CN103176258A - Module of array optical camera free of focus - Google Patents

Module of array optical camera free of focus Download PDF

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Publication number
CN103176258A
CN103176258A CN2011104407348A CN201110440734A CN103176258A CN 103176258 A CN103176258 A CN 103176258A CN 2011104407348 A CN2011104407348 A CN 2011104407348A CN 201110440734 A CN201110440734 A CN 201110440734A CN 103176258 A CN103176258 A CN 103176258A
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Prior art keywords
lens group
focus
module
lens
exempting
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CN2011104407348A
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CN103176258B (en
Inventor
王庆平
徐青
欧跃
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Alex Hua Tian Hui Chuang Technology (xi'an) Co Ltd
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KUNSHAN XITAI MICROELECTRONICS TECHNOLOGY Co Ltd
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Priority to CN201110440734.8A priority Critical patent/CN103176258B/en
Publication of CN103176258A publication Critical patent/CN103176258A/en
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Abstract

The invention discloses a module of array optical cameras free of focus. The module includes a cover of lens, a lens group and graphics chips, wherein the lens group comprises a plurality of lenses. Each lens is equipped with a plurality of secondary lenses, the secondary lenses on the same optical surface are distributed in array, and the positions of the secondary lenses on the optical surfaces which are adjacent to are corresponding. The theoretical pixel value of the lens is the sum of the pixel value of the secondary lenses and can reach 12 million and after being processed by softwares, the module pixel value of the lens can reach 8 million. In practical application, the lens group is matched with the pixel matrix of the graphics chips so that the colors of the images are better and smoother than those of the ordinary high pixel modules, the color variation is lowered, and the lens group can be applied to high pixel modules and can replace some high pixel camera modules made of aspheric surface and composed single lens. The height of the module is effectively lowered to only 3.2mm; therefore, the module meets the requirements of lightness and thinness for electronic products.

Description

The array optical camera module of exempting to focus
Technical field
The invention belongs to the optical camera field, be specifically related to the high pixel of a kind of ultrathin array and exempt from the optical camera of focusing.
Background technology
Progressively to new material, high pixel, microminiaturized development, this just orders about traditional design needs further to improve in the development of camera module.
Conventional lenses needed to connect by packing ring between a plurality of eyeglasses in when assembling, and eyeglass for packing ring assembling need to separately to establish a segment structure regional, so just strengthened lens dimension, and then strengthen the module size, not only expend starting material, and be unfavorable for that product is to lightening development.
After having recorded and narrated machinery in patent documentation 1 (the open 201654308U patent gazette of China), Jiao foreshortens in 100 microns; save spacer ring camera lens directly is glued on the cover glass of image chip with glue, reduce with this method that manufacturing tolerance is made the high-quality optical camera module of exempting to focus.but in patent documentation 1, last surface of exempting from the focusing lens group is optical aspherical surface, can not be directly and the cover glass of image chip directly bonding, be used as the position bonding with the image chip cover glass and need to separately establish a segment structure zone beyond the optics effective diameter, so just increased the bore of exempting from focusing lens, make a slice glass wafer (diameter 200mm) upper obtain exempt from focusing lens product decreased number, thereby lifting exempt from the cost of products of focusing lens, and for the whole optical camera module of exempting to focus, exempt from focusing lens and image chip when bonding, only have the neighboring area bonding, and the centre is still separation, it is not very abundant causing bonded areas, product reliability can not optimization.
Summary of the invention
In order to overcome defects, the invention provides a kind of array optical camera module of exempting to focus, this array optical camera module of exempting to focus can effectively reduce the product height, takes into account simultaneously graphical quality.
The present invention for the technical scheme that solves its technical matters and adopt is:
A kind of array optical camera module of exempting to focus, comprise camera lens outer cover, lens group and image chip, described lens group is made of some eyeglass stacks, the optical surface of every eyeglass has some story boards, and be positioned at some story boards on same optical surface and be array and arrange, the position of the story board on adjacent optical surface is corresponding.The theoretical pixel value of lens group is story board pixel value sum, can reach 1,200 ten thousand, after processing by software, camera module pixel value can reach 8,000,000, lens group coordinates the picture element matrix of image chip in actual applications, the shooting picture color is finer and smoother than common high pixel module, can effectively reduce aberration, satisfy the more and more higher image quality requirement of product.Lens group of the present invention is used for high pixel module, can substitute the high pixel optics camera module of single the camera lens making that is consisted of by many aspheric surfaces, effectively reduce the module height: the height of single 8,000,000 high pixel camera lenses is usually at 5mm usually, and lens group of the present invention is combined by low pixel story board, height can accomplish to be only 3.2mm, satisfies light, the thin requirement of present consumption electronic product.
Further technical scheme of the present invention is:
At least one optical surface of lens group is the differentiation structural design, and the face type that described differentiation structural design refers to be positioned at least one story board on same optical surface is different from the face type of all the other story boards.The differentiation structural design is in order to coordinate the partition characteristics of each picture element matrix of image chip R, G, B pixel, and chromatism of position that can the balance different color light is consistent the imaging surface of R, G, B different color light, all is imaged on well on the image chip image planes.
The story board that is positioned at same optical surface is one-body molded.Be positioned at some story board integral production cuttings of same optical surface, have higher consistance and bearing accuracy.
Be provided with adhesive coating between adjacent mirror, the bonding eyeglass that is positioned at its both sides of described adhesive coating.Adhesive coating can be high light transmission rate UV glue, and all eyeglasses directly adhesive coating of the high light transmission rate by several micron thickness fit together, and is guaranteeing to reduce the module height under high pixel prerequisite.The lens group periphery stretches out, and strengthens the cementing area that closes of UV, the improving product reliability.
Last surface of described lens group is that tabular and whole face are glued on described image chip.
Described image chip has cover glass, and last surface bonding of described lens group is on described cover glass front surface.Directly closely glued together by high light transmission rate UV glue between last surface of lens group and the cover glass (cover glass) of image chip; the thickness of UV glue is several microns; the spacer ring or the base that save Jiao after keeping between conventional lenses and chip; rear burnt tolerance is down to minimum; reach the effect of exempting to focus, guarantee that the camera module has high picture quality.
the invention has the beneficial effects as follows: the array of the present invention optical camera module group lens group of exempting to focus has some array story boards, the theoretical pixel value of lens group is story board pixel value sum, can reach 1,200 ten thousand, after processing by software, camera module pixel value can reach 8,000,000, lens group coordinates the picture element matrix of image chip in actual applications, the shooting picture color is finer and smoother than common high pixel module, can effectively reduce aberration, satisfy the more and more higher image quality requirement of product, lens group of the present invention is used for high pixel module, can substitute the high pixel optics camera module of single the camera lens making that is consisted of by many aspheric surfaces, effectively reduce the module height, the module height can accomplish only to be 3.2mm, satisfy present consumption electronic product light, thin requirement.
Description of drawings
Fig. 1 is the array of the embodiment of the present invention 1 exempt from the to focus front surface structural representation of optical camera module;
Fig. 2 is the array of the embodiment of the present invention 1 cross-sectional view of optical camera module of exempting to focus;
Fig. 3 is the array of the present invention optical camera module light path schematic diagram of exempting to focus.
Embodiment
Embodiment: below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that, protection scope of the present invention is made more explicit defining.
A kind of array optical camera module of exempting to focus is made of jointly camera lens outer cover 1, lens group 2 and image chip 3.described lens group 2 is by eyeglass 21, 22, 23 consist of by the bonding stack of high light transmittance UV glue, the optical surface one excision forming of every eyeglass has 16 story boards 24, and being positioned at 16 story boards on same optical surface is 4 * 4 arrays and arranges, the position of the story board on adjacent optical surface is corresponding, for coordinating image chip 3 each picture element matrix R, G, the partition characteristics of B pixel, each story board is also incomplete same, choose in the present embodiment first optical surface and carry out the chromatism of position that differentiation structural design (on the face type that makes the one or more story boards on first optical surface and this optical surface, the face type of all the other story boards is different) is come the balance different color light, make R, G, the imaging surface of B different color light is consistent, all be imaged on well on the image chip image planes.Last surface of lens group is glued at the cover glass of described image chip for tabular and whole face.Each optical surface of camera lens adopts wafer-level packaging to make, and after completing, the one cutting, organize respectively product into outer cover after cutting is completed, the sealing of some glue.
The enforcement of above scheme can effectively reduce the product height, makes the integrated artistic processing procedure more simplify and more easily control, and has saved human and material resources and manufacturing time, thereby has promoted yield, reduces the cost of whole optical camera module, promotes cost performance and competitive power.
The above; it is only preferred embodiment of the present invention; but protection scope of the present invention is not limited to this; any those of ordinary skill in the art are in the disclosed technical scope of the present invention; variation or the replacement that can do without creative work are within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.

Claims (6)

1. array optical camera module of exempting to focus, comprise camera lens outer cover (1), lens group (2) and image chip (3), described lens group (2) is made of some eyeglass stacks, it is characterized in that: the optical surface of every eyeglass has some story boards (24), and be positioned at some story boards on same optical surface and be array and arrange, the position of the story board on adjacent optical surface is corresponding.
2. the array according to claim 1 optical camera module of exempting to focus, it is characterized in that: at least one optical surface of lens group (2) is the differentiation structural design, and the face type that described differentiation structural design refers to be positioned at least one story board on same optical surface is different from the face type of all the other story boards.
3. the array according to claim 1 optical camera module of exempting to focus, it is characterized in that: the story board that is positioned at same optical surface is one-body molded.
4. the array according to claim 1 optical camera module of exempting to focus, is characterized in that: be provided with adhesive coating between adjacent mirror, the bonding eyeglass that is positioned at its both sides of described adhesive coating.
5. the array according to claim 1 optical camera module of exempting to focus is characterized in that: last surface of described lens group (2) is glued on described image chip (3) for tabular and whole face.
6. the array according to claim 5 optical camera module of exempting to focus, it is characterized in that: described image chip (3) has cover glass, and last surface bonding of described lens group (2) is on described cover glass front surface.
CN201110440734.8A 2011-12-26 2011-12-26 Module of array optical camera free of focus Active CN103176258B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106856200A (en) * 2015-12-09 2017-06-16 格科微电子(上海)有限公司 The forming method of multiple image sensor module
CN108132575A (en) * 2018-02-07 2018-06-08 浙江舜宇光学有限公司 Projection lens
WO2019153695A1 (en) * 2018-02-07 2019-08-15 浙江舜宇光学有限公司 Projection lens

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101334510A (en) * 2007-06-27 2008-12-31 鸿富锦精密工业(深圳)有限公司 Lens module group and its assembling method
US20090295949A1 (en) * 2008-05-28 2009-12-03 Valtion Teknillinen Tutkimuskeskus Zoom camera arrangement comprising multiple sub-cameras
CN102096168A (en) * 2009-12-14 2011-06-15 昆山西钛微电子科技有限公司 Focusing-free optical camera module
CN202075485U (en) * 2011-05-13 2011-12-14 昆山西钛微电子科技有限公司 Focusing-free optical camera module
CN202433587U (en) * 2011-12-26 2012-09-12 昆山西钛微电子科技有限公司 Array-type focusing-free optical camera module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101334510A (en) * 2007-06-27 2008-12-31 鸿富锦精密工业(深圳)有限公司 Lens module group and its assembling method
US20090295949A1 (en) * 2008-05-28 2009-12-03 Valtion Teknillinen Tutkimuskeskus Zoom camera arrangement comprising multiple sub-cameras
CN102096168A (en) * 2009-12-14 2011-06-15 昆山西钛微电子科技有限公司 Focusing-free optical camera module
CN202075485U (en) * 2011-05-13 2011-12-14 昆山西钛微电子科技有限公司 Focusing-free optical camera module
CN202433587U (en) * 2011-12-26 2012-09-12 昆山西钛微电子科技有限公司 Array-type focusing-free optical camera module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106856200A (en) * 2015-12-09 2017-06-16 格科微电子(上海)有限公司 The forming method of multiple image sensor module
CN106856200B (en) * 2015-12-09 2021-04-13 格科微电子(上海)有限公司 Forming method of multi-image sensor module
CN108132575A (en) * 2018-02-07 2018-06-08 浙江舜宇光学有限公司 Projection lens
WO2019153695A1 (en) * 2018-02-07 2019-08-15 浙江舜宇光学有限公司 Projection lens
CN108132575B (en) * 2018-02-07 2020-05-08 浙江舜宇光学有限公司 Projection lens

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Address after: 215300 No. 112, Longteng Road, Kunshan Development Zone, Suzhou, Jiangsu

Patentee after: Alex Hua Tian Technology (Kunshan) Electronics Co., Ltd.

Address before: 215300 No. 112, Longteng Road, Kunshan Development Zone, Suzhou, Jiangsu

Patentee before: Kunshan Xitai Microelectronics Technology Co., Ltd.

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Effective date of registration: 20190103

Address after: 710018 123 Fengcheng No. 5 Road, Xi'an Economic and Technological Development Zone, Shaanxi Province

Patentee after: Alex Hua Tian Hui Chuang Technology (Xi'an) Co., Ltd.

Address before: 215300 No. 112, Longteng Road, Kunshan Development Zone, Suzhou, Jiangsu

Patentee before: Alex Hua Tian Technology (Kunshan) Electronics Co., Ltd.