CN103160076A - Sheet-shaped epoxy resin composition for encapsulating electronic components and electronic component device using the same - Google Patents
Sheet-shaped epoxy resin composition for encapsulating electronic components and electronic component device using the same Download PDFInfo
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- CN103160076A CN103160076A CN2012105465468A CN201210546546A CN103160076A CN 103160076 A CN103160076 A CN 103160076A CN 2012105465468 A CN2012105465468 A CN 2012105465468A CN 201210546546 A CN201210546546 A CN 201210546546A CN 103160076 A CN103160076 A CN 103160076A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
- C08L2203/162—Applications used for films sealable films
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- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Epoxy Resins (AREA)
- Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention provides a sheet-shaped epoxy resin composition for encapsulating electronic components and an electronic component device using the same, wherein the storage stability is good, and the gas output during the solidification can be reduced. The composition is the sheet-shaped epoxy resin composition for encapsulating the electronic components, and the thickness of the sheet is in a range from 150(mu)m to 1mm. the epoxy resin composition comprises the following (A) to (D) composition, and the following (E)composition. (A) is the epoxy resin, (B) is the phenolic resin, (C) is the elastomer, (D) is the inorganic filler. The (E) is at least one of the following 5-Nitro-isophthalic acid and the complex formed by the imidazoliniumcompounds represented by the following formula(1), or the 5-Nitro-isophthalic acid and the complex formed by the imidazoliniumcompounds represented by the following formula(2), or the 5-Nitro-isophthalic acid and the complex formed by the imidazoliniumcompounds represented by the following formula(3).
Description
Technical field
The present invention relates to reduce the sheet electronic component epoxy resin composition for packaging of the generation of giving vent to anger when solidifying and normal temperature keeping quality excellence and with its electronic part apparatus.
Background technology
All the time, the electronic unit take various semiconductor elements as representative (electronics) uses with epoxy resin and carries out resin package and deviceization as the compositions of thermosetting resin of main component.In above-mentioned compositions of thermosetting resin, usually comprise curing catalyst, by using this curing catalyst, the thermofixation reaction is successfully carried out at short notice.Yet using the result of above-mentioned curing catalyst is to have keeping quality concurrently to become problem.Therefore, compositions of thermosetting resin need to be by refrigeration or freezing the keeping usually, and this situation is considered from the viewpoint of cost and qualitative control, become problem.
Under such technical background, in recent years, in order to have reactivity and keeping quality concurrently, carried out the research (referring to Patent Document 1 ~ 3) of various curing catalysts.Wherein, the borate-based curing catalyst of Fa Xian Phosphonium has very excellent solidified nature and hot potentiality.Yet, the borate-based curing catalyst of known these a little Phosphonium occured to decompose and produces and give vent to anger in when reaction, the composition of giving vent to anger of this generation might become the reason that in molding, the space forms, and then because these give vent to anger into the element surface that branch is attached to electronics, therefore, in certain electronics, in addition its characteristic is brought dysgenic worry.
Particularly in the situation that be used to form by coating the epoxy resin composition for packaging sheet that the varnish of sheet is made, because needs are temporarily made the varnish state with raw material, therefore, large on the impact of working life of composition epoxy resin sheet.Consider from the viewpoint of this working life, can use tetraphenyl boron tetraphenylphosphoniphenolate (Tetraphenylphosphonium tetraphenylborate), but existence brings dysgenic worry (referring to Patent Document 4) because of the generation of giving vent to anger to equipment performance.
The prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2000-174045 communique
Patent documentation 2: TOHKEMY 2008-285592 communique
Patent documentation 3: TOHKEMY 2009-13309 communique
Patent documentation 4: TOHKEMY 2008-260845 communique
Summary of the invention
The problem that invention will solve
As mentioned above, about the curing catalyst as compounding all the time in the composition epoxy resin of packaged material, its accelerative action in curing is self-evident, but the aspects such as generation of relevant keeping quality and give vent to anger (out gas) have problems, and strongly expect the composition epoxy resin of the improved solidification reactivity excellence of these problems.
The present invention completes in view of said circumstances, and its purpose is, provides possess good storage stability and can reduce the sheet electronic component epoxy resin composition for packaging of the generation of giving vent to anger when solidifying and use its electronic part apparatus.
For the scheme of dealing with problems
To achieve these goals, the first main points of the present invention are a kind of sheet electronic component epoxy resin composition for packaging, the sheet composition epoxy resin that uses when it is packaged electronic components, the thickness of sheet is 150 μ m ~ 1mm, above-mentioned composition epoxy resin contains following (A) ~ (D) composition and following (E) composition
(A) epoxy resin,
(B) resol,
(C) elastomerics,
(D) inanimate matter weighting agent,
(E) select clathrate complex (inclusion complex) that the imidazolium compounds of free 5-nitroisophthalic acid and following formula (1) expression forms, the clathrate complex that is formed by the imidazolium compounds of 5-nitroisophthalic acid and following formula (2) expression and clathrate complex that the imidazolium compounds that represented by 5-nitroisophthalic acid and following formula (3) forms at least a clathrate complex.
[Chemical formula 1]
[Chemical formula 2]
[chemical formula 3]
And the second main points of the present invention are a kind of electronic part apparatus, and it uses above-mentioned sheet electronic component epoxy resin composition for packaging to carry out resin package to electronic unit and forms.
The sheet composition epoxy resin that the inventor etc. are self-evident by solidification reactivity in order to obtain, the keeping quality under normal temperature is excellent and the packaged material of the generation of giving vent to anger can suppress to solidify the time consists of and repeatedly conducting in-depth research.Its result finds out, as the curing catalyst of compounding in packaged material, if use above-mentioned specific clathrate complex [(E) composition] but not the curing catalyst that used in the past, can realize expecting purpose.namely, found following situation: above-mentioned specific clathrate complex [(E) composition] be in as the 5-nitroisophthalic acid of host compound (host compound) inclusion as the specific imidazolium compounds of guest compound (guest compound), due to compound each other by physical force inclusions such as intermolecular forces but not chemical bonding, therefore, do not play a role as curing catalyst at normal temperatures, at high temperature (forming temperature) comes off by inclusion and activates as curing catalyst, its result, can obtain that normal temperature has good keeping qualities and the epoxy resin composition for packaging of the produce an effect excellence that suppresses to give vent to anger, realized the present invention.
The effect of invention
As mentioned above, the present invention is the sheet electronic component epoxy resin composition for packaging with specific thicknesses that contains epoxy resin [(A) composition], resol [(B) composition], elastomerics [(C) composition], inanimate matter weighting agent [(D) composition] and contain aforementioned specific clathrate complex [(E) composition].Therefore, also can suppress viscosity rise, possess good storage stability even preserve at normal temperatures, and the generation of giving vent to anger can suppress to solidify the time.Thereby, by using this sheet electronic component epoxy resin composition for packaging, electronic unit is encapsulated, can obtain the high electronic part apparatus of reliability.
If above-mentioned specific clathrate complex [(E) composition] is by at least a clathrate complex that forms in following clathrate complex: can be more effective aspect at least a clathrate complex in the clathrate complex that the clathrate complex that is formed by the imidazolium compounds of 5-nitroisophthalic acid and above-mentioned formula (1) expression and the imidazolium compounds that is represented by 5-nitroisophthalic acid and above-mentioned formula (2) form, the generation of giving vent to anger in keeping quality and inhibition.
If the content of above-mentioned (D) composition is 60 ~ 80 % by weight of whole composition epoxy resins, reduce cured article generation warpage effect, improve mobility, cementability effect can be more excellent.
If (E) content of composition is 0.3 ~ 5 % by weight with respect to the organic composition in composition epoxy resin, consider to bring into play more excellent effect from the viewpoint that has solidification reactivity and storage stability concurrently.
If have the functional group that reacts with epoxy resin as (A) composition as the elastomerics of above-mentioned (C) composition, can give play to thermotolerance, intensity (obdurability), performance excellent in adhesion as packaged material after solidifying, result can obtain the high electronic part apparatus of reliability.
Embodiment
Below, describe being used for implementing mode of the present invention.
Sheet electronic component epoxy resin composition for packaging of the present invention (following sometimes referred to as " sheet composition epoxy resin ") will use epoxy resin (A composition), resol (B composition), elastomerics (C) composition, inanimate matter weighting agent (D composition) and specific clathrate complex (E composition) and the composition epoxy resin that obtains forms sheet and obtains.Need to prove, in the present invention, sheet is in the situation that consider for the encapsulation purposes of electronic unit and suitably set according to the electronic unit that becomes encapsulated object etc., but put down in writing as described later like that, typically refer to total thickness 150 μ m ~ 1mm.
A: epoxy resin
As above-mentioned epoxy resin (A composition), for example, can list triphenyl methane type epoxy resin, cresols phenolic resin varnish type epoxy resin, biphenyl type epoxy resin, modified bisphenol A type epoxy resin, bisphenol A type epoxy resin, bisphenol f type epoxy resin, modified bisphenol F type epoxy resin, dicyclopentadiene-type epoxy resin, phenol novolak type epoxy resin, phenoxy resin etc.They can be used singly or in combination two or more.And; consider from the viewpoint of the toughness of the cured article of the reactivity of guaranteeing epoxy resin and composition epoxy resin; preferred epoxy equivalent (weight) is 150 ~ 250, softening temperature or fusing point be 50 ~ 130 ℃ be at normal temperatures the epoxy resin of solid; wherein consider from the viewpoint of reliability, preferably use triphenyl methane type epoxy resin, cresols phenolic resin varnish type epoxy resin, biphenyl type epoxy resin.In addition, consider from the viewpoint of low-stress, the preferred modified bisphenol A type epoxy resin with flexibility skeletons such as acetal radical, polyoxy alkylidenes that uses, above-mentioned modified bisphenol A type epoxy resin with acetal radical is good because presenting the liquid state operability, can use especially aptly.
With respect to whole composition epoxy resins, the content of above-mentioned epoxy resin (A composition) preferably sets the scope in 3 ~ 20 % by weight.
B: resol
For the resol (B composition) that uses together with above-mentioned epoxy resin (A composition), so long as and the resol that curing reaction occurs between above-mentioned epoxy resin (A composition) get final product, such as listing phenol novolac resin, aralkyl-phenol resin (phenol aralkyl resin), biphenyl aralkyl resin, dicyclopentadiene-type resol, cresols novolac resin, resole etc.These resol can be used singly or in combination two or more.And, in these resol, from considering with reactive viewpoint of above-mentioned epoxy resin (A composition), preferred use that hydroxyl equivalent is 70 ~ 250, softening temperature is the resol of 50 ~ 110 ℃, wherein consider from the high viewpoint of solidification reactivity, can use aptly the phenol novolac resin.In addition, consider from the viewpoint of reliability, can use aptly the resol of the such agent of low hygroscopicity of aralkyl-phenol resin, xenyl aralkyl resin.
Compounding ratio for above-mentioned epoxy resin (A composition) and resol (B composition), consider from the viewpoint of solidification reactivity, preferably to carry out compounding with respect to the mode that adds up to 0.5 ~ 1.3 equivalent of the hydroxyl in 1 equivalent epoxy group(ing) in epoxy resin (A composition), resol (B composition), 0.7 ~ 1.1 equivalent more preferably.
C: elastomerics
The elastomerics (C composition) that uses together with above-mentioned A composition and B composition is to give sheet composition epoxy resin flexibility and flexible material, can use the various elastomericss of this effect of performance.For example, can use rubber polymers such as various vinylformic acid (ester) based polymer, styrene-acrylate based copolymer, divinyl rubber, styrene butadiene rubbers (SBR), vinyl-vinyl acetate copolymer (EVA), synthetic polyisoprene, acrylic-nitrile rubber such as polyacrylic ester etc.They can be used singly or in combination two or more.Wherein, can use aptly relatively above-mentioned epoxy resin (A composition) easily to disperse and have the elastomerics of the functional group that reacts with above-mentioned epoxy resin (A composition).Namely, by with epoxy resin (A composition) in epoxy group(ing) react, elastomerics (C composition) is imported into the three-dimensional network in the cured article of composition epoxy resin, thereby can give play to thermotolerance, intensity (obdurability), performance excellent in adhesion as packaged material after solidifying, result can obtain the high electronic part apparatus of reliability.
As the functional group that reacts with above-mentioned epoxy resin (A composition), such as listing epoxy group(ing), carboxyl, amino, amide group, imidazolyl, phenoxy group, sulfydryl, anhydride group etc.In addition, the functional group that reacts with above-mentioned epoxy resin (A composition) is when to be epoxy group(ing), amino etc. have reactive functional group with the carboxyl of body of catalyst, the reaction of carboxyl and epoxy resin (A composition) by body of catalyst can prevent that the curing reaction between the epoxy resin (A composition) that should have-resol (B composition) is suppressed.
It is incompatible synthetic that aforesaid propylene acid (ester) based polymer can utilize by vinylformic acid (ester) monomer mixture that for example will be set as the ratio of mixture of regulation ordinary method to carry out radical polymerization.As the method for above-mentioned radical polymerization, while can use the solution polymerization process that carries out as solvent with organic solvent, make starting monomer be dispersed in water the suspension polymerization that carries out polymerization.As the polymerization starter that uses this moment, for example, can use 2,2 '-Diisopropyl azodicarboxylate, 2,2 '-azo two-(2, the 4-methyl pentane nitrile), 2,2 '-azo is two-4-methoxyl group-2,4-methyl pentane nitrile, other azos systems or diazonium are the peroxidation system polymerization starters such as polymerization starter, benzoyl peroxide and methylethyl ketone peroxide etc.Need to prove, in the situation that above-mentioned suspension polymerization preferably adds such dispersion agents such as polyacrylamide, polyvinyl alcohol.
The content of above-mentioned elastomerics (C composition) be preferably 5 ~ 40 % by weight of whole composition epoxy resins, more preferably 10 ~ 35 % by weight, be particularly preferably 15 ~ 30 % by weight.That is, when the content of elastomerics (C composition) is very few, can exist the flexibility that is difficult to obtain composition epoxy resin and cured article flexible and that be positioned at the composition epoxy resin on all ends of electronic unit to be difficult to form the tendency of convex.In addition, when the content of elastomerics (C composition) is too much, because the melt viscosity of composition epoxy resin uprises, therefore, can there be the tendency, the tendency that thermotolerance reduces of undercapacity of the cured article of filling epoxy resin composition in the gap that is difficult between electronic unit and installation base plate and composition epoxy resin.And then, be formed convex although be positioned at the cured article of the composition epoxy resin on all ends of electronic unit, because the difference of height of this protuberance becomes excessive, therefore, the picking up, carry sometimes and break down of the electronic part apparatus after cutting.
D: inanimate matter weighting agent
As the inanimate matter weighting agent (D composition) that uses together with above-mentioned A ~ C composition, for example, can list the various powder such as silica glass, talcum, SiO 2 powder (fused silica powder, crystallinity SiO 2 powder etc.), alumina powder, aluminium nitride powder, alpha-silicon nitride powders.These inanimate matter weighting agents can use disintegrated, spherical or grind the inanimate matter weighting agent arbitrarily such as inanimate matter weighting agent after processing.And these inanimate matter weighting agents can be used singly or in combination two or more.Wherein, the viewpoint of the substrate warp after reducing internal stress, its result and can suppress to encapsulate from the linear expansivity of the cured article of the composition epoxy resin that can obtain by reduction is considered, the above-mentioned SiO 2 powder of preferred use, in above-mentioned SiO 2 powder, consider from high fillibility, the such viewpoint of high workability, particularly preferably use the fused silica powder.As above-mentioned fused silica powder, can list the spheroidal fused SiO 2 powder, pulverize the fused silica powder, consider from the viewpoint of mobility, preferably use the spheroidal fused SiO 2 powder.
In addition, the median size of inanimate matter weighting agent (D composition) be preferably 1 ~ 30 μ m scope, be particularly preferably the scope of 0.3 ~ 15 μ m.Need to prove, the median size of above-mentioned inanimate matter weighting agent (D composition) for example can use arbitrary extracting from sampling overall the mensuration sample, measure with commercially available laser diffraction and scattering formula particle size distribution device.
And, the content of above-mentioned inanimate matter weighting agent (D composition) be preferably 50 ~ 85 % by weight of whole composition epoxy resins, more preferably 55 ~ 85 % by weight, be particularly preferably 60 ~ 80 % by weight.That is, this is because when the content of inanimate matter weighting agent (D composition) is very few, because the linear expansivity of the cured article of composition epoxy resin becomes large, therefore exist the warpage of cured article to become large tendency; On the other hand, when the content of inanimate matter weighting agent (D composition) is too much, because the flexibility of composition epoxy resin, mobility reduce, so the tendency of existence and the cementability reduction of electronic unit, installation base plate.
E: specific clathrate complex
The specific clathrate complex (E composition) that uses together with above-mentioned A ~ D composition refers to the clathrate complex that clathrate complex that the imidazolium compounds by the expression of 5-nitroisophthalic acid and following formula (1) forms, clathrate complex that the imidazolium compounds that is represented by 5-nitroisophthalic acid and following formula (2) forms, the imidazolium compounds that is represented by 5-nitroisophthalic acid and following formula (3) form.And these clathrate complexs can be used singly or in combination two or more.
[chemical formula 4]
[chemical formula 5]
[chemical formula 6]
Above-mentioned clathrate complex refers to guest compound (imidazolium compounds of above-mentioned formula (1) ~ (3) expression in the present invention) by host compound (the 5-nitroisophthalic acid in the present invention) inclusion (winning over by any means) and the complex body that produces.And in the present invention, the aforementioned body compound refers to be combined by the intermolecular forces that belongs to the combination of (beyond chemical bond) beyond covalent linkage the compound that forms compound and form the inclusion lattice in such compound with above-mentioned guest compound.In addition, above-mentioned inclusion lattice refer to host compound each other by the combination beyond covalent linkage carry out in conjunction with and the space (gap) of host compound more than two molecules that combine come the structure of inclusion guest compound by covalent linkage combination (intermolecular forces) in addition.
And, in above-mentioned specific clathrate complex (E composition), consider from the give vent to anger viewpoint of produce an effect of storage stability and inhibition, the clathrate complex that the clathrate complex that the imidazolium compounds that preferred use is represented by 5-nitroisophthalic acid and above-mentioned formula (1) forms, the imidazolium compounds that is represented by 5-nitroisophthalic acid and above-mentioned formula (2) form, they can distinguish use separately, also can will both be used in combination.And then, from can make initial viscosity lower, the favourable viewpoint of the concavo-convex tracing ability in when encapsulation is considered the clathrate complex that particularly preferably uses the imidazolium compounds that represented by 5-nitroisophthalic acid and above-mentioned formula (2) to form.
For above-mentioned specific clathrate complex (E composition), for example, can following operation make.Namely, after at least a imidazolium compounds in the group that can form by the imidazolium compounds with 5-nitroisophthalic acid and the free above-mentioned formula (1) of choosing ~ formula (3) expression is added in solvent, one side agitation as appropriate, carrying out heat treated or reflux on one side processes, the target clathrate complex is separated out, thereby make specific clathrate complex of the present invention.
Need to prove, under considering the diffluent situation of solvent appearance, preferably the imidazolium compounds with 5-nitroisophthalic acid and above-mentioned formula (1) ~ formula (3) expression is dissolved in separately respectively in solvent, then these lysates is mixed with each other.As above-mentioned solvent, can use such as water, methyl alcohol, ethanol, ethyl acetate, methyl acetate, Anaesthetie Ether, dimethyl ether, acetone, methylethylketone, acetonitrile etc.
In addition, when making above-mentioned specific clathrate complex (E composition), adding proportion as the imidazolium compounds of 5-nitroisophthalic acid and formula (1) ~ (3) expression, for example, with respect to 1 mole of 5-nitroisophthalic acid (host compound), preferably the imidazolium compounds (guest compound) of formula (1) ~ formula (3) expression is set as the ratio of 0.1 ~ 5.0 mole, more preferably 0.5 ~ 3.0 mole.
Heating condition during as the above-mentioned specific clathrate complex of manufacturing (E composition), so long as will be at least the imidazolium compounds of 5-nitroisophthalic acid and formula (1) ~ formula (3) expression be dissolved in solvent and the temperature range that can obtain the specific clathrate complex (E composition) as target after heating gets final product, for example, preferably heat in the scope of 40 ~ 120 ℃, more preferably heat in the scope of 50 ~ 90 ℃.
In addition, the heating of making above-mentioned specific clathrate complex (E composition) on one side the time is preferably stirred the solution or the suspension that contain the imidazolium compounds that 5-nitroisophthalic acid and formula (1) ~ formula (3) represent and is carried out, and more preferably carries out reflux.
The imidazolium compounds of 5-nitroisophthalic acid and formula (1) ~ formula (3) expression is dissolved or suspended in when making above-mentioned specific clathrate complex (E composition) operation in solvent and after heating, for example, in the imidazolium compounds with 5-nitroisophthalic acid and formula (1) ~ formula (3) expression is dissolved in solvent and after heating, can heat to make the solid chemical compound as clathrate complex to separate out by end, but at room temperature place a night after preferably heating.And, make separate out as the solid chemical compound of clathrate complex after, for example by filtering and carrying out drying, can obtain the clathrate complex as target.
For the content of above-mentioned specific clathrate complex (E composition), be preferably 0.3 ~ 5.0 % by weight, 0.5 ~ 3.0 % by weight more preferably with respect to the organic composition in composition epoxy resin.Namely, this is because when the content of above-mentioned specific clathrate complex (E composition) is very few, existence is difficult to obtain the tendency of sufficient accelerative action in curing, otherwise when content is too much, has the tendency of the ambient stable deterioration of sheet electronic component epoxy resin composition for packaging.
Various additives
In addition, in composition epoxy resin in the present invention, except above-mentioned A ~ E composition, various additives of compounding in the scope of the function of not damaging above-mentioned composition epoxy resin as required.Such as listing releasing agent, fire retardant, pigment, hydrotalcite (hydrotalcite) compounds plasma trapping agent, antioxidant, mobility donor, moisture adsorbent etc.
As above-mentioned releasing agent, can list the compounds such as higher fatty acid, high-grade aliphatic ester, higher fatty acid calcium, be wax etc. such as using carnauba wax (carnauba wax) or oxidic polyethylene.These releasing agents can be used singly or in combination two or more.
As above-mentioned fire retardant, can list the metal hydroxidess such as organophosphorus based compound, weisspiessglanz, aluminium hydroxide, magnesium hydroxide etc.They can be used singly or in combination two or more.
Above-mentioned pigment can use carbon black with anti-static effect etc.
And then, except above-mentioned various additives, can also suitably use the various coupling agents such as γ mercaptopropyitrimethoxy silane.
The making of sheet composition epoxy resin
Sheet composition epoxy resin of the present invention for example can be made in following operation.At first, become to assign to prepare composition epoxy resin by mixing each compounding, so long as the method for each compounding homogeneous chemical composition ground dispersing and mixing just is not particularly limited.Then, as required each compounding composition is dissolved in solvent etc. and applies by varnish and be filmed.Perhaps, also can by with each compounding composition directly with mixing solid resins for preparing such as kneaders, and the solid resin that will obtain thus is extruded into sheet and is filmed formation.Wherein, consider from the viewpoint of the sheet that can obtain easily uniform thickness, can use aptly above-mentioned varnish cladding process.
Making based on the sheet electronic component encapsulating epoxy resin of the present invention of above-mentioned varnish cladding process is set forth.That is, according to conventional methods above-mentioned A ~ E composition and other additives of adding are as required suitably mixed, and it is dissolved equably or be dispersed in organic solvent, preparation applies uses varnish.Then, above-mentioned varnish is coated on the base material such as polyester film and makes its drying, film adhered with polyester film etc., thus the clear coat that forms is reeled together with film.
As above-mentioned organic solvent, be not particularly limited, can list known various organic solvent in the past, such as: methylethylketone, acetone, diox, metacetone, toluene, ethyl acetate etc.They can be used singly or in combination two or more.In addition, the concentration in organic solvent preferably is made as the scope of 30 ~ 60 % by weight usually.
Make the thickness of the layer (sheet) after the organic solvent volatilization for carrying out drying after applying, consider from the homogeneity of thickness and the viewpoint of remaining quantity of solvent, be for example 5 ~ 100 μ m, be preferably 50 ~ 70 μ m.So that the sheet that thickness is 150 μ m ~ 1mm, preferred 200 μ m ~ mode of 600 μ m will obtain thus is stacked, can obtain sheet electronic component epoxy resin composition for packaging of the present invention.
Electronic part apparatus
Due to the excellences such as thermotolerance of the cured article that uses sheet electronic component epoxy resin composition for packaging of the present invention to obtain by curing reaction, therefore, can be used for aptly various electronic units, such as semiconductor sealing material etc.
As the condition that is heating and curing of above-mentioned sheet electronic component epoxy resin composition for packaging, generally can carry out in the scope of 150 ~ 190 ℃.
Below, an example of the method for packing that used sheet electronic component epoxy resin composition for packaging of the present invention is set forth.That is, for the encapsulation of the chip-shaped equipment of lift-launch on substrate that uses sheet electronic component epoxy resin composition for packaging of the present invention, for example can following operation carry out.At first, the prescribed position of preparation on substrate is equipped with the encapsulated object product of chip-shaped equipment, then, mode with the chip-shaped equipment surface that covers above-mentioned lift-launch is configured in chip-shaped equipment surface with the sheet electronic component epoxy resin composition for packaging, under the encapsulation condition of regulation, sheet is heating and curing, under the state that makes substrate and the space maintenance hollow that is equipped on the chip-shaped equipment on this substrate, chip-shaped equipment is carried out resin package thus.
As above-mentioned encapsulation condition, for example, can list following encapsulation condition: vacuum pressing after 0.5 ~ 5 minute, communicates with atmosphere under the condition of 80 ~ 100 ℃ of temperature, pressure 100 ~ 500kPa, heats 30 ~ 120 minutes under the condition of 150 ~ 190 ℃ of temperature.
An example as the formation of the electronic part apparatus that obtains thus, for example, can list: make the connection electrode part (projection that is arranged on chip-shaped equipment, bump) be connected wired circuit board on connection with under the relative state of electrode part, carry chip-shaped equipment on wired circuit board, form the potting resin layer on wired circuit board, make it cover the chip-shaped equipment that carries on above-mentioned wired circuit board, thereby carry out the electronic part apparatus of resin package.Need to prove, in this electronic part apparatus, form hollow space in the bottom of the chip-shaped equipment that becomes the space segment between chip-shaped equipment and wired circuit board.
Said chip type equipment is connected space (hollow space) spacing and can be suitably set with the size of electrode part etc. according to the connection that arranges on said chip type equipment with wired circuit board, be generally 10 ~ 100 μ m left and right.In addition, above-mentioned connection preferably sets in 150 ~ 500 μ m left and right usually with each other distance between electrode part (projection).
Embodiment
Below, embodiment and comparative example are described in the lump.But the present invention is not limited to these embodiment.
At first, make in advance composition epoxy resin, prepare each composition as follows.
Epoxy resin
Bisphenol-type epoxy resin (epoxy equivalent (weight) 173:DIC company make, EPICRON EXA-850CRP)
Resol
Phenolic varnish type resol (hydroxyl equivalent 105: clear and polymer company makes, Shonol ND-564)
Elastomerics c1
Vinylformic acid (ester) based copolymer is (by butyl acrylate: vinyl cyanide: glycidyl methacrylate=85 % by weight: 8 % by weight: the multipolymer that 7 % by weight form, weight-average molecular weight 800,000)
The synthetic aforesaid propylene acid of following operation (ester) based copolymer.Namely, use 2,2 '-Diisopropyl azodicarboxylate is as polymerization starter, with the weight ratio compounding that feeds intake with 85:8:7 of butyl acrylate, vinyl cyanide, glycidyl methacrylate, carried out radical polymerization 5 hours and then carried out radical polymerization 1 hour with 80 ℃ in methylethylketone, under nitrogen gas stream, with 70 ℃, thus synthetic vinylformic acid (ester) based copolymer as target.
Elastomerics c2
Vinylformic acid (ester) based copolymer is (by butyl acrylate: ethyl propenoate: vinyl cyanide=25 % by weight: 65 % by weight: the multipolymer that 10 % by weight form, weight-average molecular weight 700,000)
The synthetic aforesaid propylene acid of following operation (ester) based copolymer.Namely, use 2,2 '-Diisopropyl azodicarboxylate is as polymerization starter, with the weight ratio compounding that feeds intake with 25:65:10 of butyl acrylate, ethyl propenoate, vinyl cyanide, carried out radical polymerization 5 hours and then carried out radical polymerization 1 hour with 80 ℃ in methylethylketone, under nitrogen gas stream, with 70 ℃, thus synthetic vinylformic acid (ester) based copolymer as target.
Clathrate complex e1(embodiment)
The clathrate complex that the 2-ethyl-4-methylimidazole that is represented by 5-nitroisophthalic acid and aforementioned formula (1) forms
Clathrate complex e2(embodiment)
By the 2-phenyl-4 of 5-nitroisophthalic acid and aforementioned formula (2) expression, the clathrate complex that 5-dihydroxyl Methylimidazole forms
Clathrate complex e3(embodiment)
The clathrate complex that the 2-phenyl-the 4-methyl-5-hydroxymethyl imidazoles forms by 5-nitroisophthalic acid and aforementioned formula (3) expression
Clathrate complex e4(comparative example)
The clathrate complex that the 2-ethyl-4-methylimidazole that is represented by 5-Hydroxy M Phthalic Acid and aforementioned formula (1) forms
Imidazolium compounds 1
The 2-ethyl-4-methylimidazole of aforementioned formula (1) expression
Imidazolium compounds 2
The 2-phenyl-4 of aforementioned formula (2) expression, 5-dihydroxyl Methylimidazole
Imidazolium compounds 3
The 2-phenyl of aforementioned formula (3) expression-4-methyl-5-hydroxymethyl imidazoles
Phosphorus is complex compound 1
Tetraphenyl boron tetraphenylphosphoniphenolate
Phosphorus is complex compound 2
Four p-methylphenyl boronation tetraphenylphosphoniphenolates
The inanimate matter weighting agent
Spheroidal fused SiO 2 powder (median size 0.5 μ m)
Pigment
Carbon black (Mitsubishi Chemical Ind's manufacturing, carbon black 20#)
Embodiment 1 ~ 10, comparative example 1 ~ 6
The making of sheet composition epoxy resin
With each composition shown in table 1 described later ~ table 2 carrying out dispersing and mixing with the ratio shown in table, and add therein and the total amount of each composition with the methylethylketone of amount, preparation applies and uses varnish thus.
Then, apply above-mentioned varnish with the comma coating machine on the lift-off processing face of the polyester film of thickness 38 μ m (resin company of Mitsubishi makes, MRF-38), and carry out drying, form thus thickness and be the resin layer that is formed by the sheet composition epoxy resin of 50 μ m.
Next, making the lift-off processing face of the polyester film of other preparation be fitted in above-mentioned resin layer (sheet composition epoxy resin) goes up and reels.Then, Yi Bian suitably peel off polyester film, Yi Bian use stacked 12 the above-mentioned sheet composition epoxy resins of roll-type laminating machine (thickness 50 μ m), make the electronic component package sheet composition epoxy resin of total thickness 600 μ m.
The embodiment that use obtains thus and the sheet composition epoxy resin of comparative example, according to method as follows, the evaluation of measuring characteristic.With the results are shown in of these evaluation of measuring table 1 described later ~ table 2.
Storage stability
Use rheometer (HAKKE company make, RheoStress RS1) to measure the lowest melt viscosity (condition: gap 100 μ m, rotating cone diameter: 20mm, speed of rotation: 10 seconds of the sheet composition epoxy resin that obtains
-1).Then, above-mentioned sheet composition epoxy resin was preserved 30 under 20 ℃, then measured viscosity under condition same as described above, calculate the viscosity rise rate before and after preserving.Its result, with the viscosity rise rate before and after preserving lower than the resin combination of 3 times be evaluated as ◎, will be evaluated as for the resin combination of 3 ~ 10 times zero, will be evaluated as over 10 times or the unmeasured resin combination of curing *.
The generation of giving vent to anger
(GC part device model: Agilent 6890, MS part device model: Agilent 5973N) for generation gas volume when the GC-MS device (Gas Chromatography-mass Spectrometer (GCMS)) made from Agilent Technologies company is analyzed resulting sheet composition epoxy resin heat 1 hour under 175 ℃.Its measurement result being shown and will producing gas volume is that the following resin combination of 400ppm is evaluated as zero, be evaluated as producing the resin combination of gas volume over 400ppm *.
As GC section condition determination, be set as 250 ℃ of post implantation temperatures, column temperature: be warming up to 300 ℃, carrier gas flux since 40 ℃ of heat-up rates with 10 ℃/minute: He gas 1.0ml/ minute.
In addition, at the MS determination part, analyze under the condition of transmitter current 35 μ A, electron energy 70eV, detection mass range: m/z 10 ~ 800 with the EI method.
Need to prove, for generation give vent to anger quantitatively, calculate with the form of the generation gas volume that converts based on propyl carbinol.
Table 1
(% by weight)
*: with respect to the ratio (% by weight) of the whole organic compositions in composition epoxy resin.
Table 2
(% by weight)
*: with respect to the ratio (% by weight) of the whole organic compositions in composition epoxy resin.
By the above results as can be known, it is low that the viscosity of all embodiment products changes multiplying power, excellent storage stability.Therefore in addition, because the generation of giving vent to anger is also low, shows and give vent to anger storage stability under normal temperature and minimizing the two is all excellent for produce an effect.Wherein, used clathrate complex that the imidazolium compounds by the expression of 5-nitroisophthalic acid and formula (1) forms, and the viscosity variation multiplying power of the embodiment 1 ~ 4 of the clathrate complex that formed by the imidazolium compounds of 5-nitroisophthalic acid and formula (2) expression lower, the storage stability under normal temperature is excellence especially.
On the other hand, used the result as the comparative example 1 ~ 3 of the imidazolium compounds of normally used curing catalyst to be, although the generation of giving vent to anger is few, it is high that viscosity changes multiplying power, solidifies when perhaps preserving at normal temperatures, and storage stability is poor.
In addition, for used phosphorus be complex compound 1 as the comparative example 4 of curing catalyst, although that viscosity changes multiplying power is low, storage stability at normal temperatures obtains good result, has produced in a large number and has given vent to anger.
And, for to have used phosphorus be complex compound 2 as for the comparative example 5 of curing catalyst, solidify when preserving at normal temperatures, and produced in a large number and give vent to anger.
And then, for the comparative example 6 of the clathrate complex e4 that forms for the 2-ethyl-4-methylimidazole that has used by the expression of 5-Hydroxy M Phthalic Acid and aforementioned formula (1), although the generation of giving vent to anger is inhibited, solidify when preserving at normal temperatures.
Utilizability on industry
Sheet electronic component epoxy resin composition for packaging of the present invention is useful as the sheet packaged material that is used when the electronic unit take various semiconductor elements as representative (electronics) is carried out resin package.
Claims (6)
1. sheet electronic component epoxy resin composition for packaging, it is characterized in that, the sheet composition epoxy resin that uses when it is packaged electronic components, the thickness of sheet are 150 μ m ~ 1mm, described composition epoxy resin contains following (A) ~ (D) composition and following (E) composition
(A) epoxy resin,
(B) resol,
(C) elastomerics,
(D) inanimate matter weighting agent,
(E) select clathrate complex that the imidazolium compounds of free 5-nitroisophthalic acid and following formula (1) expression forms, the clathrate complex that is formed by the imidazolium compounds of 5-nitroisophthalic acid and following formula (2) expression and clathrate complex that the imidazolium compounds that represented by 5-nitroisophthalic acid and following formula (3) forms at least a clathrate complex
[Chemical formula 1]
[Chemical formula 2]
[chemical formula 3]
2. sheet electronic component epoxy resin composition for packaging according to claim 1, wherein, (E) composition is by at least a clathrate complex that forms in following material: the clathrate complex that is formed by the imidazolium compounds of 5-nitroisophthalic acid and above-mentioned formula (1) expression, and the clathrate complex that forms of the imidazolium compounds that is represented by 5-nitroisophthalic acid and above-mentioned formula (2).
3. sheet electronic component epoxy resin composition for packaging according to claim 1 and 2, wherein, (D) content of composition is 60 ~ 80 % by weight of whole composition epoxy resins.
4. the described sheet electronic component epoxy resin composition for packaging of any one according to claim 1 ~ 3, wherein, (E) content of composition is 0.3 ~ 5 % by weight with respect to the organic composition in composition epoxy resin.
5. the described sheet electronic component epoxy resin composition for packaging of any one according to claim 1 ~ 4 wherein, has the functional group that reacts with epoxy resin as (A) composition as the elastomerics of (C) composition.
6. electronic part apparatus, it is that right to use requires the described sheet electronic component epoxy resin composition for packaging of any one in 1 ~ 5 to carry out resin package to electronic unit to form.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-277093 | 2011-12-19 | ||
| JP2011277093A JP2013127034A (en) | 2011-12-19 | 2011-12-19 | Epoxy resin composition for sealing sheet-like electronic parts and electronic part device using the same |
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| Publication Number | Publication Date |
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| CN103160076A true CN103160076A (en) | 2013-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012105465468A Pending CN103160076A (en) | 2011-12-19 | 2012-12-14 | Sheet-shaped epoxy resin composition for encapsulating electronic components and electronic component device using the same |
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| Country | Link |
|---|---|
| JP (1) | JP2013127034A (en) |
| KR (1) | KR20130070544A (en) |
| CN (1) | CN103160076A (en) |
| TW (1) | TW201336920A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107408540A (en) * | 2015-03-31 | 2017-11-28 | 东丽株式会社 | Electronic component-use resin sheet, the electronic component-use resin sheet with diaphragm and semiconductor devices and its manufacture method |
| CN111557128A (en) * | 2017-12-27 | 2020-08-18 | 3M创新有限公司 | Cured epoxy resin compositions, articles, and methods suitable for electronic device housings |
| CN112512791A (en) * | 2018-08-03 | 2021-03-16 | 三菱化学株式会社 | Laminate and method for producing epoxy resin sheet |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6094958B2 (en) * | 2012-12-12 | 2017-03-15 | パナソニックＩｐマネジメント株式会社 | Epoxy resin composition for sealing power semiconductor element of power module and power module using the same |
| WO2018029744A1 (en) * | 2016-08-08 | 2018-02-15 | 東レ株式会社 | Resin sheet for electronic component, film-protected resin sheet for electronic component, and semiconductor device and production process therefor |
| EP3723125A1 (en) * | 2019-04-08 | 2020-10-14 | ABB Schweiz AG | Power electronic module and method of manufacturing a power electronic module |
| TWI709607B (en) * | 2019-05-07 | 2020-11-11 | 長春人造樹脂廠股份有限公司 | Resin composition and uses of the same |
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| CN101802049A (en) * | 2007-09-21 | 2010-08-11 | 日本曹达株式会社 | Inclusion complex containing epoxy resin composition for semiconductor encapsulation |
| JP2011225840A (en) * | 2010-03-31 | 2011-11-10 | Lintec Corp | Adhesive composition for semiconductor, adhesive sheet for semiconductor, and method for producing semiconductor device |
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| JP3217266B2 (en) * | 1996-06-11 | 2001-10-09 | 住友ベークライト株式会社 | Latent catalyst and thermosetting resin composition containing the catalyst |
| JP4054927B2 (en) * | 1998-06-25 | 2008-03-05 | 北興化学工業株式会社 | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| JP2003292581A (en) * | 2002-04-08 | 2003-10-15 | Hokko Chem Ind Co Ltd | Curing accelerator for epoxy resin |
| US9023956B2 (en) * | 2009-03-17 | 2015-05-05 | Nippon Soda Co., Ltd. | Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor |
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2011
- 2011-12-19 JP JP2011277093A patent/JP2013127034A/en active Pending
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2012
- 2012-12-14 CN CN2012105465468A patent/CN103160076A/en active Pending
- 2012-12-18 KR KR1020120148296A patent/KR20130070544A/en not_active Application Discontinuation
- 2012-12-18 TW TW101148051A patent/TW201336920A/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101802049A (en) * | 2007-09-21 | 2010-08-11 | 日本曹达株式会社 | Inclusion complex containing epoxy resin composition for semiconductor encapsulation |
| JP2011225840A (en) * | 2010-03-31 | 2011-11-10 | Lintec Corp | Adhesive composition for semiconductor, adhesive sheet for semiconductor, and method for producing semiconductor device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107408540A (en) * | 2015-03-31 | 2017-11-28 | 东丽株式会社 | Electronic component-use resin sheet, the electronic component-use resin sheet with diaphragm and semiconductor devices and its manufacture method |
| CN107408540B (en) * | 2015-03-31 | 2019-06-21 | 东丽株式会社 | Electronic component-use resin sheet, the electronic component-use resin sheet with protective film and semiconductor devices and its manufacturing method |
| TWI672330B (en) * | 2015-03-31 | 2019-09-21 | 日商東麗股份有限公司 | Resin sheet for electronic parts, resin sheet for electronic parts with protective film, semiconductor device, and manufacturing method thereof |
| CN111557128A (en) * | 2017-12-27 | 2020-08-18 | 3M创新有限公司 | Cured epoxy resin compositions, articles, and methods suitable for electronic device housings |
| US11773254B2 (en) | 2017-12-27 | 2023-10-03 | 3M Innovative Properties Company | Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods |
| CN112512791A (en) * | 2018-08-03 | 2021-03-16 | 三菱化学株式会社 | Laminate and method for producing epoxy resin sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201336920A (en) | 2013-09-16 |
| JP2013127034A (en) | 2013-06-27 |
| KR20130070544A (en) | 2013-06-27 |
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Application publication date: 20130619 |