CN103197309A - Multiple-directivity high-frequency ultrasonic sensor - Google Patents
Multiple-directivity high-frequency ultrasonic sensor Download PDFInfo
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- CN103197309A CN103197309A CN2013101085996A CN201310108599A CN103197309A CN 103197309 A CN103197309 A CN 103197309A CN 2013101085996 A CN2013101085996 A CN 2013101085996A CN 201310108599 A CN201310108599 A CN 201310108599A CN 103197309 A CN103197309 A CN 103197309A
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Abstract
The invention relates to a sensor, in particular to a high-frequency ultrasonic sensor. The high-frequency ultrasonic sensor comprises a plurality of piezoelectric ceramic slices and a plurality of matching layers, wherein the number of the matching layers is equal to that of the piezoelectric ceramic slices, an upper surface conducting layer of each piezoelectric ceramic slice is bonded to a corresponding matching layer, each corresponding matching layer is bonded to a metal outer shell. A printed circuit board (PCB) is connected in the metal shell in an adhesive mode, and a positive electrode wiring terminal and a negative electrode wiring terminal are fixed on the PCB. The upper surface conducting layer of each piezoelectric ceramic slice is connected with the positive electrode wiring terminal, and the lower surface conducting layer of each piezoelectric ceramic slice is connected with the negative electrode wiring terminal. The multiple-directivity high-frequency ultrasonic sensor with the structure can detect in multiple directions without the need for a plurality of high-frequency ultrasonic sensors. Therefore, the multiple-directivity high-frequency ultrasonic sensor not only saves space for machinery equipment but also saves the cost.
Description
Technical field
The present invention relates to a kind of sensor, particularly a kind of high-frequency ultrasonic sensor.
Background technology
Ultrasonic sensor is the sensor that utilizes hyperacoustic characteristic to develop.Ultrasound wave is the mechanical wave that a kind of vibration frequency is higher than sound wave, is taken place under the excitation of voltage by the transducing wafer that vibration produces, and it has the frequency height, wavelength is short, the diffraction phenomenon is little, particularly good directionality, can become ray and characteristics such as direction propagation.
Just because of the ultrasonic sensor good directionality, can direction propagation characteristics, so general ultrasonic sensor all is unidirectional ultrasonic sensor.As shown in Figure 1, existing folk prescription comprises matching layer 1 to high-frequency ultrasonic sensor, and it is bonding with metal shell 5 then to be bonded with piezoelectric ceramic piece 4 on the described matching layer 1.Pcb board 3 is bonding with metal shell 5, and positive signal line 2 connects the positive terminal 8 of piezoelectric ceramic piece 4 and pcb board 3, and negative signal line 6 connects the negative terminals 7 of metal shell 5 and pcb board 3.Piezoelectric ceramic piece 4 is electrically connected with metal shell 5 with the bonding plane of matching layer 1, and the both sides of piezoelectric ceramic piece 4 are connected with positive terminal 8, negative terminals 7 respectively like this.Send and received ultrasonic signal by piezoelectric ceramic piece, thus the position of detection object.
High-frequency ultrasonic sensor generally is applied in fields such as industrial automation, intelligent robot.High-frequency ultrasonic sensor can only be to folk prescription to transmitting and receiving ultrasound wave, can only survey folk prescription to.Survey a plurality of directions if desired and just a plurality of high-frequency ultrasonic sensors need be set, increased cost so undoubtedly.In addition, ultrasonic sensor is integrated is a developing direction of ultrasonic sensor.
Summary of the invention
The technical issues that need to address of the present invention provide a kind of high-frequency ultrasonic sensor of multidirectional.
For solving above-mentioned technical matters, multidirectional high-frequency ultrasonic sensor of the present invention comprises a plurality of piezoelectric ceramic pieces and the matching layer that equates with piezoelectric ceramic piece quantity, the top surface conductive layers of each piezoelectric ceramic piece is bonded on the corresponding matching layer, and described matching layer is bonded on the metal shell; Be bonded with pcb board in the described metal shell, the positive and negative electrode terminals are fixedly arranged on the described pcb board; The top surface conductive layers of described each piezoelectric ceramic piece is connected with negative terminals; The lower surface conductive layer of each piezoelectric ceramic piece is connected with positive terminal.
Described piezoelectric ceramic piece is two, and described metal shell is that two cylindrical cases are formed by connecting, and described cylindrical case inside communicates, and described two cylindrical cases are one-body molded.
Described two matching layers are bonded in respectively on two cylindrical case end faces, form angle between described two cylindrical case end faces.
Described matching layer is surperficial vertical with the detection direction of corresponding piezoelectric ceramic piece with being connected of corresponding piezoelectric ceramic piece.
Described negative terminals is connected with metal shell, and the top surface conductive layers of described each piezoelectric ceramic piece is connected with metal shell.
After adopting said structure, multidirectional high frequency ultrasound sensor of the present invention is separately positioned on a plurality of piezoelectric ceramic pieces on the different matching layers, the upper and lower conductive layers of piezoelectric ceramic piece is the public both positive and negative polarity terminals that are connected respectively, do not need to use a plurality of high-frequency ultrasonic sensors just can survey a plurality of directions like this, can not only save the space for machinery and equipment like this, can save cost again.
Description of drawings
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Fig. 1 is the inner structure synoptic diagram of folk prescription in the background technology of the present invention to high-frequency ultrasonic sensor.
Fig. 2 is sectional structure synoptic diagram of the present invention.
Fig. 3 is the structural representation of piezoelectric ceramic piece of the present invention.
Fig. 4 is the plan structure synoptic diagram of metal shell of the present invention.
Among the figure: 1 is matching layer, and 2 is the positive signal line, and 3 is pcb board, and 4 is piezoelectric ceramic piece, and 5 is metal shell, and 6 is the negative signal line, and 7 is negative terminals, and 8 is positive terminal
101 is first matching layer, and 102 is second matching layer, and 301 is the lower surface conductive layer, and 302 is top surface conductive layers, and 303 is potsherd, and 401 is first piezoelectric ceramic piece, and 402 is second piezoelectric ceramic piece
Embodiment
As shown in Figure 2, multidirectional high frequency ultrasound sensor of the present invention comprises two piezoelectric ceramic pieces and the matching layer that equates with piezoelectric ceramic piece quantity, i.e. first piezoelectric ceramic piece 401 and second piezoelectric ceramic piece 402, first matching layer 101 and second matching layer 102.
As shown in Figure 3, piezoelectric ceramic piece of the present invention comprises middle potsherd 303 and the conductive layer that covers middle potsherd two surfaces about in the of 303, and top surface conductive layers 302 and lower surface conductive layer 301, top surface conductive layers 302 and lower surface conductive layer 301 are silver-plated conductive layer here.
As shown in Figure 4, metal shell of the present invention is formed by connecting by two cylindrical cases, and in order to make the integral body of metal shell 5 more firm, described two cylindrical cases are one-body molded.Described two cylindrical case inside are identical, as shown in Figure 2, are bonded with pcb board 3 in the inner identical zone of two cylindrical cases.
As shown in Figure 2, the top surface conductive layers of described first piezoelectric ceramic piece 401 is mutually bonding with first matching layer 101, the top surface conductive layers of described second piezoelectric ceramic piece 402 is mutually bonding with second matching layer 102, described first matching layer 101 and second matching layer 102 be bonded in respectively metal shell 5 about on the end face of two cylindrical cases, disconnect between described first matching layer 101 and second matching layer 102.Positive terminal 8 and negative terminals 7 are fixedly arranged on the described pcb board 3, and the top surface conductive layers of described first piezoelectric ceramic piece 401 and second piezoelectric ceramic piece 402 all is connected with negative terminals 7; The top surface conductive layers of first piezoelectric ceramic piece 401 and second piezoelectric ceramic piece 402 is connected with positive terminal 8 by positive signal line 2.Can between positive terminal 8 and negative terminals 7, feed signal like this first piezoelectric ceramic piece 401 and second piezoelectric ceramic piece 402 are worked simultaneously, can send and receive ultrasound wave to both direction and survey.Further, for the positive and negative electrode link that reduces metal shell 5 lead that is connected with piezoelectric ceramic piece upper and lower surface conductive layer, negative terminals 7 is connected with metal shell 5 by negative signal line 6, the piezoelectric ceramic piece upper surface is electrically connected with metal shell 5 with lead between the matching layer by being arranged on the piezoelectric ceramic piece top surface conductive layers then, the piezoelectric ceramic piece upper surface has reduced the use that connects lead just by metal shell 5 indirect being connected with negative terminals 7 like this.Two electric loops have so just been formed, positive terminal 8-positive signal line 2-piezoelectric ceramic piece 401-metal shell 5-negative signal line 6-negative terminals 7; Positive terminal 8-positive signal line 2-piezoelectric ceramic piece 402-metal shell 5-negative signal line 6-negative terminals 7.Take place for respectively two piezoelectric ceramic pieces and the reception signal by two electric loops, produce and receive ultrasound wave both direction is surveyed.
Further, though it is hyperacoustic to sending that each piezoelectric ceramic piece of ultrasonic sensor is folk prescription, but the ultrasound wave surface of emission of each piezoelectric ceramic piece is fan-shaped, in order to make adjacent piezoelectric ceramic piece ultrasound wave emitting area not produce common factor, form angle between the end face of described two cylindrical cases, because two matching layers are connected on the end face of two cylindrical cases, so form angle between described first matching layer 101 and second matching layer 102.Such angle structure with locate the structure of two matching layers at grade and compare the emitting area that can effectively avoid two piezoelectric ceramic pieces and intersect.
Further, in order to make the direction of the hyperacoustic transmit direction of each piezoelectric ceramic piece and required detection be consistent as far as possible, with described two matching layers and piezoelectric ceramic piece to be connected the surface vertical with the detection direction of each piezoelectric ceramic piece, namely first matching layer 101 and first piezoelectric ceramic piece 401 be connected surperficial vertical with the detection direction of first piezoelectric ceramic piece; Being connected of second matching layer 102 and second piezoelectric ceramic piece 402 is surperficial vertical with the detection direction of second piezoelectric ceramic piece, so just can guarantee that the detection direction of each piezoelectric ceramic piece and desired detection direction are consistent.
Certainly, the quantity of piezoelectric ceramic piece of the present invention and matching layer can be more than three or three, guarantee that each piezoelectric ceramic piece is corresponding with matching layer, the top surface conductive layers of each piezoelectric ceramic piece is connected with negative terminals, and the lower surface conductive layer of each piezoelectric ceramic piece is connected with positive terminal and gets final product.Though more than described the specific embodiment of the present invention, those of skill in the art in the art should be appreciated that these only illustrate, and can make numerous variations or modification to these embodiments, and not deviate from principle of the present invention and essence.Scope of the present invention is only limited by appended claims.
Claims (5)
1. multidirectional high frequency ultrasound sensor, it is characterized in that: comprise a plurality of piezoelectric ceramic pieces and the matching layer that equates with piezoelectric ceramic piece quantity, the top surface conductive layers of each piezoelectric ceramic piece is bonded on the corresponding matching layer, and described matching layer is bonded on the metal shell; Be bonded with pcb board in the described metal shell, the positive and negative electrode terminals are fixedly arranged on the described pcb board; The top surface conductive layers of described each piezoelectric ceramic piece is connected with negative terminals; The lower surface conductive layer of each piezoelectric ceramic piece is connected with positive terminal.
2. according to the described multidirectional high frequency ultrasound of claim 1 sensor, it is characterized in that: described piezoelectric ceramic piece is two, and described metal shell is that two cylindrical cases are formed by connecting, and described cylindrical case inside communicates, and described two cylindrical cases are one-body molded.
3. according to the described multidirectional high frequency ultrasound of claim 2 sensor, it is characterized in that: described two matching layers are bonded in respectively on two cylindrical case end faces, form angle between described two cylindrical case end faces.
4. according to the described multidirectional high frequency ultrasound of claim 3 sensor, it is characterized in that: described matching layer is surperficial vertical with the detection direction of corresponding piezoelectric ceramic piece with being connected of corresponding piezoelectric ceramic piece.
5. according to each described multidirectional high frequency ultrasound sensor in the claim 1 to 4, it is characterized in that: described negative terminals is connected with metal shell, and the top surface conductive layers of described each piezoelectric ceramic piece is connected with metal shell.
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| CN2013101085996A CN103197309A (en) | 2013-03-29 | 2013-03-29 | Multiple-directivity high-frequency ultrasonic sensor |
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| CN2013101085996A CN103197309A (en) | 2013-03-29 | 2013-03-29 | Multiple-directivity high-frequency ultrasonic sensor |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106914399A (en) * | 2017-02-24 | 2017-07-04 | 常州波速传感器有限公司 | Industry control ultrasonic probe and the method for improving industry control ultrasonic probe |
| CN108549072A (en) * | 2018-04-20 | 2018-09-18 | 广东奥迪威传感科技股份有限公司 | Full angle sensor and its manufacturing method |
| CN109547911A (en) * | 2018-12-05 | 2019-03-29 | 常州波速传感器有限公司 | Orient the ultrasonic wave mould group of sounding |
| CN114111927A (en) * | 2021-11-23 | 2022-03-01 | 成都汇通西电电子有限公司 | High-frequency ultrasonic sensor suitable for gas flow detection |
| CN114111928A (en) * | 2021-11-23 | 2022-03-01 | 成都汇通西电电子有限公司 | High-frequency ultrasonic sensor suitable for gas flow detection |
| CN115287932A (en) * | 2022-07-25 | 2022-11-04 | 永发（江苏）模塑包装科技有限公司 | Ultrasonic dewatering drying cylinder with novel super-energy-saving structure and process |
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| JP2001356113A (en) * | 2000-06-14 | 2001-12-26 | Toshiba Tungaloy Co Ltd | Ultrasonic sensor |
| CN2676313Y (en) * | 2003-01-13 | 2005-02-02 | 武汉大学 | Fusion type probe |
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| CN2918729Y (en) * | 2006-07-14 | 2007-07-04 | 中国科学院声学研究所 | Multiple-directional sensor measuring drill hole wall by ultrasonic |
| CN101612048A (en) * | 2008-06-27 | 2009-12-30 | 西门子公司 | A kind of ultrasound probe and ultrasonic scanning device |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106914399A (en) * | 2017-02-24 | 2017-07-04 | 常州波速传感器有限公司 | Industry control ultrasonic probe and the method for improving industry control ultrasonic probe |
| CN108549072A (en) * | 2018-04-20 | 2018-09-18 | 广东奥迪威传感科技股份有限公司 | Full angle sensor and its manufacturing method |
| CN108549072B (en) * | 2018-04-20 | 2023-06-23 | 广东奥迪威传感科技股份有限公司 | Full angle sensor and method of manufacturing the same |
| CN109547911A (en) * | 2018-12-05 | 2019-03-29 | 常州波速传感器有限公司 | Orient the ultrasonic wave mould group of sounding |
| CN114111927A (en) * | 2021-11-23 | 2022-03-01 | 成都汇通西电电子有限公司 | High-frequency ultrasonic sensor suitable for gas flow detection |
| CN114111928A (en) * | 2021-11-23 | 2022-03-01 | 成都汇通西电电子有限公司 | High-frequency ultrasonic sensor suitable for gas flow detection |
| CN114111928B (en) * | 2021-11-23 | 2022-11-01 | 成都汇通西电电子有限公司 | High-frequency ultrasonic sensor suitable for gas flow detection |
| CN115287932A (en) * | 2022-07-25 | 2022-11-04 | 永发（江苏）模塑包装科技有限公司 | Ultrasonic dewatering drying cylinder with novel super-energy-saving structure and process |
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Application publication date: 20130710 |