CN103175178B - The preparation method of lamp housing formula radiator and LED light device - Google Patents
The preparation method of lamp housing formula radiator and LED light device Download PDFInfo
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- CN103175178B CN103175178B CN201210194710.3A CN201210194710A CN103175178B CN 103175178 B CN103175178 B CN 103175178B CN 201210194710 A CN201210194710 A CN 201210194710A CN 103175178 B CN103175178 B CN 103175178B
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Abstract
The preparation method of lamp housing formula radiator and LED light device in a kind of LED light device; the method comprises the following steps: (1) blanking: get thickness at 1mm to 3mm, raffinal sheet material containing aluminium more than 99% by the size designed in advance, this sheet material of stamping-out becomes outline needed for shell; (2) punch forming: stamp out the convex-shaped structure that a bottom width top is narrow at the middle part of sheet material; (3) drawing: Sheet drawing is configured as an open hollow blank; (4) reducing: the blank after drawing is put into reducing die, carries out process opening being shortened into default lamp housing formula radiator radian.
Description
Technical field
The present invention relates to lighting field, particularly relate to preparation method and the LED light device of lamp housing formula radiator in a kind of LED light device.
Background technology
The light efficiency of traditional incandescent lamp is only about 10lm/W, and the light efficiency of Halogen lamp LED is about 30lm/W, and most electric energy all changes into heat and dissipates, thus wastes a large amount of electric energy.LED is a kind of novel semiconductor illumination technique, and the light efficiency of LED electroluminescent lamp pearl generally reaches more than 120lm/W in the market, if arrange in pairs or groups outstanding power supply and rational structural design, the light efficiency of LED lamp can reach more than 90lm/W.Like this, the LED of 7W a to 9W can replace the conventional incandescent of 60W, thus save a large amount of electric energy.
LEDbulb lamp common in the market, LED spotlight, LEDPAR lamp etc. are generally made up of die casting aluminium radiator, hemispheric diffuser or lens module, the circuit board being welded with LED electroluminescent lamp pearl, LED drive power, lamp holder etc.Wherein circuit board to be fixed on die casting aluminium radiator and upper face shield diffuser or lens module, and die casting aluminium radiator has a cavity, and LED drive power is equipped with in the inside.
A kind of LED ball bubble radiator and LEDbulb lamp is disclosed in 201120220556.9.LEDbulb lamp radiator comprises the installation location division being positioned at the installation heat transfer part of end face, the radiating part of side and lower end, radiating part comprises the heat sink strip of complex root longitudinal direction, the upper end of heat sink strip is connected with installation heat transfer part, and lower end is formed installs location division, is reserved with gap between adjacent heat radiation bar.Although have certain thermal diffusivity, whole radiator is not made into integration, and cost compare is high.
Be disclose a kind of bulb lamp in 201020666630.X at application number, comprise diffuser and the lamp holder that can be connected with power supply, also comprise the heat abstractor be arranged between lamp holder and diffuser, be provided with in the middle of heat abstractor and pass in and out for air the cavity passed through, heat abstractor two ends are provided with the space for air turnover, the maximum feature of this patent is that heat abstractor is provided with air-flow cavity and turnover gas space, walks the heat of heat sink interior to accelerate radiating rate for air turnover fluxion strap.
In 201120086659.5, disclose a kind of LEDbulb lamp radiator, this radiator is formed in one structure, and have body and cooling platform, this body is hollow structure, has multiple thermal convection holes.This heat sink applications is in energy-saving LED bulb lamp class, and body is the important component part of whole bulb lamp outward appearance, is also LED radiator simultaneously.Material adopts the aluminium of high thermal conductivity, simultaneously passive free convection wind heat dissipation design, allow whole lamp heat radiation more at a high speed.Disclosed in this patent, radiator has very strong thermal diffusivity, but this radiator is that die casting aluminium is made, and this production method very wastes material, and weight ratio is heavier, and cost is higher.The thermal conductivity of die casting aluminium is about 88%, and thermal diffusivity is not good.The most important thing is, it comprises inner and outer wall, and multiple holes that outer wall radially the heat radiation strip hole of parallel laying and cooling platform is arranged form passage, are gone out by the heat spreader on circuit board in theory.But because circuit board is fitted on cooling platform, the heat of circuit board first can conduct to the space of inwall formation by the die casting aluminium of cooling platform, comes out heat and is formed roasting mutually, namely influence each other with the power supply being positioned at inner wall space.
In sum, there is following shortcoming in existing LED light device:
First, the cost of lamp housing is higher, often accounts for more than 30% of whole LEDbulb lamp cost.The lamp housing no matter existing lamp housing adopts traditional die casting aluminium lamp housing still to adopt the aluminium of aforementioned high thermal conductivity to make, cost is all higher, in addition, be no matter traditional die casting aluminium lamp housing or adopt aforementioned section bar aluminium to be adopt conventional material thickness to make, heavier-weight, and the weight of lamp housing directly determines the weight of whole LEDbulb lamp, cause the weight decline difficulty of whole LEDbulb lamp large thus.
Secondly, the power supply of lamp is often enclosed in a plastic housing, and plastic housing is enclosed in again in the cavity of aluminium lamp housing, and the heat of circuit board conducts in the cavity of aluminium lamp housing, this heat that power supply and lamp source heat-dissipating can be caused to send influences each other, cause power source internal temperature very high, easily damage, reach more than 80 degree through observed temperature.
Finally, shell comprises inner and outer wall, and whole making is complicated, and the weight ratio of whole radiator is heavier, cost is higher.
And the housing manufacturing process of existing LED light device, this process makes complicated.
Summary of the invention
The object of the present invention is to provide the preparation method of lamp housing formula radiator in a kind of LED light device, to solve existing LED light device heavier-weight, thermal diffusivity is not good, cost is high technical problem.
The second object of the present invention is to provide a kind of LED light device, to solve existing LED light device heavier-weight, thermal diffusivity is not good, cost is high technical problem.
A preparation method for lamp housing formula radiator in LED light device, comprises the following steps:
(1) blanking: get thickness at 1mm to 3mm, raffinal sheet material containing aluminium more than 99% by the size designed in advance, this sheet material of stamping-out becomes outline needed for shell;
(2) drawing: Sheet drawing is configured as an open hollow blank;
(3) reducing: the blank after drawing is put into reducing die, carries out process opening being shortened into default lamp housing formula radiator radian.
Preferably, also comprising between step (1) and step (2): the first punch forming: stamp out a depressed area for contacting with circuit board face at the middle part of sheet material, in depressed area, forming the binding face that can fit tightly LED circuit board.
Preferably, also comprise between step (1) and step (2): the second punch forming: stamp out the convex-shaped structure that a bottom width top is narrow at the middle part of sheet material.
Wherein, the convex-shaped structure that the middle part of described sheet material stamps out can be a conical stage body or polygonal prism taper stage body, and the end face of stage body or prism can be used for laying LED circuit board.The convex-shaped structure stamped out in the middle part of described sheet material can also be a hemisphere face, described hemisphere face stamps out several chambers further, is provided with preset pitch between chamber.
Step (1) comprises further: whole piece aluminium sheet stamping-out is gone out a heronsbill shape, and on plank, go out several circuit board fixing holes and some cable holes.Step (3) comprises further: the reducing blank after drawing is put into reducing die, and the sidewall of die is consistent with the shape of pre-designed lamp housing formula radiator outer wall; Blank presses down by push rod from top to bottom, and when housing bottom contacts with reducing female bottom, then reducing completes.
The method also comprises: (4) are oxidized blank, spray paint, electroplate at least one of them post-processed and surface treatment.
And according to the thickness that the model size of LED light device selects raffinal sheet material different, LED light device is larger, and the thickness of high-purity aluminium sheet is thicker.
Lamp housing formula radiator in a kind of lighting device, be by thickness 1mm to 3mm, containing the raffinal Sheet drawing of aluminium more than 99% after be made into integration, in hollow bulb, it is made up of radiating surface and outer cover body, forming surface contact structures between radiating surface and circuit board, outer cover body are arranged the thermal vias that can form heat dissipation channel.
Preferably, thermal vias outer cover body arranged is the heat radiation strip hole along the radial parallel laying of outer shell outer wall.Outer cover body shrinks to the other end, in a frustum gradually by with this one end of circuit board joint face.
A kind of LED light device, is characterized in that, comprising: optical mirror slip, lamp housing formula radiator, circuit board, LED drive device, wherein,
Lamp housing formula radiator be by thickness 1mm to 3mm, containing the raffinal Sheet drawing of aluminium more than 99% after be made into integration; it is hollow bulb; described lamp housing formula radiator its be made up of radiating surface and outer cover body; forming surface contact structures between radiating surface and circuit board, outer cover body are arranged the thermal vias that can form heat dissipation channel;
Optical mirror slip is arranged on the front end of lamp housing formula radiator, and LED drive device is arranged in lamp housing formula radiator or arranges its rear end.
Preferably, heat dissipation channel one: heat by conducting to radiating surface after circuit board and heat radiation plane-plane contact, then is dispelled the heat away from radiating surface by thermal vias; Heat dissipation channel two: heat distributes from LED drive device, then dispelled the heat away by thermal vias; Heat dissipation channel one and heat dissipation channel two independent of one another.
In heat dissipation channel one, heat is mainly carried out thermal convection current by the surface of housing and air thus is distributed by heat, and the existence of thermal vias can ensure that air can smooth and easy convection current thus strengthen radiating effect.And in heat dissipation channel two, heat is carried out thermal convection current by power supply shell surface and air thus is distributed by heat again after being transmitted to power supply shell surface from LED drive device by high-heat-conductivity glue water, and the existence of thermal vias can ensure that air can smooth and easy convection current thus enhancing radiating effect.Heat conduction can not accumulate in lamp interior to air by passage one and passage two swimmingly, and radiating effect is outstanding, and these two heat dissipation channels are independently independent of each other.The described optical mirror slip even smooth optical mirror slip of employing or secondary light-distribution optical mirror slip, fix by screw or glue is bonded on lamp housing formula radiator.Circuit board is the smooth module in one piece of bottom, carries out face contact bottom this with radiating surface, the joint place coating high thermal conductivity silicone grease in preferred two faces.Described LED drive module is arranged in the cavity of power supply shell, and high heat conduction is filled with in power supply shell inside, insulate excellent glue.
The preparation method of lamp housing formula radiator in the second LED light device, comprises the following steps:
(1) blanking, get thickness at 1mm to 3mm, raffinal sheet material containing aluminium more than 99% by the size designed in advance, this sheet material of stamping-out becomes outline needed for shell;
(2) first time spinning, raffinal sheet material spinning is become an open hollow part, and the size of the openend of the blank after spinning is more than or equal to the size of closed end;
(3) second time spinning, to through above step process blank adopt one comparatively spinning process process, its opening part diameter is diminished, and opening is spun into the radian of design.
Preferably, also comprising between step (1) and step (2): punch forming: stamp out a depressed area for contacting with circuit board face at the middle part of sheet material, in depressed area, forming the binding face that can fit tightly LED circuit board.
Preferably, also comprise between step (1) and step (2): the second punch forming: stamp out the convex-shaped structure that a bottom width top is narrow at the middle part of sheet material.
Wherein, the convex-shaped structure that the middle part of described sheet material stamps out can be a conical stage body or polygonal prism taper stage body, and the end face of stage body or prism can be used for laying LED circuit board.The convex-shaped structure stamped out in the middle part of described sheet material can also be a hemisphere face, described hemisphere face stamps out several chambers further, is provided with preset pitch between chamber.
A kind of LED light device, it comprises heat-dissipation lamp housing, diffuser, LED light module;
Described heat-dissipation lamp housing comprises the chip mount pad in portion disposed thereon further and is arranged on the heat radiation support of its underpart, the heat radiation support of described bottom is hollow housing, described chip mount pad is the narrow convex configuration in bottom width top, and described top and/or side can arrange LED light module;
Described diffuser is arranged on the junction of these heat-dissipation lamp housing top and the bottom and covers this LED light module.
Described heat-dissipation lamp housing be by thickness 1mm to 3mm, containing the raffinal Sheet drawing of aluminium more than 99% after be made into integration.
Described chip mount pad is taper stage body, on the top that LED light module can be located immediately at this chip mount pad and/or side.
Described LED light device also comprises a fluorescent material cover, in the chamber that the top that this fluorescent material covers on this diffuser and this radiating shell is formed, and be located in described LED light module, described fluorescent material cover is the fluorescent material cover of its inner surface or outer surface fluorescent material, or the fluorescent material cover of himself inner doping fluorescent powder; The colour temperature of the light sent after being mixed with the light of this fluorescent material by the light of this LED light module of concentration adjustment adjusting fluorescent material.
Described chip mount pad is polygonal prism cone or cone, and this LED light module a plurality of is separately positioned on each skew back face of this pyramid.
Described heat radiation support is the back taper hollow shell closed up downwards, is provided with a plurality of grid type air vent, forms multiple heat dissipation passage between this plurality of grid type air vent around this heat radiation support.
A kind of LED light device, it comprises:
One heat-dissipation lamp housing, it is hollow structure, and it comprises the first half and the latter half of linking together further, and this first half is provided with a plurality of chamber;
A plurality of diffuser;
A plurality of LED light module, described a plurality of LED light module is separately positioned in this plurality of chamber, the correspondence of opening part outwardly of each chamber arranges a diffuser, described heat-dissipation lamp housing be by thickness 1mm to 3mm, containing the raffinal Sheet drawing of aluminium more than 99% after be made into integration.
Described the first half longitudinally arranges this plurality of chamber along heat-dissipation lamp housing, and these a plurality of chambers all can surround the periphery an of the first half.
The sidewall of this plurality of chamber is not fitted each other, has spacing between this plurality of chamber, forms multiple heat dissipation passage.
The latter half of described heat-dissipation lamp housing is provided with several grid type mesh and closes up downwards, forms multiple heat dissipation passage between this grid type mesh.
Described heat-dissipation lamp housing top is provided with some thermal vias, forms multiple heat dissipation passage between this thermal vias and this grid type mesh.
Described LED light module can be placed on the bottom surface of described heat-dissipation lamp housing chamber, on sidewall or in the chamber tilting with predetermined angle, by adjusting position and the adjustable angle lighting angle of LED light module.
Connected by the material that heat conductivility is good between described a plurality of diffuser, or directly connected by heat-dissipation lamp housing.
Compared with prior art, the present invention has following beneficial effect:
First, in LED light device the preparation method of lamp housing formula radiator be adopt by thickness 1mm to 3mm, containing the raffinal Sheet drawing of aluminium more than 99% after be made into integration, so lamp housing formula radiator of the present invention only need adopt the material of die-cast aluminium shell 1/3 to 1/5 just can reach the same with die casting aluminium, even more outstanding radiating effect, cost is only 1/2 to 1/3 of die-cast aluminium shell simultaneously.Containing its thermal diffusivity of raffinal sheet material of aluminium more than 99% up to more than 230, greatly strengthen than the thermal diffusivity of die casting aluminium and section bar aluminium, and the weight of the lighting device made of this housing is less than the half of the lamp done by die cast.And the material that aluminium plate uses is also few, also reduces cost simultaneously.Therefore, LED illumination product price of the present invention is more cheap, and quality is lighter, is applicable to being used in various occasion, is namely applicable to the various types of lighting device of various model.
Then, contacted between circuit board and lamp housing formula radiator by the face way of contact of a whole plane close contact, the heat that circuit board produces can be dispersed into rapidly in air by the high-purity aluminum hull of high thermal conductivity, and radiating effect is outstanding.
Subsequently, LED electroluminescent lamp pearl and LED drive device two thermals source separately, can not produce heat localization phenomenon.That is, heat dissipation channel one: heat by conducting to radiating surface after circuit board and heat radiation plane-plane contact, then is dispelled the heat away from radiating surface by thermal vias; Heat dissipation channel two: heat distributes from LED drive device, then dispelled the heat away by thermal vias; Independently of one another, there is not the problem of the heat radiation that influences each other in heat dissipation channel one and heat dissipation channel two.
Finally, the light efficiency of LED electroluminescent lamp pearl is high, reaches more than 100lm/W, and power supply conversion efficiency is very up to more than 90%, greatly saves electric energy than ordinary incandescent lamp, only needs 7 to 9W, just can reach the brightness of the incandescent lamp of traditional more than 50W.
Accompanying drawing explanation
Fig. 1 is a kind of LED illumination product explosive view;
Fig. 2 is lamp housing formula heat spreader structures schematic diagram;
Fig. 3 A is the schematic diagram of the blank after blanking;
Fig. 3 B is the schematic diagram of the blank after the first punch forming;
Fig. 3 C is the schematic diagram of the blank after drawing;
Fig. 3 D is deep-drawing technique schematic diagram;
Fig. 3 E is necking down process schematic diagram;
Fig. 3 F is the schematic diagram of the hair accessory after the second punch forming;
Fig. 3 G is the schematic diagram of the blank part after the third punch forming;
Fig. 3 H is the schematic diagram of the blank part after the 4th kind of punch forming;
Fig. 3 I is the schematic diagram of the blank part after Fig. 3 H two times punch;
Fig. 4 A is the schematic diagram of the blank after blanking;
Fig. 4 B be stamping after the schematic diagram of blank;
Fig. 4 C is first time spinning process schematic diagram;
Fig. 4 D is second time spinning process schematic diagram;
Fig. 5 is LEDbulb lamp schematic diagram;
Fig. 6 is LEDPAR lamp explosive view;
Fig. 7 is LEDPAR lamp schematic diagram;
Fig. 8 is the MR16 schematic diagram of a LED;
Fig. 9 is the MR16 explosive view of a LED;
Figure 10 is the bulb lamp heat-dissipation lamp housing part-structure schematic diagram of application examples 4;
Figure 11 is the bulb lamp heat-dissipation lamp housing part-structure schematic diagram of application examples 5;
Figure 12 is the bulb lamp heat-dissipation lamp housing part-structure schematic diagram of application examples 6.
Detailed description of the invention
The present invention is described in detail below in conjunction with accompanying drawing.
Refer to Fig. 1, a kind of LED illumination product, comprises optical mirror slip 1, lamp housing formula radiator 2, circuit board 3, LED drive device 4, power supply shell 5, lamp holder 6.
The material that optical mirror slip 1 preferred light transmitance is high is made, as PC, PMMA, glass, lucite etc.Its effect is divided into secondary light-distribution, even light two kinds according to the unusual of light fixture kind.The light that the LED light module of secondary light-distribution optical mirror slip to LED electroluminescent lamp pearl or integration packaging sends plays the effect redistributed, the shape making the hot spot of receiving plane become circular light spot, rectangular light spot etc. to need arbitrarily.Secondary light-distribution optical mirror slip there are one or more than one luminous intensity distribution unit.Even smooth optical mirror slip plays the effect of evenly dispersing to the light that LED electroluminescent lamp pearl sends, and generally coarse process is carried out on the surface of even smooth optical mirror slip or inside lens materials, adds even stimulative substance.Optical mirror slip 1 is fixed by screw or glue is bonded on lamp housing formula radiator 2.
Lamp housing formula radiator 2 is formed between 1mm to 3mm, containing the high-purity aluminium sheet manufacture of aluminium more than 99% by whole piece thickness.Tradition LEDbulb lamp or LEDPAR lamp adopt die casting aluminium lamp housing formula radiator mostly, and the thermal conductivity factor of die casting aluminium is only about 95W/mK.The present invention innovatively proposes the technology adopting high-purity aluminium sheet drawing to manufacture LED lamp lamp housing formula radiator.The thermal conductivity factor of raffinal is about about 237W/mK, it is 2.5 times of common die casting aluminium, so lamp housing formula radiator of the present invention only need adopt the material of die-cast aluminium shell 1/3 to 1/5 just can reach the same with die casting aluminium, even more outstanding radiating effect, cost is only 1/2 to 1/3 of die-cast aluminium shell simultaneously.The bulb lamp weight made of this housing is less than the half of the lamp done by die cast.
Such as, conventional 1050,1060, the 1070 three kinds of high-purity aluminium sheets of light trade.The thermal conductivity factor of fine aluminium is 237W/m.K, and the aluminum content of 1050 aluminium sheets is 99.5%, and thermal conductivity factor is 209W/m.K, and the aluminum content of 1060 aluminium sheets is 99.6%, and thermal conductivity factor should between 1050 aluminium sheets and 1070 aluminium sheets.The aluminum content of 1070 aluminium sheets is 99.7%, thermal conductivity factor 226W/m.K.The thermal conductivity factor of this high-purity aluminium sheet will far away higher than the thermal conductivity factor of the about 209W/m.K of section bar aluminium, and more higher than the thermal conductivity factor of die casting aluminium about 95W/m.K, therefore radiator of the present invention has splendid radiating effect.
Traditional die casting aluminium LEDbulb lamp or PAR lamp, circuit board goes out often often only has fraction area to contact with lamp housing formula radiator 2, and this causes heat successfully not conduct to lamp housing formula radiator 2 from circuit board 3.Lamp housing formula radiator 2 of the present invention its be made up of radiating surface 21 and outer cover body 22, forming surface contact structures between radiating surface 21 and circuit board 3, outer cover body 22 are arranged and can form the thermal vias of heat dissipation channel.The thermal vias that outer cover body 22 is arranged is the heat radiation strip hole 23 along the radial parallel laying of outer shell outer wall, and in addition, outer cover body 22 is shunk to opposite end, in a frustum gradually by this one end of radiating surface 21.Radiating surface 21 is smooth one side, or goes out a burnishing surface to lower recess, for contacting with circuit board 3.Radiating surface 21 is arranged several circuit board fixing holes 25 and a cable hole 24.
Radiating surface 21 is smooth one side, or goes out a burnishing surface to lower recess, this design thus can fit tightly with the bottom of smooth circuit board 3, can apply High thermal-conductive silicone grease and also can not apply between circuit board 3 and lamp housing formula radiator 2.The heat of circuit board 3 passes to rapidly on lamp housing formula radiator 2, plays good radiating effect.On the outer cover body 22 of lamp housing formula radiator 2, surrounding has excised portion of material, obtains the housing of a hollow out, namely arranges heat radiation strip hole 23.The heat of such lamp housing formula radiator 2 can at the unobstructed thermal cycle passage of the inside and outside formation of lamp housing formula radiator one of hollow out.Lamp housing formula radiator 2 is formed by the metallic plate drawing and forming that surface area is larger, circuit board 3 is fixed on the surface that lamp housing formula radiator 2 can make full use of housing larger effectively to dispel the heat, the heat produced by LED is transmitted to rapidly lamp housing formula radiator 2 from circuit board 3 and is then transmitted in air.
Circuit board 3 is the smooth light emitting modules in one piece of bottom, and its shiny surface and the circuit board stationary plane of lamp housing formula radiator 2 fit tightly, and the joint place in two faces can apply high thermal conductivity silicone grease, also can not be coated with.It can be the PCBA board of welding LED electroluminescent lamp pearl on the circuit board 3 of excellent thermal conductivity, also can be the LED light module of a monoblock integration packaging.Circuit board 3 material that preferably thermal conductivity is high, the heat that LED chip produces to be transmitted to rapidly on circuit board 3 thus to avoid the accumulation of heat near LED chip.Heat again closely and the larger body contact of surface area, can promptly be dispersed in air by circuit board.Heat defines smooth and easy, an efficient conduction pathway from lamp pearl inside to air.
LED drive module 4 is high efficiency driver apparatus.Its input line is connected with the both positive and negative polarity of lamp holder 6, and its output line is connected with the both positive and negative polarity of circuit board 3.It is placed in the cavity of power supply shell 5, and high heat conduction is filled with in power supply shell inside, insulate excellent glue.The heat that power source internal height heating element produces can conduct by this glue fast, avoids thermal accumlation around high heater element.The other end of power supply shell is used for fixing lamp holder 6.
Power supply shell 5 is made of plastics, and is the tubular shell of a hollow.It is for fixed light shell-type radiator 2 and lamp holder 6.Place LED drive module 4 in its cavity and pour into high heat conduction, insulate excellent glue.Heat dissipation channel one: heat by conducting to radiating surface after circuit board and heat radiation plane-plane contact, then is dispelled the heat away from radiating surface by thermal vias; Heat dissipation channel two: heat distributes from LED drive device, then dispelled the heat away by thermal vias; Heat dissipation channel one and heat dissipation channel two independent of one another.
Lamp holder 6 is generally the lamp holder of standard, as E27 screw socket etc., but also can customize according to actual needs.
Below the concrete manufacturing process of the first lamp housing formula radiator is specifically introduced:
The process of lamp housing formula radiator (2) is mainly divided into the following steps:
1. blanking (as shown in Figure 3A).Utilize stamping-out, sheet material is excised unwanted part, obtain required outline.As shown in Figure 3A, whole piece aluminium sheet stamping-out is gone out a heronsbill shape, and on plank, go out several circuit board fixing holes and a cable hole.Further, according to the thickness that the model size of LED light device selects raffinal sheet material different, LED light device is larger, and the thickness of high-purity aluminium sheet is thicker.Thickness increases, and its sectional area increases, and the biography speed of heat also increases, and makes radiating effect higher.Or LED light device requires higher to thermal diffusivity, and the thickness of employing is also thicker.
2. stamping (as shown in Fig. 3 B, 3F-3I).Stamp out the shape of needs in sheet material middle part with a finishing die, this shape can be a depressed area contacted with circuit board face, also can be the narrow upper convex platform body structure in bottom width top or hemisphere face structure.Also can carry out two times punch according to concrete topology requirement, as Fig. 3 I be exactly carry out two times punch in the hemisphere face structure of Fig. 3 H after form multiple chamber structure.Adopt different moulds plate forming can be gone out required various structures.
3. drawing (as shown in Figure 3 C).It is an open hollow part (as Fig. 3 D) by metallic plate drawing and forming.Now this blank is a cylindrical shape, and the diameter at its two is the same.As Fig. 3 D, die 31 is fixed, then will treat that drawing blank 32 is fitted on the upper surface of drawing punch 33, with push rod 34 by drawing punch 33 with treat that drawing blank 32 heads in die 31, namely blank is shaped to an equirotal straight-cylindrical part in two ends.Below be only a kind of implementation of drawing and forming, this mode be not used for limitation of the present invention.
4. reducing (as shown in FIGURE 3 E).The opening part of straight-cylindrical blank is carried out reducing process, its opening part diameter is diminished, and shortens opening into pre-designed radian.As Fig. 3 E, the reducing blank after drawing is put into reducing die 42, the sidewall of die 42 is just the shape of lamp housing formula radiator 2 outer wall designed.Blank presses down by push rod 41 from top to bottom.Housing bottom with when contacting bottom reducing die 42 then reducing complete.
5. post-production and surface treatment.After reducing completes, blank is oxidized, sprays paint, the surface treatment such as plating, also can not process.
Below introduce the concrete manufacturing process of the second lamp housing formula radiator:
This method step 3,4,5 is key steps below, and order can not be exchanged.
The process of lamp housing formula radiator is mainly divided into the following steps:
1. blanking (as shown in Figure 4 A).Utilize stamping-out, sheet material is excised unwanted part, obtain required outline.As shown in Figure 4 A, plank is gone out several circuit board fixing holes and a cable hole.
2. stamping (as shown in Figure 4 B).On lamp housing 2, the part of fixing circuit board and fixed optics eyeglass is a depressed area, needs the shape extruding needs with a punch head.
3. first time spinning (as shown in Figure 4 C).Metallic plate spinning is become an open hollow part.The size of the openend of the blank after spinning is more than or equal to the size of closed end.As Fig. 4 C, together with treating that the ground of spinning blank 51 fits tightly with the end face of spinning block 52, and together around A axle High Rotation Speed.Then together with withstanding treat that spinning blank 51 makes to treat that spinning blank 51 all fits tightly with spinning block 52 with push rod 53.Treat that spinning blank has just been made into open hollow part.
4. second time spinning (as shown in Figure 4 D).Adopt a kind of comparatively special spinning process to process to the blank through above step process, its opening part diameter is diminished, and opening is spun into pre-designed radian.As Fig. 4 D, the side radian of eccentric spinning block 63 is just in time the radian of required raffinal housing side.Blank 62 does rotation around axle P, and eccentric spinning block 63 is also revolving round the sun around axle P while doing rotation around axle Q.Then the sidewall of push rod 61 blank makes the sidewall of the sidewall of blank 62 and eccentric spinning block 63 fit tightly.Taking-up product after spinning completes.This comparatively special spinning process is used to be to product successfully be taken off from mould.
5. stamping-out.Stamping-out process is carried out to the side of the blank through above step process, removes the part wanting to remove, obtain the raffinal housing of hollow out.
6. post-production and surface treatment.Finally, blank is oxidized, sprays paint, the surface treatment such as plating, also can not process.
Application examples:
Application examples 1:
As Fig. 5, it is depicted as a LEDbulb lamp schematic diagram.This LEDbulb lamp is the bulb lamp that 220v exchanges input, E27 screw socket, can be used for replacing traditional 220V and inputs incandescent lamp.Input line, through power supply shell 5, is welded on the both positive and negative polarity of E27 lamp holder by the input line of the LED drive module first 220V interchange input, direct current exported.Then E27 lamp holder is pressed on power supply shell 5.Again LED drive module 4 is filled in the cavity of power supply shell 5, the glue of perfusion excellent heat conductivity, place a period of time and wait for that the glue solidifies.After the glue solidifies, by the cable hole of the output line of LED drive module 4 through lamp housing formula radiator 2, then the stitch of lamp housing formula radiator 2 is inserted in hole corresponding outside power supply shell 5, blend compounds hydropexis.Again circuit board 3 is screwed on metal shell, and the output line of LED drive module 4 is welded on circuit board 3.Finally hemispherical, optical mirror slip 1 glue with even light action are fixed on lamp housing formula radiator 2.Assembling just completes.
This LEDbulb lamp is the input of 220V, 50Hz standard household AC electrical, and has the E27 lamp holder of standard, can replace existing family expenses incandescent lamp easily.
Application examples 2
Be a LEDPAR lamp schematic diagram as shown in Figure 6 and Figure 7.This LEDPAR lamp is the PAR lamp that 220v exchanges input, E27 screw socket.Input line, through power supply shell 5, is welded on the both positive and negative polarity of E27 lamp holder by the input line of the LED drive module first 220V interchange input, direct current exported.Then E27 lamp holder is pressed on power supply shell 5.Again LED drive module 4 is filled in the cavity of power supply shell 5, the glue of perfusion excellent heat conductivity, place a period of time and wait for that the glue solidifies.After the glue solidifies, by the cable hole of the output line of LED drive module 4 through metalized lamp shell-type radiator 2, then the stitch of lamp housing formula radiator 2 is inserted in hole corresponding outside power supply shell 5, blend compounds hydropexis.Again circuit board 3 is screwed on metal shell, and the output line of LED drive module 4 is welded on circuit board 3.Finally the optical mirror slip 1 with optically focused effect is screwed on lamp housing formula radiator 2.Assembling just completes.
This LEDPAR lamp is the input of 220V, 50Hz standard household AC electrical, and has the E27 lamp holder of standard, can replace existing PAR lamp easily.
Application examples 3
One .MR16 embodiment
As Fig. 8 and Fig. 9, it is depicted as the MR16 schematic diagram of a LED.This LEDMR16 is the input of 12V direct current, GU10 lamp holder, and power supply shell and lamp holder is injection molded in order to one, can be used for replacing traditional 12V and inputs MR16.The circuit board of this MR16 has welded 3 LEDs electroluminescent lamp pearls, optical mirror slip 1 has had three secondary light-distribution unit, these three luminous intensity distribution unit play the effect of convergence to the light that each LED electroluminescent lamp pearl sends.First the input line of LED drive module is passed power supply shell 5, input line is welded on the both positive and negative polarity of lamp holder.Then LED drive module 4 is filled in the cavity of power supply shell 5, the glue of perfusion excellent heat conductivity, place a period of time and wait for that the glue solidifies.After the glue solidifies, by the cable hole of the output line of LED drive module 4 through lamp housing 2, then the stitch of lamp housing 2 is inserted in hole corresponding outside power supply shell 5, blend compounds hydropexis.Again circuit board 3 is screwed on metal shell, and the output line of LED drive module 4 is welded on circuit board 3.Finally the optical mirror slip 1 with optically focused effect is screwed on lamp housing 2.Assembling just completes.
This LEDMR16 is the input of 12V direct current, and has the GU10 lamp holder of standard, can replace the MR16 of traditional employing halogen bulb easily.
Application examples 4
As shown in Figure 10, this application examples is identical with the most of technical characteristic of application examples 1, same section repeats no more, difference is that described case type radiator 2 comprises the chip mount pad 111 in portion disposed thereon further and is arranged on the heat radiation support 112 of its underpart, this top connects this bottom, these top and the bottom can be integral structure or detachable movable connection structure, the multiple connected modes such as concrete connected mode can be and is threaded, buckle connection.Described chip mount pad 111 is the taper stage body (circular cone or multiaspect pyramid and similar structures) thereof of epirelief, described circuit board 3 is arranged on the top of this chip mount pad 111, a fluorescent material cover 15 is established in circuit board 3 upper cover, fluorescent material cover 15 is in hemispherical, inner surface or the outer surface of described fluorescent material cover 15 have fluorescent material, or himself inner doping fluorescent powder.
Described LED light module is arranged on the top of this chip mount pad; Described heat radiation support is the back taper hollow shell closed up downwards, a plurality of grid type air vent 112a is provided with around this heat radiation support, form multiple heat dissipation passage between this plurality of grid type air vent, surrounding air effectively can form convection current, takes away heat rapidly.
Described diffuser is arranged on the junction of these heat-dissipation lamp housing top and the bottom and covers this LED light module.Described heat-dissipation lamp housing be by thickness 1mm to 3mm, containing the raffinal Sheet drawing of aluminium more than 99% after be made into integration, in hollow structure.
Described LED light module can be single particle, also can be the light emitting module of COB encapsulation, and can also be the PCBA circuit board of some particle compositions, what send be blue light.
In the chamber that the top that described fluorescent material covers on this diffuser and this radiating shell is formed, and be located in described LED light module, in hemispherical dome structure.Inner surface or the outer surface of described fluorescent material cover have fluorescent material, or himself inner doping fluorescent powder; The blue-light excited fluorescent material that LED light module sends sends gold-tinted.Blue light and yellow light mix obtain white light.The ratio of gold-tinted and blue light can be regulated to obtain the white light of different-colour by regulating the concentration of fluorescent material.Be arranged on by fluorescent material on the fluorescent material cover away from LED chip, the heat that the heat that can prevent chip from producing and fluorescent powder grain produce forms superposition, and good heat dissipation effect, the life-span is long.After increasing fluorescent material cover, photochromic uniformity is good.
Described LED light device also comprises driving power and plastics power supply shell; this driving power is arranged in this plastics power supply shell; this plastics power supply shell shields to driving power, prevents driving power from leaking electricity, the fault such as short circuit and causing danger, and strengthens the security of described LED light device.This driving power and this plastics power supply shell are arranged in the hollow housing of heat-dissipation lamp housing.
LED light device can be 360 degree at the lighting angle of horizontal cross-section, at the lighting angle α of vertical section between 250 ~ 320 degree.
LED light device provided by the invention, light emitting region is large and thermal diffusivity is good, and application is wide, goes for each lighting field in productive life.And disclosed in the first embodiment, be arranged on by fluorescent material on the fluorescent material cover away from LED chip, the heat that the heat that can prevent chip from producing and fluorescent powder grain produce forms superposition, and good heat dissipation effect, the life-span is long.After increasing fluorescent material cover, photochromic uniformity is good.
Application examples 5
As shown in figure 11, this application examples is identical with the most of technical characteristic of application examples 4, same section repeats no more, difference is that the upper chip mount pad 111' of described case type radiator is polygonal prism cone, multiple circuit board 3 is separately positioned on each side of this chip mount pad 111', remove fluorescent material cover, directly in LED chip, apply fluorescent powder grain.
Application examples 6
As shown in figure 12, this application examples is identical with the most of technical characteristic of application examples 1, same section repeats no more, difference is that described case type radiator 2 comprises the first half and the latter half linked together further, described heat-dissipation lamp housing 1 the first half is provided with a plurality of chamber 211, described the first half longitudinally arranges this plurality of chamber 11 along heat-dissipation lamp housing 1, and these a plurality of chambers 211 all can surround the periphery an of the first half.Multiple LED circuit board 3 is separately positioned in this plurality of chamber 211, each chamber 211 towards outward opening correspondence, this diffuser 1' is set.The sidewall of a plurality of chambers 11 of described case type radiator 2 is not fitted each other, spacing is had between this plurality of chamber 211, therefore have multiple heat dissipation passage between this plurality of chamber 11, and the chamber 211 of described heat-dissipation lamp housing adopts metal material to make, good heat dissipation effect.
The latter half is provided with grid type mesh and closes up downwards, heat-dissipation lamp housing be by thickness 1mm to 3mm, containing the raffinal Sheet drawing of aluminium more than 99% after be made into integration, in hollow structure.Multiple LED light module is separately positioned in this plurality of chamber, and the correspondence of opening part outwardly of each chamber arranges a diffuser.
The sidewall of a plurality of chambers of described heat-dissipation lamp housing is not fitted each other, has spacing between this plurality of chamber, therefore has multiple heat dissipation passage between this plurality of chamber, and the chamber of described heat-dissipation lamp housing adopts metal material to make, good heat dissipation effect.Multiple heat dissipation passage is formed between the grid type mesh of described heat-dissipation lamp housing, and the top of heat-dissipation lamp housing is provided with some thermal vias, multiple heat dissipation passage is also form between thermal vias and grid type mesh, the multiple heat dissipation passage strengthened each other, heat Quick diffusing is gone out, reaches good radiating effect further.
Described a plurality of diffuser only accounts for less area, be different from lampshade of the prior art and be generally whole hemisphere face shield, and connect with the metal material of good heat conductivity between a plurality of diffuser of the present invention, also can directly be connected by the heat-dissipation lamp housing of metal material, considerably increase the surface area of metal material, effectively strengthen radiating effect.
Described LED light module can be single LEDs particle, also can be the LED light module of COB encapsulation, can also be the PCBA circuit board of several LEDs particle composition, the surface of this LED particle is covered with fluorescent powder grain.
Described LED light device also comprises plastics power supply shell, and described driving power is arranged in this plastics power supply shell, and therefore, plastics power supply shell shields to driving power, prevents driving power from leaking electricity, the fault such as short circuit and causing danger.This driving power and this plastics power supply shell are arranged in the hollow chamber of heat-dissipation lamp housing 1.
According to the demand of different lighting angles, described LED light module can be placed on the bottom surface of described heat-dissipation lamp housing chamber, on sidewall or in the chamber tilting with predetermined angle, by adjusting position and the adjustable angle lighting angle of LED light module flexibly, the scope of the lighting angle of this LED light module reaches 250-320 degree on vertical section, and the overall range of this plurality of LED light module lighting angle in multiple described chamber can reach 360 degree on horizontal cross-section.LED light device provided by the invention, light emitting region is large and thermal diffusivity is good, and application is wide, goes for each lighting field in productive life.
Be only several specific embodiments of the application above, but the application is not limited thereto, the changes that any person skilled in the art can think of, all should drops in the protection domain of the application.
Claims (18)
1. the preparation method of lamp housing formula radiator in LED light device, is characterized in that, comprise the following steps:
(1) blanking: get thickness at 1mm to 3mm, raffinal sheet material containing aluminium more than 99% by the size designed in advance, this sheet material of stamping-out becomes outline needed for shell; Wherein, whole piece aluminium sheet stamping-out is gone out a heronsbill shape;
(2) punch forming: stamp out the convex-shaped structure that a bottom width top is narrow at the middle part of sheet material;
(3) drawing: Sheet drawing is configured as an open hollow blank;
(4) reducing: the blank after drawing is put into reducing die, carry out process opening being shortened into default lamp housing formula radiator radian, the size making lamp housing formula radiator have an openend is less than the inner chamber of bed-plate dimension.
2. the preparation method of lamp housing formula radiator in LED light device as claimed in claim 1, it is characterized in that, the convex-shaped structure that the middle part of described sheet material stamps out is a conical stage body or polygonal prism taper stage body, and the end face of stage body or prism can be used for laying LED circuit board.
3. the preparation method of lamp housing formula radiator in LED light device as claimed in claim 1, it is characterized in that, the convex-shaped structure stamped out in the middle part of described sheet material is a hemisphere face.
4. the preparation method of lamp housing formula radiator in LED light device as claimed in claim 3, is characterized in that, described hemisphere face stamps out several chambers further, is provided with preset pitch between chamber.
5. in the LED light device as described in any one of Claims 1-4, the preparation method of lamp housing formula radiator, is characterized in that, step (1) comprises further:
Whole piece aluminium sheet stamping-out is gone out a heronsbill shape, and on plank, goes out several circuit board fixing holes and some cable holes.
6. in the LED light device according to any one of Claims 1-4, the preparation method of lamp housing formula radiator, is characterized in that, step (4) comprises further:
Reducing blank after drawing is put into reducing die, and the sidewall of die is consistent with the shape of pre-designed lamp housing formula radiator outer wall;
Blank presses down by push rod from top to bottom, and when housing bottom contacts with reducing female bottom, then reducing completes.
7. the preparation method of lamp housing formula radiator in the LED light device according to any one of Claims 1-4, is characterized in that, also comprise:
(5) blank is oxidized, sprays paint, electroplate at least one of them in interior post-processed and surface treatment.
8. a LED light device, is characterized in that, it comprises heat-dissipation lamp housing, diffuser, LED light module;
Described heat-dissipation lamp housing comprises the chip mount pad in portion disposed thereon further and is arranged on the heat radiation support of its underpart, the heat radiation support of described bottom is hollow housing, described heat radiation support is the back taper hollow shell closed up downwards, the inner chamber making lamp housing formula radiator have an openend size to be less than bed-plate dimension, described chip mount pad is the narrow convex configuration in bottom width top, and top and/or the side of described chip mount pad can arrange LED light module;
Described diffuser is arranged on the junction of these heat-dissipation lamp housing top and the bottom and covers this LED light module;
Described heat-dissipation lamp housing be by thickness 1mm to 3mm, containing the raffinal Sheet drawing of aluminium more than 99% after be made into integration;
A plurality of grid type air vent is provided with around described heat radiation support.
9. LED light device as claimed in claim 8, it is characterized in that, described chip mount pad is taper stage body, on the top that LED light module can be located immediately at this chip mount pad and/or side.
10. LED light device as claimed in claim 9, it is characterized in that, described LED light device also comprises a fluorescent material cover, in the chamber that the top that this fluorescent material covers on this diffuser and this heat-dissipation lamp housing is formed, and be located in described LED light module, described fluorescent material cover is the fluorescent material cover of its inner surface or outer surface fluorescent material, or the fluorescent material cover of himself inner doping fluorescent powder; The colour temperature of the light sent after being mixed with the light of this fluorescent material by the light of this LED light module of concentration adjustment adjusting fluorescent material.
11. LED light device as claimed in claim 8, it is characterized in that, described chip mount pad is polygonal prism cone or cone, and this LED light module a plurality of is separately positioned on each skew back face of this pyramid.
12. LED light device as claimed in claim 8, is characterized in that, be provided with a plurality of grid type air vent around described heat radiation support, form multiple heat dissipation passage between this plurality of grid type air vent.
13. 1 kinds of LED light device, it is characterized in that, it comprises:
One heat-dissipation lamp housing, it is hollow structure, it comprises the first half and the latter half of linking together further, this the first half is provided with a plurality of chamber, the latter half of described heat-dissipation lamp housing is provided with some grid type mesh and closes up downwards, the inner chamber making lamp housing formula radiator have an openend size to be less than bed-plate dimension;
A plurality of diffuser;
A plurality of LED light module, described a plurality of LED light module is separately positioned in this plurality of chamber, the correspondence of opening part outwardly of each chamber arranges a diffuser, described heat-dissipation lamp housing be by thickness 1mm to 3mm, containing the raffinal Sheet drawing of aluminium more than 99% after be made into integration.
14. LED light device as claimed in claim 13, is characterized in that, described the first half longitudinally arranges this plurality of chamber along heat-dissipation lamp housing, and these a plurality of chambers all can surround the periphery an of the first half.
15. LED light device as claimed in claim 14, it is characterized in that, the sidewall of this plurality of chamber is not fitted each other, has spacing between this plurality of chamber, forms multiple heat dissipation passage.
16. LED light device as claimed in claim 13, is characterized in that, form multiple heat dissipation passage between described grid type mesh, described heat-dissipation lamp housing top is provided with some thermal vias, forms multiple heat dissipation passage between this thermal vias and this grid type mesh.
17. LED light device as described in claim 13 or 14, it is characterized in that, described LED light module can be placed on the bottom surface of described heat-dissipation lamp housing chamber, on sidewall or in the chamber tilting with predetermined angle, by adjusting position and the adjustable angle lighting angle of LED light module.
18. LED light device as described in claim 13 or 14, is characterized in that, connected, or directly connected by heat-dissipation lamp housing between described a plurality of diffuser by the material that heat conductivility is good.
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| CN201210194710.3A CN103175178B (en) | 2012-06-08 | 2012-06-08 | The preparation method of lamp housing formula radiator and LED light device |
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| CN201210194710.3A CN103175178B (en) | 2012-06-08 | 2012-06-08 | The preparation method of lamp housing formula radiator and LED light device |
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| CN106764535A (en) * | 2017-02-28 | 2017-05-31 | 浙江英特来光电科技有限公司 | A kind of tunable optical toning LEDbulb lamp |
| CN108687208B (en) * | 2018-05-15 | 2024-05-28 | 浙江晨丰科技股份有限公司 | Lamp heat dissipation aluminum part, processing technology thereof and lamp |
| CN115971443A (en) | 2023-01-16 | 2023-04-18 | 厦门普为光电科技有限公司 | Manufacturing method of common mold of industrial lighting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1079681A (en) * | 1992-08-28 | 1993-12-22 | 王万里 | Cold stamping forming method |
| CN202065729U (en) * | 2011-04-29 | 2011-12-07 | 起运民生照明股份有限公司 | Light-emitting diode (LED) lamp bulb |
| CN102364215A (en) * | 2011-07-26 | 2012-02-29 | 浙江迈勒斯照明有限公司 | Light-emitting diode (LED) candle lamp |
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2012
- 2012-06-08 CN CN201210194710.3A patent/CN103175178B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1079681A (en) * | 1992-08-28 | 1993-12-22 | 王万里 | Cold stamping forming method |
| CN202065729U (en) * | 2011-04-29 | 2011-12-07 | 起运民生照明股份有限公司 | Light-emitting diode (LED) lamp bulb |
| CN102364215A (en) * | 2011-07-26 | 2012-02-29 | 浙江迈勒斯照明有限公司 | Light-emitting diode (LED) candle lamp |
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