CN103198922B - A kind of comb electric capacity Precise Assembling Method based on bi-stable state compliant mechanism - Google Patents

A kind of comb electric capacity Precise Assembling Method based on bi-stable state compliant mechanism Download PDF

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CN103198922B
CN103198922B CN201310128735.8A CN201310128735A CN103198922B CN 103198922 B CN103198922 B CN 103198922B CN 201310128735 A CN201310128735 A CN 201310128735A CN 103198922 B CN103198922 B CN 103198922B
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compliant mechanism
comb
stable state
movable
polar plate
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CN103198922A (en
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何广平
赵全亮
狄杰建
袁俊杰
孙恺
赵雅彬
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North China University of Technology
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Abstract

梳齿状电容器是MEMS器件中常用的微致动器和微传感器的结构形式。梳齿状电容器插齿间隙通常只有几微米,其正负极板之间的间隙需要精密控制。本设计提出一种基于双稳态柔顺机构的梳齿电容精密装配方法,能够提高梳齿状电容器正负极板之间间隙的精密控制,从而使批量具有相同结构的MEMS器件具有一致的、可估计的电容值,提高静电MEMS器件批量制造时性能的一致性。Comb-tooth capacitors are commonly used microactuators and microsensors in MEMS devices. Comb-tooth-shaped capacitors usually only have a few microns between the teeth, and the gap between the positive and negative plates needs to be precisely controlled. This design proposes a comb-tooth capacitor precision assembly method based on the bistable compliant mechanism, which can improve the precise control of the gap between the positive and negative plates of the comb-shaped capacitor, so that the MEMS devices with the same structure in batches have a consistent and reliable Estimated capacitance values to improve consistency of performance when electrostatic MEMS devices are manufactured in batches.

Description

一种基于双稳态柔顺机构的梳齿电容精密装配方法A precision assembly method for comb capacitors based on bistable compliant mechanism

技术领域technical field

本发明涉及一种基于双稳态柔顺机构的梳齿电容精密装配方法,属于MEMS器件中的微致动器和微传感器技术领域。The invention relates to a comb-tooth capacitor precision assembly method based on a bistable compliant mechanism, and belongs to the technical field of microactuators and microsensors in MEMS devices.

背景技术Background technique

梳齿状电容器是MEMS器件中常用的微致动器和微传感器的结构形式。梳齿状电容器正负极板之间的间隙需要精密控制,才能使批量具有相同结构的MEMS器件具有一致的、可估计的电容值,从而提高静电MEMS器件批量制造时性能的一致性。但是梳齿状电容器插齿间隙通常只有几微米,给采用深层反应离子刻蚀制造工艺造成很大困难。Comb-tooth capacitors are commonly used microactuators and microsensors in MEMS devices. The gap between the positive and negative plates of the comb-tooth capacitor needs to be precisely controlled, so that MEMS devices with the same structure in batches can have consistent and estimable capacitance values, thereby improving the consistency of performance during batch manufacturing of electrostatic MEMS devices. However, the inter-tooth gap of the comb-shaped capacitor is usually only a few microns, which makes it very difficult to adopt a deep reactive ion etching manufacturing process.

发明内容Contents of the invention

针对梳齿状电容器正负极板之间的间隙需要精密控制的问题,本发明提出一种基于双稳态柔顺机构的梳齿电容精密装配方法,能够提高梳齿状电容器正负极板之间间隙的精密控制。Aiming at the problem that the gap between the positive and negative plates of a comb-toothed capacitor requires precise control, the present invention proposes a precision assembly method for a comb-toothed capacitor based on a bistable compliant mechanism, which can improve the gap between the positive and negative plates of a comb-toothed capacitor. Precise control of clearance.

为了实现上述目的,本发明采用如下技术方案。In order to achieve the above object, the present invention adopts the following technical solutions.

所述梳齿状电容器的固定梳齿和活动梳齿采用平面铺开制造,制造完成后,固定极板与活动极板之间具有一定的水平横向距离。The fixed combs and movable combs of the comb-shaped capacitor are manufactured by laying on a plane. After the manufacturing is completed, there is a certain horizontal distance between the fixed plate and the movable plate.

为实现固定梳齿与活定梳齿的交叉装配和精密定位,在活动极板后侧设计与之相连的双稳态柔顺机构。双稳态柔顺机构是一种具有两个静力学平衡位形的柔顺并联机构。利用双稳态柔顺机构的两位形平衡特征和柔顺运动能力,设计了一种进行微机械电子系统(MEMS)器件的片上装配方法。可用于多种需要精确定位和结构间隙控制的MEMS器件中。这种结构具有设计制造简单,结构刚度和力-变形分析方便的优点,适合于MEMS器件的批量制造。In order to realize the cross-assembly and precise positioning of the fixed comb teeth and movable fixed comb teeth, a bistable compliance mechanism connected to it is designed on the rear side of the movable plate. A bistable compliant mechanism is a compliant parallel mechanism with two static equilibrium configurations. Utilizing the bistable compliant mechanism's two-dimensional balance characteristics and compliant motion capability, an on-chip assembly method for micromechanical electronic systems (MEMS) devices is designed. It can be used in a variety of MEMS devices that require precise positioning and structural gap control. This structure has the advantages of simple design and manufacture, structural rigidity and force-deformation analysis, and is suitable for mass production of MEMS devices.

在双稳态柔顺机构的后侧同时设计电热柔顺致动器。电热柔顺制动是一种能输出相对较大输出力的微机械致动器。由于热量损耗的不确定性,电热微致动器的精确运动控制十分困难。在本设计中,只利用电热微致动器进行双稳态柔顺机构的平衡位形变换的驱动控制,活动极板的精密装配定位控制通过锁定块实现。An electrothermal compliance actuator is also designed on the rear side of the bistable compliance mechanism. Electrothermal compliance brake is a kind of micromechanical actuator that can output relatively large output force. Precise motion control of electrothermal microactuators is difficult due to the uncertainty of heat loss. In this design, only the electrothermal micro-actuator is used to drive and control the balance configuration transformation of the bistable compliance mechanism, and the precise assembly and positioning control of the movable plate is realized through the locking block.

附图说明Description of drawings

图1是梳齿装配前示意图。Figure 1 is a schematic diagram of the comb teeth before assembly.

所述图1中标号说明:1固定梳齿、2 活动梳齿、3 锁定块、4 弹性梁、5 双稳态柔顺机构、6 支撑块、7 电热驱动电极、8 电热柔顺机构微致动器。Explanation of the numbers in Figure 1: 1 fixed comb, 2 movable comb, 3 locking block, 4 elastic beam, 5 bistable compliance mechanism, 6 support block, 7 electrothermal driving electrode, 8 microactuator of electrothermal compliance mechanism .

图2是梳齿装配后示意图。Fig. 2 is a schematic diagram of the assembled comb.

图3是锁定块的工作原理图。Figure 3 is a working principle diagram of the locking block.

图4是双端支撑柔性双稳态屈梁示意图。Fig. 4 is a schematic diagram of a flexible bistable bending beam supported at both ends.

图5是电热柔顺机构微致动器的工作原理图。Fig. 5 is a schematic diagram of the working principle of the micro-actuator of the electrothermal compliance mechanism.

具体实施方式detailed description

如附图1所示,一种基于双稳态柔顺机构的梳齿电容精密装配方法,其特征在于,所述装置包含有:固定梳齿1、活动梳齿2、锁定块3、弹性梁4、双稳态柔顺机构5、支撑块6、电热驱动电极7、电热柔顺机构微致动器8。As shown in Figure 1, a comb-tooth capacitor precision assembly method based on a bistable compliant mechanism is characterized in that the device includes: fixed combs 1, movable combs 2, locking blocks 3, and elastic beams 4 , Bistable compliance mechanism 5, support block 6, electrothermal drive electrode 7, electrothermal compliance mechanism micro-actuator 8.

如附图1和附图2所示,分别为双稳态柔顺机构5装配完成前和装配完成后的两个静态平衡位形。由于双稳态柔顺机构5在其两个静态平衡位形都有一定的稳定性,当器件工作于振动环境时,活动极板的位置也不会发生变化,能实现稳定锁定。As shown in accompanying drawings 1 and 2, they are the two static equilibrium configurations of the bistable compliance mechanism 5 before and after assembly. Since the bistable compliance mechanism 5 has certain stability in its two static equilibrium configurations, when the device works in a vibrating environment, the position of the movable plate will not change, and stable locking can be realized.

如附图3所示,活动极板位置锁定块3的结构采用末端A处为V形收缩槽结构,B处为薄壁悬臂梁结构。当活动极板支架对锁定块3的A端斜面施加作用力F时,锁定块3的薄壁梁B将产生弯曲变形。当活动极板支架通过V形槽后,锁定块3薄壁梁B变形回复原位,锁定块的A端面顶在活动极板支架的后端面,使活动极板不能回复到原位,实现静电梳状插齿电极的交叉装配。锁定块3 A端V形槽斜面的倾角需要根据柔性梁B的弯曲刚度进行匹配设计。当柔性梁B的弯曲刚度较大时,设计A端斜面倾角为较小值;当柔性梁B的弯曲刚度较小时,设计A端斜面倾角为较大值,从而为活动极板位置的锁定提供更可靠的支撑。As shown in Figure 3, the structure of the movable plate position locking block 3 adopts a V-shaped contraction groove structure at the end A, and a thin-walled cantilever beam structure at B. When the active plate bracket exerts a force F on the inclined surface of the A end of the locking block 3, the thin-walled beam B of the locking block 3 will produce bending deformation . When the movable plate support passes through the V-shaped groove, the thin-walled beam B of the locking block 3 deforms and returns to its original position, and the A end face of the locking block is pushed against the rear end face of the movable plate support, so that the movable plate cannot return to the original position, and the electrostatic comb shape is realized. Cross-assembly of pinned electrodes. The inclination angle of the inclined surface of the V-shaped groove at the A end of the locking block 3 needs to be matched according to the bending stiffness of the flexible beam B. When the bending stiffness of the flexible beam B is relatively large, the inclination angle of the A-end is designed to be a small value; when the bending stiffness of the flexible beam B is small, the inclination angle of the A-end is designed to be a large value, thereby providing a guarantee for the locking of the movable plate position More reliable support.

如附图4所示,双稳态柔顺机构5的设计采用双端支撑柔性屈梁结构。在外力F的所用下柔顺机构的稳态位形可从图4(a)所示位置变为图4(b)所示位置。这种稳态位形的变化可用于MEMS器件内活动部件位置的调整和装配。As shown in Figure 4, the design of the bistable compliance mechanism 5 adopts a double-end support flexible flexion beam structure. Under the application of external force F, the steady-state configuration of the compliant mechanism can change from the position shown in Figure 4(a) to the position shown in Figure 4(b). This change in steady-state configuration can be used to adjust and assemble the position of moving parts in MEMS devices.

如附图5所示,采用电热柔顺机构微致动器8实现双稳态柔顺机构5稳态位形的驱动变换。电热柔顺机构微致动器8的电极两端施加电压时,柔顺梁中产生电流,由于柔顺梁具有一定的电阻,在通过电流后会产生热量。电阻发热将导致柔顺梁长度增加。由于电热柔顺机构采用V形梁对称结构,当柔顺梁的长度增加时,在两侧对称力作用下,柔性梁的中间支架将只产生水平横向位移。电热微致动器可产生相对较大的输出力,推动双稳态柔顺机构5产生位形的变换,从而实现静电插齿活动电极位置的控制。当活动电极支架通过如图3所示的V形槽后,锁定块3位置回复,实现活动极板位置的锁定。As shown in Fig. 5, the electrothermal compliance mechanism micro-actuator 8 is used to realize the drive conversion of the steady-state configuration of the bistable compliance mechanism 5. When a voltage is applied to both ends of the electrodes of the micro-actuator 8 of the electrothermal compliance mechanism, a current is generated in the compliance beam. Since the compliance beam has a certain resistance, heat will be generated after passing the current. Resistive heating will result in an increase in the length of the compliant beam. Since the electrothermal compliance mechanism adopts a V-shaped beam symmetrical structure, when the length of the compliance beam increases, under the action of symmetrical forces on both sides, the middle support of the flexible beam will only produce horizontal and lateral displacements . The electrothermal micro-actuator can generate a relatively large output force to push the bistable compliant mechanism 5 to change the configuration, thereby realizing the control of the position of the movable electrode of the electrostatic gear shaping. When the movable electrode bracket passes through the V-shaped groove as shown in FIG. 3 , the position of the locking block 3 is restored to realize the locking of the position of the movable electrode plate.

要使该片上装配机构正常工作,需要将电热柔顺机构的水平方向结构刚度设计为,将双稳态柔顺机构5的弯曲变形刚度设计为,将锁定块柔性梁的结构刚度设计为,且三个结构刚度满足关系To make the on-chip assembly mechanism work normally, the horizontal structural stiffness of the electrothermal compliance mechanism needs to be designed as , the bending deformation stiffness of the bistable compliant mechanism 5 is designed as , the structural stiffness of the locking block flexible beam is designed as , and the three structural stiffnesses satisfy the relationship .

Claims (4)

1. a comb electric capacity Precise Assembling Method based on bi-stable state compliant mechanism, this assembly method is to fixed fingers and activity Comb plane fanning assembles, and after having assembled, has certain horizontal cross distance between fixed polar plate and movable polar plate, and it is special Levy and be that the employing of this assembly method includes clamping block, spring beam, bi-stable state compliant mechanism, bracer, electrothermal drive electrode, electric heating Fixed fingers, movable comb are assembled by the assembling device of compliant mechanism micro-actuator;Electric heating compliant mechanism micro-cause during assembling Dynamic device promotes bi-stable state compliant mechanism to move, and bi-stable state compliant mechanism drives movable polar plate and the work being fixed on movable polar plate Dynamic comb moves to fixed fingers, and movable comb tooth pushes fixed fingers teeth groove, clamping block locking movable polar plate the most at last, it is achieved Gu Determine comb and the cross assembly of movable comb and precision positioning.
Comb electric capacity Precise Assembling Method based on bi-stable state compliant mechanism the most according to claim 1, it is characterised in that Bi-stable state compliant mechanism is that both-end supports flexibility girder construction in the wrong, is positioned on rear side of movable polar plate and is connected with movable polar plate;Electric heating Compliant mechanism micro-actuator is positioned on rear side of bi-stable state compliant mechanism, drives and controls the conversion of bi-stable state compliant mechanism equilibrium configuration.
Comb electric capacity Precise Assembling Method based on bi-stable state compliant mechanism the most according to claim 1, it is characterised in that Clamping block is made up of with flexible beam V-arrangement retraction slot structure end, and flexible beam is thin-walled cantilever beam structure, V-arrangement retraction slot inclined-plane Inclination angle matches with the bending stiffness of flexible beam.
Comb electric capacity Precise Assembling Method based on bi-stable state compliant mechanism the most according to claim 1, it is characterised in that The horizontal direction rigidity of structure of electric heating compliant mechanism is K1, the flexural deformation rigidity of bi-stable state compliant mechanism 5 is K2, clamping block is soft The rigidity of structure of property beam is K3, then K is met1>K2>2K3
CN201310128735.8A 2013-04-15 2013-04-15 A kind of comb electric capacity Precise Assembling Method based on bi-stable state compliant mechanism Expired - Fee Related CN103198922B (en)

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CN108226235B (en) * 2016-12-21 2020-12-15 中国矿业大学 A capacitive MEMS gas sensor
CN107907045B (en) * 2017-09-28 2019-09-13 东南大学 A Curvature Sensor with Interdigital Capacitive Structure
CN109990028B (en) * 2019-03-21 2020-08-18 西安交通大学 A constant force compliance mechanism

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