CN103197192B - Method for detecting short circuit and device - Google Patents
Method for detecting short circuit and device Download PDFInfo
- Publication number
- CN103197192B CN103197192B CN201310084324.3A CN201310084324A CN103197192B CN 103197192 B CN103197192 B CN 103197192B CN 201310084324 A CN201310084324 A CN 201310084324A CN 103197192 B CN103197192 B CN 103197192B
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- circuit
- transfer printing
- array base
- short
- base palte
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000010023 transfer printing Methods 0.000 claims abstract description 87
- 238000001514 detection method Methods 0.000 claims abstract description 47
- 238000004458 analytical method Methods 0.000 claims description 16
- 238000012546 transfer Methods 0.000 claims description 11
- 238000005286 illumination Methods 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000002184 metal Substances 0.000 description 32
- 230000007547 defect Effects 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Abstract
The invention discloses a kind of method for detecting short circuit and device, described method for detecting short circuit comprises the following steps: by exposure transfer printing, array basal plate circuit is carried out to transfer printing, form the circuit after transfer printing; Detect the off position in the circuit after transfer printing; Analyze the location of short circuit of array base palte circuit according to described off position. The present invention has realized short-circuit detecting in base plate line has been converted into the detection of opening circuit, thereby has reduced the short-circuit detecting difficulty of array base palte circuit, has improved production efficiency.
Description
Technical field
The present invention relates to technical field of liquid crystal display, particularly a kind of short-circuit detecting of array base palte circuitMethod and device.
Background technology
Along with the development of electronic technology, flat-panel display device has obtained development at full speed, as liquid crystal displayPart, plasma display device and OLED(OrganicLight-EmittingDiode, organic light emission twoUtmost point pipe) display device. In the middle of flat-panel display device, liquid crystal display device is because its weight is low, volumeLittle, low power consumption and other advantages, thus be widely used.
In prior art, the array base palte of liquid crystal display device is provided with metal wire, and this metal wire comprises numberAccording to line and gate line, comprise opening circuit and short-circuit test to metal wire at the processing procedure of array base palte. Wherein,The method that the short-circuit test of metal wire is adopted is conventionally that signal emission sensor is arranged to a strip metalOn one end of line, signal receiving sensor is arranged at the other end of this metal wire, receives by decision signalDetection signal that whether sensor receives signal emission sensor transmitting is as according to judging current detectionWhether metal wire there is open defect, if signal receiving sensor is not received signal, represents this metal wireBetween the metal wire being adjacent, exist and open circuit. And the detection of the circuit defect of metal wire is by automatic lightThe metal wire of learning scanner pair array substrate carries out optical detection, determines the location of short circuit of metal wire. Due toAutomated optical scanner is for adopting optical principle to scan, and therefore it can judge metal wire by accident in the time detectingLocation of short circuit, thus the production efficiency of array base palte affected.
Summary of the invention
Main purpose of the present invention is to provide a kind of method for detecting short circuit, is intended to reduce array base palte circuitShort-circuit detecting difficulty.
In order to realize goal of the invention, the invention provides a kind of method for detecting short circuit, this method for detecting short circuit bagDraw together following steps:
By exposure transfer printing, array basal plate circuit is carried out to transfer printing, form the circuit after transfer printing;
Detect the off position in the circuit after transfer printing;
Analyze the location of short circuit of array base palte circuit according to described off position.
Preferably, described step of array basal plate circuit being carried out to transfer printing by exposure transfer printing is specifically wrappedDraw together:
By exposure transfer printing, array base palte circuit is transferred on the flat board that scribbles photoconductive layer.
Preferably, the photoconductive layer part being irradiated by light on described flat board forms conductor wire.
Preferably, the described location of short circuit step according to off position analysis array base palte circuit is specially,Analyze two adjacent lines in the corresponding array base palte circuit of the circuit that opens circuit forming after transfer printing.
Preferably, the step of the off position in the circuit after described detection transfer printing specifically comprises:
Control interval is arranged at the signal transmitting being connected on the same circuit after transfer printing and with this line electricity and passesSensor and signal receiving sensor move perpendicular to described circuit;
Judging whether signal receiving sensor exists in mobile process does not receive signal emission sensorThe phenomenon of the detection signal of transmitting;
If so, judge after the transfer printing of current detection and exist and open circuit in circuit;
If not, judge after the transfer printing of current detection and do not exist and open circuit in circuit.
The present invention also provides a kind of short-circuit detecting device, and this short-circuit detecting device comprises:
Transfer printing module, for by exposure transfer printing, array basal plate circuit being carried out to transfer printing, forms transfer printingAfter circuit;
Detection module, for detection of the off position in the circuit after transfer printing;
Analysis module, for analyzing the location of short circuit of array base palte circuit according to described off position.
Preferably, described transfer printing module is for being transferred to array base palte circuit to scribble by exposure transfer printingOn the flat board of photoconductive layer.
Preferably, on described flat board, there is the conductor wire of the photoconductive layer part formation being irradiated by light.
Preferably, described analysis module is for analyzing the corresponding array base of the circuit that opens circuit forming after transfer printingTwo adjacent lines in printed line road.
Preferably, described analysis module comprises:
Signal emission sensor, for output detection signal to the circuit after transfer printing;
Signal receiving sensor, the detection signal of launching for receiving signal emission sensor;
Control module, was arranged at the same circuit after transfer printing and is electrically connected with this circuit for the control intervalThe described signal emission sensor and the signal receiving sensor that connect move perpendicular to described circuit;
Judging unit, judges whether signal receiving sensor exists in mobile process not receive signalThe phenomenon of the detection signal of emission sensor transmitting; If so, judge after the transfer printing of current detection in circuitExistence is opened circuit; If not, judge after the transfer printing of current detection and do not exist and open circuit in circuit.
The present invention carries out transfer printing by exposure transfer printing pair array base plate line, then detects the line after transfer printingOff position in road, the last location of short circuit corresponding according to off position analytic substrate. Thereby realizeShort-circuit detecting in array base palte circuit is converted into the detection of opening circuit, has therefore reduced the short of array base palte circuitRoad detection difficulty, has improved production efficiency.
Brief description of the drawings
Fig. 1 is the schematic flow sheet of method for detecting short circuit one embodiment of the present invention;
Fig. 2 is the structural representation of array base palte circuit;
Fig. 3 is the line construction schematic diagram on exposure transfer printing rear plate;
Fig. 4 is the schematic flow sheet of another embodiment of method for detecting short circuit of the present invention;
Fig. 5 is the structural representation of short-circuit detecting device one embodiment of the present invention;
Fig. 6 is the structural representation of detection module in Fig. 5.
Realization, functional characteristics and the advantage of the object of the invention, in connection with embodiment, are done further with reference to accompanying drawingExplanation.
Detailed description of the invention
Should be appreciated that specific embodiment described herein is only in order to explain the present invention, and be not used in limitDetermine the present invention.
With reference to Fig. 1, Fig. 1 is the schematic flow sheet of method for detecting short circuit one embodiment of the present invention. The present embodimentThe method for detecting short circuit providing comprises the following steps:
Step S10, carries out transfer printing by exposure transfer printing to array basal plate circuit, forms the line after transfer printingRoad;
In the present embodiment, can on a flat board, evenly smear one deck photoconductive layer, then by exposure transfer printingMethod is transferred to array base palte circuit on this flat board. Particularly, in exposure-processed process, on flat boardPhotoconductive layer will be formed conductor wire by the part of illumination, will not formed white space by the part of illumination. KnotClose with reference to shown in Fig. 2 and Fig. 3, Fig. 2 is the structural representation of array base palte circuit; Fig. 3 turns for exposingPrint the line construction schematic diagram on rear plate. As shown in the figure, array base palte circuit comprise metal wire A1, A2,A3, A4, A5 and A6, wherein between metal wire A3 and A4 by shorting stub A7 short circuit, useWhen exposure transfer printing pair array base plate line carries out transfer printing, the sky of optical conductive layer between every two metal lineWhite region will be by illumination, with the just right part of metal wire because light is blocked by metal wire not by illumination,Thereby make the photoelectric conductance layer on flat board after transfer printing, form the white space between every two metal lineCorresponding conducting wire B1～B5. Because the white space between metal wire A3 and A4 is divided by shorting stub A7Every, thereby the circuit B3 after transfer printing is disconnected at shorting stub A7 place.
Step S20, detects the off position in the circuit after transfer printing;
Step S30, according to the location of short circuit of off position analysis array base palte circuit.
By above-mentioned exposure transfer printing, after array base palte circuit is transferred on above-mentioned flat board, now can profitDetect the open defect of the circuit B1～B5 existence on flat board by the detection principle of the checkout equipment that opens circuit, soAccording to this open defect, residing position analysis obtains location of short circuit corresponding to array base palte circuit afterwards. This realityExecute in example, the location of short circuit of analyzing array base palte circuit according to off position forms after being specially and analyzing transfer printingThe corresponding array base palte circuit of the circuit that opens circuit in two adjacent lines. For example obtain after transfer printing when detectingCircuit B3 exists while opening circuit, analyze circuit B3 after this transfer printing corresponding be metal wire A3 and A4 itBetween white space, between metal wire A3 and A4, there is short circuit.
The present invention carries out transfer printing by exposure transfer printing pair array base plate line, then detects the line after transfer printingOff position in road, the last location of short circuit corresponding according to off position analytic substrate. Thereby realizeShort-circuit detecting in array base palte circuit is converted into the detection of opening circuit, has therefore reduced the short of array base palte circuitRoad detection difficulty, has improved production efficiency.
In conjunction with reference to shown in Fig. 4, Fig. 4 is the flow process signal of another embodiment of method for detecting short circuit of the present inventionFigure. Based on above-described embodiment, in the present embodiment, above-mentioned steps S20 specifically comprises:
Step S21, controls and is arranged on the two ends of the same circuit after transfer printing and is connected with this line electricitySignal emission sensor C and signal receiving sensor D move perpendicular to described circuit;
Step S22, judges in mobile process whether signal receiving sensor exists not receive signal and send outPenetrate the phenomenon of the detection signal of sensor emission; If perform step S23, otherwise execution step S24.
Step S23, exists and opens circuit in circuit after the transfer printing of judgement current detection;
Step S24, does not exist and opens circuit in circuit after the transfer printing of judgement current detection.
For example whether exist while opening circuit detecting the circuit B1～B5 of above-mentioned flat board, can first signal be launchedSensor C is placed in one end of circuit B1, signal receiving sensor D is placed in to the other end of circuit B1,Then simultaneously control signal emission sensor C and signal receiving sensor D perpendicular to circuit B1 to circuitB5 moves. Particularly, signal emission sensor C will launch a high level signal, and this high level signal willOutput is as for the circuit of this signal emission sensor C electrical connection, if now signal receiving sensor D receivesTo this high level signal, prove that the current circuit being electrically connected with signal emission sensor C is complete lineRoad; If now signal receiving sensor D does not receive high level signal, prove current and signal transmittingThere is open defect in the circuit of sensor C electrical connection, now will return to above-mentioned steps S30, according to flat boardOn the circuit B3 that opens circuit of existence analyze and obtain in corresponding array base palte circuit between metal wire A3 and A4There is circuit defect.
The present invention also provides a kind of short-circuit detecting device, for realizing said method, and shown in Fig. 5,Fig. 5 is the structural representation of short-circuit detecting device one embodiment of the present invention. The short circuit inspection that the present embodiment providesSurvey device comprises:
Transfer printing module 100, for array basal plate circuit being carried out to transfer printing by exposure transfer printing, formation turnsCircuit after seal;
In the present embodiment, can on a flat board, evenly smear one deck photoconductive layer, then by transfer printing module 100By exposure transfer printing, array base palte circuit is transferred on this flat board. Particularly, in exposure-processed processIn, the photoconductive layer on flat board will be formed conductor wire by the part of illumination, will not formed by the part of illuminationWhite space. In conjunction with reference to shown in Fig. 2 and Fig. 3, array base palte circuit comprise metal wire A1, A2,A3, A4, A5 and A6, wherein between metal wire A3 and A4 by shorting stub A7 short circuit, useWhen exposure transfer printing pair array base plate line carries out transfer printing, the sky of optical conductive layer between every two metal lineWhite region will be by illumination, with the just right part of metal wire because light is blocked by metal wire not by illumination,Thereby make the photoelectric conductance layer on flat board after transfer printing, form the white space between every two metal lineCorresponding conducting wire B1～B5. Because the white space between metal wire A3 and A4 is divided by shorting stub A7Every, thereby the circuit B7 after transfer printing is disconnected at shorting stub A7 place.
Detection module 200, for detection of the off position in the circuit after transfer printing;
Analysis module 300, for analyzing short circuit position corresponding to array base palte circuit according to described off positionPut.
In the present embodiment, when transfer printing module 100 is by exposure transfer printing, array base palte circuit is transferred toAfter on above-mentioned flat board, now can utilize the detection principle of the checkout equipment that opens circuit to detect by detection module 200The open defect that circuit B1～B5 on flat board exists, then exports the positional information of this open defect toAnalysis module 300, by analysis module 300, according to this open defect, residing position analysis obtains array base palteThe location of short circuit that circuit is corresponding. In the present embodiment, analysis module 300 is analyzed array base according to off positionThe location of short circuit on printed line road is specially analyzes the corresponding array base palte circuit of the circuit that opens circuit forming after transfer printingIn two adjacent lines. For example, when the circuit B3 after detection module 200 detects acquisition transfer printing exists and opens circuit,By analysis module 300 analyze circuit B3 after this transfer printing corresponding be between metal wire A3 and A4, between metal wire A3 and A4, there is short circuit in white space.
The present invention adopts exposure transfer printing pair array base plate line to carry out transfer printing by transfer printing module 100, soAfter detect the off position in the circuit after transfer printing by detection module 200, last root is by analysis module 300According to location of short circuit corresponding to off position analytic substrate. Thereby realize short circuit inspection in array base palte circuitSurvey is converted into the detection of opening circuit, and has therefore reduced the short-circuit detecting difficulty of array base palte circuit, has improved productionEfficiency.
In conjunction with reference to shown in Fig. 6, Fig. 6 is the structural representation of detection module in Fig. 5. Based on above-mentioned realityExecute example, in the present embodiment, above-mentioned detection module 200 comprises:
Signal emission sensor C, for output detection signal to the circuit after transfer printing;
Signal receiving sensor D, the detection signal of launching for receiving signal emission sensor C;
Control module 201, for control be arranged at respectively the two ends of the same circuit after transfer printing and with thisSignal emission sensor C and signal receiving sensor D that line electricity connects move perpendicular to described circuit;
Judging unit 202, judges whether signal receiving sensor D does not exist reception in mobile processThe phenomenon of the detection signal of launching to signal emission sensor C; If so, judge the transfer printing of current detectionIn rear circuit, exist and open circuit; If not, judge after the transfer printing of current detection and do not exist and open circuit in circuit.
For example whether exist while opening circuit detecting the circuit B1～B5 of above-mentioned flat board, can first signal be launchedSensor C is placed in one end of circuit B1, signal receiving sensor D is placed in to the other end of circuit B1,Then by control module 201 simultaneously control signal emission sensor C and signal receiving sensor D perpendicular toCircuit B1 moves to circuit B5. Particularly, signal emission sensor C will launch a high level signal,This high level signal is the circuit as for this signal emission sensor C electrical connection by output, if now signal connectsReceive sensor D and receive this high level signal, judging unit 202 will judge that current and signal transmitting passesThe circuit of sensor C electrical connection is complete circuit; If now signal receiving sensor D does not receive high electricityFlat signal, judging unit 202 will judge that the current circuit being electrically connected with signal emission sensor C existsOpen defect, now analyzes the circuit B3 being opened circuit according to the existence on flat board by above-mentioned analysis module 300Obtain in corresponding array base palte circuit and have circuit defect between metal wire A3 and A4.
These are only the preferred embodiments of the present invention, not thereby limit the scope of the claims of the present invention, everyUtilize equivalent structure or the conversion of equivalent flow process that description of the present invention and accompanying drawing content do, or directly orConnect and be used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. a method for detecting short circuit, is characterized in that, comprises the following steps:
By exposure transfer printing, array basal plate circuit is carried out to transfer printing, form the circuit after transfer printing;
Detect the off position in the circuit after transfer printing;
Analyze the location of short circuit of array base palte circuit according to described off position;
Wherein, describedly array basal plate circuit is carried out to transfer printing specifically comprise by exposure transfer printing: pass throughExposure transfer printing array base palte circuit is transferred on the flat board that scribbles photoconductive layer, on described flat board by lightThe photoconductive layer part of irradiating forms conductor wire, will not formed white space by the part of illumination.
2. method for detecting short circuit as claimed in claim 1, is characterized in that, described according to off positionThe location of short circuit step of analyzing array base palte circuit is specially, and analyzes the circuit institute that opens circuit forming after transfer printing rightTwo adjacent lines in the array base palte circuit of answering.
3. method for detecting short circuit as claimed in claim 1 or 2, is characterized in that, described detection transfer printingAfter circuit in the step of off position specifically comprise:
Control interval is arranged at the signal transmitting being connected on the same circuit after transfer printing and with this line electricity and passesSensor and signal receiving sensor move perpendicular to described circuit;
Judging whether signal receiving sensor exists in mobile process does not receive signal emission sensorThe phenomenon of the detection signal of transmitting;
If so, judge after the transfer printing of current detection and exist and open circuit in circuit;
If not, judge after the transfer printing of current detection and do not exist and open circuit in circuit.
4. a short-circuit detecting device, is characterized in that, comprising:
Transfer printing module, for by exposure transfer printing, array basal plate circuit being carried out to transfer printing, forms transfer printingAfter circuit;
Detection module, for detection of the off position in the circuit after transfer printing;
Analysis module, for analyzing the location of short circuit of array base palte circuit according to described off position;
Wherein, described transfer printing module specifically for: by exposure transfer printing array base palte circuit is transferred toScribble on the flat board of photoconductive layer, the photoconductive layer part being irradiated by light on described flat board forms conductor wire,Will do not formed white space by the part of illumination.
5. short-circuit detecting device as claimed in claim 4, is characterized in that, described analysis module is used forAnalyze two adjacent lines in the corresponding array base palte circuit of the circuit that opens circuit forming after transfer printing.
6. the short-circuit detecting device as described in claim 4 or 5, is characterized in that, described analysis moduleComprise:
Signal emission sensor, for output detection signal to the circuit after transfer printing;
Signal receiving sensor, the detection signal of launching for receiving signal emission sensor;
Control module, was arranged at the same circuit after transfer printing and is electrically connected with this circuit for the control intervalThe described signal emission sensor and the signal receiving sensor that connect move perpendicular to described circuit;
Judging unit, judges whether signal receiving sensor exists in mobile process not receive signalThe phenomenon of the detection signal of emission sensor transmitting; If so, judge after the transfer printing of current detection in circuitExistence is opened circuit; If not, judge after the transfer printing of current detection and do not exist and open circuit in circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310084324.3A CN103197192B (en) | 2013-03-15 | 2013-03-15 | Method for detecting short circuit and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310084324.3A CN103197192B (en) | 2013-03-15 | 2013-03-15 | Method for detecting short circuit and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103197192A CN103197192A (en) | 2013-07-10 |
| CN103197192B true CN103197192B (en) | 2016-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310084324.3A Expired - Fee Related CN103197192B (en) | 2013-03-15 | 2013-03-15 | Method for detecting short circuit and device |
Country Status (1)
| Country | Link |
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| CN (1) | CN103197192B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1720458A (en) * | 2002-11-30 | 2006-01-11 | Oht株式会社 | Circuit pattern inspection device and circuit pattern inspection method |
| CN101004434A (en) * | 2006-01-17 | 2007-07-25 | 厦门火炬福大显示技术有限公司 | Method and device for detecting electrodes of flat panel display parts |
| CN201130224Y (en) * | 2007-10-23 | 2008-10-08 | 南京华显高科有限公司 | Short and break tester for plasma display panel electrode |
| TW201142317A (en) * | 2010-05-20 | 2011-12-01 | Wistron Corp | Printed circuit board and a circuit detection method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006300665A (en) * | 2005-04-19 | 2006-11-02 | Oht Inc | Inspection device, and conductive pattern inspection method |
-
2013
- 2013-03-15 CN CN201310084324.3A patent/CN103197192B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1720458A (en) * | 2002-11-30 | 2006-01-11 | Oht株式会社 | Circuit pattern inspection device and circuit pattern inspection method |
| CN101004434A (en) * | 2006-01-17 | 2007-07-25 | 厦门火炬福大显示技术有限公司 | Method and device for detecting electrodes of flat panel display parts |
| CN201130224Y (en) * | 2007-10-23 | 2008-10-08 | 南京华显高科有限公司 | Short and break tester for plasma display panel electrode |
| TW201142317A (en) * | 2010-05-20 | 2011-12-01 | Wistron Corp | Printed circuit board and a circuit detection method |
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| CN103197192A (en) | 2013-07-10 |
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Granted publication date: 20160518 |