CN103159162A - Method of producing microporous diaphragm - Google Patents
Method of producing microporous diaphragm Download PDFInfo
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- CN103159162A CN103159162A CN2011104231302A CN201110423130A CN103159162A CN 103159162 A CN103159162 A CN 103159162A CN 2011104231302 A CN2011104231302 A CN 2011104231302A CN 201110423130 A CN201110423130 A CN 201110423130A CN 103159162 A CN103159162 A CN 103159162A
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- optical substrate
- aerosol
- sio2
- solder
- light hurdle
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- Surface Treatment Of Optical Elements (AREA)
Abstract
The invention relates to a field of optical elements, and discloses a method of producing microporous diaphragm. The method comprises firstly using a lithography method to etch projections of required shapes and sizes on an optical substrate, plating a non-infiltrating film layer on the projections; secondly covering SiO2 aerosol or low-temperature solder on non-plated areas of the optical substrate; and finally solidifying the aerosol and removing the optical substrate to form the required microporous diaphragm, wherein the optical substrate uses materials capable of infiltrating with the SiO2 aerosol or the low-temperature solder, the film layer on the projections uses materials that do not infiltrate with the SiO2 aerosol or the low-temperature solder. By utilizing a characteristic that the substrate can infiltrate with the SiO2 aerosol and the film layer cannot infiltrate with the SiO2 aerosol, the microporous diaphragm array is produced, the technology is simple, and the microporous diaphragm can be rapidly produced in a large scale.
Description
Technical field
The present invention relates to the optical element field, relate in particular to a kind of method of making micropore light hurdle.
Background technology
The light hurdle is used for controlling electron beam and angular aperture as the important accessory on some electronic optical instrument, is used for micro-area diffraction and micro-zone analysis in electron microscope technique.Along with the development of cause of science, more and more less to Guang Lan aperture requirement, the existing following micropore light hurdle of 20 μ m that utilizes photoetching technique processing.The diameter in Guang Lan aperture is directly connected to the resolution ratio of electron microscope and the definition of imaging.
Summary of the invention
The invention provides the method on a kind of brand-new making micropore light hurdle, technique is simple, is fit to extensive quick Fabrication.
For achieving the above object, technical scheme proposed by the invention is: a kind of method of making micropore light hurdle comprises the steps: that (1) adopt the projection of photoetching method etching required form, size on optical substrate; (2) on projection the plating one rete, with this optical substrate as template; (3) the non-coating film area at optical substrate covers SiO2 aerosol or solder; (4) SiO2 aerosol or solder are solidified; (5) remove optical substrate, form required micropore light hurdle; Wherein, described optical substrate adopts the material that can infiltrate with SiO2 aerosol or solder, the employing of the rete of plating and SiO2 aerosol or the nonwettable material of solder projection on.
Further, adopt the demoulding or finishing method to remove optical substrate in step (5).
Further, the method can be used for making the light hurdle of the various geometries such as circle, rectangle, rectangle and size.
Beneficial effect of the present invention: a kind of method of making micropore light hurdle of the present invention, utilize substrate and SiO2 aerosol to infiltrate, and the nonwettable characteristic making micropore light of rete and SiO2 aerosol hurdle array, technique is simple, and quick Fabrication on a large scale.
Description of drawings
Fig. 1 is the optical substrate schematic diagram after photoetching;
Fig. 2 is plating non-infiltration rete schematic diagram on the optical substrate projection;
Fig. 3 is for covering SiO2 aerosol schematic diagram afterwards;
Fig. 4 is the top view of Fig. 1;
Fig. 5 is the micropore light hurdle schematic diagram after the demoulding.
Reference numeral: 1, optical substrate; 101, projection; 2, rete; 3, SiO2 aerosol; 301, micropore.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention will be further described.
As Figure 1-3, the manufacturing process for micropore light hurdle comprises the steps:
(1) adopt the projection 101 of photoetching method etching required form, size on optical substrate 1, as shown in figs. 1 and 4;
(2) the projection 101 on the plating one rete 2, with this optical substrate 1 as template, as shown in Figure 2;
(3) the non-coating film area at optical substrate 1 covers SiO2 aerosol 3 or solder.As shown in Figure 3;
(4) SiO2 aerosol 3 or solder are solidified;
(5) remove optical substrate 1, form micropore 301 arrays on the SiO2 aerosol 3 after curing or solder, as shown in Figure 5, be required micropore light hurdle;
Wherein, described optical substrate adopts the material that can infiltrate with SiO2 aerosol or solder, the employing of the rete of plating and SiO2 aerosol or the nonwettable material of solder projection on.Can adopt the demoulding or finishing method to remove optical substrate 1 in step (5).
The method can be used for making the light hurdle of the various geometries such as circle, rectangle, rectangle and size, and can realize extensive quick Fabrication.
Although specifically show and introduced the present invention in conjunction with preferred embodiment; but the those skilled in the art should be understood that; within not breaking away from the spirit and scope of the present invention that appended claims limits; the various variations of in the form and details the present invention being made are protection scope of the present invention.
Claims (3)
1. a method of making micropore light hurdle, is characterized in that, comprises the steps: the projection of (1) employing photoetching method etching required form, size on optical substrate; (2) on projection the plating one rete, with this optical substrate as template; (3) the non-coating film area at optical substrate covers SiO2 aerosol or solder; (4) SiO2 aerosol or solder are solidified; (5) remove optical substrate, form required micropore light hurdle; Wherein, described optical substrate adopts the material that can infiltrate with SiO2 aerosol or solder, the employing of the rete of plating and SiO2 aerosol or the nonwettable material of solder projection on.
2. a kind of method of making micropore light hurdle as claimed in claim 1, is characterized in that: adopt the demoulding or finishing method to remove optical substrate in step (5).
3. a kind of method of making micropore light hurdle as claimed in claim 1 or 2 is characterized in that: the micropore light hurdle of making is circular, rectangle or rectangle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110423130.2A CN103159162B (en) | 2011-12-16 | 2011-12-16 | A kind of method making micropore light hurdle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110423130.2A CN103159162B (en) | 2011-12-16 | 2011-12-16 | A kind of method making micropore light hurdle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103159162A true CN103159162A (en) | 2013-06-19 |
| CN103159162B CN103159162B (en) | 2015-08-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201110423130.2A Active CN103159162B (en) | 2011-12-16 | 2011-12-16 | A kind of method making micropore light hurdle |
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| CN (1) | CN103159162B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107402415A (en) * | 2016-05-20 | 2017-11-28 | 福州高意光学有限公司 | A kind of complex optics angle of wedge piece and preparation method thereof |
| CN113126186A (en) * | 2019-12-31 | 2021-07-16 | 中芯集成电路（宁波）有限公司 | Integrated aperture lens and manufacturing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2483739Y (en) * | 2001-07-20 | 2002-03-27 | 中国科学院上海技术物理研究所 | Non-refrigeration type infrared target light diaphragm |
| JP2005036174A (en) * | 2003-07-02 | 2005-02-10 | Olympus Corp | Resin composition for optical material, and optical element using the composition |
| CN101139091A (en) * | 2007-07-30 | 2008-03-12 | 浙江大学 | Method for preparing fullerene kind one-dimensional nanometer structure array by humifying pattern plate surface |
| CN101177237A (en) * | 2006-11-07 | 2008-05-14 | 财团法人工业技术研究院 | Nanometer array and method for forming the same |
| US20080160285A1 (en) * | 2006-12-28 | 2008-07-03 | Industrial Technology Research Institute | Structure having nano-hole and fabricating method thereof, tip array structure and fabricating method of tip structure |
| CN102012632A (en) * | 2010-09-10 | 2011-04-13 | 中国科学院合肥物质科学研究院 | Method for preparing bionic adhesion arrays with different top end structures |
-
2011
- 2011-12-16 CN CN201110423130.2A patent/CN103159162B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2483739Y (en) * | 2001-07-20 | 2002-03-27 | 中国科学院上海技术物理研究所 | Non-refrigeration type infrared target light diaphragm |
| JP2005036174A (en) * | 2003-07-02 | 2005-02-10 | Olympus Corp | Resin composition for optical material, and optical element using the composition |
| CN101177237A (en) * | 2006-11-07 | 2008-05-14 | 财团法人工业技术研究院 | Nanometer array and method for forming the same |
| US20080160285A1 (en) * | 2006-12-28 | 2008-07-03 | Industrial Technology Research Institute | Structure having nano-hole and fabricating method thereof, tip array structure and fabricating method of tip structure |
| CN101139091A (en) * | 2007-07-30 | 2008-03-12 | 浙江大学 | Method for preparing fullerene kind one-dimensional nanometer structure array by humifying pattern plate surface |
| CN102012632A (en) * | 2010-09-10 | 2011-04-13 | 中国科学院合肥物质科学研究院 | Method for preparing bionic adhesion arrays with different top end structures |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107402415A (en) * | 2016-05-20 | 2017-11-28 | 福州高意光学有限公司 | A kind of complex optics angle of wedge piece and preparation method thereof |
| CN113126186A (en) * | 2019-12-31 | 2021-07-16 | 中芯集成电路（宁波）有限公司 | Integrated aperture lens and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103159162B (en) | 2015-08-05 |
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