CN103160880A - Electrolysis copper plating solution - Google Patents
Electrolysis copper plating solution Download PDFInfo
- Publication number
- CN103160880A CN103160880A CN 201110423822 CN201110423822A CN103160880A CN 103160880 A CN103160880 A CN 103160880A CN 201110423822 CN201110423822 CN 201110423822 CN 201110423822 A CN201110423822 A CN 201110423822A CN 103160880 A CN103160880 A CN 103160880A
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- CN
- China
- Prior art keywords
- copper plating
- plating solution
- electrolysis copper
- good
- phosphonic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Preventing Corrosion Or Incrustation Of Metals (AREA)
Abstract
The invention discloses an electrolysis copper plating solution. The electrolysis copper plating solution comprises, by weight, 30-50g/L of one kind of cupric nitrate, 100-150g/L of hydroxy butylidene phosphonic acid, 1-5g/L of phosphonic acid dimethyl ammonium, 5-10g/L of tripotassium citrate, 0.01-0.05g/L of polyethyleneimine and the rest of the electrolysis copper plating solution is water. The electrolysis copper plating solution is reasonable in formula, good in stability of plating solution, environment-friendly, pollution free, and good in quality of produced products.
Description
Technical field
The invention belongs to the electroplating technology field, be specifically related to a kind of electrolytic copper plating liquor.
Background technology
Metalwork copper facing can obtain preservative effect and conductivity preferably, and a large amount of copper electroplating solutions that use are seriously polluted at present, the wastewater treatment difficulty, and bath stability is poor, and work-ing life, short needs were frequently changed.
Summary of the invention
The object of the present invention is to provide a kind of formula reasonable, good stability, long service life, the electrolytic copper plating liquor that quality of coating is high.
Technical solution of the present invention is:
A kind of electrolytic copper plating liquor is characterized in that: namely formula is: a kind of 30～50g/L in cupric nitrate, hydroxyl fourth fork di 2 ethylhexyl phosphonic acid 100～150gL, first ammonia two methene phosphonic acids 1～5g/L, citric acid tri potassium 5～10g/L, polymine alkane 0.01～0.05g/L, excess water.
The present invention fills a prescription rationally, and bath stability is good, and is environment friendly and pollution-free, the good product quality of production.
Embodiment:
A kind of electrolytic copper plating liquor, its formula is: a kind of 30g/L in cupric nitrate, hydroxyl fourth fork di 2 ethylhexyl phosphonic acid 100gL, first ammonia two methene phosphonic acids 3g/L, citric acid tri potassium 5g/L, polymine alkane 0.01g/L, excess water.
Claims (1)
1. electrolytic copper plating liquor is characterized in that: namely formula is: a kind of 30～50g/L in cupric nitrate, hydroxyl fourth fork di 2 ethylhexyl phosphonic acid 100～150gL, first ammonia two methene phosphonic acids 1～5g/L, citric acid tri potassium 5～10g/L, polymine alkane 0.01～0.05g/L, excess water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110423822 CN103160880A (en) | 2011-12-18 | 2011-12-18 | Electrolysis copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110423822 CN103160880A (en) | 2011-12-18 | 2011-12-18 | Electrolysis copper plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103160880A true CN103160880A (en) | 2013-06-19 |
Family
ID=48584400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110423822 Pending CN103160880A (en) | 2011-12-18 | 2011-12-18 | Electrolysis copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103160880A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104332213A (en) * | 2014-11-19 | 2015-02-04 | 印培东 | Electroplating copper clad aluminum conductor |
-
2011
- 2011-12-18 CN CN 201110423822 patent/CN103160880A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104332213A (en) * | 2014-11-19 | 2015-02-04 | 印培东 | Electroplating copper clad aluminum conductor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130619 |