CN103172881A - Method for preparing metamaterial base plate - Google Patents
Method for preparing metamaterial base plate Download PDFInfo
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- CN103172881A CN103172881A CN 201110439948 CN201110439948A CN103172881A CN 103172881 A CN103172881 A CN 103172881A CN 201110439948 CN201110439948 CN 201110439948 CN 201110439948 A CN201110439948 A CN 201110439948A CN 103172881 A CN103172881 A CN 103172881A
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- glue
- strongthener
- dielectric constant
- resin solution
- glasscloth
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Abstract
The invention provides a method for preparing a metamaterial base plate. The method comprises the following steps of: respectively adding one or more types of padding to one or more types of organic resin solutions, fully mixing so as to form glue solutions with different dielectric constants; and then sequentially immersing reinforcing materials used as supporting layers in different glue solution formulas for resolidification, thus obtaining the base plate. The metamaterial base plate manufactured by the method has the functions of changing refractive indexes and impedance matching and the like.
Description
[technical field]
The present invention relates to super Material Field, relate in particular to the method for the super material substrate of preparation.
[background technology]
Super material refers to artificial composite structure or the matrix material that some have the not available extraordinary physical properties of natural materials.Structurally ordered design by on the key physical yardstick of material can break through the restriction of some apparent natural law, thereby maybe must exceed the meta-materials function of the intrinsic common character of nature.Super material character and function mainly come from its inner structure but not consist of their material, therefore are design and synthetic super material, and people have carried out a lot of research work.Super material comprises man-made structures and the accompanying material of man-made structures, this attachment material is played a supporting role to man-made structures, therefore can be any material different from man-made structures, the stack meeting of this bi-material produces an effective dielectric constant and magnetic permeability in the space, and these two physical parameters corresponding respectively electric field response and the magnetic responsiveness of material.
The performance of substrate has important impact to the final performance of super material, different baseplate materials has different advantages and deficiency, the advantages such as epoxy resin base plate commonly used has can high-low temperature resistant, physical strength is high, good stability, but existing substrate all only has uniform specific inductivity, the requirement such as specific refractory power that can not Adaptive change, impedance matching.
[summary of the invention]
The invention provides a kind of super material substrate preparation method, adopt filler that the organic resin solvent is carried out filling-modified to form the glue formula of differing dielectric constant, then will be immersed in successively as the strongthener of supporting layer in different glue formulas and solidify again, make thus substrate, and make the requirements such as specific refractory power that substrate can Adaptive change and impedance matching.
According to a main aspect of the present invention, the method comprises the following steps:
A, one or more fillers are joined respectively in one or more organic resin solution and fully mix, to form multiple glue with differing dielectric constant;
B, strongthener is immersed in a kind of glue;
C, strongthener is taken out from this glue, after drying, then immerse in another kind of glue;
D, repetition c step were until strongthener immersed all glues;
E, strongthener is taken out oven dry by being baked into the semicure shape from last a kind of glue;
F, the strongthener of semicure is carried out hot-press solidifying again, thereby make substrate.
According to an aspect of the present invention, filler comprises one or more in cenosphere, ceramic powder, gel.
According to an aspect of the present invention, organic resin solution comprises epoxy resin solution, brominated epoxy resin solution or epoxy resin phenolic aldehyde solution.
According to an aspect of the present invention, strongthener is glasscloth, paper substrate electronics cloth, ceramic base electronics cloth or metal matrix electronics cloth.
According to an aspect of the present invention, cenosphere is one or more in hollow glass micropearl, phenolic aldehyde cenosphere, low-polyacrylate microballon, poly-segregation ethylene copolymer microballon.
According to an aspect of the present invention, cenosphere is Powdered.
According to an aspect of the present invention, in step a, form multiple glue with differing dielectric constant by controlling the content of filler in organic resin solution.
According to an aspect of the present invention, in step c, after strongthener is taken out from glue, the oven dry before, utilize rolling device that strongthener is extruded predetermined thickness.
According to an aspect of the present invention, in step c, the time that strongthener is dried is 10-30 second.
According to an aspect of the present invention, in step e, the time that strongthener is baked to the semicure shape is 5-6 minute.
According to an aspect of the present invention, in step f, the strongthener of semicure is cut into suitable size carries out again hot-press solidifying.
According to an aspect of the present invention, the size order of strongthener according to the specific inductivity of glue infiltrated, distribute thereby make super material substrate have the gradient specific inductivity.
According to an aspect of the present invention, the size of strongthener according to the specific inductivity of glue infiltrated by the arithmetic progression order.
According to an aspect of the present invention, the size of strongthener according to the specific inductivity of glue infiltrated by the Geometric Sequence order.
Will be appreciated that, the feature in the above each side of the present invention is independent assortment within the scope of the invention, and is not subjected to the restriction of its order---as long as the technical scheme after combination drops in connotation of the present invention.
[description of drawings]
In order to be illustrated more clearly in the technical scheme in the present invention, the below will do to introduce simply to accompanying drawing of the present invention, wherein:
Fig. 1 is the schematic diagram of the super material substrate of prepared according to the methods of the invention.
Fig. 2 has shown schematically that the specific inductivity in this super material substrate distributes.
[embodiment]
Hereinafter in connection with the preferred embodiments of the present invention, technical scheme of the present invention is elaborated.
Need to understand, following description (comprising accompanying drawing) is only exemplary, but not the limitation of the present invention description.Can relate in the following description the concrete quantity of parts, yet also it is to be understood that, these quantity are only also exemplary, and those skilled in the art can choose arbitrarily with reference to the present invention the parts of proper amt.And the wordings such as mentioned " first ", " second ", be not the sequence that represents parts importance in the present invention, only is used as the difference name of parts and is referred to as.
According to one embodiment of present invention, at first need one or more fillers are joined respectively in one or more organic resin solution and fully mix, to form multiple glue with differing dielectric constant.This can be wherein that a kind of filler is joined respectively in multiple organic resin solution and mixes respectively, can be also that multiple filler is joined respectively in a kind of organic resin solution and mixes respectively, certainly, can be also that multiple filler is joined respectively in multiple organic resin solution and mixes respectively.And, when only using a kind of filler and a kind of organic resin solution, can form multiple glue with differing dielectric constant by controlling the content of filler in organic resin solution.
The material of filler can be taken from one or more in cenosphere, ceramic powder, gel; And, cenosphere this as one or more in hollow glass micropearl, phenolic aldehyde cenosphere, low-polyacrylate microballon, poly-segregation ethylene copolymer microballon.And organic resin solution can be epoxy resin solution, brominated epoxy resin solution or epoxy resin phenolic aldehyde solution.
After making glue, strongthener (such as glasscloth, paper substrate electronics cloth, ceramic base electronics cloth or metal matrix electronics cloth) is immersed in wherein in a kind of glue; Then strongthener is taken out from this glue, through (for example 50-100 ℃ of the oven dry of short period of time, 10-30 second) after, immerse again another kind of glue (namely, glue with another specific inductivity) in, in this process, after namely taking out, before oven dry, can use rolling device that strongthener is extruded into and have predetermined thickness; Then repeating this step constantly takes out strongthener, dries, immerses, until strongthener immersed all glues again; Then, after strongthener was taken out oven dry from last a kind of glue, high temperature toasted for a long time (for example 150-180 ℃, 5-6 minute) and makes it into the semicure shape; At last, the strongthener of semicure is carried out hot-press solidifying again, thereby make substrate, and before hot-press solidifying, the strongthener of semicure first can be cut into suitable size.
Like this, prepared substrate has several by the layer that glue forms, and these layers have different specific inductivity.In the process of preparation substrate, can soak successively strongthener according to the size order of the specific inductivity of glue, make thus being arranged in order from the inside to surface by size of specific inductivity of glue layer, make super material substrate have the distribution of gradient specific inductivity.Also can according to the concrete application requiring of super material substrate, according to particular order, for example soak strongthener according to the order of arithmetic progression or Geometric Sequence.
Fig. 1 has schematically shown super material substrate 10 of prepared according to the methods of the invention, and the length and width size of this substrate all can be for several centimetres to hundreds of centimetre.Should super material substrate 10 comprise strongthener (for example glasscloth) 12 and the first glue layer 1, the second glue layer 2, the 3rd glue layer 3, the 4th glue layer 4 and the 5th glue layer 5 that are formed by glue on strongthener 12 zygomorphy ground, the thickness of these glue layers is at a few tenths of a mm extremely between several millimeters.In order to highlight substrate, basic longer than glue layer in figure, but the glue layer is the whole surface that preferably covers substrate during actually operating.In this embodiment, the specific inductivity of the first glue layer 1 is that the specific inductivity of 1, the second glue layer 2 is 2, the specific inductivity of the 3rd glue layer 3 is 3, the specific inductivity of the 4th glue layer 4 is that the specific inductivity of 4, the five glue layers 5 is 5, and this schematically provides by the distinct colors depth in Fig. 2.
The below provides a specific embodiment of this super material substrate 10 of preparation:
With cenosphere, ceramic powder, these fillers of gel individually or arbitrary combination ground, join respectively in epoxy resin solution solution according to predetermined ratio, and fully mix respectively, obtain respectively DIELECTRIC CONSTANT ε and be for example five kinds of glues of 1,2,3,4,5.
it is in 1 glue that glasscloth 12 is immersed in DIELECTRIC CONSTANT ε, by the time after fully soaking, glasscloth 12 is taken out from this glue, then use the rolling device (not shown) that glasscloth 12 is extruded into and have the approximately thickness of 1.0mm, then will be attached with glasscloth 12 baking approximately 10 seconds of glue under the about condition of 100 ℃, until glasscloth 12 is dried, namely, the surface no longer includes liquid glue, at this moment, be that 1 glue is attached on glasscloth 12 by DIELECTRIC CONSTANT ε, form symmetrically the first glue layer 1 on the both sides of glasscloth 12.
Then, will immerse again with the glasscloth 12 of the first glue layer 1 DIELECTRIC CONSTANT ε and be in 2 glue, again glasscloth 12 be taken out after by the time fully soaking, and then use rolling device that glasscloth 12 is extruded into and have the approximately thickness of 1.5mm.Then under the about condition of 100 ℃ with glasscloth 12 baking approximately 10 seconds, until it is dried, at this moment, be that 2 glue is attached on glasscloth 12 by DIELECTRIC CONSTANT ε, or rather, be to be attached on the first glue layer 1, and at its zygomorphy ground formation the second glue layer 2.
Then, be in 3 glue with immersing again DIELECTRIC CONSTANT ε with the glasscloth 12 of the first glue layer 1 and the second glue layer 2 successively from inside to outside, by the time after fully soaking, glasscloth 12 is taken out, then use rolling device that glasscloth 12 is extruded into and have the approximately thickness of 2.0mm.Then under the about condition of 100 ℃ with glasscloth 12 baking approximately 10 seconds, until it is dried, at this moment, be that 3 glue is attached on glasscloth 12 by DIELECTRIC CONSTANT ε, or rather, be to be attached on the second glue layer 2, and at its zygomorphy ground formation the 3rd glue layer 3.
Then, be in 4 glue with immersing again DIELECTRIC CONSTANT ε with the glasscloth 12 of the first glue layer 1, the second glue layer 2 and the 3rd glue layer 3 successively from inside to outside, by the time after fully soaking, glasscloth 12 is taken out, then use rolling device that glasscloth 12 is extruded into and have the approximately thickness of 2.5mm.Then under the about condition of 100 ℃ with glasscloth 12 baking approximately 10 seconds, until it is dried, at this moment, be that 4 glue is attached on glasscloth 12 by DIELECTRIC CONSTANT ε, or rather, be to be attached on the 3rd glue layer 3, and at its zygomorphy ground formation the 4th glue layer 4.
Again then, be in 5 glue with immersing again DIELECTRIC CONSTANT ε with the glasscloth 12 of the first glue layer 1, the second glue layer 2, the 3rd glue layer 3 and the 4th glue layer 4 successively from inside to outside, by the time after fully soaking, glasscloth 12 is taken out, then use rolling device that glasscloth 12 is extruded into and have the approximately thickness of 3.0mm.Then under the about condition of 100 ℃ with glasscloth 12 baking approximately 10 seconds, until it is dried, at this moment, be that 5 glue is attached on glasscloth 12 by DIELECTRIC CONSTANT ε, or rather, be to be attached on the 4th glue layer 4, and in its zygomorphy ground formation.
After roughly drying with the glasscloth 12 (it is the blank of substrate 10) of the first glue layer 1, the second glue layer 2, the 3rd glue layer 3, the 4th glue layer 4 and the 5th glue layer 5 successively from inside to outside, be placed on approximately under the condition of 180 ℃ baking approximately 5 minutes, and made the glasscloth 12 with the glue layer be on the whole the semicure shape.
At last, with this semicure be cut into the size of 20x20cm with the glasscloth 12 of glue layer, then carry out hot-press solidifying, thereby make substrate 10.Wherein the technique of hot-press solidifying can be with reference to the technology of existing pcb board preparation for this.
The super material substrate of prepared according to the methods of the invention has by Gradient distribution or specific inductivity that distribute by other rules, requirement that can the Adaptive change impedance matching, and also can use at other hertzian wave for example increase or reduce reflectivity as required.
Need to understand, above basis has preferred embodiment been done detailed description to the present invention, but it will be appreciated that, scope of the present invention is not limited to these concrete embodiments, but comprises that those skilled in the art are according to any modifications and changes that openly can make of the present invention.
Claims (11)
1. method for preparing super material substrate, the method comprises the following steps:
A, one or more fillers are joined respectively in one or more organic resin solution and fully mix, to form multiple glue with differing dielectric constant;
B, strongthener is immersed in a kind of glue;
C, strongthener is taken out from this glue, after drying, then immerse in another kind of glue;
D, repetition c step were until described strongthener immersed all glues;
E, described strongthener is taken out oven dry by being baked into the semicure shape from last a kind of glue;
F, the described strongthener of semicure is carried out hot-press solidifying again, thereby make substrate.
2. method according to claim 1, is characterized in that, described filler comprises one or more in cenosphere, ceramic powder, gel.
3. method according to claim 1, is characterized in that, described organic resin solution comprises epoxy resin solution, brominated epoxy resin solution or epoxy resin phenolic aldehyde solution.
4. method according to claim 1, is characterized in that, described strongthener is glasscloth, paper substrate electronics cloth, ceramic base electronics cloth or metal matrix electronics cloth.
5. method according to claim 2, is characterized in that, described cenosphere is one or more in hollow glass micropearl, phenolic aldehyde cenosphere, low-polyacrylate microballon, poly-segregation ethylene copolymer microballon.
6. method according to claim 1, is characterized in that, in step a, forms multiple glue with differing dielectric constant by controlling the content of described filler in described organic resin solution.
7. method according to claim 1, is characterized in that, in step c, after described strongthener is taken out from glue, the oven dry before, utilize rolling device that described strongthener is extruded predetermined thickness.
8. method according to claim 1, is characterized in that, in step f, the described strongthener of semicure is cut into suitable size carries out hot-press solidifying again.
9. method according to claim 1, is characterized in that, the size order of described strongthener according to the specific inductivity of described multiple glue with differing dielectric constant infiltrated, and makes described super material substrate have the gradient specific inductivity and distribute.
10. method according to claim 1, is characterized in that, the size of described strongthener according to the specific inductivity of described multiple glue with differing dielectric constant infiltrated by the arithmetic progression order.
11. method according to claim 1 is characterized in that, the size of described strongthener according to the specific inductivity of described multiple glue with differing dielectric constant infiltrated by the Geometric Sequence order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110439948 CN103172881A (en) | 2011-12-26 | 2011-12-26 | Method for preparing metamaterial base plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201110439948 CN103172881A (en) | 2011-12-26 | 2011-12-26 | Method for preparing metamaterial base plate |
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| CN103172881A true CN103172881A (en) | 2013-06-26 |
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| CN 201110439948 Pending CN103172881A (en) | 2011-12-26 | 2011-12-26 | Method for preparing metamaterial base plate |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103756253A (en) * | 2013-12-17 | 2014-04-30 | 北京化工大学 | Low dielectric constant hollow carbon sphere/epoxy resin composite material and preparation method thereof |
| CN104947358A (en) * | 2015-03-27 | 2015-09-30 | 安徽丹凤电子材料股份有限公司 | Electronic fabric surface treatment technology |
-
2011
- 2011-12-26 CN CN 201110439948 patent/CN103172881A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103756253A (en) * | 2013-12-17 | 2014-04-30 | 北京化工大学 | Low dielectric constant hollow carbon sphere/epoxy resin composite material and preparation method thereof |
| CN104947358A (en) * | 2015-03-27 | 2015-09-30 | 安徽丹凤电子材料股份有限公司 | Electronic fabric surface treatment technology |
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Owner name: SHENZHEN GUANGQI CHUANGZHI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENZHEN KUANG-CHI INSTITUTE OF ADVANCED TECHNOLOGY Effective date: 20140702 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20140702 Address after: 518000 Guangdong, Baoan District, Xixiang, Baoan street, the Internet industry base of the seaside village of, building two, building 18, 2003A Applicant after: Shenzhen Guangqi Powerise Technology Co. Ltd. Address before: 518000 Nanshan District City, Guangdong province high tech Zone in the middle of a high tech building, No. 9 software building Applicant before: Shenzhen Kuang-Chi Institute of Advanced Technology |
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| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130626 |