CN103177917B - A kind of magnetron and apply the magnetron sputtering apparatus of this magnetron - Google Patents

A kind of magnetron and apply the magnetron sputtering apparatus of this magnetron Download PDF

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CN103177917B
CN103177917B CN201110433434.7A CN201110433434A CN103177917B CN 103177917 B CN103177917 B CN 103177917B CN 201110433434 A CN201110433434 A CN 201110433434A CN 103177917 B CN103177917 B CN 103177917B
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magnetic pole
magnetron
internal magnetic
sub
outer magnetic
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CN103177917A (en
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杨玉杰
耿波
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Beijing North Microelectronics Co Ltd
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Beijing North Microelectronics Co Ltd
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Abstract

The invention provides a kind of magnetron and apply the magnetron sputtering apparatus of this magnetron, comprise opposite polarity outer magnetic pole and internal magnetic pole, on the cross section of the center line perpendicular to described outer magnetic pole, described outer magnetic pole is closed annular, described internal magnetic pole be arranged on the outer magnetic pole of described annular around cavity in, wherein, described internal magnetic pole comprises more than three sub-internal magnetic poles, described more than three sub-internal magnetic poles are arranged around the center line of described outer magnetic pole, thus are formed and described sub-internal magnetic pole quantity passage accordingly between described outer magnetic pole and internal magnetic pole.This magnetron can improve the uniformity of target erosion, thus improves the utilance of target.

Description

A kind of magnetron and apply the magnetron sputtering apparatus of this magnetron
Technical field
The present invention relates to microelectronic processing technique field, particularly, relate to a kind of magnetron and apply the magnetron sputtering apparatus of this magnetron.
Background technology
Magnetic control sputtering device is collided by the particle in plasma and target with the device of the deposition of material will sputtered from target on workpiece to be machined.In actual applications, in order to the utilance of the efficiency and target that improve sputtering, magnetron is provided with at the back of target, the magnetic field utilizing magnetron to produce extends the movement locus of electronics, the probability that increase electronics and process gas (as argon gas) collide, thus improve the density of plasma, and then improve the efficiency of sputtering and the utilance of target.
Fig. 1 a is the longitudinal section view of existing a kind of magnetron.Refer to Fig. 1 a, this magnetron comprises opposite polarity outer magnetic pole 1 and internal magnetic pole 2, and the magnetic field formed by outer magnetic pole 1 and internal magnetic pole 2 can by plasma constraint at target material surface.The shape of interval region 3 on the radial section of magnetron formed between outer magnetic pole 1 and internal magnetic pole 2 is closed kidney shape track.During use, magnetron rotates around pivot 4, and scans whole target material surface.Fig. 1 b utilizes the magnetron in Fig. 1 a to carry out the corrosion curve after experimental simulation scanning to target.Wherein, ordinate represents the corrosion depth of target; The abscissa of corrosion curve represents the distance of target center to edge.As shown in Figure 1 b, the corrosion depth of point 132,134,130,136, the 138 position target in corrosion curve is relatively dark, especially the corrosion depth of point 136 position target is the darkest and corrosion area is very large.Learn thus, when adopting the magnetron in Fig. 1 a to scan target, the uniformity of target erosion is poor, causes the utilance of target lower.
For this reason, a difficult problem of putting in face of those skilled in the art is exactly how can design a kind of magnetron, and the uniformity of target erosion is got a promotion.
Summary of the invention
The present invention is intended at least to solve one of technical problem existed in prior art, and propose a kind of magnetron and apply the magnetron sputtering apparatus of this magnetron, it can improve the uniformity of target erosion.
A kind of magnetron is provided for realizing object of the present invention, comprise opposite polarity outer magnetic pole and internal magnetic pole, on the cross section of the center line perpendicular to described outer magnetic pole, described outer magnetic pole is closed annular, described internal magnetic pole be arranged on the outer magnetic pole of described annular around cavity in, wherein, described internal magnetic pole comprises more than three sub-internal magnetic poles, described more than three sub-internal magnetic poles are arranged around the center line of described outer magnetic pole, thus form the discontinuous passage corresponding with described sub-internal magnetic pole quantity between described outer magnetic pole and internal magnetic pole.
Wherein, described sub-internal magnetic pole is arranged on around the center line of described outer magnetic pole equably.
Wherein, the quantity of described sub-internal magnetic pole is three.
Wherein, the inwall of described outer magnetic pole is provided with towards the outstanding protuberance of its centerline direction, the sub-cavity that the interior separation of described outer magnetic pole becomes quantity corresponding with the quantity of described sub-internal magnetic pole by described protuberance, a described sub-internal magnetic pole is set in each described sub-cavity, thus is formed and described sub-internal magnetic pole quantity circular passage accordingly between described outer magnetic pole and internal magnetic pole.
Wherein, the shape of described sub-internal magnetic pole on the cross section of the center line perpendicular to described outer magnetic pole is " ginkgo leaf " shape or " water chestnut " shape or fan-shaped.
Wherein, described internal magnetic pole comprises internal magnetic pole body and multiple first magnet, and described first magnet is evenly arranged along the profile of described internal magnetic pole body; Described outer magnetic pole comprises outer magnetic pole body and multiple second magnet, described second magnet is evenly arranged along the profile of described outer magnetic pole body, and the polarity being arranged on the first magnet on described internal magnetic pole body is contrary with the polarity of the second magnet be arranged on described outer magnetic pole body.
Wherein, described first magnet and described second magnet are magnet.
Wherein, the width of the described passage between described outer magnetic pole and described internal magnetic pole is 20 ~ 30mm.
Preferably, the width of the described passage between described outer magnetic pole and described internal magnetic pole is 25.4mm.
The present invention also provides a kind of magnetron sputtering apparatus, and comprise target and be arranged at the magnetron above target, described magnetron, in order to scan described target material surface, is characterized in that, described magnetron adopts above-mentioned magnetron provided by the invention.
The present invention has following beneficial effect:
Magnetron provided by the invention, it passes through the sub-internal magnetic pole arranging more than three around the center line of outer magnetic pole, to form the passage corresponding with sub-internal magnetic pole quantity between outer magnetic pole and internal magnetic pole, this not only can improve the uniformity of target erosion, thus improve the utilance of target, and the length of the interval region between outer magnetic pole and internal magnetic pole can be shortened, thus the running orbit of electronics in plasma, ion can be shortened, and then the sputtering pressure of starter and maintain plasma can be reduced.
Magnetron sputtering apparatus provided by the invention, it is by adopting above-mentioned magnetron, not only can improve the uniformity of target erosion, thus improve the utilance of target, and the length of interval region can be shortened, thus the running orbit of electronics in plasma, ion can be shortened, and then the sputtering pressure of starter and maintain plasma can be reduced.
Accompanying drawing explanation
Fig. 1 a is the profile of existing a kind of magnetron;
Fig. 1 b utilizes the magnetron in Fig. 1 a to carry out the corrosion curve after experimental simulation scanning to target;
Fig. 2 is the longitudinal section view of magnetron provided by the invention;
Fig. 3 carries out the corrosion curve after experimental simulation scanning to magnetron provided by the invention to target; And
Fig. 4 is the arrangement schematic diagram of the sub-internal magnetic pole of magnetron provided by the invention.
Embodiment
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with accompanying drawing, magnetron provided by the invention and the magnetron sputtering apparatus of applying this magnetron are described in detail.
Fig. 2 is the longitudinal section view of magnetron provided by the invention.Refer to Fig. 2, magnetron provided by the invention comprises opposite polarity outer magnetic pole 40 and internal magnetic pole, and wherein, internal magnetic pole comprises internal magnetic pole body and multiple first magnet 51, and the first magnet 51 is evenly arranged along the profile of internal magnetic pole body; Outer magnetic pole 40 comprises outer magnetic pole body and multiple second magnet 43, and the second magnet 43 is evenly arranged along the profile of outer magnetic pole body.Further, the first magnet 51 be arranged on internal magnetic pole body is contrary with the polarity being arranged on the second magnet 43 on outer magnetic pole body, in order to the generation magnetic field, end at internal magnetic pole body and outer magnetic pole body.First magnet 51 and the second magnet 43 can adopt material as magnetic in tools such as magnet to make.
In the present embodiment, on the cross section (that is, perpendicular to the cross section of the center line 41 of outer magnetic pole 40) of outer magnetic pole 40 radial direction, the shape of outer magnetic pole 40 is closed annular, and the outer magnetic pole 40 of this annular is around formation one cavity.The inwall of outer magnetic pole 40 is provided with three protuberances 42 given prominence to towards its center line 41, by protuberance 42, the cavity that outer magnetic pole 40 surrounds is separated into three sub-cavitys.Protuberance 42 is provided with the second magnet 43, and the second magnet 43 is evenly arranged along the profile of protuberance 42.
Internal magnetic pole comprises three sub-internal magnetic poles 50, and the shape approximation of sub-internal magnetic pole 50 on the cross section of its radial direction is " ginkgo leaf " shape.Three sub-internal magnetic poles 50 are arranged in three sub-cavitys accordingly, that is, in every sub-cavity, arrange a sub-internal magnetic pole 50, thus make between internal magnetic pole and outer magnetic pole 40, form three circular passages 52.Make to form the shorter circular passage 52 of three length between internal magnetic pole and outer magnetic pole 40 by three sub-internal magnetic poles 50, this not only can improve the uniformity of target erosion, thus improves the utilance of target; And the running orbit of electronics in plasma, ion can be shortened, thus the sputtering pressure of starter and maintain plasma can be reduced.
The present embodiment can by the width regulating the size of sub-internal magnetic pole 50 to regulate circular passage 52, thus make the design of magnetron more flexible.In the present embodiment, the width of circular passage 52 is 20 ~ 30mm, can obtain when the width of circular passage is 25.4mm by simulation, the Corrosion results of target is better, but, those skilled in the art knows, and real experimental result and analog result always to exist some errors.The circular passage of such setting not only can reduce the sputtering pressure of starter and maintain plasma, and can improve the uniformity of target erosion, thus improves the utilance of target.
Fig. 3 carries out the corrosion curve after experimental simulation scanning to magnetron provided by the invention to target.Refer to Fig. 3, the ordinate of corrosion curve represents the corrosion depth of target; The abscissa of corrosion curve represents the distance of target center to edge.As can be seen from Figure 3, the difference of the corrosion depth of each position of target obviously reduces, and this shows that the magnetron scanning target material surface adopting the present embodiment to provide can improve the uniformity of target erosion, thus can improve the utilance of target.
It should be noted that, in the present embodiment, internal magnetic pole comprises three sub-internal magnetic poles 50.In fact internal magnetic pole can comprise the sub-internal magnetic pole 50 of more than three.As long as arrange the sub-internal magnetic pole 50 of more than three in the cavity that outer magnetic pole 40 surrounds, and sub-internal magnetic pole 50 is arranged on the center line 41 of outer magnetic pole 40 around, the shorter circular passage of length 52 can be obtained, thus realize the object that the present invention reduces starter and maintain plasma air pressure.
In addition, in the present embodiment, three circular passages 52 are intersected by paracentral position at outer magnetic pole 40, that is, three circular passages 52 exist a shared region 53, but the present invention is not limited thereto.Three circular passages 52 also can be separate circular passages, that is, whether circular passage 52 is independent, do not affect and realize object of the present invention, as long as circular passage 52 does not form a continuous print circular passage, the circular passage namely avoiding the formation of continuous print length longer all can realize object of the present invention.
In addition, in the present embodiment, the shape of three sub-internal magnetic poles 50 is similar, vary in size, but the present invention is not limited thereto.The shape of the sub-internal magnetic pole of the present invention 50 can be identical with size, also can be different.In other words, the shape of sub-internal magnetic pole 50 and size do not affect the object that the present invention reduces the sputtering pressure of starter and maintain plasma.As shown in Figure 4, be the arrangement schematic diagram of the sub-internal magnetic pole of magnetron provided by the invention.Three sub-internal magnetic pole 20 shape and size are identical, and the center line 11 being evenly distributed in outer magnetic pole around.
Also it should be noted that, in the present embodiment, the sub-internal magnetic pole 50 of the magnetron shape approximation on its radial section is in " ginkgo leaf " shape shown in Fig. 2.But be not limited thereto in actual applications, the shape of sub-internal magnetic pole 50 on its radial section can also be " water chestnut " shape, other shape such as fan-shaped.Also it should be noted that, in actual applications, the shape of outer magnetic pole on its radial section is not limited to the shape shown in the present embodiment, and it can be any closed annular suitable with the shape of internal magnetic pole.And the width of the circular passage formed between outer magnetic pole with internal magnetic pole in each position can be equal or unequal.The width of circular passage in each position all can adjust according to the Corrosion results of target, thus realizes process optimization.
In addition, although the passage formed between the sub-internal magnetic pole 50 of the present embodiment and outer magnetic pole 40 is circular passage, the present invention is not limited to circular passage.The passage formed between sub-internal magnetic pole 50 and outer magnetic pole 40 also can be the passage of other than ring type, as being the passage of arc.
Also it should be noted that, in actual applications, when magnetron scans whole target material surface, its rotating shaft can overlap with the center line of outer magnetic pole, also according to the Corrosion results of target, rotating shaft can be arranged on other positions of disalignment.
By test simulation, the modification of above-described embodiment all can obtain the corrosion curve be similar to Fig. 3, thus shows that the modification of above-described embodiment all can improve the uniformity of target erosion, and then improves the utilance of target.
In sum, the above-mentioned magnetron that the present embodiment provides, it passes through the sub-internal magnetic pole arranging more than three around the center line of outer magnetic pole, to form the passage corresponding with sub-internal magnetic pole quantity between outer magnetic pole and internal magnetic pole, this not only can improve the uniformity of target erosion, thus improve the utilance of target, and the length of the interval region between outer magnetic pole and internal magnetic pole can be shortened, thus the running orbit of electronics in plasma, ion can be shortened, and then the sputtering pressure of starter and maintain plasma can be reduced.
Present invention also offers a kind of magnetron sputtering apparatus, it comprises target and is arranged at the magnetron above target, and wherein, magnetron have employed above-mentioned magnetron that the present embodiment provides in order to scan target material surface.
The above-mentioned magnetron sputtering apparatus that the present embodiment provides, it is by adopting above-mentioned magnetron, not only can improve the uniformity of target erosion, thus improve the utilance of target, and the length of interval region can be shortened, thus the running orbit of electronics in plasma, ion can be shortened, and then the sputtering pressure of starter and maintain plasma can be reduced.
Be understandable that, the illustrative embodiments that above execution mode is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.

Claims (10)

1. a magnetron, comprise opposite polarity outer magnetic pole and internal magnetic pole, on the cross section of the center line perpendicular to described outer magnetic pole, described outer magnetic pole is closed annular, described internal magnetic pole be arranged on the outer magnetic pole of described annular around cavity in, it is characterized in that, described internal magnetic pole comprises more than three sub-internal magnetic poles, described more than three sub-internal magnetic poles are arranged around the center line of described outer magnetic pole, thus form the discontinuous passage corresponding with described sub-internal magnetic pole quantity between described outer magnetic pole and internal magnetic pole.
2. magnetron according to claim 1, is characterized in that, described sub-internal magnetic pole is arranged on around the center line of described outer magnetic pole equably.
3. magnetron according to claim 2, is characterized in that, the quantity of described sub-internal magnetic pole is three.
4. magnetron according to claim 1, it is characterized in that, the inwall of described outer magnetic pole is provided with towards the outstanding protuberance of its centerline direction, the sub-cavity that the interior separation of described outer magnetic pole becomes quantity corresponding with the quantity of described sub-internal magnetic pole by described protuberance, a described sub-internal magnetic pole is set in each described sub-cavity, thus is formed and described sub-internal magnetic pole quantity circular passage accordingly between described outer magnetic pole and internal magnetic pole.
5. magnetron according to claim 1, is characterized in that, the shape of described sub-internal magnetic pole on the cross section of the center line perpendicular to described outer magnetic pole is " ginkgo leaf " shape or " water chestnut " shape or fan-shaped.
6. magnetron according to claim 1, is characterized in that, described internal magnetic pole comprises internal magnetic pole body and multiple first magnet, and described first magnet is evenly arranged along the profile of described internal magnetic pole body; Described outer magnetic pole comprises outer magnetic pole body and multiple second magnet, described second magnet is evenly arranged along the profile of described outer magnetic pole body, and the polarity being arranged on the first magnet on described internal magnetic pole body is contrary with the polarity of the second magnet be arranged on described outer magnetic pole body.
7. magnetron according to claim 6, is characterized in that, described first magnet and described second magnet are magnet.
8. magnetron according to claim 1, is characterized in that, the width of the described passage between described outer magnetic pole and described internal magnetic pole is 20 ~ 30mm.
9. magnetron according to claim 8, is characterized in that, the width of the described passage between described outer magnetic pole and described internal magnetic pole is 25.4mm.
10. a magnetron sputtering apparatus, comprise target and be arranged at the magnetron above target, described magnetron, in order to scan described target material surface, is characterized in that, described magnetron adopts the magnetron in claim 1-9 described in any one.
CN201110433434.7A 2011-12-21 2011-12-21 A kind of magnetron and apply the magnetron sputtering apparatus of this magnetron Active CN103177917B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106609352B (en) * 2015-10-27 2019-04-23 北京北方华创微电子装备有限公司 Sputtering equipment and its operating method
CN107154330B (en) * 2016-03-04 2019-01-18 北京北方华创微电子装备有限公司 The magnetron sputtering apparatus of magnetron and the application magnetron

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0479189A1 (en) * 1990-09-29 1992-04-08 Tokyo Electron Limited Magnetron plasma processing apparatus
CN1978697A (en) * 2005-11-11 2007-06-13 亚升技术公司 Magnetron source having increased usage life
CN1997768A (en) * 2005-01-05 2007-07-11 应用材料股份有限公司 Multi-track magnetron exhibiting more uniform deposition and reduced rotational asymmetry
CN101553595A (en) * 2005-07-25 2009-10-07 应用材料股份有限公司 Method and apparatus for sputtering onto large flat panels

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0479189A1 (en) * 1990-09-29 1992-04-08 Tokyo Electron Limited Magnetron plasma processing apparatus
CN1997768A (en) * 2005-01-05 2007-07-11 应用材料股份有限公司 Multi-track magnetron exhibiting more uniform deposition and reduced rotational asymmetry
CN101553595A (en) * 2005-07-25 2009-10-07 应用材料股份有限公司 Method and apparatus for sputtering onto large flat panels
CN1978697A (en) * 2005-11-11 2007-06-13 亚升技术公司 Magnetron source having increased usage life

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Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone

Patentee after: Beijing North China microelectronics equipment Co Ltd

Address before: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing, Chaoyang District

Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing

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