CN103175178A - Manufacture method of lamp housing type radiator and light-emitting diode (LED) illuminating device - Google Patents
Manufacture method of lamp housing type radiator and light-emitting diode (LED) illuminating device Download PDFInfo
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- CN103175178A CN103175178A CN2012101947103A CN201210194710A CN103175178A CN 103175178 A CN103175178 A CN 103175178A CN 2012101947103 A CN2012101947103 A CN 2012101947103A CN 201210194710 A CN201210194710 A CN 201210194710A CN 103175178 A CN103175178 A CN 103175178A
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Abstract
The invention provides a manufacture method of a lamp housing type radiator in a light-emitting diode (LED) illuminating device and the LED illuminating device. The manufacture method includes the following steps: (1) blanking, wherein a needed outer contour of a housing is blanked from a high-purity aluminum plate according to a scheduled size, wherein the thickness of the aluminum plate is within 1mm-3mm, and the aluminum plate comprises more than 90% of aluminum; (2) punch forming, wherein an upper convex structure with a wide bottom and a narrow top is punched in the middle portion of the plate; (3) deep drawing, wherein the plate is deep-drawn to form an opened hollow rough part; and (4) necking, wherein the deep-drawn rough part is put in a necking-down female die, and the opening of the rough part is necked down to the scheduled radian of the lamp housing type radiator.
Description
Technical field
The present invention relates to lighting field, relate in particular to preparation method and the LED lighting device of lamp housing formula radiator in a kind of LED lighting device.
Background technology
The light efficiency of traditional incandescent lamp is only about 10 lm/W, and the light efficiency of Halogen lamp LED is that about 30 lm/W, most electric energy all change into dissipation of heat and fall, thereby have wasted a large amount of electric energy.LED is a kind of novel semiconductor lighting technology, more than the light efficiency of LED electroluminescent lamp pearl has generally reached 120lm/W in the market, if arrange in pairs or groups outstanding power supply and rational structural design, more than the light efficiency of LED light fixture can reach 90lm/W.Like this, a 7W can replace the conventional incandescent of 60W to the LED lamp of 9W, thereby save a large amount of electric energy.
Common LED bulb lamp, LED shot-light, LED PAR lamp etc. generally are made of die casting aluminium radiator, hemispheric diffuser or lens module, the circuit board that is welded with LED electroluminescent lamp pearl, LED driving power, lamp holder etc. in the market.Wherein circuit board is fixed on the die casting aluminium radiator and goes up face shield and diffuser or lens module, and the die casting aluminium radiator has a cavity, and the LED driving power is equipped with in the inside.
A kind of LED ball bubble radiator and LED bulb lamp are disclosed in 201120220556.9.LED bulb lamp radiator comprises the installation heat transfer part that is positioned at end face, the radiating part of side and the installation location division of lower end, radiating part comprises complex root heat sink strip longitudinally, the upper end of heat sink strip is connected with the installation heat transfer part, and the lower end consists of installs the location division, is reserved with the gap between adjacent heat sink strip.Although have certain thermal diffusivity,, whole radiator is not made into integration, and cost compare is high.
Be to disclose a kind of bulb lamp in 201020666630.X at application number, comprise diffuser and be connected the lamp holder that is connected with power supply, also comprise the heat abstractor that is arranged between lamp holder and diffuser, be provided with the cavity that passes through for the air turnover in the middle of heat abstractor, the heat abstractor two ends are provided with the space for the air turnover, the maximum characteristics of this patent are that heat abstractor is provided with air-flow cavity and turnover gas space, walk the heat of heat sink interior for air turnover fluxion strap and accelerate radiating rate.
Disclose a kind of LED bulb lamp heat radiator in 201120086659.5, this radiator structure that is formed in one has body and cooling platform, and this body is hollow structure, has a plurality of thermal convection holes.This heat sink applications is in energy-saving LED bulb lamp class, and body is the important component part of whole bulb lamp outward appearance, is also the LED radiator simultaneously.Material adopts the aluminium of high thermal conductivity, passive free convection wind heat dissipation design simultaneously, allow whole lamp heat radiation more at a high speed.The disclosed radiator of this patent has very strong thermal diffusivity, and still, this radiator is that die casting aluminium is made, and this production method is wasted material very much, and weight ratio is heavier, and cost is higher.The thermal conductivity of die casting aluminium is in 88% left and right, and thermal diffusivity is not good.The most important thing is, it comprises inner and outer wall, and a plurality of holes formation passages that arrange on the heat radiation strip hole that outer wall is laid along radial parallel and cooling platform dispel the heat away the heat on circuit board in theory.But because circuit board is to be fitted on cooling platform, the heat of circuit board can first conduct to the space of inwall formation by the die casting aluminium of cooling platform, comes out heat with the power supply that is positioned at inner wall space and forms mutual baking, and namely influences each other.
In sum, there is following shortcoming in existing LED lighting device:
At first, the cost of lamp housing is higher, often accounts for more than 30% of whole LED bulb lamp cost.No matter existing lamp housing is the lamp housing that adopts traditional die casting aluminium lamp housing still to adopt the aluminium of aforementioned high thermal conductivity to make, cost is all higher, in addition, no matter be traditional die casting aluminium lamp housing or adopting aforementioned section bar aluminium is to adopt conventional material thickness to make, weight is heavier, and the weight of lamp housing has directly determined the weight of whole LED bulb lamp, causes thus the weight decline difficulty of whole LED bulb lamp large.
Secondly, the power supply of lamp often is enclosed in a plastic housing, and plastic housing is enclosed in again in the cavity of aluminium lamp housing, and the heat of circuit board conducts in the cavity of aluminium lamp housing, this heat that can cause power supply and lamp source heat-dissipating to send influences each other, cause the power supply internal temperature very high, easily damage, more than observed temperature reaches 80 degree.
At last, shell comprises inner and outer wall, and whole making is complicated, and the weight ratio of whole radiator is heavier, cost is higher.
And, the housing manufacturing process of existing LED lighting device, this process is made complicated.
Summary of the invention
The object of the present invention is to provide the preparation method of lamp housing formula radiator in a kind of LED lighting device, to solve the existing technical problem that LED lighting device weight is heavier, thermal diffusivity is not good, cost is high.
The second purpose of the present invention is to provide a kind of LED lighting device, to solve the existing technical problem that LED lighting device weight is heavier, thermal diffusivity is not good, cost is high.
The preparation method of lamp housing formula radiator in a kind of LED lighting device comprises the following steps:
(1) blanking: by in advance the design size get thickness at 1mm to 3mm, contain the raffinal sheet material of aluminium more than 99%, this sheet material of stamping-out becomes the required outline of shell;
(2) pull and stretch: Sheet drawing is configured as an open hollow blank;
(3) reducing: the blank after pull and stretch is put into the reducing die, carry out opening is shortened into the processing of default lamp housing formula radiator radian.
Preferably, also comprise between step (1) and step (2): the first punch forming: stamp out one at the middle part of sheet material for the depressed area that contacts with the circuit board face, form the binding face that can fit tightly the LED circuit plate in the depressed area.
Preferably, also comprise between step (1) and step (2): the second punch forming: stamp out a narrow convex-shaped structure in bottom width top at the middle part of sheet material.
Wherein, the convex-shaped structure that the middle part of described sheet material stamps out can be a conical stage body or polygonal prism taper stage body, and the end face of stage body or prism can be used for laying the LED circuit plate.The convex-shaped structure that described sheet material middle part stamps out can also be a hemisphere face, further stamps out several chambers on described hemisphere face, is provided with default spacing between chamber.
Step (1) further comprises: whole piece aluminium sheet stamping-out is gone out a heronsbill shape, and go out several circuit board fixing holes and some cable holes on plank.Step (3) further comprises: the reducing blank after pull and stretch is put into the reducing die, and the sidewall of die is consistent with the shape of pre-designed lamp housing formula radiator outer wall; Push rod presses down blank from top to bottom, when housing bottom and reducing die bottom contacts reducing complete.
The method also comprises: (4) are carried out oxidation, are sprayed paint, electroplate at least one of them post-processed and surface treatment blank.
And, select the different thickness of raffinal sheet material according to the model size of LED lighting device, the LED lighting device is larger, and the thickness of high-purity aluminium sheet is thicker.
Lamp housing formula radiator in a kind of lighting device, at 1mm to 3mm, be made into integration after containing the raffinal Sheet drawing of aluminium more than 99% by thickness, be hollow bulb, it is comprised of radiating surface and outer cover body, form surface contact structure between radiating surface and circuit board, the heat radiation through hole that can form heat dissipation channel is set on outer cover body.
Preferably, the heat radiation strip hole of the heat radiation through hole that arranges on outer cover body for laying along the outer shell outer wall radial parallel.Outer cover body is a frustum by shrinking gradually to the other end with this end of circuit board joint face.
A kind of LED lighting device is characterized in that, comprising: optical mirror slip, lamp housing formula radiator, circuit board, LED drive unit, wherein,
Lamp housing formula radiator is at 1mm to 3mm, be made into integration after containing the raffinal Sheet drawing of aluminium more than 99% by thickness, it is hollow bulb, it is comprised of described lamp housing formula radiator radiating surface and outer cover body, form surface contact structure between radiating surface and circuit board, the heat radiation through hole that can form heat dissipation channel is set on outer cover body;
Optical mirror slip is arranged on the front end of lamp housing formula radiator, and the LED drive unit is arranged in lamp housing formula radiator or its rear end is set.
Preferably, heat dissipation channel one: heat conducts to radiating surface by circuit board and heat radiation after plane-plane contact, then dispels the heat away by the heat radiation through hole from radiating surface; Heat dissipation channel two: heat distributes from the LED drive unit, then dispels the heat away by the heat radiation through hole; Heat dissipation channel one and heat dissipation channel two are independent of one another.
In heat dissipation channel one, thereby heat is mainly surface by housing and air to carry out thermal convection current dissipation of heat is gone out, and can smooth and easy convection current strengthen radiating effect thereby the existence of heat radiation through hole can guarantee air.And in heat dissipation channel two, thereby heat is gone out dissipation of heat from carrying out thermal convection current by power supply shell surface and air again the LED drive unit is transmitted to power supply shell surface by high-heat-conductivity glue water after, thereby the existence of heat radiation through hole can guarantee that air can smooth and easy convection current enhancing radiating effect.Passage one and passage two can conduct heat to air swimmingly and not accumulate in lamp interior, and radiating effect is outstanding, and these two heat dissipation channels independently are independent of each other.The described optical mirror slip even smooth optical mirror slip of employing or secondary light-distribution optical mirror slip can be screwed or glue is bonded on lamp housing formula radiator.Circuit board is a module that the bottom is smooth, and this bottom is carried out face with radiating surface and contacted, the joint place coating high thermal conductivity silicone grease of preferred two faces.Described LED drive module setting in the cavity of power supply shell, inner high heat conduction, the good glue of insulation of filling with of power supply shell.
The preparation method of lamp housing formula radiator in the second LED lighting device comprises the following steps:
(1) blanking, by in advance the design size get thickness at 1mm to 3mm, contain the raffinal sheet material of aluminium more than 99%, this sheet material of stamping-out becomes the required outline of shell;
(2) spinning for the first time becomes an open hollow part with raffinal sheet material spinning, and the size of the openend of the blank after spinning is more than or equal to the size of closed end;
(3) spinning for the second time adopts a kind of comparatively spinning process to process to the blank through above step process, its opening part diameter is diminished, and opening is spun into the radian of design.
Preferably, also comprise between step (1) and step (2): punch forming: stamp out one at the middle part of sheet material for the depressed area that contacts with the circuit board face, form the binding face that can fit tightly the LED circuit plate in the depressed area.
Preferably, also comprise between step (1) and step (2): the second punch forming: stamp out a narrow convex-shaped structure in bottom width top at the middle part of sheet material.
Wherein, the convex-shaped structure that the middle part of described sheet material stamps out can be a conical stage body or polygonal prism taper stage body, and the end face of stage body or prism can be used for laying the LED circuit plate.The convex-shaped structure that described sheet material middle part stamps out can also be a hemisphere face, further stamps out several chambers on described hemisphere face, is provided with default spacing between chamber.
A kind of LED lighting device, it comprises heat-dissipation lamp housing, diffuser, LED light emitting module;
Described heat-dissipation lamp housing further comprises the chip mount pad of section disposed thereon and is arranged on the heat radiation support of its underpart, the heat radiation support of described bottom is hollow housing, described chip mount pad is the narrow convex configuration in bottom width top, and described top and/or side can arrange the LED light emitting module;
Described diffuser is arranged on the junction of this heat-dissipation lamp housing top and the bottom and covers this LED light emitting module.
Described heat-dissipation lamp housing is at 1mm to 3mm, be made into integration after containing the raffinal Sheet drawing of aluminium more than 99% by thickness.
Described chip mount pad is the taper stage body, and the LED light emitting module can be located immediately on the top and/or side of this chip mount pad.
Described LED lighting device also comprises a fluorescent material cover, this fluorescent material covers in the chamber that the top of this diffuser and this radiating shell forms, and be located on described LED light emitting module, described fluorescent material cover is the fluorescent material cover that its inner surface or outer surface apply fluorescent material, perhaps the fluorescent material cover of himself inner doping fluorescent powder; The colour temperature of the light of this LED light emitting module of concentration adjustment by adjusting fluorescent material and the light that sends after the light of this fluorescent material mixes.
Described chip mount pad is polygonal prism cone or cone, and a plurality of these LED light emitting modules are separately positioned on each skew back face of this pyramid.
Described heat radiation support is the back taper hollow shell that closes up downwards, is provided with a plurality of grid type air vents around this heat radiation support, forms the multiple heat dissipation passage between these a plurality of grid type air vents.
A kind of LED lighting device, it comprises:
One heat-dissipation lamp housing, it is hollow structure, and it further comprises the first half and the latter half that links together, and this first half is provided with a plurality of chambers;
A plurality of diffusers;
A plurality of LED light emitting modules, described a plurality of LED light emitting module is separately positioned in these a plurality of chambers, the correspondence of opening part outwardly of each chamber arranges a diffuser, and described heat-dissipation lamp housing is at 1mm to 3mm, be made into integration after containing the raffinal Sheet drawing of aluminium more than 99% by thickness.
Described the first half vertically arranges these a plurality of chambers along heat-dissipation lamp housing, and all these a plurality of chambers can surround the periphery an of the first half.
The sidewall of these a plurality of chambers is not fitted each other, between these a plurality of chambers, spacing is arranged, and forms the multiple heat dissipation passage.
The latter half of described heat-dissipation lamp housing is provided with several grid type mesh and closes up downwards, forms the multiple heat dissipation passage between this grid type mesh.
Described heat-dissipation lamp housing top is provided with some heat radiation through holes, forms the multiple heat dissipation passage between this heat radiation through hole and this grid type mesh.
Described LED light emitting module can be placed on the bottom surface of described heat-dissipation lamp housing chamber, on sidewall or be tilting in chamber with predetermined angle, by adjusting position and the adjustable angle lighting angle of LED light emitting module.
Connected by the good material of heat conductivility between described a plurality of diffuser, perhaps directly connected by heat-dissipation lamp housing.
Compared with prior art, the present invention has following beneficial effect:
At first, in the LED lighting device, the preparation method of lamp housing formula radiator is to adopt by thickness at 1mm to 3mm, be made into integration after containing the raffinal Sheet drawing of aluminium more than 99%, so lamp housing formula radiator of the present invention only need adopt the material of die casting aluminium housing 1/3 to 1/5 just can reach the radiating effect the same, even more outstanding with die casting aluminium, cost is only 1/2 to 1/3 of die casting aluminium housing simultaneously.Contain aluminium its thermal diffusivity of raffinal sheet material more than 99% up to more than 230, greatly strengthen than the thermal diffusivity of die casting aluminium and section bar aluminium, and the weight of the lighting device of making of this housing is less than half of the lamp of making of die cast.And the material that aluminium plate uses is also few, has also reduced cost simultaneously.Therefore, LED illuminating product cheaper of the present invention, quality is lighter, is fit to use in various occasions, namely is applicable to the various types of lighting devices of various models.
Then, the face way of contact by a whole plane close contact between circuit board and lamp housing formula radiator contacts, and the heat that circuit board produces can be dispersed into rapidly in air by the high-purity aluminum hull of high thermal conductivity, and radiating effect is outstanding.
Subsequently, two thermals source of LED electroluminescent lamp pearl and LED drive unit separately can not produce the heat localization phenomenon.That is, heat dissipation channel one: heat conducts to radiating surface by circuit board and heat radiation after plane-plane contact, then dispels the heat away by the heat radiation through hole from radiating surface; Heat dissipation channel two: heat distributes from the LED drive unit, then dispels the heat away by the heat radiation through hole; Heat dissipation channel one and heat dissipation channel two are independent of one another, do not have the problem of the heat radiation that influences each other.
At last, the light efficiency of LED electroluminescent lamp pearl is high, and more than reaching 100lm/W, and power supply conversion efficiency is very up to more than 90%, than ordinary incandescent lamp saves energy greatly, only needs 7 to 9W, just can reach the brightness of the above incandescent lamp of traditional 50W.
Description of drawings
Fig. 1 is a kind of LED illuminating product explosive view;
Fig. 2 is lamp housing formula heat spreader structures schematic diagram;
Fig. 3 A is the schematic diagram of the blank after blanking;
Fig. 3 B is the schematic diagram of the blank after the first punch forming;
Fig. 3 C is the schematic diagram of the blank after pull and stretch;
Fig. 3 D is the deep-drawing technique schematic diagram;
Fig. 3 E is the necking down process schematic diagram;
Fig. 3 F is the schematic diagram of the hair accessory after the second punch forming;
Fig. 3 G is the schematic diagram of the blank spare after the third punch forming;
Fig. 3 H is the schematic diagram of the 4th kind of blank spare after punch forming;
Fig. 3 I is the schematic diagram of the blank spare after Fig. 3 H two times punch;
Fig. 4 A is the schematic diagram of the blank after blanking;
Fig. 4 B is the schematic diagram of the blank after stamping;
Fig. 4 C is spinning process schematic diagram for the first time;
Fig. 4 D is spinning process schematic diagram for the second time;
Fig. 5 is LED bulb lamp schematic diagram;
Fig. 6 is LED PAR lamp explosive view;
Fig. 7 is LED PAR lamp schematic diagram;
Fig. 8 is the MR16 schematic diagram of a LED;
Fig. 9 is the MR16 explosive view of a LED;
Figure 10 is the bulb lamp heat-dissipation lamp housing part-structure schematic diagram of application examples 4;
Figure 11 is the bulb lamp heat-dissipation lamp housing part-structure schematic diagram of application examples 5;
Figure 12 is the bulb lamp heat-dissipation lamp housing part-structure schematic diagram of application examples 6.
The specific embodiment
Describe the present invention in detail below in conjunction with accompanying drawing.
See also Fig. 1, a kind of LED illuminating product comprises optical mirror slip 1, lamp housing formula radiator 2, circuit board 3, LED drive unit 4, power supply shell 5, lamp holder 6.
The optical mirror slip 1 high material of preferred light transmitance is made, as PC, PMMA, glass, lucite etc.Its effect is according to unusual two kinds of secondary light-distribution, the even light that are divided into of light fixture kind.The secondary light-distribution optical mirror slip plays to the light that the LED light emitting module of LED electroluminescent lamp pearl or integration packaging sends the effect of redistributing, and makes the hot spot of receiving plane become the shape that circular light spot, rectangular light spot etc. need arbitrarily.One or more than one luminous intensity distribution unit are arranged on the secondary light-distribution optical mirror slip.Even smooth optical mirror slip plays the effect of evenly dispersing to the light that LED electroluminescent lamp pearl sends, and generally the surface of even smooth optical mirror slip is carried out coarse processing or add even stimulative substance inside lens materials.Optical mirror slip 1 can be screwed or glue is bonded on lamp housing formula radiator 2.
Lamp housing formula radiator 2 by whole piece thickness 1mm to 3mm, contain the high-purity aluminium sheet manufacturing of aluminium more than 99% and form.Tradition LED bulb lamp or LED PAR lamp adopt die casting aluminium lamp housing formula radiator mostly, and the thermal conductivity factor of die casting aluminium is only the 95W/mK left and right.The present invention has proposed to adopt high-purity aluminium sheet pull and stretch to make the technology of LED lamp shell formula radiator with innovating.The thermal conductivity factor of raffinal is about the 237W/mK left and right, 2.5 times of common die casting aluminium, so lamp housing formula radiator of the present invention only need adopt the material of die casting aluminium housing 1/3 to 1/5 just can reach the radiating effect the same, even more outstanding with die casting aluminium, cost is only 1/2 to 1/3 of die casting aluminium housing simultaneously.The bulb lamp weight of making of this housing is less than half of the lamp of making of die cast.
Such as, light trade is commonly used 1050,1060,1,070 three kinds of high-purity aluminium sheets.The thermal conductivity factor of fine aluminium is 237 W/m.K, and the aluminum content of 1050 aluminium sheets is 99.5%, and thermal conductivity factor is 209W/m.K, and the aluminum content of 1060 aluminium sheets is 99.6%, and thermal conductivity factor should be between 1050 aluminium sheets and 1070 aluminium sheets.The aluminum content of 1070 aluminium sheets is 99.7%, thermal conductivity factor 226 W/m.K.The thermal conductivity factor of this high-purity aluminium sheet will be far away higher than the thermal conductivity factor of the about 209W/m.K of section bar aluminium, and more higher than the thermal conductivity factor about die casting aluminium 95 W/m.K, therefore radiator of the present invention has splendid radiating effect.
Traditional die casting aluminium LED bulb lamp or PAR lamp, circuit board often go out often only has the fraction area to contact with lamp housing formula radiator 2, and this causes heat successfully not conduct to lamp housing formula radiator 2 from circuit board 3.It is comprised of lamp housing formula radiator of the present invention 2 radiating surface 21 and outer cover body 22, forms surface contact structure between radiating surface 21 and circuit board 3, and the heat radiation through hole that can form heat dissipation channel is set on outer cover body 22.The heat radiation through hole that arranges on outer cover body 22 is the heat radiation strip hole 23 of laying along the outer shell outer wall radial parallel, and in addition, outer cover body 22 is shunk to the opposite end gradually by radiating surface 21 these ends, is a frustum.Radiating surface 21 is smooth one side, or goes out a burnishing surface to lower recess, is used for contacting with circuit board 3.Several circuit board fixing holes 25 and a cable hole 24 are set on radiating surface 21.
Radiating surface 21 is smooth one side, or goes out a burnishing surface to lower recess, thereby this design can fit tightly with the bottom of smooth circuit board 3, can apply high thermal conductive silicon fat between circuit board 3 and lamp housing formula radiator 2 and also can not apply.The heat of circuit board 3 passes to rapidly on lamp housing formula radiator 2, plays good radiating effect.On the outer cover body 22 of lamp housing formula radiator 2, surrounding has been excised the part material, obtains the housing of a hollow out, and heat radiation strip hole 23 namely is set.The heat of lamp housing formula radiator 2 can be at unobstructed thermal cycle passage of the inside and outside formation of lamp housing formula radiator of hollow out like this.Lamp housing formula radiator 2 is formed by a larger metallic plate drawing and forming of surface area, circuit board 3 is fixed on can takes full advantage of housing larger surface on lamp housing formula radiator 2 and effectively dispel the heat, the heat that LED is produced is transmitted to rapidly on lamp housing formula radiator 2 from circuit board 3 and then is transmitted to air.
Lamp holder 6 is generally the lamp holder of standard, as the E27 screw socket etc., but also can customize according to actual needs.
Below specifically introduce the concrete manufacturing process of the first lamp housing formula radiator:
The process of lamp housing formula radiator (2) mainly is divided into the following steps:
1. blanking (as shown in Figure 3A).Utilize stamping-out, the unwanted part of sheet material excision, obtain required outline.As shown in Figure 3A, whole piece aluminium sheet stamping-out is gone out a heronsbill shape, and go out several circuit board fixing holes and a cable hole on plank.Also have, select the different thickness of raffinal sheet material according to the model size of LED lighting device, the LED lighting device is larger, and the thickness of high-purity aluminium sheet is thicker.Thickness increases, and its sectional area increases, and the biography speed of heat also increases, and makes radiating effect higher.Perhaps, the LED lighting device requires higher to thermal diffusivity, and the thickness of employing is also thicker.
2. stamping (as shown in Fig. 3 B, 3F-3I).Stamp out the shape that needs in the sheet material middle part with a finishing die, this shape can be a depressed area that contacts with the circuit board face, can be also that a bottom width is pushed up narrow upper convex stage body structure or hemisphere face structure.Also can carry out two times punch according to concrete topology requirement, be exactly to carry out in the hemisphere face structure of Fig. 3 H forming a plurality of chamber structures after two times punch as Fig. 3 I.Adopt different moulds plate forming can be gone out required various structures.
3. pull and stretch (as shown in Figure 3 C).Be an open hollow part (as Fig. 3 D) with the metallic plate drawing and forming.This moment, this blank was a cylindrical shape, and the diameter at its two is the same.As Fig. 3 D, die 31 is fixing, then will treat that pull and stretch blank 32 is fitted on the upper surface of pull and stretch punch 33, with pull and stretch punch 33 with treat that pull and stretch blank 32 heads in die 31, blank namely is shaped to an equirotal straight-cylindrical part in two ends with push rod 34.Only below a kind of implementation of drawing and forming, this mode be not limit to of the present invention.
4. reducing (as shown in Fig. 3 E).The opening part of straight-cylindrical blank is carried out the reducing processing, its opening part diameter is diminished, and opening is shortened into the radian of pre-design.As Fig. 3 E, the reducing blank after pull and stretch is put into reducing die 42, the sidewall of die 42 is just the shape of lamp housing formula radiator 2 outer walls that design.Push rod 41 presses down blank from top to bottom.Housing bottom when reducing die 42 bottoms contact reducing complete.
5. post-production and surface treatment.After reducing is completed, to blank carry out oxidation, spray paint, the surface treatment such as plating, can not process yet.
Below introduce the concrete manufacturing process of the second lamp housing formula radiator:
Below this method step 3,4,5th, key step, the order can not change.
The process of lamp housing formula radiator mainly is divided into the following steps:
1. blanking (as shown in Fig. 4 A).Utilize stamping-out, the unwanted part of sheet material excision, obtain required outline.As shown in Fig. 4 A, go out several circuit board fixing holes and a cable hole on plank.
2. stamping (as shown in Figure 4 B).On lamp housing 2, the part of fixing circuit board and fixed optics eyeglass is a depressed area, needs to extrude with a punch head shape that needs.
3. spinning (as shown in Fig. 4 C) for the first time.Metallic plate spinning is become an open hollow part.The size of the openend of the blank after spinning is more than or equal to the size of closed end.As Fig. 4 C, treat that the ground of spinning blank 51 and the end face of spinning block 52 fit tightly together, and together around A axle High Rotation Speed.Then withstand with push rod 53 and treat that spinning blank 51 makes and treat that spinning blank 51 and spinning block 52 all fit tightly together.Treat that the spinning blank just has been made into the open hollow part.
4. spinning (as shown in Fig. 4 D) for the second time.Adopt a kind of comparatively special spinning process to process to the blank through above step process, its opening part diameter is diminished, and opening is spun into the radian of pre-design.As Fig. 4 D, the side radian of eccentric spinning block 63 is just in time the radian of needed raffinal housing side.Blank 62 is done rotation around axle P, and eccentric spinning block 63 is also revolving round the sun around axle P when doing rotation around axle Q.Then the sidewall of push rod 61 blanks fits tightly the sidewall of blank 62 and the sidewall of eccentric spinning block 63.After spinning is completed, the taking-up product gets final product.Using this comparatively special spinning process is for product successfully being taken off from mould.
5. stamping-out.Process carrying out stamping-out through the side of the blank of above step process, remove and want the part removed, obtain the raffinal housing of hollow out.
6. post-production and surface treatment.At last, to blank carry out oxidation, spray paint, the surface treatment such as plating, can not process yet.
Application examples:
Application examples 1:
As Fig. 5, it is depicted as a LED bulb lamp schematic diagram.This LED bulb lamp is the bulb lamp that 220v exchanges input, E27 screw socket, can be used for replacing traditional 220V input incandescent lamp.At first the input line that 220V is exchanged the LED driver module of input, direct current output is passed power supply shell 5, input line is welded on the both positive and negative polarity of E27 lamp holder.Then the E27 lamp holder is pressed on power supply shell 5.LED driver module 4 is filled in the cavity of power supply shell 5, the good glue of perfusion thermal conductivity is placed a period of time and is waited for that the glue solidifies again.After the glue solidifies, the output line of LED driver module 4 is passed the cable hole of lamp housing formula radiator 2, then the stitch of lamp housing formula radiator 2 is inserted in corresponding hole, power supply shell 5 outsides, and fix with glue.Again circuit board 3 is screwed on metal shell, and the output line of LED driver module 4 is welded on circuit board 3.At last hemispherical, optical mirror slip 1 use glue with even light action are fixed on lamp housing formula radiator 2.Assembling has just been completed.
This LED bulb lamp is 220V, and 50Hz family expenses alternating current is inputted, and has the E27 lamp holder of standard, can replace easily existing family expenses incandescent lamp.
Application examples 2
Be a LED PAR lamp schematic diagram as shown in Figure 6 and Figure 7.This LED PAR lamp is the PAR lamp that 220v exchanges input, E27 screw socket.At first the input line that 220V is exchanged the LED driver module of input, direct current output is passed power supply shell 5, input line is welded on the both positive and negative polarity of E27 lamp holder.Then the E27 lamp holder is pressed on power supply shell 5.LED driver module 4 is filled in the cavity of power supply shell 5, the good glue of perfusion thermal conductivity is placed a period of time and is waited for that the glue solidifies again.After the glue solidifies, the output line of LED driver module 4 is passed the cable hole of metalized lamp shell-type radiator 2, then the stitch of lamp housing formula radiator 2 is inserted in corresponding hole, power supply shell 5 outsides, and fix with glue.Again circuit board 3 is screwed on metal shell, and the output line of LED driver module 4 is welded on circuit board 3.At last the optical mirror slip 1 with optically focused effect is screwed on lamp housing formula radiator 2.Assembling has just been completed.
This LED PAR lamp is 220V, and 50Hz family expenses alternating current is inputted, and has the E27 lamp holder of standard, can replace easily existing PAR lamp.
Application examples 3
One .MR16 embodiment
As Fig. 8 and Fig. 9, it is depicted as the MR16 schematic diagram of a LED.This LED MR16 is the input of 12V direct current, GU10 lamp holder, and power supply shell and lamp holder are injection molded into for one, can be used for replacing traditional 12V input MR16.Welded 3 LEDs electroluminescent lamp pearls on the circuit board of this MR16, three secondary light-distribution unit have been arranged on optical mirror slip 1, the effect that the light that these three luminous intensity distribution unit send each LED electroluminescent lamp pearl plays to converge.At first the input line of LED driver module is passed power supply shell 5, input line is welded on the both positive and negative polarity of lamp holder.Then LED driver module 4 is filled in the cavity of power supply shell 5, the good glue of perfusion thermal conductivity is placed a period of time and is waited for that the glue solidifies.After the glue solidifies, the output line of LED driver module 4 is passed the cable hole of lamp housing 2, then the stitch of lamp housing 2 is inserted in corresponding hole, power supply shell 5 outsides, and fix with glue.Again circuit board 3 is screwed on metal shell, and the output line of LED driver module 4 is welded on circuit board 3.At last the optical mirror slip 1 with optically focused effect is screwed on lamp housing 2.Assembling has just been completed.
This LED MR16 is the input of 12V direct current, and has the GU10 lamp holder of standard, can replace easily the MR16 of traditional employing based on halogen bulb.
Application examples 4
As shown in figure 10, this application examples is identical with the most of technical characterictic of application examples 1, same section repeats no more, difference is that described case type radiator 2 further comprises the chip mount pad 111 and the heat radiation support 112 that is arranged on its underpart of section disposed thereon, this top connects this bottom, these top and the bottom can be integral structure or detachable movable connection structure, and concrete connected mode can be and is threaded, the multiple connected modes such as buckle connection.The taper stage body that described chip mount pad 111 is epirelief (circular cone or multiaspect pyramid and similar structures thereof), described circuit board 3 is arranged on the top of this chip mount pad 111, establish a fluorescent material cover 15 in circuit board 3 upper covers, fluorescent material cover 15 is hemispherical, inner surface or the outer surface of described fluorescent material cover 15 are coated with fluorescent material, perhaps himself inner doping fluorescent powder.
Described LED light emitting module is arranged on the top of this chip mount pad; Described heat radiation support is the back taper hollow shell that closes up downwards, be provided with a plurality of grid type air vent 112a around this heat radiation support, form the multiple heat dissipation passage between these a plurality of grid type air vents, surrounding air can effectively form convection current, takes away rapidly heat.
Described diffuser is arranged on the junction of this heat-dissipation lamp housing top and the bottom and covers this LED light emitting module.Described heat-dissipation lamp housing be by thickness at 1mm to 3mm, be made into integration after containing the raffinal Sheet drawing of aluminium more than 99%, be hollow structure.
Described LED light emitting module can be single particle, can be also the light emitting module of COB encapsulation, can also be the PCBA circuit board that some particles form, and what send is blue light.
Described fluorescent material covers in the chamber that the top of this diffuser and this radiating shell forms, and is located on described LED light emitting module, is hemispherical dome structure.Inner surface or the outer surface of described fluorescent material cover are coated with fluorescent material, perhaps himself inner doping fluorescent powder; The blue-light excited fluorescent material that the LED light emitting module sends sends gold-tinted.Blue light and yellow light mix obtain white light.The ratio that can regulate gold-tinted and blue light by the concentration of regulating fluorescent material obtains the white light of different-colour.Fluorescent material is arranged on fluorescent material cover away from LED chip, can prevents that the heat that heat that chip produces and fluorescent powder grain produce from forming stack, good heat dissipation effect, the life-span is long.After increasing the fluorescent material cover, photochromic high conformity.
Described LED lighting device also comprises driving power and plastics power supply shell; this driving power is arranged in this plastics power supply shell; this plastics power supply shell shields to driving power, prevents the faults such as driving power leaks electricity, short circuit and causes danger, and strengthens the security of described LED lighting device.This driving power and this plastics power supply shell are arranged in the hollow housing of heat-dissipation lamp housing.
The LED lighting device can be 360 degree at the lighting angle of horizontal cross-section, at the lighting angle α of vertical section between 250～320 degree.
LED lighting device provided by the invention, light emitting region is large and thermal diffusivity good, and application is wide, goes for each lighting field in productive life.And as disclosed in the first embodiment, fluorescent material is arranged on fluorescent material cover away from LED chip, can prevent that the heat that heat that chip produces and fluorescent powder grain produce from forming stack, good heat dissipation effect, the life-span is long.After increasing the fluorescent material cover, photochromic high conformity.
Application examples 5
As shown in figure 11, this application examples is identical with the most of technical characterictic of application examples 4, same section repeats no more, difference is that the upper chip mount pad 111' of described case type radiator is the polygonal prism cone, a plurality of circuit boards 3 are separately positioned on each side of this chip mount pad 111', remove the fluorescent material cover, directly apply fluorescent powder grain on LED chip.
Application examples 6
As shown in figure 12, this application examples is identical with the most of technical characterictic of application examples 1, same section repeats no more, difference is that described case type radiator 2 further comprises the first half and the latter half that links together, described heat-dissipation lamp housing 1 the first half is provided with a plurality of chambers 211, described the first half vertically arranges these a plurality of chambers 11 along heat-dissipation lamp housing 1, and all these a plurality of chambers 211 can surround the periphery an of the first half.A plurality of LED circuit plates 3 are separately positioned in these a plurality of chambers 211, each chamber 211 towards the outward opening correspondence, this diffuser 1' is set.The sidewall of a plurality of chambers 11 of described case type radiator 2 is not fitted each other, between these a plurality of chambers 211, spacing is arranged, therefore between this a plurality of chambers 11, the multiple heat dissipation passage is arranged, and the chamber 211 employing metal materials of described heat-dissipation lamp housing make, good heat dissipation effect.
The latter half is provided with the grid type mesh and closes up downwards, heat-dissipation lamp housing be by thickness at 1mm to 3mm, be made into integration after containing the raffinal Sheet drawing of aluminium more than 99%, be hollow structure.A plurality of LED light emitting modules are separately positioned in these a plurality of chambers, and the correspondence of opening part outwardly of each chamber arranges a diffuser.
Therefore the sidewall of a plurality of chambers of described heat-dissipation lamp housing is not fitted each other, between these a plurality of chambers, spacing is arranged, and between this a plurality of chambers, the multiple heat dissipation passage is arranged, and the chamber of described heat-dissipation lamp housing employing metal material makes, good heat dissipation effect.Form the multiple heat dissipation passage between the grid type mesh of described heat-dissipation lamp housing, and the top of heat-dissipation lamp housing is provided with some heat radiation through holes, also formed the multiple heat dissipation passage between heat radiation through hole and grid type mesh, the multiple heat dissipation passage of strengthening each other, the heat Quick diffusing is gone out, further reach good radiating effect.
Described a plurality of diffuser only accounts for less area, be different from lampshade of the prior art and be generally whole hemisphere face shield, and the metal material with good heat conductivity between a plurality of diffuser of the present invention connects, also can be directly connected by the heat-dissipation lamp housing of metal material, greatly increase the surface area of metal material, effectively strengthened radiating effect.
Described LED light emitting module can be single LEDs particle, can be also the LED light emitting module of COB encapsulation, can also be the PCBA circuit board that several LEDs particles form, and is covered with fluorescent powder grain on the surface of this LED particle.
Described LED lighting device also comprises plastics power supply shell, and described driving power is arranged in this plastics power supply shell, and therefore, plastics power supply shell shields to driving power, prevents the faults such as driving power leaks electricity, short circuit and causes danger.This driving power and this plastics power supply shell are arranged in the hollow chamber of heat-dissipation lamp housing 1.
Demand according to different lighting angles, described LED light emitting module can be placed on the bottom surface of described heat-dissipation lamp housing chamber, on sidewall or be tilting in chamber with predetermined angle, position and adjustable angle lighting angle by flexible adjustment LED light emitting module, the scope of the lighting angle of this LED light emitting module reaches the 250-320 degree on vertical section, the overall range of these a plurality of LED light emitting module lighting angles in a plurality of described chambers can reach 360 degree on the horizontal cross-section.LED lighting device provided by the invention, light emitting region is large and thermal diffusivity good, and application is wide, goes for each lighting field in productive life.
Above disclosed be only several specific embodiments of the application, but the application is not limited thereto, the changes that any person skilled in the art can think of all should drop in the application's protection domain.
Claims (18)
1. the preparation method of lamp housing formula radiator in a LED lighting device, is characterized in that, comprises the following steps:
(1) blanking: by in advance the design size get thickness at 1mm to 3mm, contain the raffinal sheet material of aluminium more than 99%, this sheet material of stamping-out becomes the required outline of shell;
(2) punch forming: stamp out a narrow convex-shaped structure in bottom width top at the middle part of sheet material;
(3) pull and stretch: Sheet drawing is configured as an open hollow blank;
(4) reducing: the blank after pull and stretch is put into the reducing die, carry out opening is shortened into the processing of default lamp housing formula radiator radian.
2. the preparation method of lamp housing formula radiator in LED lighting device as claimed in claim 1, it is characterized in that, the convex-shaped structure that the middle part of described sheet material stamps out is a conical stage body or polygonal prism taper stage body, and the end face of stage body or prism can be used for laying the LED circuit plate.
3. the preparation method of lamp housing formula radiator in LED lighting device as claimed in claim 1, is characterized in that, the convex-shaped structure that stamps out in the middle part of described sheet material is a hemisphere face.
4. the preparation method of lamp housing formula radiator in LED lighting device as claimed in claim 3, is characterized in that, further stamps out several chambers on described hemisphere face, is provided with default spacing between chamber.
5. the preparation method of lamp housing formula radiator in LED lighting device as described in claim 1 to 4 any one, is characterized in that, step (1) further comprises:
Whole piece aluminium sheet stamping-out is gone out a heronsbill shape, and go out several circuit board fixing holes and some cable holes on plank.
6. the preparation method of lamp housing formula radiator in LED lighting device as described in any one in claim 1 to 5, is characterized in that, step (4) further comprises:
Reducing blank after pull and stretch is put into the reducing die, and the sidewall of die is consistent with the shape of pre-designed lamp housing formula radiator outer wall;
Push rod presses down blank from top to bottom, when housing bottom and reducing die bottom contacts reducing complete.
7. the preparation method of lamp housing formula radiator in LED lighting device as described in any one in claim 1 to 5, is characterized in that, also comprises:
(5) blank is carried out oxidation, sprays paint, electroplates at least one of them in interior post-processed and surface treatment.
8. a LED lighting device, is characterized in that, it comprises heat-dissipation lamp housing, diffuser, LED light emitting module;
Described heat-dissipation lamp housing further comprises the chip mount pad of section disposed thereon and is arranged on the heat radiation support of its underpart, the heat radiation support of described bottom is hollow housing, described chip mount pad is the narrow convex configuration in bottom width top, and described top and/or side can arrange the LED light emitting module;
Described diffuser is arranged on the junction of this heat-dissipation lamp housing top and the bottom and covers this LED light emitting module;
Described heat-dissipation lamp housing is at 1mm to 3mm, be made into integration after containing the raffinal Sheet drawing of aluminium more than 99% by thickness.
9. LED lighting device as claimed in claim 8, is characterized in that, described chip mount pad is the taper stage body, and the LED light emitting module can be located immediately on the top and/or side of this chip mount pad.
10. LED lighting device as claimed in claim 9, it is characterized in that, described LED lighting device also comprises a fluorescent material cover, this fluorescent material covers in the chamber that the top of this diffuser and this radiating shell forms, and be located on described LED light emitting module, described fluorescent material cover is the fluorescent material cover that its inner surface or outer surface apply fluorescent material, perhaps the fluorescent material cover of himself inner doping fluorescent powder; The colour temperature of the light of this LED light emitting module of concentration adjustment by adjusting fluorescent material and the light that sends after the light of this fluorescent material mixes.
11. LED lighting device as claimed in claim 8 is characterized in that, described chip mount pad is polygonal prism cone or cone, and a plurality of these LED light emitting modules are separately positioned on each skew back face of this pyramid.
12. LED lighting device as claimed in claim 8, it is characterized in that, described heat radiation support is the back taper hollow shell that closes up downwards, is provided with a plurality of grid type air vents around this heat radiation support, forms the multiple heat dissipation passage between these a plurality of grid type air vents.
13. a LED lighting device is characterized in that, it comprises:
One heat-dissipation lamp housing, it is hollow structure, and it further comprises the first half and the latter half that links together, and this first half is provided with a plurality of chambers;
A plurality of diffusers;
A plurality of LED light emitting modules, described a plurality of LED light emitting module is separately positioned in these a plurality of chambers, the correspondence of opening part outwardly of each chamber arranges a diffuser, and described heat-dissipation lamp housing is at 1mm to 3mm, be made into integration after containing the raffinal Sheet drawing of aluminium more than 99% by thickness.
14. LED lighting device as claimed in claim 13 is characterized in that, described the first half vertically arranges these a plurality of chambers along heat-dissipation lamp housing, and all these a plurality of chambers can surround the periphery an of the first half.
15. LED lighting device as claimed in claim 14 is characterized in that the sidewall of these a plurality of chambers is not fitted each other, between these a plurality of chambers, spacing is arranged, and forms the multiple heat dissipation passage.
16. LED lighting device as claimed in claim 13, it is characterized in that, the latter half of described heat-dissipation lamp housing is provided with several grid type mesh and closes up downwards, form the multiple heat dissipation passage between this grid type mesh, described heat-dissipation lamp housing top is provided with some heat radiation through holes, forms the multiple heat dissipation passage between this heat radiation through hole and this grid type mesh.
17. LED lighting device as described in claim 13 or 14, it is characterized in that, described LED light emitting module can be placed on the bottom surface of described heat-dissipation lamp housing chamber, on sidewall or be tilting in chamber with predetermined angle, by adjusting position and the adjustable angle lighting angle of LED light emitting module.
18. LED lighting device as described in claim 13 or 14 is characterized in that, is connected by the good material of heat conductivility between described a plurality of diffusers, is perhaps directly connected by heat-dissipation lamp housing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210194710.3A CN103175178B (en) | 2012-06-08 | 2012-06-08 | The preparation method of lamp housing formula radiator and LED light device |
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| CN201210194710.3A CN103175178B (en) | 2012-06-08 | 2012-06-08 | The preparation method of lamp housing formula radiator and LED light device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106764535A (en) * | 2017-02-28 | 2017-05-31 | 浙江英特来光电科技有限公司 | A kind of tunable optical toning LEDbulb lamp |
| CN108687208A (en) * | 2018-05-15 | 2018-10-23 | 浙江晨丰科技股份有限公司 | A kind of lamps and lanterns heat dissipation aluminum component and its processing technology and lamps and lanterns |
| JP7466245B1 (en) | 2023-01-16 | 2024-04-12 | 厦門普為光電科技有限公司 | Common manufacturing method for molds for industrial lighting devices |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1079681A (en) * | 1992-08-28 | 1993-12-22 | 王万里 | A kind of cold stamping shaping method |
| CN202065729U (en) * | 2011-04-29 | 2011-12-07 | 起运民生照明股份有限公司 | Light-emitting diode (LED) lamp bulb |
| CN102364215A (en) * | 2011-07-26 | 2012-02-29 | 浙江迈勒斯照明有限公司 | Light-emitting diode (LED) candle lamp |
-
2012
- 2012-06-08 CN CN201210194710.3A patent/CN103175178B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1079681A (en) * | 1992-08-28 | 1993-12-22 | 王万里 | A kind of cold stamping shaping method |
| CN202065729U (en) * | 2011-04-29 | 2011-12-07 | 起运民生照明股份有限公司 | Light-emitting diode (LED) lamp bulb |
| CN102364215A (en) * | 2011-07-26 | 2012-02-29 | 浙江迈勒斯照明有限公司 | Light-emitting diode (LED) candle lamp |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106764535A (en) * | 2017-02-28 | 2017-05-31 | 浙江英特来光电科技有限公司 | A kind of tunable optical toning LEDbulb lamp |
| CN108687208A (en) * | 2018-05-15 | 2018-10-23 | 浙江晨丰科技股份有限公司 | A kind of lamps and lanterns heat dissipation aluminum component and its processing technology and lamps and lanterns |
| JP7466245B1 (en) | 2023-01-16 | 2024-04-12 | 厦門普為光電科技有限公司 | Common manufacturing method for molds for industrial lighting devices |
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| CN103175178B (en) | 2016-02-10 |
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Address after: 310015, 3 north, 2 North, 18 Kang Road, Hangzhou, Zhejiang, Gongshu District Applicant after: Hangzhou Huapu Yongming Photoelectric Co., Ltd. Address before: 311305, Hangzhou, Zhejiang province Ling'an City Qingshan Lake Street Chuen mouth Village No. 15 Applicant before: Hangzhou Huapu Yongming Photoelectric Co., Ltd. |
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