate B2 of the first electronic pads B21 shown in Fig. 9 C and the second electronic pads B22 corresponds to when stacking on second electrically-conductive backing plate.Again, the first electronic pads B21 of circuit board B2 is connected by lead with the second electronic pads B22, connects so described first electrode unit is formed with described second electrode unit.In addition, because circuit board B2 can be a two-sided circuit board, so first electrode unit and second electrode unit that electrically connect by circuit board B2, can utilize the contact design of circuit board B2, surface and first electrode unit and second electrode unit electrically connect, another surface then is provided with the electrical derivation contact with DSSC, in order to the electric connection of outside.In addition, the position of the circuit board B2 of present embodiment corresponds to the first dead zone E1 and the second dead zone E2, thereby convenient the electric connection.In addition, the width of the part of first conductive layer, the 305 contiguous first dead zone E1 can be big (as thick line part in graphic) than other parts, can promote electrical conductive performance whereby.
The above only is illustrative, and non-limiting.Anyly do not break away from spirit of the present invention and category, and to its equivalent modifications of carrying out or change, all should be included in the claim institute restricted portion.
Claims (11)
1. a DSSC is characterized in that, comprising:
One first electrically-conductive backing plate;
One dye coating has at least one dyestuff portion, and is arranged on described first electrically-conductive backing plate;
One first conductive layer, be arranged on described first electrically-conductive backing plate and be positioned at described dyestuff portion around, and form at least one hexagon; And
One second electrically-conductive backing plate is oppositely arranged with described first electrically-conductive backing plate.
2. DSSC according to claim 1 is characterized in that, hexagon of described dyestuff portion's formation.
3. DSSC according to claim 1 is characterized in that, described first conductive layer has a plurality of hexagons.
4. DSSC according to claim 2 is characterized in that, formed one of them the hexagon area of described first conductive layer, the hexagonal area that forms more than or equal to described dyestuff portion.
5. DSSC according to claim 1 is characterized in that, a spacing of described first conductive layer and described dyestuff portion is between 0.1mm to 50mm.
6. DSSC according to claim 1 is characterized in that, also comprises:
One insulating protective layer is arranged on described first conductive layer.
7. DSSC according to claim 6 is characterized in that, the material of described insulating protective layer comprises glass cement.
8. DSSC according to claim 6 is characterized in that, the material of described insulating protective layer comprises bismuth oxide.
9. DSSC according to claim 1 is characterized in that, also comprises:
One second conductive layer is arranged on described second electrically-conductive backing plate.
10. according to claim 1 or 9 described DSSC, it is characterized in that the live width of described first conductive layer or described second conductive layer is between 0.1mm to 30mm.
11. DSSC according to claim 9 is characterized in that, the setting of aliging with described second conductive layer of described first conductive layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210014695XA CN103208369A (en) | 2012-01-17 | 2012-01-17 | Dye-sensitized solar cell |
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| CN201210014695XA CN103208369A (en) | 2012-01-17 | 2012-01-17 | Dye-sensitized solar cell |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1846327A (en) * | 2003-11-25 | 2006-10-11 | 日本特殊陶业株式会社 | Dye-sensitized solar cell |
| US20100012182A1 (en) * | 2008-07-16 | 2010-01-21 | Oki Semiconductor Co., Ltd. | Dye sensitized solar cell and method of fabricating the same |
| CN102129911A (en) * | 2009-12-24 | 2011-07-20 | 乐金显示有限公司 | Dye-sensitized solar cell |
-
2012
- 2012-01-17 CN CN201210014695XA patent/CN103208369A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1846327A (en) * | 2003-11-25 | 2006-10-11 | 日本特殊陶业株式会社 | Dye-sensitized solar cell |
| US20100012182A1 (en) * | 2008-07-16 | 2010-01-21 | Oki Semiconductor Co., Ltd. | Dye sensitized solar cell and method of fabricating the same |
| CN102129911A (en) * | 2009-12-24 | 2011-07-20 | 乐金显示有限公司 | Dye-sensitized solar cell |
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Application publication date: 20130717 |