CN103176258B - Module of array optical camera free of focus - Google Patents
Module of array optical camera free of focus Download PDFInfo
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- CN103176258B CN103176258B CN201110440734.8A CN201110440734A CN103176258B CN 103176258 B CN103176258 B CN 103176258B CN 201110440734 A CN201110440734 A CN 201110440734A CN 103176258 B CN103176258 B CN 103176258B
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Abstract
The invention discloses a module of array optical cameras free of focus. The module includes a cover of lens, a lens group and graphics chips, wherein the lens group comprises a plurality of lenses. Each lens is equipped with a plurality of secondary lenses, the secondary lenses on the same optical surface are distributed in array, and the positions of the secondary lenses on the optical surfaces which are adjacent to are corresponding. The theoretical pixel value of the lens is the sum of the pixel value of the secondary lenses and can reach 12 million and after being processed by softwares, the module pixel value of the lens can reach 8 million. In practical application, the lens group is matched with the pixel matrix of the graphics chips so that the colors of the images are better and smoother than those of the ordinary high pixel modules, the color variation is lowered, and the lens group can be applied to high pixel modules and can replace some high pixel camera modules made of aspheric surface and composed single lens. The height of the module is effectively lowered to only 3.2mm; therefore, the module meets the requirements of lightness and thinness for electronic products.
Description
Technical field
The invention belongs to optical camera field, be specifically related to a kind of ultrathin array high pixel and exempt from focal optical camera.
Background technology
The development of camera module is progressively to new material, high pixel, miniaturization, and this just orders about traditional design needs to improve further.
Conventional lenses, when assembling, needs between multiple eyeglass to be connected by packing ring, and eyeglass is in order to need separately to establish a segment structure region with packing ring assembling, so just increase lens dimension, and then strengthen module size, not only expend starting material, and be unfavorable for that product is to lightening development.
In patent documentation 1 (the open 201654308U patent gazette of China), describe Jiao after by machinery foreshortens within 100 microns; saving spacer ring is directly glued to camera lens on the cover glass of image chip with glue, reduces manufacturing tolerance to make the method that high-quality exempts from focal optical camera module with this.But in patent documentation 1, last surface of exempting from focusing lens head group is optical aspherical surface, can not directly and the cover glass of image chip directly bond, and need beyond optics effective diameter, separately establish a segment structure region to be used as the position bonded with image chip cover glass, which increases the bore of exempting from focusing lens, what make the upper acquisition of a slice glass wafer (diameter 200mm) exempts from focusing lens product decreased number, thus the cost of products of focusing lens is exempted from lifting, and exempt from for focal optical camera module for whole, when exempting from focusing lens and image chip bonding, neighboring area is only had to bond, and centre is still separation, bonded areas is caused not to be very abundant, product reliability can not optimization.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of array and exempting from focal optical camera module, this array exempts from focal optical camera module can effectively reduce product height, takes into account graphical quality simultaneously.
The present invention in order to the technical scheme solving its technical matters and adopt is:
A kind of array exempts from focal optical camera module, comprise camera lens outer cover, lens group and image chip, described lens group is superposed by some eyeglasses and forms, the optical surface of every block eyeglass has some story boards, and the some story boards be positioned on same optical surface are array arrangement, the position of the story board on adjacent optical surface is corresponding.Lens group theoretical pixel values is story board pixel value sum, 1,200 ten thousand can be reached, can 8,000,000 be reached by camera module pixel value after software process, lens group coordinates the picture element matrix of image chip in actual applications, shooting picture color is finer and smoother than common high pixel module, effectively can reduce aberration, meet the image quality requirement that product is more and more higher.Lens group of the present invention is used for high pixel module, the high pixel optics camera module of single the camera lens making be made up of many aspheric surfaces can be substituted, effectively reduce module height: the height of single 8,000,000 high pixel camera lenses is usually at 5mm usually, and lens group of the present invention is combined by low pixel story board, height can do to only 3.2mm, meets the requirement that present consumption electronic product is light, thin.
Further technical scheme of the present invention is:
At least one optical surface of lens group is differentiation structural design, and described differentiation structural design refers to that the face type of at least one story board be positioned on same optical surface is different from the face type of all the other story boards.Differentiation structural design is the partition characteristics in order to coordinate each picture element matrix R, G, B pixel of image chip, can balance the chromatism of position of different color light, the imaging surface of R, G, B different color light is consistent, be imaged on all well in image chip image planes.
The story board being positioned at same optical surface is one-body molded.Be positioned at some story board integral production cuttings of same optical surface, there is higher consistance and positioning precision.
Adhesive coating is provided with, the bonding eyeglass being positioned at its both sides of described adhesive coating between adjacent mirror.Adhesive coating can be high light transmission rate UV glue, and all eyeglasses are directly fit together by the adhesive coating of the high light transmission rate of several micron thickness, under the high pixel prerequisite of guarantee, reduce module height.Lens group periphery stretches out, and strengthens UV glue bonded area, improving product reliability.
Last surface of described lens group is tabular and whole face is glued on described image chip.
Described image chip has cover glass, and last surface bonding of described lens group is on described cover glass front surface.Directly closely being glued together by high light transmission rate UV glue between last surface and cover glass (cover glass) of image chip of lens group; the thickness of UV glue is several micron; save spacer ring burnt after keeping between conventional lenses and chip or base; rear burnt tolerance is down to minimum; reach the effect exempting to focus, ensure that camera module has high picture quality.
The invention has the beneficial effects as follows: array of the present invention is exempted from focal optical camera module group lens group and had some array story boards, lens group theoretical pixel values is story board pixel value sum, 1,200 ten thousand can be reached, can 8,000,000 be reached by camera module pixel value after software process, lens group coordinates the picture element matrix of image chip in actual applications, shooting picture color is finer and smoother than common high pixel module, effectively can reduce aberration, meet the image quality requirement that product is more and more higher, lens group of the present invention is used for high pixel module, the high pixel optics camera module of single the camera lens making be made up of many aspheric surfaces can be substituted, effectively reduce module height, module height can do to only 3.2mm, meet present consumption electronic product light, thin requirement.
Accompanying drawing explanation
Fig. 1 is the front surface structural representation that the array of the embodiment of the present invention 1 exempts from focal optical camera module;
Fig. 2 is the cross-sectional view that the array of the embodiment of the present invention 1 exempts from focal optical camera module;
Fig. 3 is that array of the present invention exempts from focal optical camera module light path schematic diagram.
Embodiment
Embodiment: be described in detail preferred embodiment of the present invention below in conjunction with accompanying drawing, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus make more explicit defining to protection scope of the present invention.
A kind of array exempts from focal optical camera module, is jointly made up of camera lens outer cover 1, lens group 2 and image chip 3.Described lens group 2 is by eyeglass 21, 22, 23 are consisted of the bonding superposition of high light transmittance UV glue, the optical surface one excision forming of every block eyeglass has 16 story boards 24, and 16 story boards be positioned on same optical surface are 4 × 4 array arrangements, the position of the story board on adjacent optical surface is corresponding, for coordinating each picture element matrix R of image chip 3, G, the partition characteristics of B pixel, each story board is also incomplete same, choose first optical surface in the present embodiment and carry out the chromatism of position that differentiation structural design (make the face type of the one or more story boards on first optical surface different from the face type of all the other story boards on this optical surface) balances different color light, make R, G, the imaging surface of B different color light is consistent, be imaged on all well in image chip image planes.Last surface of lens group is glued at the cover glass of described image chip for tabular whole face.The each optical surface of camera lens adopts wafer-level packaging to make, one cutting after completing, after cutting completes by product respectively group enter outer cover, the sealing of some glue.
The enforcement of above scheme can effectively reduce product height, integrated artistic processing procedure is more simplified and more easily controls, having saved human and material resources and manufacturing time, thus promotes yield, reduces the cost of whole optical camera module, promotes cost performance and competitive power.
The above; be only preferred embodiment of the present invention; but protection scope of the present invention is not limited thereto; any those of ordinary skill in the art are in the technical scope disclosed by the present invention; the change can done without creative work or replacement, all should be encompassed within protection scope of the present invention.Therefore, the protection domain that protection scope of the present invention should limit with claims is as the criterion.
Claims (1)
1. an array exempts from focal optical camera module, comprise camera lens outer cover (1), lens group (2) and image chip (3), described lens group (2) is superposed by some eyeglasses and forms, it is characterized in that: described lens group (2) is by three pieces of eyeglasses and be the first eyeglass (21) respectively, second eyeglass (22) and the 3rd eyeglass (23) are consisted of the bonding superposition of high light transmission rate UV glue, the optical surface one excision forming of every block eyeglass has 16 story boards (24), and 16 story boards be positioned on same optical surface are 4 × 4 array arrangements, the position of the story board on adjacent optical surface is corresponding, at least one optical surface of lens group (2) is differentiation structural design, described differentiation structural design refers to that the face type of at least one story board be positioned on same optical surface is different from the face type of all the other story boards, last surface of described lens group (2) is for tabular and whole face is glued on described image chip (3), described image chip (3) has cover glass, last surface bonding of described lens group (2) is on cover glass front surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110440734.8A CN103176258B (en) | 2011-12-26 | 2011-12-26 | Module of array optical camera free of focus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110440734.8A CN103176258B (en) | 2011-12-26 | 2011-12-26 | Module of array optical camera free of focus |
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| Publication Number | Publication Date |
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| CN103176258A CN103176258A (en) | 2013-06-26 |
| CN103176258B true CN103176258B (en) | 2015-06-17 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106856200B (en) * | 2015-12-09 | 2021-04-13 | 格科微电子（上海）有限公司 | Forming method of multi-image sensor module |
| WO2019153695A1 (en) * | 2018-02-07 | 2019-08-15 | 浙江舜宇光学有限公司 | Projection lens |
| CN108132575B (en) * | 2018-02-07 | 2020-05-08 | 浙江舜宇光学有限公司 | Projection lens |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101334510A (en) * | 2007-06-27 | 2008-12-31 | 鸿富锦精密工业（深圳）有限公司 | Lens module group and its assembling method |
| CN102096168A (en) * | 2009-12-14 | 2011-06-15 | 昆山西钛微电子科技有限公司 | Focusing-free optical camera module |
| CN202075485U (en) * | 2011-05-13 | 2011-12-14 | 昆山西钛微电子科技有限公司 | Focusing-free optical camera module |
| CN202433587U (en) * | 2011-12-26 | 2012-09-12 | 昆山西钛微电子科技有限公司 | Array-type focusing-free optical camera module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI20085510L (en) * | 2008-05-28 | 2009-11-29 | Valtion Teknillinen | A zoom-camera arrangement comprising several sub-cameras |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101334510A (en) * | 2007-06-27 | 2008-12-31 | 鸿富锦精密工业（深圳）有限公司 | Lens module group and its assembling method |
| CN102096168A (en) * | 2009-12-14 | 2011-06-15 | 昆山西钛微电子科技有限公司 | Focusing-free optical camera module |
| CN202075485U (en) * | 2011-05-13 | 2011-12-14 | 昆山西钛微电子科技有限公司 | Focusing-free optical camera module |
| CN202433587U (en) * | 2011-12-26 | 2012-09-12 | 昆山西钛微电子科技有限公司 | Array-type focusing-free optical camera module |
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Address after: 215300 No. 112, Longteng Road, Kunshan Development Zone, Suzhou, Jiangsu Patentee after: Alex Hua Tian Technology (Kunshan) Electronics Co., Ltd. Address before: 215300 No. 112, Longteng Road, Kunshan Development Zone, Suzhou, Jiangsu Patentee before: Kunshan Xitai Microelectronics Technology Co., Ltd. |
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Effective date of registration: 20190103 Address after: 710018 123 Fengcheng No. 5 Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Patentee after: Alex Hua Tian Hui Chuang Technology (Xi'an) Co., Ltd. Address before: 215300 No. 112, Longteng Road, Kunshan Development Zone, Suzhou, Jiangsu Patentee before: Alex Hua Tian Technology (Kunshan) Electronics Co., Ltd. |