CN103165369A - Bottom electrode mechanism and plasma processing equipment with the same - Google Patents
Bottom electrode mechanism and plasma processing equipment with the same Download PDFInfo
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- CN103165369A CN103165369A CN2011104273220A CN201110427322A CN103165369A CN 103165369 A CN103165369 A CN 103165369A CN 2011104273220 A CN2011104273220 A CN 2011104273220A CN 201110427322 A CN201110427322 A CN 201110427322A CN 103165369 A CN103165369 A CN 103165369A
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Abstract
The invention discloses a bottom electrode mechanism used for plasma processing equipment, and further discloses the plasma processing equipment with the bottom electrode mechanism. The bottom electrode mechanism used for the plasma processing equipment comprises a support plate, a bottom electrode base plate and at least one support unit, wherein support units are is placed between the support plate and the bottom electrode base plate, and the support plate and the bottom electrode base plate evenly contact through the support unit. The support unit comprises three grounding pillar support rods, a plurality of grounding pillars and two cylinder actuators. The cylinder actuators are placed below the grounding pillar rod on two sides, and piston rods of the cylinder actuators are connected to the grounding pillar rod on the two sides, wherein the grounding pillar rods on the two sides is placed outside and relative to the piston rods of the cylinder drivers. The bottom electrode mechanism is good in grounding performance and capable of reducing light striking and discharging, and improves equipment stability of the bottom electrode mechanism.
Description
Technical field
The present invention relates to semi-conductor device technology field, particularly relate to a kind of bottom electrode mechanism and have the apparatus for processing plasma of this bottom electrode mechanism.
Background technology
Automaticity in existing solar battery sheet production process is more and more higher.Wherein, PECVD (Plasma Enhanced Chemical Vapor Deposition, plasma enhanced chemical vapor deposition) is the important step in the manufacture of solar cells thin film growth process.The chamber of PECVD equipment passes into etching gas under vacuum environment.Etching gas after being heated to predetermined temperature, by radio frequency electrical from becoming plasma.These plasmas are in the required membrane structure of the Surface Creation of wafer.
PECVD chamber interior temperature homogeneity, airflow homogeneity, bottom electrode ground connection uniformity all can produce material impact to the coating process of wafer.Wherein, the ground connection uniformity is one of important technical links of PECVD equipment.In addition, the adjustable height of accurately regulating the bottom electrode mechanism in PECVD equipment to realize the complete horizontal location of bottom electrode mechanism lifting process, is also one of uniform essential condition of plated film.
Fig. 6 is the bottom electrode mechanism of traditional flat direct method PECVD equipment.As shown in Figure 6, chamber base plate 2 ' has carried out grounding, thereby makes the current potential of chamber base plate 2 ' identical with ground.Cylinder 1 ' can drive earthing rod support bar 4 ' and earthing rod 5 ' rises, thereby holds up support plate 6, so that the earthing rod upper surface contacts with support plate 6 ', and then makes support plate ground connection by earth connection 3 ' and chamber base plate 2 '.But, due to machining accuracy or PECVD equipment in the temperature of run duration process cavity more than 400 ℃, be subject to the impact of high temperature, earthing rod 1 " can expanded by heating, thereby can't realize good contacting with support plate 6 '.In order to overcome above-mentioned impact, in the bottom electrode ground structure of traditional flat direct method PECVD equipment, as shown in Figure 7, at earthing rod 1 " on high temperature spring 2 is set " and earthing rod end cap 3 ".Earthing rod end cap 3 " can do along earthing rod 5 and endwisely slip.When earthing rod 5 holds up support plate, high temperature spring 2 " compress high earthing rod 1 because of stressed " stressed large, earthing rod end cap 3 " slide into lower limit, and low earthing rod 1 " stressed little, earthing rod end cap 3 " fall less than lower limit.But, because be subjected to spring 2 " the effect of thrust, also can contact with support plate, thereby realize that all earthing rods can contact with support plate.
But, adopt the bottom electrode of traditional flat direct method PECVD equipment of said structure to have following problem:
(1) price that temperature can anti-high temperature spring more than 400 ℃ is generally higher, and at high temperature easily tempering follow the string.
(2) each earthing rod is stressed inconsistent, and the partial earthing post contacts bad with support plate, sparking or discharge between part in support plate and reaction chamber when causing technique.
Summary of the invention
The present invention is intended to one of solve the problems of the technologies described above at least.For this reason, the present invention need to provide a kind of bottom electrode mechanism for apparatus for processing plasma, and this bottom electrode mechanism ground connection is functional and stabilization of equipment performance is good.
In addition, the present invention also needs to provide a kind of apparatus for processing plasma with above-mentioned bottom electrode mechanism.
In view of this, the embodiment of first aspect present invention proposes a kind of bottom electrode mechanism for apparatus for processing plasma, comprise: support plate, bottom electrode base plate and at least one load bearing unit, wherein: described load bearing unit is arranged between described support plate and bottom electrode base plate, make support plate and bottom electrode base plate even contact by described load bearing unit, described load bearing unit comprises: three earthing rod support bars, and described earthing rod support bar is arranged on the top of described bottom electrode base plate and hinged successively; A plurality of earthing rods, described earthing rod are separately positioned on described earthing rod support bar, are used for flatly supporting described support plate; And two cylinder drivers, described cylinder driver is arranged on the below of the earthing rod support bar that is positioned at both sides and the piston rod of described cylinder driver is connected to the earthing rod support bar that is positioned at both sides, to drive described earthing rod support bar along the vertical direction liftable, wherein, the earthing rod that is positioned at both sides is arranged to be positioned at the outside with respect to the piston rod of described cylinder driver.
The bottom electrode mechanism that is used for apparatus for processing plasma according to the embodiment of the present invention, by this load bearing unit, namely utilize cylinder driver drives earthing rod and the vertically elevating movement of earthing rod support bar in load bearing unit, and then held up the support plate that is positioned at the earthing rod top.Owing to connecting by articulated manner between a plurality of earthing rod support bars, thereby make the earthing rod that is arranged on the earthing rod support bar can horizontal location at lifting process, realize contacting between all earthing rods and support plate good, thereby can reduce sparking and discharge, and then improve the stabilization of equipment performance of bottom electrode mechanism.
In one embodiment of the invention, described earthing rod support bar is connected to each other by rotating shaft or bearing.
Thus, in lifting process, any one earthing rod affords the pressure from support plate, all this pressure can be delivered on other earthing rods, thereby be grounded as much as possible the stressed mean allocation of post.
In one embodiment of the invention, described earthing rod support bar comprises: the first earthing rod support bar; The second earthing rod support bar, described the second earthing rod support bar is connected with described the first earthing rod support bar by the first rotating shaft; And the 3rd earthing rod support bar, described the 3rd earthing rod support bar is connected with described the second earthing rod support bar by the second rotating shaft.
In one embodiment of the invention, described cylinder driver further comprises the first cylinder driver and the second cylinder driver, and the piston rod of described the first cylinder driver is connected to described the first earthing rod support bar, and the piston rod of described the second cylinder driver is connected to described the 3rd earthing rod support bar.
in one embodiment of the invention, described earthing rod further comprises: the first earthing rod, described the first earthing rod are connected to described the first earthing rod support bar vertically, the second earthing rod, described the second earthing rod is connected to the centre position of described the second earthing rod support bar vertically, and the 3rd earthing rod, described the 3rd earthing rod is connected to described the 3rd earthing rod support bar vertically, distance between the piston rod of wherein said the first rotating shaft and described the first cylinder driver and the tie point of described the first earthing rod support bar is the twice of the distance between the tie point of described the first earthing rod and described the first earthing rod support bar, and the distance between the tie point of the piston rod of the second rotating shaft and described the second cylinder driver and described the 3rd earthing rod support bar is the twice of the distance between the tie point of described the 3rd earthing rod and described the 3rd earthing rod support bar.
Thus, when the distance between corresponding rotating shaft, cylinder driver and earthing rod support bar satisfied aforementioned proportion and concerns, the pressure that three earthing rods are subject to support plate equated, thereby realized the even distribution of power.
In one embodiment of the invention, be formed with level trough and vertical channel on described earthing rod support bar, described level trough and vertical channel run through mutually, one end of the piston rod of described cylinder driver stretches in described vertical channel, and an end of described piston rod is fixed with along described vertical channel slide block slidably, be fixed with rotating shaft on described slide block, described rotating shaft flatly is arranged in described level trough and along described level trough slidably.
Thus, when the temperature distortion of earthing rod support bar, rotating shaft can be slided in level trough with the compensation heat distortion amount, thereby when cylinder driver drives earthing rod support bar and earthing rod elevating movement, still can be grounded as much as possible the stressed mean allocation of post.In addition, due to the rotating shaft heat distortion amount of compensation of ground post that can slide, thereby improve useful life of bottom electrode mechanism, correspondingly reduced the production cost of equipment.
In one embodiment of the invention, described level trough and vertical channel are rectangular channel or oblong slots.
In one embodiment of the invention, described cylinder driver is synchronously driven.
Thus, the driving earthing rod support bar that the cylinder driver can be synchronous and the elevating movement of earthing rod are grounded the horizontal location of post, make all contact between all earthing rods and support plate good.
In one embodiment of the invention, described bottom electrode base plate is identical with earth potential through grounding and current potential.
In one embodiment of the invention, described earthing rod support bar is electrically connected to described bottom electrode base plate.
Thus, the current potential of the earthing rod on being grounded the post support bar and being positioned at the earthing rod support bar is identical with earth potential.
The embodiment of second aspect present invention proposes a kind of apparatus for processing plasma, comprises vacuum chamber; Be arranged on the top electrode mechanism in described vacuum chamber; And the bottom electrode mechanism in first aspect present invention embodiment, described bottom electrode mechanism is arranged in described vacuum chamber and is relative with described top electrode mechanism.
Apparatus for processing plasma according to the embodiment of the present invention, bottom electrode mechanism horizontal location fully in lifting process, thereby make the spacing of each position between bottom electrode mechanism and top electrode mechanism identical, and then can improve the uniformity of wafer being carried out plated film.
In one embodiment of the invention, described apparatus for processing plasma is plasma enhanced chemical vapor deposition equipment.
Additional aspect of the present invention and advantage part in the following description provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment in conjunction with following accompanying drawing, wherein:
Fig. 1 is the front view of the bottom electrode mechanism for apparatus for processing plasma according to an embodiment of the invention;
Fig. 2 is the vertical view of bottom electrode mechanism in Fig. 1;
Fig. 3 is the stressed schematic diagram between earthing rod support bar, rotating shaft and the cylinder driver of bottom electrode mechanism in Fig. 1;
Fig. 4 is the structural representation of earthing rod support bar;
Fig. 5 is the schematic diagram according to the apparatus for processing plasma of the embodiment of the present invention;
Fig. 6 is the schematic diagram of the bottom electrode mechanism of traditional flat direct method PECVD equipment; And
Fig. 7 is the schematic diagram of traditional earthing rod structure.
Embodiment
The below describes embodiments of the invention in detail, and the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment that is described with reference to the drawings, only be used for explaining the present invention, and can not be interpreted as limitation of the present invention.
in description of the invention, it will be appreciated that, term " " center ", " vertically ", " laterally ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end ", " interior ", orientation or the position relationship of indications such as " outward " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, rather than device or the element of indication or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as limitation of the present invention.
In addition, term " first ", " second " only are used for describing purpose, and can not be interpreted as indication or hint relative importance.
In description of the invention, need to prove, unless clear and definite regulation and restriction are separately arranged, term " installation ", " being connected ", " connection " should be done broad understanding, for example, can be to be fixedly connected with, connect integratedly, can be also to removably connect; Can be mechanical connection or electrical connection, can be also the connection of two element internals; Can be directly to be connected, also can indirectly be connected by intermediary, for the ordinary skill in the art, can understand as the case may be the concrete meaning of above-mentioned term.
Below with reference to Fig. 1 to Fig. 4, the bottom electrode mechanism that is used for apparatus for processing plasma 100 according to the embodiment of the present invention is described.This bottom electrode mechanism 100 can be applicable to manufacture of solar cells thin film growth process link, can be used for simultaneously the higher technical field of uniformity requirement to multiple spot resistance to earth (or contact).
As shown in Figure 1, the bottom electrode mechanism 100 that the embodiment of the present invention provides is used for plasma processing comprises support plate 110, bottom electrode base plate 120 and at least one load bearing unit.This load bearing unit is arranged between described support plate 110 and bottom electrode base plate 120, makes support plate 110 and bottom electrode base plate 120 even contact by described load bearing unit.The quantity of described load bearing unit can determine according to design requirement.This load bearing unit comprises: three earthing rod support bars 131,132,133, a plurality of earthing rod 141,142,143 and two cylinder drivers 151,152.
Pending wafer can be placed in the top of support plate 110.Bottom electrode base plate 120 is arranged on the below of support plate 110.In one embodiment of the invention, bottom electrode base plate 120 is carried out grounding, thereby make the current potential of bottom electrode base plate 120 identical with earth potential.
Earthing rod support bar 131,132,133 is arranged on the top of bottom electrode base plate 120, and earthing rod support bar 131,132,133 is hinged successively.In other words, two adjacent earthing rod support bars connect by articulated manner.In one embodiment of the invention, can be connected to each other by rotating shaft between two adjacent earthing rod support bars.In another one embodiment of the present invention, can be connected to each other by bearing between two adjacent earthing rod support bars.
In one embodiment of the invention, the earthing rod support bar is respectively the first earthing rod support bar 131, the second earthing rod support bar 132 and the 3rd earthing rod support bar 133.In addition, need to prove, there is no specific proportion requirement on quantity between earthing rod and earthing rod support bar, as long as be provided with at least an earthing rod on each earthing rod support bar, and the hinged place that this earthing rod can not be positioned at described adjacent support bar gets final product.
As shown in Figure 1, the earthing rod support bar is electrically connected to bottom electrode base plate 120, thereby makes each earthing rod support bar have the earth potential identical with bottom electrode base plate 120, thereby is grounded.In an example of the present invention, the earthing rod support bar that is positioned at both sides is connected to be grounded with bottom electrode base plate 120 by wire.Because two adjacent earthing rod support bars are connected by rotating shaft, when the earthing rod support bar in both sides had earth potential, the current potential of other middle earthing rod support bars was also earth potential.
Earthing rod is separately positioned on the earthing rod support bar, with supports loadboard 110 flatly.In one embodiment of the invention, earthing rod can equate with the quantity of earthing rod support bar.Because the earthing rod support bar has earth potential, thereby earthing rod also has earth potential.When the upper surface of earthing rod contacts with support plate 110, support plate 110 ground connection.
In one embodiment of the invention, the quantity of a plurality of earthing rods can be three, is respectively the first earthing rod 141, the second earthing rod 142 and the 3rd earthing rod 143.Wherein, the first earthing rod 141, the second earthing rod 142 and the 3rd earthing rod 143 vertically are arranged on respectively on corresponding earthing rod support bar 131,132 and 133.Be understandable that, the quantity of earthing rod is only for exemplary purposes, rather than in order to limit the present invention.
The cylinder driver is arranged on the below of the earthing rod support bar that is positioned at both sides, and the piston rod of cylinder driver is connected to the earthing rod support bar that is positioned at both sides to drive the earthing rod support bar along the vertical direction liftable, and the described earthing rod that wherein is positioned at both sides is arranged to be positioned at the outside with respect to the piston rod of described cylinder driver.Wherein, the quantity of cylinder driver can be for a plurality of.In one embodiment of the invention, cylinder driver 151,152 can be synchronously driven, thereby the cylinder driver can drive the elevating movement of earthing rod support bar and earthing rod, is grounded the horizontal location of post, make all contact between all earthing rods and support plate 110 good.
In one embodiment of the invention, the quantity of cylinder driver can be two, is respectively the first cylinder driver 151 and the second cylinder driver 152.Particularly, the piston rod of two cylinder drivers is connected with the earthing rod support bar that is positioned at both sides respectively.Due to, hinged by rotating shaft between the earthing rod support bar, the earthing rod support bar that is positioned at both sides by driving moves along the vertical direction liftable, and then can drive other earthing rod support bars and move along the vertical direction liftable.Be understandable that, the quantity of cylinder driver is only for exemplary purposes, rather than in order to limit the present invention.
In addition, because connecting by rotating shaft, the earthing rod support bar is connected to each other, thereby in by cylinder driver drives lifting process, when being arranged in earthing rod of a plurality of earthing rods on the earthing rod support bar and affording pressure from support plate 110, this pressure all can be delivered on other earthing rods, thereby is grounded as much as possible the stressed mean allocation of post.
Need to prove; those of ordinary skill is after having read aforementioned techniques scheme of the present invention; the arrangement of earthing rod support bar, earthing rod and cylinder driver in obviously can Fig. 1 carries out repetition, namely comprises that a plurality of load bearing units implement according to bottom electrode of the present invention mechanism, within this also falls into protection scope of the present invention.
In one embodiment of the invention, can be formed with level trough 1311 and vertical channel 1312 on the first earthing rod support bar 131, and level trough 1311 and vertical channel 1312 run through mutually.In other words, level trough 1311 and vertical channel 1312 above-below directions and left and right directions interpenetrate, as shown in Figure 4.In an example of the present invention, level trough 1311 and vertical channel 1312 can form respectively rectangular channel or oblong slots.As shown in Figure 4, an end of the piston rod of the first cylinder driver 151 extend in vertical channel 1312, and an end of piston rod be fixed with along vertical channel 1312 slidably slide block 1511, be fixed with rotating shaft 1512 on slide block 1511.Rotating shaft 1512 is arranged in level trough 1311 and along level trough 1311 slidably.Bolt 1513 can be fixed slide block 1511, rotating shaft 1512 and cylinder driver 151.Be understandable that, the first earthing rod support bar 131 and the first cylinder driver 151 are only for exemplary purposes, the cylinder driver that above-mentioned syndeton goes for each earthing rod support bar and is connected with this earthing rod support bar.
Due to apparatus for processing plasma in the temperature of run duration process cavity more than 400 ℃, be subject to the impact of high temperature, the earthing rod support bar is deformed by the thermal stretching meeting.Adopt the load bearing unit of said structure, when cylinder driver drives earthing rod support bar and earthing rod elevating movement, the heat distortion amount of rotating shaft slip compensation of ground post support bar in the oblong slots of earthing rod support bar, thereby when earthing rod contacts with support plate 120, can guarantee that still each earthing rod is stressed evenly.In addition, due to the rotating shaft heat distortion amount of compensation of ground post that can slide, thereby improve useful life of bottom electrode mechanism, correspondingly reduced the production cost of equipment.
The below provides the embodiment of the present invention as an example of three earthing rods, two cylinders example bottom electrode mechanism 100 is described in detail.
As depicted in figs. 1 and 2, the earthing rod support bar in load bearing unit comprises the first earthing rod support bar 131, the second earthing rod support bar 132 and the 3rd earthing rod support bar 133.Wherein, the second earthing rod support bar 132 is connected with the first earthing rod support bar 131 by the first rotating shaft 161, and the 3rd earthing rod support bar 133 is connected with the second earthing rod support bar 132 by the second rotating shaft 162.The first earthing rod support bar 131 and the 3rd earthing rod support bar 133 can be two levers take the first rotating shaft 161 and the second rotating shaft 162 as fulcrum respectively.Thereby when any one earthing rod afforded the pressure of support plate 110, this pressure all can be passed on other earthing rods, thereby was grounded as much as possible the stressed mean allocation of post.
A plurality of earthing rods in load bearing unit comprise the first earthing rod 141, the second earthing rod 142 and the 3rd earthing rod 143.Each earthing rod is connected with each earthing rod support bar accordingly.Particularly, the first earthing rod 141 is connected on the first earthing rod support bar 131 vertically, and the second earthing rod 142 is connected on the second earthing rod support bar 132 vertically, and the 3rd earthing rod 143 is connected on the 3rd earthing rod support bar 133 vertically.
Cylinder driver in load bearing unit comprises the first cylinder driver 151 and the second cylinder driver 152.The piston rod that the piston rod of the first cylinder driver 151 is connected to the first earthing rod support bar 131, the second cylinder drivers 152 is connected to the 3rd earthing rod support bar 133.In other words, the piston rod of two cylinder drivers is connected with the earthing rod support bar that is positioned at both sides respectively.When the first cylinder driver 151 drives the first vertically elevating movement of earthing rod support bar 131, when the second cylinder driver 152 drives the 3rd vertically elevating movement of earthing rod support bar 133, drive the also vertically elevating movement of the second earthing rod support bar 132.When the first cylinder driver 151 and the second cylinder driver 152 corresponding earthing rod support bars of drive and earthing rod rising, the upper surface of earthing rod contacts with support plate 120, and then holds up the support plate that is positioned at the earthing rod top.
As shown in Figure 3, the first rotating shaft 161 is positioned at the A point, the tie point of the piston rod of the first cylinder driver 151 and the first earthing rod support bar 131 is the B point, the tie point of the first earthing rod 141 and the first earthing rod support bar 131 is the C point, and to be support plate 110 be applied to pressure on the first earthing rod support bar 131 by the first earthing rod 141 to G.Distance between the piston rod of the first rotating shaft 161 and the first cylinder driver 151 and the tie point of the first earthing rod support bar 131 is the twice of the distance between the tie point of the first earthing rod 131 and the first earthing rod support bar 131.In other words, between A point and B point apart from 2L be the twice of the distance L between C point and B point.
The second rotating shaft 162 is positioned at the D point, the tie point of the piston rod of the second cylinder driver 152 and the 3rd earthing rod support bar 133 is the E point, the tie point of the 3rd earthing rod 143 and the 3rd earthing rod support bar 133 is the F point, and to be support plate 110 be applied to pressure on the 3rd earthing rod support bar 133 by the 3rd earthing rod 143 to G.Distance between the piston rod of the second rotating shaft 162 and the second cylinder driver 152 and the tie point of the 3rd earthing rod support bar 133 is the twice of the distance between the tie point of the piston rod of the tie point of the 3rd earthing rod 143 and the 3rd earthing rod support bar 133 and the second cylinder driver 152 and the 3rd earthing rod support bar 133.In other words, between D point and E point apart from 2L be the twice of the distance L between E point and F point.
When the distance between corresponding rotating shaft, cylinder driver and earthing rod support bar satisfied aforementioned proportion and concerns, the pressure that three earthing rods are subject to support plate 110 equated, thereby realizes that each earthing rod is stressed evenly.
According to the bottom electrode mechanism that is used for apparatus for processing plasma of the embodiment of the present invention, by the cylinder driver drives earthing rod in load bearing unit and the vertically elevating movement of earthing rod support bar, and then hold up the support plate that is positioned at the earthing rod top.Owing to connecting by articulated manner between the earthing rod support bar, thereby make the earthing rod that is arranged on the earthing rod support bar can horizontal location at lifting process, realize contacting between all earthing rods and support plate good, thereby can reduce the sparking discharge, and then improve the stabilization of equipment performance of bottom electrode mechanism.
Below with reference to the apparatus for processing plasma 1000 of Fig. 5 description according to the embodiment of the present invention.
As shown in Figure 5, the apparatus for processing plasma 1000 that provides of the embodiment of the present invention comprises bottom electrode mechanism 100, top electrode mechanism 200 and vacuum chamber.Wherein, bottom electrode mechanism 100 and top electrode mechanism 200 all are arranged in vacuum chamber.And bottom electrode mechanism 100 and top electrode mechanism 200 are oppositely arranged.In one embodiment of the invention, the bottom electrode mechanism that can provide for the above embodiment of the present invention of bottom electrode mechanism 100.
Vacuum chamber passes into etching gas under vacuum environment, etching gas after being heated to preset temperature, by radio frequency electrical from becoming plasma.These plasmas are in the required membrane structure of the Surface Creation that is placed on the wafer on support plate 110.The bottom electrode mechanism 100 that provides due to the above embodiment of the present invention can realize horizontal location in lifting process, thereby can guarantee with top electrode mechanism 200 between consistent during the spacing of each position, and then can improve the uniformity that the wafer that utilizes on 1000 pairs of support plates 110 of apparatus for processing plasma carries out plated film.
In one embodiment of the invention, apparatus for processing plasma can be PECVD (Plasma Enhanced Chemical Vapor Deposition, plasma enhanced chemical vapor deposition) equipment.
Apparatus for processing plasma according to the embodiment of the present invention, the adjustable height of bottom electrode mechanism can accurately be realized regulating, and horizontal location fully in lifting process, thereby make the spacing of each position between bottom electrode mechanism and top electrode mechanism identical, and then can improve the uniformity of wafer being carried out plated film.
In the description of this specification, the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means to be contained at least one embodiment of the present invention or example in conjunction with specific features, structure, material or the characteristics of this embodiment or example description.In this manual, the schematic statement of above-mentioned term not necessarily referred to identical embodiment or example.And the specific features of description, structure, material or characteristics can be with suitable mode combinations in any one or more embodiment or example.
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: in the situation that do not break away from principle of the present invention and aim can be carried out multiple variation, modification, replacement and modification to these embodiment, scope of the present invention is limited by claim and equivalent thereof.
Claims (12)
1. a bottom electrode mechanism that is used for apparatus for processing plasma, is characterized in that, comprising: support plate, bottom electrode base plate and at least one load bearing unit, wherein:
Described load bearing unit is arranged between described support plate and bottom electrode base plate, makes support plate and bottom electrode base plate even contact by described load bearing unit, and described load bearing unit comprises:
Three earthing rod support bars, described earthing rod support bar is arranged on the top of described bottom electrode base plate and hinged successively;
A plurality of earthing rods, described earthing rod are separately positioned on described earthing rod support bar, are used for flatly supporting described support plate; And
Two cylinder drivers, described cylinder driver are arranged on the below of the earthing rod support bar that is positioned at both sides and the piston rod of described cylinder driver is connected to the earthing rod support bar that is positioned at both sides, driving described earthing rod support bar along the vertical direction liftable,
Wherein, the earthing rod that is positioned at both sides is arranged to be positioned at the outside with respect to the piston rod of described cylinder driver.
2. bottom electrode according to claim 1 mechanism, is characterized in that, described earthing rod support bar is connected to each other by rotating shaft or bearing.
3. bottom electrode according to claim 2 mechanism, is characterized in that, described earthing rod support bar comprises:
The first earthing rod support bar;
The second earthing rod support bar, described the second earthing rod support bar is connected with described the first earthing rod support bar by the first rotating shaft; And
The 3rd earthing rod support bar, described the 3rd earthing rod support bar is connected with described the second earthing rod support bar by the second rotating shaft.
4. bottom electrode according to claim 3 mechanism, it is characterized in that, described cylinder driver further comprises the first cylinder driver and the second cylinder driver, and the piston rod of described the first cylinder driver is connected to described the first earthing rod support bar, and the piston rod of described the second cylinder driver is connected to described the 3rd earthing rod support bar.
5. bottom electrode according to claim 3 mechanism, is characterized in that, described earthing rod further comprises:
The first earthing rod, described the first earthing rod are connected to described the first earthing rod support bar vertically;
The second earthing rod, described the second earthing rod is connected to the centre position of described the second earthing rod support bar vertically; And
The 3rd earthing rod, described the 3rd earthing rod are connected to described the 3rd earthing rod support bar vertically, wherein
Distance between the piston rod of described the first rotating shaft and described the first cylinder driver and the tie point of described the first earthing rod support bar is the twice of the distance between the tie point of described the first earthing rod and described the first earthing rod support bar, and the distance between the tie point of the piston rod of the second rotating shaft and described the second cylinder driver and described the 3rd earthing rod support bar is the twice of the distance between the tie point of described the 3rd earthing rod and described the 3rd earthing rod support bar.
6. bottom electrode according to claim 1 mechanism, it is characterized in that, be formed with level trough and vertical channel on described earthing rod support bar, described level trough and vertical channel run through mutually, one end of the piston rod of described cylinder driver stretches in described vertical channel, and an end of described piston rod is fixed with along described vertical channel slide block slidably, is fixed with rotating shaft on described slide block, and described rotating shaft flatly is arranged in described level trough and along described level trough slidably.
7. bottom electrode according to claim 6 mechanism, is characterized in that, described level trough and vertical channel are rectangular channel or oblong slots.
8. bottom electrode according to claim 1 mechanism, is characterized in that, described cylinder driver is synchronously driven.
9. bottom electrode according to claim 1 mechanism, is characterized in that, described bottom electrode base plate is identical with earth potential through grounding and current potential.
10. bottom electrode according to claim 1 mechanism, is characterized in that, described earthing rod support bar is electrically connected to described bottom electrode base plate.
11. an apparatus for processing plasma is characterized in that, comprising:
Vacuum chamber;
Be arranged on the top electrode mechanism in described vacuum chamber; And
As the described bottom electrode of any one in claim 1-10 mechanism, described bottom electrode mechanism is arranged in described vacuum chamber and is relative with described top electrode mechanism.
12. apparatus for processing plasma according to claim 11 is characterized in that, described apparatus for processing plasma is plasma enhanced chemical vapor deposition equipment.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020177119A1 (en) * | 2019-03-07 | 2020-09-10 | Applied Materials, Inc. | Grounding strap design |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1749430A (en) * | 2004-09-15 | 2006-03-22 | 应用材料股份有限公司 | Pecvd susceptor support construction |
| CN102108503A (en) * | 2009-12-10 | 2011-06-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Grounding/supporting device and plasma treatment equipment employing same |
-
2011
- 2011-12-19 CN CN201110427322.0A patent/CN103165369B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1749430A (en) * | 2004-09-15 | 2006-03-22 | 应用材料股份有限公司 | Pecvd susceptor support construction |
| CN102108503A (en) * | 2009-12-10 | 2011-06-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Grounding/supporting device and plasma treatment equipment employing same |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020177119A1 (en) * | 2019-03-07 | 2020-09-10 | Applied Materials, Inc. | Grounding strap design |
| TWI724773B (en) * | 2019-03-07 | 2021-04-11 | 美商應用材料股份有限公司 | Substrate processing chamber |
| CN113966543A (en) * | 2019-03-07 | 2022-01-21 | 应用材料公司 | Ground strap design |
| CN113966543B (en) * | 2019-03-07 | 2023-06-30 | 应用材料公司 | Ground strap design |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103165369B (en) | 2015-10-21 |
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Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |