CN103199022A - Calibration method of prealignment machine - Google Patents
Calibration method of prealignment machine Download PDFInfo
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- CN103199022A CN103199022A CN 201210002104 CN201210002104A CN103199022A CN 103199022 A CN103199022 A CN 103199022A CN 201210002104 CN201210002104 CN 201210002104 CN 201210002104 A CN201210002104 A CN 201210002104A CN 103199022 A CN103199022 A CN 103199022A
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- prealignment machine
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Abstract
The invention discloses a calibration method of a prealignment machine. A wafer is placed on the prealignment machine through a manipulator. The confirmation of relative directions of the manipulator and the prealignment machine includes the following steps: the wafer is placed on the prealignment machine through the manipulator, and a circle center of the wafer is located at a first position point in a first coordinate system where the prealignment machine is located; the prealignment machine recognizes a coordinate of the first position point in the first coordinate system; the manipulator drives the wafer to move for a distance along the X axis direction of a second coordinate system where the manipulator is located, and the circle center of the wafer arrives at a second position point; the prealignment machine recognizes a coordinate of the second position point in the first coordinate system; an included angle between a connecting line of the first position point and the second position point, and the X axis of the first coordinate system is calculated, and the included angle is the relative direction of the first coordinate system and the second coordinate system; and the position of the wafer is regulated through the manipulator, and the wafer is pre-aligned.
Description
Technical field
The present invention relates to a kind of scaling method of prealignment machine, particularly a kind of definite prealignment machine and robot coordinate are the scaling method of relative position.
Background technology
Along with industrial expansion, a large amount of automation tools is introduced in the industrial production, for example in the assembling process of wafer, it at first is the breach of identification wafer, and prior art is to adopt vacuum adsorption type single shaft prealignment machine, single shaft prealignment machine all needs when using to finish prealignment to wafer (the identification wafer center of circle and breach or side cut position and make breach or cut edge towards a certain default direction) jointly with manipulator, and adopts the vacuum adsorption type manipulator mostly.After the prealignment machine identifies the wafer center of circle, should adjust wafer position by manipulator, make the rotating shaft of vacuum cup on the prealignment machine by the wafer center of circle.If do not know the relative position information (direction and distance) of prealignment machine and robot coordinate system this moment, then system can't it makes adjustment accurately to wafer to manipulator instruction indication, prealignment also can't be learnt the definite position of wafer on manipulator after finishing, and prealignment will lose meaning.
Summary of the invention
In view of above content, be necessary to provide a kind of convenience scaling method of prealignment machine accurately.
A kind of scaling method of prealignment machine, described scaling method comprises:
One manipulator is placed on a wafer on the one prealignment machine;
Determining of described manipulator and prealignment machine coordinate system relative direction comprises step:
The center of circle of described wafer is in the primary importance point in one first coordinate system at described prealignment machine place, described prealignment machine rotates a circle described wafer, and described prealignment machine identifies the coordinate of described primary importance point in described first coordinate system, is designated as (x1, y1)
Described manipulator orders about described wafer and moves the distance of certain-length along the X direction of one second coordinate system at described manipulator place, is designated as Δ X, and the center of circle of described wafer arrives second place point from described primary importance point,
Described prealignment machine identifies the coordinate of described second place point in described first coordinate system, be designated as (x2, y2),
Angle between the line of calculating primary importance point and second place point and the transverse axis of described first coordinate system, described angle is the relative direction of described first coordinate system and described second coordinate system, is designated as ∠ θ,
Described ∠ θ is the relative direction of described manipulator and prealignment machine coordinate system;
Described manipulator is adjusted wafer position, and wafer is carried out prealignment.
In one embodiment, described scaling method also comprises:
Determining of described manipulator and prealignment machine coordinate system relative position comprises step:
Described manipulator is placed on described wafer on the described prealignment machine, and the home position of described wafer is positioned at one the 4th location point of described first coordinate system,
Described prealignment machine identifies the 4-coordinate value of described the 4th location point in described first coordinate system,
Described manipulator orders about described wafer and rotates one first angle around the initial point of described second coordinate system, makes the center of circle of described wafer arrive one the 5th position in described first coordinate system,
Described prealignment machine is identified five coordinate figure of described the 5th position in described first coordinate system,
Described manipulator orders about described wafer and rotates one second angle around the initial point of described second coordinate system, makes the center of circle of described wafer arrive one the 6th position in described first coordinate system,
Described prealignment machine is identified six coordinate figure of described the 6th position in described first coordinate system,
Go out the coordinate of initial point in described first coordinate system of described second coordinate system by the coordinate Calculation of described fourth, fifth, six positions, obtain the distance between the initial point of the initial point of described second coordinate system and described first coordinate system,
Obtain the relative position of described manipulator and prealignment machine coordinate system.
In one embodiment, described manipulator orders about described wafer and rotates heptangle degree, anistree degree around the initial point of described second coordinate system ... the N angle, and described prealignment machine identifies seven coordinate figure, eight coordinate figure of home position in first coordinate system of described wafer ... the N coordinate figure;
Appoint and get described 4-coordinate value, the 5th coordinate figure ... the coordinate figure of three positions in the N coordinate figure;
Obtain the coordinate figure of initial point in first coordinate system of described prealignment machine of second coordinate system by circle approximating method.The coordinate figure of the initial point of second coordinate system in first coordinate system of described prealignment machine is the relative position of the coordinate system of described manipulator and described prealignment machine.
In one embodiment, described circle approximating method adopts least square method.
In one embodiment, the computing formula of described angle is ∠ θ=arctan (y2-y1)/(x2-x1).
In one embodiment, the method for calculating described angle also can be passed through following steps:
The center of circle of supposing described wafer is moved Δ X along the transverse axis of described first coordinate system and is arrived one the 3rd position apart from meeting;
Described prealignment machine is identified the coordinate of described the 3rd position in described first coordinate system, then the coordinate of described the 3rd position be (x1+ Δ X, y1);
Connect described primary importance point, described second place point and described the 3rd location point, forming one is the isosceles triangle of waist with Δ X, and the length between described primary importance point and the described second place point equals Δ X, be designated as b, described primary importance point equals Δ X with the length of described the 3rd location point, be designated as a, then described primary importance point is designated as c with the length of described the 3rd location point, then
The computing formula of described angle is ∠ θ=arccos (a
2+ b
2-c
2)/2ab.
Compared with prior art, in the scaling method of above-mentioned prealignment machine, can know relative direction, the positional information of knowing described prealignment machine and described robot coordinate system, make more accurate to the prealignment of wafer.
Description of drawings
Fig. 1 is the schematic diagram of scaling method one embodiment of prealignment machine of the present invention.
Fig. 2 be prealignment machine of the present invention scaling method one embodiment prealignment machine and the robot coordinate scaling method flow chart that is relative direction.
Fig. 3 be prealignment machine of the present invention scaling method one embodiment prealignment machine and the robot coordinate scaling method flow chart that is relative position.
The main element symbol description
| |
10 |
| The |
20 |
| Wafer | 30 |
Following embodiment will further specify the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
See also Fig. 1, in a preferred embodiments of the present invention, comprise a manipulator 10 and a prealignment machine 20.Described manipulator 10 and described prealignment machine 20 are in order to carry out prealignment to a wafer 30.
Described prealignment machine 20 is among the one first coordinate system xoy.Described manipulator 10 is among the one second coordinate system x ' o ' y ', and comprises a terminal E.Described wafer 30 has a center of circle, and is provided with a breach 31.
Described prealignment machine 20 is in order to the position in the center of circle of identifying described wafer 30.Described manipulator 10 is in order to grasp described wafer 30.Move described manipulator 10, can adjust the position of described wafer 30.
See also Fig. 2 and Fig. 3, the demarcation of prealignment device coordinate system relative position comprises that prealignment machine and robot coordinate are that the demarcation of relative direction and prealignment machine and robot coordinate are the demarcation of relative position.
The demarcation of described manipulator and prealignment machine coordinate system relative direction may further comprise the steps:
S11, manipulator 10 is placed on wafer 30 on the described prealignment machine 20;
S12, prealignment machine 20 rotate a circle wafer 30, and prealignment machine 20 identifies the primary importance C point of the center of circle in coordinate system xoy of described wafer 30, first coordinate of described C point in coordinate system xoy be designated as (x1, y1);
S13, manipulator 10 pick up described wafer 30 along x ' the direction of principal axis displacement Δ X of described coordinate system x ' o ' y ', and the terminal E of described manipulator 10 has moved Δ X apart from arriving the F point, and the center of circle of described wafer 30 arrives a second place A point from primary importance C point;
S14, prealignment machine 20 identify the second place A point of the center of circle in coordinate system xoy of described wafer 30, second coordinate of described A point in coordinate system xoy be designated as (x2, y2);
S15, the angle between the line that calculating A point and C are ordered and the x axle of coordinate system xoy.Angle between the line that A point and C are ordered and the x axle of coordinate system xoy is the angle of the coordinate system relative direction of described manipulator 10 and described prealignment machine 20.
In one embodiment, the method for calculating the angle between the x axle of line that A point and C order and coordinate system xoy can be:
The center of circle C point of supposing described wafer 30 arrives one the 3rd position B point along the mobile Δ X of the x axle of the coordinate system xoy of described prealignment machine 20 apart from meeting; Described prealignment machine 20 identifies the B point of the center of circle in coordinate system xoy of described wafer 30, then the coordinate of described B point in coordinate system xoy be (x1+ Δ X, y1).To constitute one be the isosceles triangle ACB of waist with Δ X for tie point C, A and B so.If the AC length of side is b, the AB length of side is c, and the BC length of side is a, a=b=Δ X then, and
Then ∠ ACB (∠ θ) is the angle of the coordinate system relative direction of described manipulator 10 and described prealignment machine 20.Known three sides of a triangle are long, and the angle of ∠ ACB can be tried to achieve by the cosine law, i.e. ∠ ACB=arccos (a
2+ b
2-c
2)/2ab.
In another embodiment, the method of the angle between the line that calculating is ordered with A point and C and the x axle of coordinate system xoy can be: be connected A point and C point, then the angle that the slope between the x axle of straight line AC and coordinate system xoy is corresponding is the angle of described manipulator 10 and the coordinate system relative direction of described prealignment machine 20.Slope k between the x axle of straight line AC and coordinate system xoy can get by formula k=(y2-y1)/(x2-x1), i.e. ∠ ACB=arctan (y2-y1)/(x2-x1).
Described manipulator and prealignment machine coordinate system relative position are demarcated and be may further comprise the steps:
S21, described manipulator 10 is placed on wafer 30 on the described prealignment machine 20, and home position is arranged in one the 4th position C0 point of coordinate system xoy;
Described the 4th position C0 point can be same position with primary importance C point;
S22, described prealignment machine 20 identify the 4-coordinate value of home position C0 in coordinate system xoy of described wafer 30;
S23, described manipulator 10 pick up described wafer 30 and rotate one first angle around the initial point o ' of described coordinate system x ' o ' y, make the center of circle of described wafer 30 arrive position C1 among the coordinate system xoy;
S24, one five coordinate figure of home position C1 in coordinate system xoy of the described wafer 30 of described prealignment machine 20 identifications;
S25, described manipulator 10 pick up described wafer 30 and rotate one second angle around the initial point o ' of described coordinate system x ' o ' y, and the center of circle of described wafer 30 arrives position C2 among the coordinate system xoy;
S26, described prealignment machine 20 identify one six coordinate figure of home position C2 in coordinate system xoy of described wafer 30;
S27, execution in step S23-S24 or S25-S26;
Described manipulator 10 is picked up described wafer 30 and is rotated a heptangle degree, anistree degree, the 9th angle around the initial point o ' of described coordinate system x ' o ' y ... N angle, described prealignment machine identify one seven coordinate figure, eight coordinate figure, nine coordinate figure of home position C2 in coordinate system xoy of described wafer 30 ... the N coordinate figure;
Above-mentioned N is natural number.By this step, can obtain the more multiposition point of the center of circle in the coordinate system xoy of described prealignment machine 20 of described wafer 30.
S28 appoints and gets 4-coordinate value, the 5th coordinate figure ... the coordinate figure of three positions in the N coordinate figure;
By the coordinate of initial point o ' in the described first coordinate system xoy of the second coordinate system x ' o ' y described above, can obtain the distance between the initial point o of the initial point o ' of the described second coordinate system x ' o ' y and the described first coordinate system xoy, be designated as r.
Described 4-coordinate value, the 5th coordinate figure ... N coordinate figure location point is on the circle in the center of circle at an initial point o ' with the coordinate system x ' o ' y of described manipulator 10.
S29 obtains the coordinate figure of o ' in the coordinate system xoy of described prealignment machine 20 by circle approximating method.The coordinate figure of o ' in the coordinate system xoy of described prealignment machine 20 is the relative position of the coordinate system of described manipulator 10 and described prealignment machine 20.Described circle approximating method can adopt least square method, makes the result more accurate.
The step that the step that described coordinate system relative direction is demarcated and coordinate system relative position are demarcated can be exchanged, and also can according to circumstances carry out separately.
Determining that prealignment machine and robot coordinate are under the situation of relative position and direction, described manipulator is adjusted wafer position, and wafer is carried out prealignment.
Claims (8)
1. the scaling method of a prealignment machine is characterized in that, described scaling method comprises:
One manipulator is placed on a wafer on the one prealignment machine;
Determining of described manipulator and prealignment machine coordinate system relative direction comprises step:
The center of circle of described wafer is in the primary importance point in one first coordinate system at described prealignment machine place, described prealignment machine rotates a circle described wafer, and described prealignment machine identifies the coordinate of described primary importance point in described first coordinate system, is designated as (x1, y1)
Described manipulator orders about described wafer and moves the distance of certain-length along the X direction of one second coordinate system at described manipulator place, is designated as Δ X, and the center of circle of described wafer arrives second place point from described primary importance point,
Described prealignment machine identifies the coordinate of described second place point in described first coordinate system, be designated as (x2, y2),
Angle between the line of calculating primary importance point and second place point and the transverse axis of described first coordinate system, described angle is the relative direction of described first coordinate system and described second coordinate system, is designated as ∠ θ,
Described ∠ θ is the relative direction of described manipulator and prealignment machine coordinate system;
Described manipulator is adjusted wafer position, and wafer is carried out prealignment.
2. the scaling method of prealignment machine as claimed in claim 1 is characterized in that, described scaling method also comprises:
Determining of described manipulator and prealignment machine coordinate system relative position comprises step:
Described manipulator is placed on described wafer on the described prealignment machine, and the home position of described wafer is positioned at one the 4th location point of described first coordinate system,
Described prealignment machine identifies the 4-coordinate value of described the 4th location point in described first coordinate system,
Described manipulator orders about described wafer and rotates one first angle around the initial point of described second coordinate system, makes the center of circle of described wafer arrive one the 5th position in described first coordinate system,
Described prealignment machine is identified five coordinate figure of described the 5th position in described first coordinate system,
Described manipulator orders about described wafer and rotates one second angle around the initial point of described second coordinate system, makes the center of circle of described wafer arrive one the 6th position in described first coordinate system,
Described prealignment machine is identified six coordinate figure of described the 6th position in described first coordinate system,
Go out the coordinate of initial point in described first coordinate system of described second coordinate system by the coordinate Calculation of described fourth, fifth, six positions, obtain the distance between the initial point of the initial point of described second coordinate system and described first coordinate system,
Obtain the relative position of described manipulator and prealignment machine coordinate system.
3. the scaling method of prealignment machine as claimed in claim 2 is characterized in that, is gone out the coordinate of initial point in described first coordinate system of described second coordinate system by the coordinate Calculation of described fourth, fifth, six positions.
4. the scaling method of prealignment machine as claimed in claim 2 is characterized in that, determining of described manipulator and prealignment machine coordinate system relative position also comprises step:
Described manipulator orders about described wafer and rotates heptangle degree, anistree degree around the initial point of described second coordinate system ... the N angle, and described prealignment machine identifies seven coordinate figure, eight coordinate figure of home position in first coordinate system of described wafer ... the N coordinate figure;
Appoint and get described 4-coordinate value, the 5th coordinate figure ... the coordinate figure of three positions in the N coordinate figure;
Obtain the coordinate figure of initial point in first coordinate system of described prealignment machine of second coordinate system by circle approximating method.The coordinate figure of the initial point of second coordinate system in first coordinate system of described prealignment machine is the relative position of the coordinate system of described manipulator and described prealignment machine.
5. the scaling method of prealignment machine as claimed in claim 4 is characterized in that, described circle approximating method adopts least square method.
6. the scaling method of prealignment machine as claimed in claim 1 is characterized in that, the method for calculating described angle is the slope between the transverse axis of the line that calculates primary importance point and second place point and described first coordinate system.
7. the scaling method of prealignment machine as claimed in claim 5 is characterized in that, the computing formula of described angle is ∠ θ=arctan (y2-y1)/(x2-x1).
8. the scaling method of prealignment machine as claimed in claim 1 is characterized in that, calculates the method for described angle and also can pass through following steps:
The center of circle of supposing described wafer is moved Δ X along the transverse axis of described first coordinate system and is arrived one the 3rd position apart from meeting;
Described prealignment machine is identified the coordinate of described the 3rd position in described first coordinate system, then the coordinate of described the 3rd position be (x1+ Δ X, y1);
Connect described primary importance point, described second place point and described the 3rd location point, forming one is the isosceles triangle of waist with Δ X, and the length between described primary importance point and the described second place point equals Δ X, be designated as b, described primary importance point equals Δ X with the length of described the 3rd location point, be designated as a, then described primary importance point is designated as c with the length of described the 3rd location point
The computing formula of described angle is ∠ θ=arccos (a
2+ b
2-c
2)/2ab.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210002104.7A CN103199022B (en) | 2012-01-05 | 2012-01-05 | Calibration method of prealignment machine |
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|---|---|---|---|
| CN201210002104.7A CN103199022B (en) | 2012-01-05 | 2012-01-05 | Calibration method of prealignment machine |
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| CN103199022A true CN103199022A (en) | 2013-07-10 |
| CN103199022B CN103199022B (en) | 2015-05-13 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105717395A (en) * | 2016-02-24 | 2016-06-29 | 深圳精智达技术股份有限公司 | Alignment method and device of product to be measured |
| CN110085534A (en) * | 2019-05-05 | 2019-08-02 | 北京华卓精科科技股份有限公司 | A kind of wafer alignment method and its prealignment mechanism, handling machinery arm |
| CN110091340A (en) * | 2019-05-07 | 2019-08-06 | 芯导精密(北京)设备有限公司 | A kind of wafer pick-and-place manipulator |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58120109A (en) * | 1982-01-12 | 1983-07-16 | Mitsubishi Electric Corp | Coordinate measuring system for numerically controlled machine tool |
| JPH08137528A (en) * | 1994-11-02 | 1996-05-31 | Yaskawa Electric Corp | Calibration method for robot and turn table |
| JP2005340315A (en) * | 2004-05-25 | 2005-12-08 | Nikon Corp | Alignment device, exposure apparatus, alignment method and exposure method, and device manufacturing method and (tool) reticle for calibration |
| US7433759B2 (en) * | 2004-07-22 | 2008-10-07 | Applied Materials, Inc. | Apparatus and methods for positioning wafers |
| US8185242B2 (en) * | 2008-05-07 | 2012-05-22 | Lam Research Corporation | Dynamic alignment of wafers using compensation values obtained through a series of wafer movements |
| US8457786B2 (en) * | 2008-11-25 | 2013-06-04 | Abb Technology Ltd | Method and an apparatus for calibration of an industrial robot system |
-
2012
- 2012-01-05 CN CN201210002104.7A patent/CN103199022B/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105717395A (en) * | 2016-02-24 | 2016-06-29 | 深圳精智达技术股份有限公司 | Alignment method and device of product to be measured |
| CN110085534A (en) * | 2019-05-05 | 2019-08-02 | 北京华卓精科科技股份有限公司 | A kind of wafer alignment method and its prealignment mechanism, handling machinery arm |
| CN110091340A (en) * | 2019-05-07 | 2019-08-06 | 芯导精密(北京)设备有限公司 | A kind of wafer pick-and-place manipulator |
| CN110091340B (en) * | 2019-05-07 | 2020-10-20 | 芯导精密(北京)设备有限公司 | Wafer picking and placing manipulator |
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| Publication number | Publication date |
|---|---|
| CN103199022B (en) | 2015-05-13 |
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