CN103184495B - Electroplating technology and apply this technique prepare plated item - Google Patents
Electroplating technology and apply this technique prepare plated item Download PDFInfo
- Publication number
- CN103184495B CN103184495B CN201110444184.7A CN201110444184A CN103184495B CN 103184495 B CN103184495 B CN 103184495B CN 201110444184 A CN201110444184 A CN 201110444184A CN 103184495 B CN103184495 B CN 103184495B
- Authority
- CN
- China
- Prior art keywords
- paint
- skin
- metal powder
- binder course
- electroplating technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 27
- 238000005516 engineering process Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title abstract description 15
- 239000003973 paint Substances 0.000 claims abstract description 58
- 239000000843 powder Substances 0.000 claims abstract description 40
- 239000004033 plastic Substances 0.000 claims abstract description 38
- 229920003023 plastic Polymers 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 37
- 239000002184 metal Substances 0.000 claims abstract description 37
- 210000003491 Skin Anatomy 0.000 claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000011230 binding agent Substances 0.000 claims abstract description 26
- 238000000576 coating method Methods 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000007747 plating Methods 0.000 claims abstract description 11
- 238000005507 spraying Methods 0.000 claims abstract description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 230000004913 activation Effects 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 238000005755 formation reaction Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000000016 photochemical curing Methods 0.000 claims 2
- 238000007788 roughening Methods 0.000 abstract description 5
- 238000001994 activation Methods 0.000 abstract description 3
- 229920000122 Acrylonitrile butadiene styrene Polymers 0.000 description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000011528 polyamide (building material) Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N Acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 230000003628 erosive Effects 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
A kind of electroplating technology, it comprises the steps: to provide plastic substrate；Surface spraying at this plastic substrate forms skin of paint, containing metal powder and paint in this skin of paint；Skin of paint is carried out laser radiation treatment, makes skin of paint be transformed into binder course；Carry out plating on the surface of this binder course and form electrodeposited coating.This electroplating technology is simple, decreases roughening and the activation process of conventional plating process, and the material of plastic substrate is not particularly limited.Additionally, the present invention also provides for plated item obtained by a kind of above-mentioned technique.
Description
Technical field
The present invention relates to a kind of electroplating technology and apply the plated item obtained by this electroplating technology.
Background technology
The electroplating technology on common plastics surface generally includes following steps: uses acidity and/or alkaline solution that plastic substrate is stung erosion, makes surface of plastic matrix be roughened；It is then used by the method for the electrochemistry surface of plastic matrix after roughening and deposits a layers of copper；Finally carry out electroplating various metal level on layers of copper surface again.But, this kind of processing step is loaded down with trivial details, is unfavorable for simplification and the reduction of production cost produced.
Existing a kind of plastic surface galvanizing technique be use laser direct forming (laser direct sturcture,
LDS) technology.The plastic substrate of this kind of LDS electroplating technology use is a kind of special resin material, containing metal in this resin material.The flow process of LDS electroplating technology is: first uses laser to process the plastic substrate of this special substance, makes the exposed metal/bare metal in plastic substrate and activate；Surface of plastic matrix after laser treatment carries out electroplated metal layer the most again.But, this kind of technique can only be electroplated at special surface of plastic matrix, limits the further application of LDS electroplating technology.
Summary of the invention
In view of this, it is necessary to provide a kind of technique simple, and do not limit the electroplating technology of plastic substrate material.
It addition, there is a need to provide a kind of by the plated item obtained by above-mentioned coating process.
A kind of electroplating technology, it comprises the steps:
Plastic substrate is provided；
Surface spraying at this plastic substrate forms skin of paint, containing metal powder and paint in this skin of paint；
Skin of paint is carried out laser radiation treatment, makes exposed formation one binder course of the metal powder in skin of paint；
Carry out plating on the surface of this binder course and form electrodeposited coating.
A kind of plated item, it includes plastic substrate, is formed at the binder course of surface of plastic matrix, is formed at the electrodeposited coating on binder course surface, this binder course is to be formed through laser irradiation, containing metal powder and paint in this binder course by a skin of paint containing metal powder and paint.
Electroplating technology of the present invention can directly be electroplated on its surface after laser activation processes at a kind of skin of paint containing metal powder of surface spraying of plastic substrate, this skin of paint；This electroplating technology is simple, decreases roughening and the activation process of conventional plating process, and the material of plastic substrate is not particularly limited.The electrodeposited coating of the plated item obtained by this electroplating technology is firmly combined with plastic substrate.
Accompanying drawing explanation
Fig. 1 is the sectional view of the plated item of a preferred embodiment of the present invention.
Main element symbol description
| Plated item | 10 |
| Plastic substrate | 11 |
| Binder course | 13 |
| Electrodeposited coating | 15 |
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Referring to Fig. 1, the present invention one better embodiment prepares the electroplating technology of plated item 10, and it comprises the steps:
(1) plastic substrate 11 is provided.The material of this plastic substrate 11 is preferably Merlon (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polyamide (PA) or the blend of PC Yu ABS, but is not limited to above-mentioned several plastic material.
(2) surface at this plastic substrate 11 forms a skin of paint (not shown), and the mode of spraying can be used to form described skin of paint.Containing metal powder and paint in this skin of paint, this metal powder can be aluminium powder, palladium powder or nikel powder, and the particle diameter of metal powder can be 0.05-0.5 m.This paint can be ultraviolet light cured paint or heat cure paint, preferably ultraviolet light cured paint.Heat cure paint can be PU paint.The weight/mass percentage composition of the metal powder contained in this paint is 5%-15%.The thickness of this skin of paint is 8-12 m.
(3) using laser that skin of paint is carried out radiation treatment, make skin of paint be transformed into a binder course 13, exposure time is usually no more than 30 seconds.As long as strict restriction the such as the light source category of laser and technological parameter is reached following effect.After laser radiation treatment, the paint composition on skin of paint surface can be removed and make metal powder exposed, metal powder activation can be made simultaneously to make itself and follow-up electrodeposited coating 15 adhesion-tight.This step can reach and is similar to the roughening of ordinary plating process, the effect of activated plastics matrix 11.The thickness of this binder course 13 is 1-5 m.
It should be understood that this radiation treatment can be local irradiation, the region the most optionally need to electroplated on skin of paint surface carries out laser irradiation.And with the electrodeposited coating that re-plating after this kind of method irradiation is prepared, there is boundary line clearly.
(4) carry out plating on the surface of this binder course 13 and form electrodeposited coating 15, prepare described plated item 10.The material of this electrodeposited coating 15 is selected from the one in the metals such as copper, chromium and nickel.This electrodeposited coating 15 can be securely joined with in the surface of binder course 13.
It should be understood that this electrodeposited coating 15 can be the multi-layer plating layer repeatedly electroplating formation.
The electroplating technology of the present invention is not limited by plastic material, may be implemented in the metal plating on various plastic substrate 11 surface, and technique is simple.
Referring to Fig. 1, the plated item 10 of the present invention one better embodiment, it includes a plastic substrate 11, is formed at the binder course 13 on plastic substrate 11 surface, is formed at the electrodeposited coating 15 on binder course 13 surface.This binder course 13 is that the skin of paint containing metal powder and paint is formed through laser irradiation, and there is exposed metal powder on this binder course 13 surface.The thickness of this binder course 13 is 1-5 m.This metal powder can be aluminium powder, palladium powder or nikel powder, and the particle diameter of metal powder can be 0.05-0.5 m.This paint can be ultraviolet light cured paint or heat cure paint, preferably ultraviolet light cured paint.The weight/mass percentage composition of the metal powder contained in this skin of paint is 5%-15%.The material of this electrodeposited coating 15 is selected from the one in the metals such as copper, chromium and nickel.
Electroplating technology of the present invention can directly be electroplated on its surface after laser activation processes at a kind of skin of paint containing metal powder of surface spraying of plastic substrate 11, this skin of paint；This electroplating technology is simple, decreases roughening and the activation process of conventional plating process, and not limits the material of plastic substrate 11.It is firmly combined with plastic substrate 11 with the electrodeposited coating 15 of the plated item 10 obtained by this electroplating technology.
Claims (11)
1. an electroplating technology, it comprises the steps:
Plastic substrate is provided；
Surface spraying at this plastic substrate forms skin of paint, containing metal powder in this skin of paint
And paint, the weight/mass percentage composition of the metal powder contained in this skin of paint is 5%-15%；
Skin of paint is carried out laser radiation treatment, makes the exposed formation of the metal powder in skin of paint one
Binder course；
Carry out plating on the surface of this binder course and form electrodeposited coating.
2. electroplating technology as claimed in claim 1, it is characterised in that: this metal powder is aluminum
Powder, palladium powder or nikel powder.
3. electroplating technology as claimed in claim 2, it is characterised in that: the grain of this metal powder
Footpath is 0.05-0.5 μm.
4. electroplating technology as claimed in claim 1, it is characterised in that: this paint is ultraviolet
Photocuring paint or heat cure paint.
5. electroplating technology as claimed in claim 1, it is characterised in that: the thickness of this skin of paint
Degree is 8-12 μm.
6. a plated item, it includes plastic substrate, it is characterised in that: this plated item also wraps
Include the binder course being formed at surface of plastic matrix, be formed at the electrodeposited coating on binder course surface, should
Binder course is to be formed through laser irradiation by a skin of paint containing metal powder and paint, should
Containing metal powder and paint in binder course, the percent mass of the metal powder contained in this skin of paint
Content is 5%-15%.
7. plated item as claimed in claim 6, it is characterised in that: the thickness of this binder course
For 1-5 μm.
8. plated item as claimed in claim 6, it is characterised in that: this metal powder be aluminium powder,
Palladium powder or nikel powder, the particle diameter of metal powder is 0.05-0.5 μm.
9. plated item as claimed in claim 6, it is characterised in that: the material of this electrodeposited coating
One in copper, chromium and nickel.
10. plated item as claimed in claim 6, it is characterised in that: this paint is ultraviolet
Photocuring paint or heat cure paint.
11. plated items as claimed in claim 6, it is characterised in that: the table of this binder course
Face is exposed the metal powder after laser activation.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110444184.7A CN103184495B (en) | 2011-12-27 | Electroplating technology and apply this technique prepare plated item | |
| TW100149949A TWI553169B (en) | 2011-12-27 | 2011-12-30 | Plating method and plating article made by smae |
| US13/490,764 US20130161195A1 (en) | 2011-12-27 | 2012-06-07 | Electroplating method and article made by same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110444184.7A CN103184495B (en) | 2011-12-27 | Electroplating technology and apply this technique prepare plated item |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103184495A CN103184495A (en) | 2013-07-03 |
| CN103184495B true CN103184495B (en) | 2016-12-14 |
Family
ID=
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1470677A (en) * | 2002-07-26 | 2004-01-28 | 铭恩彩镀股份有限公司 | Plastic surface laser-carving and electroplating method |
| US7815777B2 (en) * | 2003-09-04 | 2010-10-19 | Atotech Deutschland Gmbh | Power supply device in a device for electrochemical treatment |
| CN102002712A (en) * | 2009-09-03 | 2011-04-06 | 深圳富泰宏精密工业有限公司 | Electronic device shell and manufacturing method thereof |
| CN102071412A (en) * | 2010-04-14 | 2011-05-25 | 比亚迪股份有限公司 | Plastic product and preparation method thereof |
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1470677A (en) * | 2002-07-26 | 2004-01-28 | 铭恩彩镀股份有限公司 | Plastic surface laser-carving and electroplating method |
| US7815777B2 (en) * | 2003-09-04 | 2010-10-19 | Atotech Deutschland Gmbh | Power supply device in a device for electrochemical treatment |
| CN102002712A (en) * | 2009-09-03 | 2011-04-06 | 深圳富泰宏精密工业有限公司 | Electronic device shell and manufacturing method thereof |
| CN102071412A (en) * | 2010-04-14 | 2011-05-25 | 比亚迪股份有限公司 | Plastic product and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2011107611A (en) | CHEMICAL METAL COATINGS | |
| KR101579239B1 (en) | Lamination and method for manufacturing lamination | |
| CN106868478B (en) | Environmentally friendly rugged catalyst for the electrodeless metal of printed circuit board and through-hole | |
| US20100068465A1 (en) | Housing and method for making the housing | |
| MY173170A (en) | Alloy coated workpieces | |
| Schaubroeck et al. | Surface modification of an epoxy resin with polyamines and polydopamine: Adhesion toward electroless deposited copper | |
| CN204608194U (en) | A kind of electroplanting device | |
| WO2020052239A1 (en) | Electromagnetic shielding film preparation method | |
| CN103184495B (en) | Electroplating technology and apply this technique prepare plated item | |
| DE602008005184D1 (en) | METHOD FOR PRODUCING A COATING OF YELLOW GOLD ALLOYING BY GALVANIZATION WITHOUT USE OF TOXIC METALS OR METALLOIDS | |
| TWI583268B (en) | Supplied with copper foil, copper laminates and | |
| WO2006138033A3 (en) | Substrate with alloy finish and method of making | |
| US20090255823A1 (en) | Method for electroplating a plastic substrate | |
| CN106868479B (en) | Environmentally friendly rugged catalyst for the electrodeless metal of printed circuit board and through-hole | |
| JP2012015448A (en) | Flexible copper clad laminate and manufacturing method of the same, and circuit board using the same | |
| CN107130273A (en) | A kind of low toxicity plastic structural part electroplating technology | |
| TWI553169B (en) | Plating method and plating article made by smae | |
| JP3925724B2 (en) | Surface treatment method for non-conductive materials | |
| CN103866299A (en) | Pretreatment process of surface chemical plating of resin matrix composite material | |
| CN110192268A (en) | Method of the plating metal substrate to obtain required surface roughness | |
| JP2010280416A (en) | Method for manufacturing conductive fastening band | |
| KR102156316B1 (en) | Surface treatment method for top-cab of sylindrical secondary battery | |
| Grech et al. | Coating of diamond particles for production of metal matrix composites | |
| JP2006523773A (en) | Use of articles as electronic structural components | |
| KR101332301B1 (en) | Plating method using the ni-free three element alloys plating and tri-valent chromium plating |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161214 Termination date: 20191227 |